CN206834174U - A kind of DFN1608 high density framework - Google Patents
A kind of DFN1608 high density framework Download PDFInfo
- Publication number
- CN206834174U CN206834174U CN201720739577.3U CN201720739577U CN206834174U CN 206834174 U CN206834174 U CN 206834174U CN 201720739577 U CN201720739577 U CN 201720739577U CN 206834174 U CN206834174 U CN 206834174U
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- muscle
- chip
- dfn1608
- vertical
- high density
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- 238000009434 installation Methods 0.000 claims abstract description 56
- 238000005192 partition Methods 0.000 claims abstract description 22
- 238000000926 separation method Methods 0.000 claims abstract description 19
- 241000276425 Xiphophorus maculatus Species 0.000 claims abstract description 4
- 238000005520 cutting process Methods 0.000 claims description 70
- 210000003205 muscle Anatomy 0.000 claims description 56
- 230000007797 corrosion Effects 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000002224 dissection Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Abstract
It the utility model is related to semiconductor fabrication, more particularly to a kind of DFN1608 high density framework, rectangular frame including platy structure, multiple chip installation portions being adapted with DFN1608 encapsulating structures are set on framework, the chip installation portion includes chip placing area and pin weld zone, it is polarity demarcation strip between the chip placing area and pin weld zone, separation gap is provided with polarity demarcation strip, chip placing area and pin weld zone are separated, partition groove is extended with from separation gap on the polarity demarcation strip close to pin weld zone side.The framework sets special polarity demarcation strip, and sets separation gap on polarity demarcation strip, has the function that polarity separates, ensures properties of product.
Description
Technical field
A kind of semiconductor fabrication is the utility model is related to, particularly a kind of DFN1608 high density framework.
Background technology
Semiconductor refers to material of the electric conductivity between conductor and insulator under normal temperature, its radio, television set with
And had a wide range of applications on thermometric, if diode is exactly the device using semiconductor fabrication.Therefore, no matter from science and technology or warp
From the perspective of Ji development, the demand of semiconductor is all very huge.
In the manufacturing process of semiconductor, typically semiconductor is integrated on lead frame, allows lead frame as collection
Into the chip carrier of circuit, electric loop is formed, serves the function served as bridge connected with outer lead.
Chip package form is DFN1608 chip installation portion, and its requirement of one single chip installation portion size after encapsulating is：
1.6*0.8mm, to reach and make full use of framework matrix material and strengthen the purpose that framework adapts to more different scale chips, need
The chip placing area of one single chip installation portion on framework be enlarged, reduce pin weld zone, but produced from chip
Consider in terms of quality, can have adverse effect on again, this just needs the specific knot to chip installation portion on framework and framework
Structure optimizes design, to meet use demand.
Utility model content
Goal of the invention of the present utility model is：For in the prior art in order to improve packing forms be DFN1608 core
Piece installation portion is expanded using by the chip placing area of chip installation portion the adaptability of chip and the utilization rate of framework matrix
Greatly, the technical scheme for being reduced pin weld zone, but the technical problem for causing the quality of chip product not ensure, there is provided
A kind of DFN1608 high density framework, the framework sets special polarity demarcation strip, and sets compartment on polarity demarcation strip
Gap, have the function that polarity separates, ensure properties of product.
To achieve these goals, the technical solution adopted in the utility model is：
A kind of DFN1608 high density framework, include the rectangular frame of platy structure, multiple and DFN1608 is set on framework
The adaptable chip installation portion of encapsulating structure, the chip installation portion include chip placing area and pin weld zone, the chip
Be polarity demarcation strip between settlement and pin weld zone, separation gap be provided with polarity demarcation strip, by chip placing area and
Pin weld zone is separated, and partition groove is extended with from separation gap on the polarity demarcation strip close to pin weld zone side.
The framework sets special polarity demarcation strip between chip placing area and pin weld zone, and in polarity demarcation strip
Upper setting separation gap, chip placing area and pin weld zone are separated, and have the function that polarity separates, and then be beneficial to chip
Installation and pin welding, ensure properties of product, and partition groove is set on polarity demarcation strip, partition groove extends to compartment
Gap, so when pin draws as pin weld zone from chip placing area, pin can be placed in partition groove, lead-foot-line is carried out
It is spacing, welded beneficial to pin, ensure product quality.
As preferred scheme of the present utility model, the partition groove width is corresponding with the position of pin, makes institute
There is pin to be respectively positioned on when passing through polarity demarcation strip in partition groove.When pin welds, arranged with partition groove, and closing
Reason set partition groove width be adapted with pin number and arrangement, beneficial to stablize pin, reduction polarity demarcation strip pair
The interference of pin, ensure pin welding quality.
As preferred scheme of the present utility model, the ratio between the chip placing area and pin weld zone occupied area are more than
2.5:1.Chip installation portion is more than 2.5 with pin weld zone occupied area ratio:1, large-sized silicon seat can be obtained, is adapted to bigger
The chip of size, the compatibility of chip installation portion is improved, and then improve the utilization rate of framework, avoid repetition from molding, be cost-effective.
As preferred scheme of the present utility model, a circle side is provided between the frame of framework and the region of arrangement chip
Frame Cutting Road, including horizontal frame Cutting Road and vertical frame Cutting Road, in horizontal frame Cutting Road and vertical frame Cutting Road
Upper interval digging has multiple dead slots.Dead slot is arranged at intervals on horizontal frame Cutting Road and vertical frame Cutting Road, is easy to frame
Cut lock out operation.
As preferred scheme of the present utility model, spaced dead slot is vertical edge groove on vertical frame Cutting Road,
And transverse cuts locating slot is additionally provided with vertical frame Cutting Road, the transverse cuts locating slot and adjacent chips installation portion it
Between cutting position be correspondingly arranged.
As preferred scheme of the present utility model, spaced dead slot is horizontal edge groove on horizontal frame Cutting Road,
And vertical cutting locating slot is additionally provided with horizontal frame Cutting Road, the vertical cutting locating slot and adjacent chips installation portion it
Between cutting position be correspondingly arranged.Cutting locating slot is set respectively on vertical frame Cutting Road and horizontal frame Cutting Road, just
In the positional dissection of chip installation portion, improve operating efficiency and avoid damage of product.
As preferred scheme of the present utility model, connect between the adjacent transverse cutting locating slot on vertical frame Cutting Road
There is even muscle, this connects muscle for vertical half rotten even muscle, is also connected between the adjacent vertical cutting locating slot of horizontal frame Cutting Road
Muscle, this connects muscle for laterally half rotten even muscle.Vertical half rotten even muscle and laterally half rotten even muscle, the i.e. thickness for connecting muscle are corroded one
Half, while reinforcement Cutting Road structure is played, the cutting operation of more conducively follow-up frame.
As preferred scheme of the present utility model, the chip installation portion is rectangle, the long side of all chip installation portions with
The short side parallel arrangement of framework, company's muscle between adjacent chips installation portion long side are vertical dowel, and company's muscle between short side is
Lateral connection muscle.The short side of the long side of all chip installation portions and framework is arranged in parallel, regular arrangement is advantageous to increase
Add the utilization rate of framework matrix；And vertical dowel and lateral connection muscle is set between adjacent chips installation portion, increase framework
The stability of intensity and each chip installation portion.
As preferred scheme of the present utility model, the vertical dowel and lateral connection muscle are half corrosion structure.
As preferred scheme of the present utility model, cross dowel is equipped with four angles of chip installation portion, it is described
Cross dowel is arranged on the position that vertical dowel and lateral connection muscle intersects.Connect muscle muscle using cross and connect vertical dowel
With the crossover location of lateral connection muscle, it can realize and more efficiently connect and cut lock out operation, improve production efficiency, be also beneficial to
Reduce the width dimensions of vertical dowel and lateral connection muscle, improve the arrangement rate of chip installation portion.
In summary, by adopting the above-described technical solution, the beneficial effects of the utility model are：
1st, the framework sets special polarity demarcation strip, and sets separation gap on polarity demarcation strip, reaches polarity point
Every effect, ensure properties of product；And partition groove is set on polarity demarcation strip, partition groove extends to separation gap, this
Pin can be placed in partition groove by sample when pin draws as pin weld zone from chip placing area, spacing to lead-foot-line progress,
Welded beneficial to pin, ensure product quality；
2nd, chip installation portion and pin weld zone occupied area ratio are more than 2.5:1, large-sized silicon seat can be obtained, is adapted to
Larger sized chip, the compatibility of chip installation portion is improved, and then improve the utilization rate of framework, avoided repeating die sinking, save
Cost；
The 3rd, cutting locating slot is set respectively on vertical frame Cutting Road and horizontal frame Cutting Road, be easy to chip installation portion
Positional dissection, improve and operating efficiency and avoid damage of product；
4th, connect the crossover location of the vertical dowel of muscle muscle connection and lateral connection muscle using cross, can realize and more efficiently connect
Lock out operation is connect and cut, production efficiency is improved, is also beneficial to reduce the width dimensions of vertical dowel and lateral connection muscle, carries
The arrangement rate of high chip installation portion.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model DFN1608 high density frameworks.
Fig. 2 is distribution map of the multiple chip installation portions of close frame in Fig. 1 on framework.
Fig. 3 is the structural representation of one single chip installation portion.
Fig. 4 is chip in embodiment and the schematic diagram of the chip installation portion after lead-foot-line.
Marked in figure：1- frameworks, 101- chip units, 2- unit separation troughs, 3- chip installation portions, 301- chip placings
Area, 302- polarity demarcation strips, 303- partition grooves, 304- pins weld zone, even muscle, 4- lateral connection muscle, 5- are erected for 305- supports
To dowel, 501- cross dowels, the vertical frame Cutting Roads of 6-, 601- transverse cuts locating slots, 602- vertical edge grooves, 603-
Even muscle, 7- transverse direction frame Cutting Roads, 701- vertically cut locating slot for vertical half corruption, and 702- horizontal edge grooves, 703- horizontal half is rotten to be connected
Muscle, 8- chips, 9- lead-foot-lines.
Embodiment
Below in conjunction with the accompanying drawings, the utility model is described in detail.
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining this
Utility model, it is not used to limit the utility model.
Embodiment 1
As shown in Figures 1 to 4, the DFN1608 high density frameworks of the present embodiment, the rectangular frame 1 of platy structure is included,
Multiple chip installation portions 3 being adapted with DFN1608 encapsulating structures are set on framework 1, the chip installation portion 3 includes chip placing
Area 301 and pin weld zone 304, it is polarity demarcation strip 302 between the chip placing area 301 and pin weld zone 304, in pole
Property demarcation strip 302 be provided with separation gap, the polarity in chip placing area 301 and pin weld zone 304 is separated, close to drawing
On the polarity demarcation strip 302 of the side of pin weld zone 304 partition groove 303 is extended with from separation gap.
As shown in figure 1, the framework 1 of the present embodiment is divided into two chip units 101 by unit separation trough 2.
Further, the width of the partition groove 303 is corresponding with the position of pin, makes all pins by pole
It is respectively positioned on during property demarcation strip 302 in partition groove 303.When pin welds, arranged with partition groove, and rationally setting
The width of partition groove is adapted with pin number and arrangement, beneficial to stablize pin, reduce polarity demarcation strip to pin
Interference, ensure pin welding quality.
As shown in figure 4, after chip 8 is placed in the chip placing area 301 of chip installation portion 3, the lead-foot-line 9 of chip 8
It is welded in pin weld zone 304, and during the process polarity demarcation strip 302 of lead-foot-line 9, in partition groove 303.
In summary, the framework of the present embodiment sets special polarity to separate between chip placing area and pin weld zone
Plate, and separation gap is set on polarity demarcation strip, chip placing area and pin weld zone are separated, reach polarity separation
Effect, and then installed beneficial to chip and welded with pin, ensure properties of product, and partition groove is set on polarity demarcation strip, point
Separation gap is extended to every groove, so when pin draws as pin weld zone from chip placing area, pin can be placed in separation
It is spacing to lead-foot-line progress in groove, welded beneficial to pin, ensure product quality.
Embodiment 2
As shown in Figures 1 to 4, the DFN1608 high density frameworks according to embodiment 1, the chip placing of the present embodiment
The ratio between area 301 and the occupied area of pin weld zone 304 are 3:1.Obtained according to practical production experience, chip installation portion welds with pin
Area's occupied area ratio is connect as 3:When 1, the silicon seat of large-size can be obtained, adapts to larger sized chip, improves chip installation portion
Compatibility, and then improve framework utilization rate, avoid repeat die sinking, it is cost-effective.
In the present embodiment, a circle frame Cutting Road is provided between the frame of framework 1 and the region of arrangement chip, including
Horizontal frame Cutting Road 7 and vertical frame Cutting Road 6, on horizontal frame Cutting Road 7 and vertical frame Cutting Road 6 be spaced digging have
Multiple dead slots.Dead slot is arranged at intervals on horizontal frame Cutting Road and vertical frame Cutting Road, is easy to the cutting of frame to separate behaviour
Make.
Specifically, spaced dead slot is vertical edge groove 602 on vertical frame Cutting Road 6, and is cut in vertical frame
Cut and transverse cuts locating slot 601 is additionally provided with 6, cutting between the transverse cuts locating slot 601 and adjacent chips installation portion 3
Cut position correspondence setting.
Similarly, spaced dead slot is horizontal edge groove 702 on horizontal frame Cutting Road 7, and is cut in horizontal frame
Cut and vertical cutting locating slot 701 is additionally provided with 7, cutting between the vertical cutting locating slot 701 and adjacent chips installation portion 3
Cut position correspondence setting.Cutting locating slot is set respectively on vertical frame Cutting Road and horizontal frame Cutting Road, is easy to chip
The positional dissection of installation portion, improve operating efficiency and avoid damage of product.
Further, muscle is connected between the adjacent transverse cutting locating slot 601 on vertical frame Cutting Road 6, the company
Muscle is vertical half rotten even muscle 603, and muscle is also connected between the adjacent vertical cutting locating slot 701 of horizontal frame Cutting Road 7, should
Even muscle is laterally half rotten even muscle 703.Vertical half rotten even muscle and laterally half rotten even muscle, the i.e. thickness for connecting muscle are corroded half,
While reinforcement Cutting Road structure is played, the cutting operation of more conducively follow-up frame.
Embodiment 3
As shown in Figures 1 to 4, the DFN1608 high density frameworks according to embodiment 1 or embodiment 2, the present embodiment
Chip installation portion 3 is rectangle, and the long side of all chip installation portions 3 is arranged in parallel with the short side of framework 1, adjacent chips installation portion 3
Company's muscle between long side is vertical dowel 5, and company's muscle between short side is lateral connection muscle 4.By the length of all chip installation portions
The short side of side and framework is arranged in parallel, and regular arrangement is advantageous to increase the utilization rate of framework matrix；And in adjacent chips
Vertical dowel and lateral connection muscle is set between installation portion, increases frame strength and the stability of each chip installation portion.
In the present embodiment, the vertical dowel 5 and lateral connection muscle 4 are half corrosion structure.Half corrosion structure erects
To dowel and lateral connection muscle, i.e., a part of thickness of Plate with web is removed, be easy to the operation for separating and cutting, reduce blade
Heat caused by cutting, and then avoid damage to chip product.
Further, the present embodiment is equipped with cross dowel 501, the cross on four angles of chip installation portion 3
Dowel 501 is arranged on the position that vertical dowel 5 and lateral connection muscle 4 intersect.Connect the vertical connection of muscle muscle connection using cross
The crossover location of muscle and lateral connection muscle, it can realize and more efficiently connect and cut lock out operation, improve production efficiency, also favorably
In the width dimensions for reducing vertical dowel and lateral connection muscle, the arrangement rate of raising chip installation portion.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (10)
1. a kind of DFN1608 high density framework, include the rectangular frame of platy structure, it is characterised in that set on framework multiple
The chip installation portion being adapted with DFN1608 encapsulating structures, the chip installation portion include chip placing area and pin weld zone,
It is polarity demarcation strip between the chip placing area and pin weld zone, separation gap is provided with polarity demarcation strip, by chip
Settlement and pin weld zone are separated, and separation is extended with from separation gap on the polarity demarcation strip close to pin weld zone side
Groove.
2. DFN1608 high density framework according to claim 1, it is characterised in that the width of the partition groove is with drawing
The position of pin is corresponding, all pins is respectively positioned on when passing through polarity demarcation strip in partition groove.
3. DFN1608 high density framework according to claim 2, it is characterised in that welded with pin in the chip placing area
The ratio between area's occupied area is connect more than 2.5:1.
4. DFN1608 high density framework according to claim 1, it is characterised in that in the frame and arrangement chip of framework
Region between be provided with a circle frame Cutting Road, including horizontal frame Cutting Road and vertical frame Cutting Road, in horizontal frame
Digging is spaced on Cutting Road and vertical frame Cutting Road multiple dead slots.
5. DFN1608 high density framework according to claim 4, it is characterised in that be spaced on vertical frame Cutting Road
The dead slot of setting is vertical edge groove, and transverse cuts locating slot is additionally provided with vertical frame Cutting Road, and the transverse cuts are determined
Cutting position between position groove and adjacent chips installation portion is correspondingly arranged.
6. DFN1608 high density framework according to claim 5, it is characterised in that be spaced on horizontal frame Cutting Road
The dead slot of setting is horizontal edge groove, and vertical cutting locating slot is additionally provided with horizontal frame Cutting Road, and the vertical cutting is fixed
Cutting position between position groove and adjacent chips installation portion is correspondingly arranged.
7. DFN1608 high density framework according to claim 6, it is characterised in that the phase on vertical frame Cutting Road
Muscle is connected between adjacent transverse cuts locating slot, this connects muscle for vertical half rotten even muscle, in the adjacent vertical of horizontal frame Cutting Road
Muscle is also connected between cutting locating slot, this connects muscle for laterally half rotten even muscle.
8. the DFN1608 high density frameworks according to one of claim 1-7, it is characterised in that the chip installation portion is
Rectangle, the long side of all chip installation portions and the short side of framework are arranged in parallel, and company's muscle between adjacent chips installation portion long side is
Vertical dowel, company's muscle between short side is lateral connection muscle.
9. DFN1608 high density framework according to claim 8, it is characterised in that the vertical dowel connects with horizontal
It is half corrosion structure to connect muscle.
10. DFN1608 high density framework according to claim 9, it is characterised in that on four angles of chip installation portion
Cross dowel is equipped with, the cross dowel is arranged on the position that vertical dowel and lateral connection muscle intersects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720739577.3U CN206834174U (en) | 2017-06-23 | 2017-06-23 | A kind of DFN1608 high density framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720739577.3U CN206834174U (en) | 2017-06-23 | 2017-06-23 | A kind of DFN1608 high density framework |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206834174U true CN206834174U (en) | 2018-01-02 |
Family
ID=60777889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720739577.3U Active CN206834174U (en) | 2017-06-23 | 2017-06-23 | A kind of DFN1608 high density framework |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206834174U (en) |
-
2017
- 2017-06-23 CN CN201720739577.3U patent/CN206834174U/en active Active
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