CN203565661U

CN203565661U - Forming die of double-row flat packaging chip pins

Info

Publication number: CN203565661U
Application number: CN201320696116.4U
Authority: CN
Inventors: 宗红军; 徐媛; 李秀梅; 张鹏; 何丽娟
Original assignee: Tianjin Embedtec Co Ltd
Current assignee: Tianjin Embedtec Co Ltd
Priority date: 2013-11-06
Filing date: 2013-11-06
Publication date: 2014-04-30
Anticipated expiration: 2023-11-06

Abstract

The utility model discloses a forming die of double-row flat packaging chip pins. The forming die is characterized in that the forming die comprises a bottom die and an upper die, wherein the bottom die comprises a bottom die base body, pin supporting beams and two positioning columns; the upper die comprises an upper die base body, chip concave cavities and two positioning holes; the positioning columns of the bottom die are matched with the positioning holes of the upper die, and centering and alignment between the bottom die and the upper die are guaranteed; the chip pins are supported by the pin supporting beams on the bottom die, and one chip concave cavity is formed between every two pin supporting beams; the upper die can move up and down along the positioning columns of the bottom die, and the chip pins can be stamped and formed.

Description

A kind of mould of double flat packaged chip pin

Technical field

The utility model relates to chip manufacture technology, particularly a kind of mould of double flat packaged chip pin.

Background technology

Chip pin mould is a kind of novel die that comes from surface mounting technology Demand Design, for the axial straight pin of chip is processed into can surface mount the pin shape of welding.The quality of chip pin moulding directly affects welding quality and the reliability of chip.Chip pin moulding is the important step of surface mount weld preparation work, requires the high conformity of pin after moulding, and coplanarity is good.But traditional pin forming method adopts manual tweezers moulding, easy damaged pin, and pin forming uniformity is low, and coplanarity is poor, is unfavorable for the welding quality of chip pin.

Utility model content

For prior art deficiency, the technical problem that the utility model quasi-solution is determined is that a kind of mould of double flat packaged chip pin is provided.This mould has simple in structure, easy to operate, and shaping speed is fast, and production efficiency is high, can not damage chip pin, and guarantees welding quality.

The technical scheme that the utility model solve the technical problem is, designs a kind of mould of double flat packaged chip pin, it is characterized in that this mould comprises bed die and patrix, and bed die comprises bed die matrix, two pin brace summers and two locating dowels; Patrix comprises patrix matrix, chip cavity and two locating holes; The locating dowel of bed die and the locating hole of patrix coupling, and guarantee bed die and patrix contraposition placed in the middle; Pin brace summer supporting chip pin on bed die, and between two pin brace summers, form chip chamber; Patrix can move up and down along the locating dowel of bed die, realizes the punch forming of chip pin.

Compared with prior art, the utility model mould has the following advantages:

1. in this mould design, pin brace summer has certain angle of inclination, and the partial design contacting with pin has fillet, therefore can not cause damage to chip pin; Simultaneously bed die and patrix contact-making surface are smooth, guarantee position level after pin forming, guarantee welding quality.

2. this forming die structure is simple, easy to operate, and shaping speed is fast, can enhance productivity, and guarantee chip solderability.

Accompanying drawing explanation

Fig. 1 is the completed state schematic diagram of a kind of embodiment of the utility model mould;

Fig. 2 is the bed die perspective view of a kind of embodiment of the utility model mould;

Fig. 3 is the patrix perspective view of a kind of embodiment of the utility model mould;

Fig. 4 is the cross section structure for amplifying schematic diagram of Fig. 2 of a kind of embodiment of the utility model mould;

Fig. 5 is the cross section structure for amplifying schematic diagram of Fig. 3 of a kind of embodiment of the utility model mould;

Fig. 6 is the shape schematic diagram that leaves spacing between the patrix cavity seamed edge of a kind of embodiment of the utility model mould and bed die pin brace summer;

Fig. 7 is the chip moulding pre-structure schematic diagram of a kind of embodiment of the utility model mould;

Fig. 8 is structural representation after the chip moulding of a kind of embodiment of the utility model mould.

The specific embodiment

Below in conjunction with embodiment and accompanying drawing thereof, further describe the utility model.

The mould (being called for short mould, referring to Fig. 1-8) of the double flat packaged chip pin of the utility model design, is characterized in that this mould comprises bed die and patrix, and bed die comprises bed die matrix 1, two pin brace summers 2 and two locating dowels 3; Patrix comprises patrix matrix 5, chip cavity 6 and two locating holes 7; Locating hole 7 on locating dowel 3 and patrix on bed die mates, and guarantees bed die and patrix contraposition placed in the middle, the pin brace summer 2 supporting chip pins 9 on bed die, and between two pin brace summers 2, form chip chamber 10; Patrix can move up and down along the locating dowel of bed die 3, realizes the punch forming of chip pin 9.

For handled easily, guarantee product quality, further feature of the present utility model is, and the lateral surface of described pin brace summer 2 slopes inwardly, and inclined plane becomes 60～85 ° of angles with bed die matrix, the top rounding (referring to Fig. 4) of pin brace summer 2.

Further feature of the present utility model is between the edge of chip cavity 6 and pin brace summer 2 bottom outer edge, to leave the spacing (referring to Fig. 6) of 0.5～1mm.

Further feature of the present utility model is, seamed edge 8 roundings (referring to Fig. 5) of patrix chip cavity 6.

Mould of the present utility model is applicable to process the pin forming of the axial straight pin chip of double flat package.Spacing (size in chip chamber 10 in other words) between the height of described pin brace summer 2 and two pin brace summers 2 is determined according to chip body dimension.In other words, the utility model mould is applicable to process a series of chip pin.

Operation principle and the process of the utility model mould are:

Within first chip 4 being positioned over to the chip chamber 10 of 2 of two pin brace summers, then the locating hole 7 of patrix is aimed to bed die locating dowel 3, patrix is moved downward along locating dowel 3, seamed edge 8 fillets of patrix chip cavity 6 touch chip pin 9; During punching press, the downward punching press chip pin 9 of patrix, until patrix moves to bottom, completes the punch forming of chip pin 9.In punch forming process, the seamed edge 8 of described cavity 6 can not touch chip body, and described pin brace summer 2 is also supporting chip pin 9 simultaneously, guarantees that the root of chip pin 9 is not subject to external force; The design edge of cavity 6 and the bottom outer edge of pin brace summer 2 leave the spacing of 0.5～1mm, can guarantee that forming process can not have shearing force to chip pin 9, add seamed edge 8 roundings of cavity 6, also can not damage chip pin 9 during moulding; Because the working surface of patrix matrix 5 and bed die matrix 1 is straight smooth, during punch forming, patrix and bed die clamp chip pin 9, can guarantee the glacing flatness of chip pin 9 again, and it is in same plane (referring to Fig. 7,8), guarantee product quality.

Experiment shows, the chip pin mould that application the utility model proposes, and the damage pin in the time of can effectively solving pin forming and affect the poor problem of lead coplanarity is raised the efficiency simultaneously.

Claims

1. a mould for double flat packaged chip pin, is characterized in that this mould comprises bed die and patrix, and bed die comprises bed die matrix, pin brace summer and two locating dowels; Patrix comprises patrix matrix, chip cavity and two locating holes; The locating dowel of bed die and the locating hole of patrix coupling, and guarantee bed die and patrix contraposition placed in the middle; Pin brace summer supporting chip pin on bed die, and between two pin brace summers, form chip chamber; Patrix can move up and down along the locating dowel of bed die, realizes the punch forming of chip pin.

2. the mould of double flat packaged chip pin according to claim 1, is characterized in that the lateral surface of described pin brace summer slopes inwardly, and inclined plane becomes 60～85 ° of angles, the top rounding of pin brace summer with bed die matrix.

3. the mould of double flat packaged chip pin according to claim 1, is characterized in that leaving between the edge of described chip cavity and pin brace summer bottom outer edge the spacing of 0.5～1mm.

4. the mould of double flat packaged chip pin according to claim 1, is characterized in that the seamed edge rounding of described patrix chip cavity.