CN206250155U - One kind overlapping lead frame amendment tool - Google Patents
One kind overlapping lead frame amendment tool Download PDFInfo
- Publication number
- CN206250155U CN206250155U CN201621267850.9U CN201621267850U CN206250155U CN 206250155 U CN206250155 U CN 206250155U CN 201621267850 U CN201621267850 U CN 201621267850U CN 206250155 U CN206250155 U CN 206250155U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- overlapping
- depressed area
- cushion block
- etched regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses one kind overlapping lead frame amendment tool, including piece under pressure, cushion block, overlapping lead frame is provided between piece under pressure and cushion block, overlapping lead frame includes the copper bridge framework, chip and the lead frame that are sequentially overlapped, lead frame is provided with two parallel half-etched regions in the width direction, and structure of the lead frame between half-etched regions is recessed to copper bridge framework, cave inward to form depressed area in the middle part of the upper surface of cushion block, the width of depressed area is more than two distances of half-etched regions, less than the width of lead frame；When using, lead frame is positioned over the upper surface of cushion block, and the two ends of lead frame are located at outside depressed area, and two half-etched regions are respectively positioned in depressed area, and piece under pressure pushes copper bridge framework so that structure of the lead frame between half-etched regions is protruded to depressed area.Revised lead frame is in plastic packaging there is no space and the upper surface of lower mould between, it is to avoid excessive glue causes product rejection.
Description
Technical field
The utility model is related to the technical field of lead frame, more particularly to a kind of overlapping lead frame for overlapping lead frame
The positive tool of un-wheeling repair.
Background technology
In lead frame, there is a kind of overlapping lead frame, as depicted in figs. 1 and 2, overlapping lead frame 3 ' includes folding successively
Add lead frame 31 ', chip 32 ' and the copper bridge framework 33 ' put, lead frame 31 ' and chip 32 ', chip 32 ' and copper bridge frame
Welded together by tin cream between frame 33 ', because overlapping lead frame 3 ' requires lead frame in flip-chip welding
31 ' set half-etched regions 311 ' in the steady arm region of both sides in the width direction, by after half-etching, half-etched regions
311 ' thickness does not only carry out 30% of the thickness before half-etching.During subsequent reflow is welded, tin cream is by half flowing shape
State becomes solid-state, and volume contraction produces pulling force, due to the thickness ratio of copper bridge framework 33 ' to copper bridge framework 33 ' and lead frame 31 '
Thicker, the power of resistance to deformation is than larger, and lead frame 31 ' is easier to deform, and the half-etched regions 311 ' of lead frame 31 '
Thickness is smaller, therefore, as shown in figure 3, after Reflow Soldering, structure of the lead frame 31 ' between half-etched regions 311 ' can be to
Copper bridge framework 33 ' is recessed.It is follow-up carry out plastic packaging when, as shown in Figure 4 and Figure 5, overlapping lead frame 3 ' be placed on mould 41 ' and
Between lower mould 42 ', lead frame 31 ' is upwarped due to middle part, and gap is produced between the upper surface of meeting and lower mould 42 ', in plastic packaging mistake
Cheng Zhong, gap can produce excessive glue (plastic packaging colloid enters gap) phenomenon and cause product rejection.
Utility model content
The purpose of this utility model is to propose a kind of overlapping lead frame amendment tool, the overlapping lead frame that will deform
It is modified, it is to avoid in plastic packaging, excessive glue is scrapped.
It is that, up to this purpose, the utility model uses following technical scheme：
One kind overlapping lead frame amendment tool, including piece under pressure, cushion block, set between the piece under pressure and the cushion block
Overlapping lead frame is equipped with, the overlapping lead frame includes the copper bridge framework, chip and the lead frame that are sequentially overlapped, described to draw
Wire frame is provided with two parallel half-etched regions, and knot of the lead frame between half-etched regions in the width direction
Structure is recessed to the copper bridge framework, and the piece under pressure can downwards be close to or be upwardly away from the cushion block, the upper surface of the cushion block
Middle part cave inward to form depressed area, the width of the depressed area more than two distances of the half-etched regions, less than institute
State the width of lead frame；When using, the lead frame is positioned over the upper surface of the cushion block, the two ends of the lead frame
Outside the depressed area, two half-etched regions are respectively positioned in the depressed area, and the piece under pressure pushes the copper bridge
Framework so that structure of the lead frame between half-etched regions is protruded to the depressed area.
Wherein, the depth of the depressed area is 0.05mm-0.2mm.
Wherein, the depth of the depressed area is 0.12mm.
Wherein, two half-etched regions are set along the Central Symmetry of the depressed area.
Wherein, the bottom of the piece under pressure is convexly equipped with the protuberance for depressing the copper bridge framework, the protruding parts
Between two half-etched regions.
Wherein, the protuberance is set along the Central Symmetry of the depressed area.
Wherein, the edge of the overlapping lead frame is provided with location hole, is provided with the cushion block and the location hole
Corresponding locating dowel.
Wherein, multiple overlapping lead frames connect to form overlapping lead frame assembly side by side, and the location hole is located at described
The edge of lead frame assembly is overlapped, the cushion block is provided with the depression in the respective regions of each lead frame
Area.
Beneficial effect：The utility model provides a kind of overlapping lead frame amendment tool, including piece under pressure, cushion block,
Overlapping lead frame is provided between the piece under pressure and the cushion block, the overlapping lead frame includes the copper bridge being sequentially overlapped
Framework, chip and lead frame, the lead frame are provided with two parallel half-etched regions in the width direction, and described
Structure of the lead frame between half-etched regions is recessed to the copper bridge framework, and the piece under pressure can be close to downwards or remote upwards
From the cushion block, cave inward to form depressed area in the middle part of the upper surface of the cushion block, the width of the depressed area is more than two
The distance of the half-etched regions, less than the width of the lead frame；When using, the lead frame is positioned over the cushion block
Upper surface, the two ends of the lead frame are located at outside the depressed area, and two half-etched regions are respectively positioned on the depression
In area, the piece under pressure pushes the copper bridge framework so that structure of the lead frame between half-etched regions is to described
Protrude depressed area.Structure by lead frame between half-etched regions is modified to away from copper bridge frame from Xiang Tongqiao frameworks protrusion
After the protrusion of frame direction, in plastic packaging, the first upper surface with lower mould of structure between the half-etched regions of lead frame, half loses
The region for carving region exterior press against fixation by the both sides of lower mould, there is no space between lead frame and the upper surface of lower mould, keep away
Exempting from excessive glue causes product rejection.
Brief description of the drawings
Fig. 1 is the top view of the overlapping lead frame of prior art.
Fig. 2 is the A-A of Fig. 1 to sectional view.
Fig. 3 is the schematic diagram after the deformation of the overlapping lead frame of prior art.
Fig. 4 is the overlapping lead frame structural representation in a mold of prior art.
Fig. 5 is the partial enlarged drawing at the B of Fig. 4.
Fig. 6 is overlapping lead frame and the structural representation for correcting tool in the utility model.
Fig. 7 is the partial enlarged drawing at the C of Fig. 6.
Fig. 8 is revised overlapping lead frame of the present utility model structural representation in a mold.
Wherein：
1- piece under pressures, 11- protuberances, 2- cushion blocks, 21- depressed areas, 3- overlapping lead frames, 31- lead frames, 311- half
Etching area, 32- chips, 33- copper bridge frameworks, the upper moulds of 41-, mould under 42-, 3 '-overlapping lead frame, 31 '-lead frame,
311 '-half-etched regions, 32 '-chip, 33 '-copper bridge framework, 41 '-upper mould, 42 '-lower mould,
Specific embodiment
It is that the technical problem for solving the utility model, the technical scheme for using and the technique effect for reaching are clearer,
Further illustrate the technical solution of the utility model below in conjunction with the accompanying drawings and by specific embodiment.
Embodiment 1
A kind of overlapping lead frame amendment tool is present embodiments provided, as shown in Figure 6 and Figure 7, including piece under pressure 1, pad
Block 2, is provided with overlapping lead frame 3 between piece under pressure 1 and cushion block 2, and overlapping lead frame 3 includes the copper bridge frame being sequentially overlapped
Frame 33, chip 32 and lead frame 31, lead frame 33 are provided with two parallel half-etched regions 311 in the width direction, and
Structure of the lead frame 31 between half-etched regions 311 is recessed to copper bridge framework 33, and piece under pressure 1 can be close to downwards or remote upwards
From cushion block 2, cave inward to form depressed area 21 in the middle part of the upper surface of cushion block 2, the width of depressed area 21 is more than two half-etchings
The distance in region 311, less than the width of lead frame 31；When using, lead frame 31 is positioned over the upper surface of cushion block 2, lead
The two ends of framework 31 are located at outside depressed area 21, and two half-etched regions 311 are respectively positioned in depressed area 21, and piece under pressure 1 pushes copper bridge
Framework 33 so that structure of the lead frame 31 between half-etched regions 311 is protruded to depressed area 21.By lead frame 31 half
Structure between etching area 311 is modified to after being protruded away from copper bridge framework direction 33 from the protrusion of Xiang Tongqiao frameworks 33, in modeling
Feng Shi, as shown in figure 8, the first upper surface with lower mould 42 of structure between the half-etched regions 311 of lead frame 31, half loses
Carve the region outside region 311 and press against fixation by the both sides of lower mould 42, between lead frame 31 and the upper surface of lower mould 42 no longer
There is space, it is to avoid excessive glue causes product rejection.
Because the size for overlapping lead frame 3 itself is smaller, in the present embodiment, the depth of depressed area 21 should not be higher than
0.2mm, it is to avoid the structure between the half-etched regions 311 of lead frame 31 is reversely protruded (i.e. towards the side away from copper bridge framework 33
To protrusion) too many and cause lead frame 31 to damage, the depth of depressed area 21 also not preferably less than 0.05mm, otherwise cannot be by lead
Structure between the half-etched regions 311 of framework 31 is reversely protruded.The depth of depressed area 21 can select to compare conjunction in 0.12mm
It is suitable.Certainly, the depth of depressed area 21 can also be adjusted according to the size of overlapping lead frame 3 itself and practical distortion amount.
In the present embodiment, two half-etched regions 311 are set along the Central Symmetry of depressed area 21, during amendment, can
To ensure that lead frame 311 keeps symmetric deformation as far as possible, minimum point (point that evagination most protrudes) is allowed to be located at two half-etchings as far as possible
The centre in region 311, is adjacent to the upper surface of lower mould 4 during beneficial to follow-up plastic packaging.The bottom of piece under pressure 1 be convexly equipped with for depressing
The protuberance 11 of copper bridge framework 33, protuberance 11 is located between two half-etched regions 311, and protuberance 11 can be by copper bridge framework
33 stress point is concentrated between two half-etched regions 311 of lead frame 31, beneficial to copper bridge framework 33 from centre to lead
Framework 31 exerts a force, by the structure evagination between two half-etched regions 311 of lead frame 31.Similarly, protuberance 11 is along depression
The Central Symmetry in area 21 is set, and can as far as possible ensure that lead frame 311 keeps symmetric deformation, and lower mould is adjacent to during beneficial to follow-up plastic packaging
4 upper surface.
, it is necessary to be positioned to overlapping lead frame 3 during amendment, it is to avoid overlapping lead frame 3 is moved, Ke Yi
The edge for overlapping lead frame 3 is provided with location hole, and locating dowel corresponding with location hole is provided with cushion block 2.By positioning
Post coordinates positioning with location hole.In fact, overlapping lead frame 3 is small-sized, it is often multiple to overlap lead frames 3 side by side
Connection forms overlapping lead frame assembly, and location hole is located at the edge of overlapping lead frame assembly, and cushion block 2 is in each lead frame
31 respective regions are provided with depressed area 21, realize a collection of overlapping lead frame (often in number by location hole and locating dowel
Hundred) positioning, then by the cooperation of cushion block 2 and piece under pressure 41, once to the lead frame amendment of a batch of overlapping, greatly
Improve amendment efficiency.
Above content is only preferred embodiment of the present utility model, for one of ordinary skill in the art, according to this reality
With new thought, will change in specific embodiments and applications, this specification content should not be construed as
To limitation of the present utility model.
Claims (8)
1. it is a kind of to overlap lead frame amendment tool, it is characterised in that including piece under pressure (1), cushion block (2), in the piece under pressure
(1) it is provided with and the cushion block (2) between overlapping lead frame (3), overlapping lead frame (3) includes the copper that is sequentially overlapped
Bridge framework (33), chip (32) and lead frame (31), the lead frame (33) be provided with the width direction two it is parallel
Half-etched regions (311), and structure of the lead frame (31) between half-etched regions (311) is to the copper bridge framework
(33) it is recessed, the piece under pressure (1) can downwards be close to or be upwardly away from the cushion block (2), in the upper surface of the cushion block (2)
Portion caves inward to form depressed area (21), the width of the depressed area (21) more than two half-etched regions (311) away from
From less than the width of the lead frame (31)；When using, the lead frame (31) is positioned over the upper table of the cushion block (2)
Face, the two ends of the lead frame (31) are located at the depressed area (21) outward, and two half-etched regions (311) are respectively positioned on institute
State in depressed area (21), the piece under pressure (1) pushes the copper bridge framework (33) so that the lead frame (31) is in half-etching
Structure between region (311) is protruded to the depressed area (21).
2. overlapping lead frame amendment tool as claimed in claim 1, it is characterised in that the depth of the depressed area (21) is
0.05mm-0.2mm。
3. overlapping lead frame amendment tool as claimed in claim 2, it is characterised in that the depth of the depressed area (21) is
0.12mm。
4. the overlapping lead frame amendment tool as described in claim any one of 1-3, it is characterised in that two half-etchings
Region (311) is set along the Central Symmetry of the depressed area (21).
5. the overlapping lead frame amendment tool as described in claim any one of 1-3, it is characterised in that the piece under pressure (1)
Bottom be convexly equipped with protuberance (11) for depressing the copper bridge framework (33), the protuberance (11) is positioned at two described half
Between etching area (311).
6. it is as claimed in claim 5 to overlap lead frame amendment tool, it is characterised in that the protuberance (11) is along described recessed
The Central Symmetry for falling into area (21) is set.
7. the overlapping lead frame amendment tool as described in claim any one of 1-3, it is characterised in that the overlapping lead frame
The edge of frame (3) is provided with location hole, and locating dowel corresponding with the location hole is provided with the cushion block (2).
8. overlapping lead frame amendment tool as claimed in claim 7, it is characterised in that multiple overlapping lead frame (3) and
Row's connection forms overlapping lead frame assembly, and the location hole is located at the edge of the overlapping lead frame assembly, the cushion block
(2) respective regions in each lead frame (31) are provided with the depressed area (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621267850.9U CN206250155U (en) | 2016-11-23 | 2016-11-23 | One kind overlapping lead frame amendment tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621267850.9U CN206250155U (en) | 2016-11-23 | 2016-11-23 | One kind overlapping lead frame amendment tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206250155U true CN206250155U (en) | 2017-06-13 |
Family
ID=59002200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621267850.9U Expired - Fee Related CN206250155U (en) | 2016-11-23 | 2016-11-23 | One kind overlapping lead frame amendment tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206250155U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110767610A (en) * | 2019-10-15 | 2020-02-07 | 四川豪威尔信息科技有限公司 | Integrated circuit and manufacturing method thereof |
| CN117038475A (en) * | 2023-10-09 | 2023-11-10 | 四川明泰微电子有限公司 | Chip orthopedic device |
-
2016
- 2016-11-23 CN CN201621267850.9U patent/CN206250155U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110767610A (en) * | 2019-10-15 | 2020-02-07 | 四川豪威尔信息科技有限公司 | Integrated circuit and manufacturing method thereof |
| CN110767610B (en) * | 2019-10-15 | 2021-06-25 | 四川豪威尔信息科技有限公司 | Integrated circuit and manufacturing method thereof |
| CN117038475A (en) * | 2023-10-09 | 2023-11-10 | 四川明泰微电子有限公司 | Chip orthopedic device |
| CN117038475B (en) * | 2023-10-09 | 2024-01-23 | 四川明泰微电子有限公司 | Chip orthopedic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170613 Termination date: 20171123 |