CN106298560A - Leads of IC forming device - Google Patents
Leads of IC forming device Download PDFInfo
- Publication number
- CN106298560A CN106298560A CN201610863979.4A CN201610863979A CN106298560A CN 106298560 A CN106298560 A CN 106298560A CN 201610863979 A CN201610863979 A CN 201610863979A CN 106298560 A CN106298560 A CN 106298560A
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- CN
- China
- Prior art keywords
- draw
- chip
- groove
- leads
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
Leads of IC forming device, relate to leads of IC forming technique field, solve existing IC chip hand finishing device exist be easily generated cooperation the tightest, cause tiny dislocation between mould, and then cause lead forming there is error and affect the problems such as forming quality, including die ontology, cover plate, tiltedly split and retaining mechanism；Die ontology includes mold base, mold base makes two parallel draw-in groove sidewalls, along the upper forming angle of outside processing on draw-in groove sidewall, lower forming angle at draw-in groove side-wall outer side with the processing of mold base junction, it is chip draw-in groove between draw-in groove sidewall, by retaining mechanism, die ontology is fixed with cover plate, chip clamping will be shaped by die ontology with cover plate, use tiltedly to split and from top to bottom depress along draw-in groove side-wall outer side, make chip lead prolong upper and lower forming angle and shape.Forming device of the present invention, its die ontology has mould and coordinates tight, simple in construction and reduce lead forming error.
Description
Technical field
The present invention relates to leads of IC forming technique field, be specifically related to leads of IC forming device, mainly
For QFP, aerofoil profile encapsulation leads of IC are shaped.
Background technology
At present, straight wire device is to use more a kind of packing forms in high reliability product, needs it is carried out two
Secondary shaping processes, and the parameter such as die size, lead thicknesses integrated circuit within the specific limits can be entered by all kinds of formers
Row shapes, but for the shaping of non-standard device, equipment shapes and can not meet the shaping of all of leads of IC, generally uses
Solution be design frock to carry out manual shaping operation.
It is not tight that traditional simple hand forming device is easily generated cooperation, causes tiny dislocation between mould, causes going between into
Shape error, affects forming quality, reduces crudy, extends manufacture cycle, and increases manufacturing cost.
Summary of the invention
The present invention is to solve that existing IC chip hand finishing device exists and be easily generated cooperation sternly, cause mould
Between tiny dislocation, and then cause lead forming there is error and affect the problems such as forming quality, it is provided that leads of IC
Forming device.
Leads of IC forming device, including die ontology, cover plate, tiltedly splits and retaining mechanism；Described die ontology bag
Include mold base, described mold base makes two parallel draw-in groove sidewalls, described draw-in groove sidewall is processed along outside
Upper forming angle, at the lower forming angle of described draw-in groove side-wall outer side and mold base junction processing, between described draw-in groove sidewall
For chip draw-in groove, by retaining mechanism, die ontology is fixed with cover plate, chip clamping will be shaped by die ontology with cover plate,
Use tiltedly to split and from top to bottom depress along draw-in groove side-wall outer side, make chip lead vertically forming angle shape.
Beneficial effects of the present invention:
One, the present invention uses retaining mechanism Fixed Design, improves mould entirety compatible degree, improves forming quality.
Two, the one-body molded design of die ontology of the present invention, is easy to fast assembling-disassembling, carries between simple in construction, and cover plate
High efficiency, shortens the manufacturing cycle.
Three, hand finishing device of the present invention, it is adaptable to the batch hand finishing of QFP, aerofoil profile encapsulation integrated circuit,
By change die size, the IC chip hand finishing of different package size had universality and the property used for reference.
Four, hand finishing device of the present invention, its die ontology has mould and coordinates tight, simple in construction and subtract
Few lead forming error.
Accompanying drawing explanation
Fig. 1 is the structural representation of die ontology in leads of IC forming device of the present invention；
Fig. 2 is the structural representation of leads of IC forming device cover plate of the present invention；
Fig. 3 is the installation diagram of leads of IC forming device of the present invention；
Fig. 4 is the structural representation tiltedly split in leads of IC forming device of the present invention；
Fig. 5 is the operation chart of leads of IC forming device of the present invention.
In figure: 1, mold base, 2, edge on draw-in groove sidewall, 3, upper forming angle, 4, lower forming angle, 5, mould screw fixes
Hole, 6, chip draw-in groove, 7, cover plate, edge under 7-1, cover plate, 8-cover screw fixing hole, 9-M3 screw, 10-tiltedly splits.
Detailed description of the invention
Detailed description of the invention one, combining Fig. 1 to Fig. 5 present embodiment is described, leads of IC forming device, including mould
Tool body, cover plate 7, tiltedly split 10 and retaining mechanism；Described die ontology includes mold base 1, makes on described mold base 1
Two parallel draw-in groove sidewalls 2, along the upper forming angle 3 of processing outside 2-1 on described draw-in groove sidewall, at described draw-in groove sidewall 2
The lower forming angle 4 that outside processes with mold base 1 junction, is chip draw-in groove 6 between described draw-in groove sidewall 2, by locking machine
Structure will shape chip clamping by fixing with cover plate 2 for die ontology, and employing is tiltedly split 10 and from top to bottom depressed outside draw-in groove sidewall 2,
Make chip lead prolong upper and lower forming angle to shape.
Retaining mechanism described in present embodiment is made up of M3*12 screw 9 or wing nut, at described chip draw-in groove 6
Upper symmetrical punching 5；Described cover plate 7 is offered screw fixed hole 8, when die ontology and cover plate 7 agree with, uses screw 9 or butterfly
Shape nut is fixed with the screw fixed hole 7-1 on cover plate 7 by die ontology.
The width of the chip draw-in groove 6 described in present embodiment with shape chip width identical, the degree of depth of chip draw-in groove 6 by
The outlet method and the body thickness that shape chip determine, the height of described draw-in groove sidewall 2 and thickness have control and shapes chip shoulder
Wide, the high and effect of forming angle radius of standing, draw-in groove sidewall is determined along 2-1 width by the shoulder breadth shaping chip.
Upper forming angle 3 and lower forming angle 4 in present embodiment are as required in top and the bottom at draw-in groove side-wall outer side
It is not processed into arc to be formed, leaves the inclination angle of 3 to 5 ° between described mold base 1 and lower forming angle 4, stay for chip lead resilience
Go out certain surplus.
Under cover plate described in present embodiment along 7-1 width with on draw-in groove sidewall along 2-1 shoulder breadth keep consistent, described
Die ontology, cover plate and the material tiltedly split are aluminum workpiece.
Present embodiment carries out fillet process to the described sharp corner tiltedly splitting 10, prevents from lead-in wire is caused damage.
Hand finishing device described in present embodiment can be applicable to the ic core of the multiple encapsulation such as QFP, aerofoil profile
Sheet shapes.
Detailed description of the invention two, combining Fig. 5 present embodiment is described, present embodiment is to use detailed description of the invention one institute
The leads of IC forming device stated, to shaping the example that chip forms:
Before carrying out chip shaping, being put into by chip to be formed in chip draw-in groove 6, chip both sides lead-in wire rides over draw-in groove sidewall
On along 2-1, cover plate 7 is covered, fastens with M3 screw, make to combine consolidation between die ontology, chip, cover plate 7.
During shaping, first with tiltedly split 10 prolong chip-side lead-in wire be from top to bottom close to draw-in groove side-wall outer side pressure, make lead-in wire
Prolong upper and lower forming angle and become the shape meeting form finding design.
After completing side shaping, then the chip lead of opposite side is formed, shape after terminating as required by unnecessary
Lead-in wire wipes out to meet the length of bonding pad of chip package.
Claims (8)
1. leads of IC forming device, including die ontology, cover plate (7), tiltedly splits (10) and retaining mechanism, it is characterized in that；
Described die ontology includes mold base (1), makes two parallel draw-in groove sidewalls (2) on described mold base,
Along the upper forming angle (3) of (2-1) outside processing on described draw-in groove sidewall, at described draw-in groove sidewall (2) outside and mold base (1)
The lower forming angle (4) of junction processing, is chip draw-in groove (6) between described draw-in groove sidewall (2), by retaining mechanism by mould originally
Body is fixed with cover plate (7), by die ontology with cover plate (7) by chip clamping to be formed, uses and tiltedly splits (10) along draw-in groove sidewall
(2) outside is from top to bottom depressed, and makes chip lead to be formed shape along upper forming angle (3) and lower forming angle (4).
Leads of IC forming device the most according to claim 1, it is characterised in that described retaining mechanism by screw and
Nut forms, symmetrical punching (5) on described chip draw-in groove；Described cover plate (7) is offered screw fixed hole (8), passes through spiral shell
Die ontology is fixed by nail nut with cover plate.
Leads of IC forming device the most according to claim 1, it is characterised in that along (7-1) under described cover plate
Width is identical with the width on edge (2-1) on draw-in groove sidewall.
Leads of IC forming device the most according to claim 1, it is characterised in that the width of described chip draw-in groove (6)
Spending identical with Chip-wide to be formed, the degree of depth of chip draw-in groove (6) is by the outlet method of chip to be formed and chip body thickness
Determine.
Leads of IC forming device the most according to claim 1, it is characterised in that wide along (2-1) on draw-in groove sidewall
Spend and determined by the shoulder breadth of chip to be formed.
Leads of IC forming device the most according to claim 1, it is characterised in that described upper forming angle (3) and under
Forming angle (4) is processed into arc, leaves the inclination angle of 3 to 5 ° between described mold base (1) and lower forming angle (4).
Leads of IC forming device the most according to claim 1, it is characterised in that tiltedly split (10) sharp corner to described
Carry out fillet process.
Leads of IC forming device the most according to claim 1, it is characterised in that described die ontology, cover plate (7)
Tiltedly split (10) and be aluminum workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610863979.4A CN106298560A (en) | 2016-09-29 | 2016-09-29 | Leads of IC forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610863979.4A CN106298560A (en) | 2016-09-29 | 2016-09-29 | Leads of IC forming device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106298560A true CN106298560A (en) | 2017-01-04 |
Family
ID=57716482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610863979.4A Pending CN106298560A (en) | 2016-09-29 | 2016-09-29 | Leads of IC forming device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106298560A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112453262A (en) * | 2020-11-17 | 2021-03-09 | 中国科学院长春光学精密机械与物理研究所 | Lead forming device for integrated circuit |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030162330A1 (en) * | 2002-02-27 | 2003-08-28 | Sanyo Electric Co., Ltd. | Method for manufacturing a semiconductor device |
| CN1534747A (en) * | 2003-03-27 | 2004-10-06 | �¹������ҵ��ʽ���� | Device and method for mfg. leal wire frame formed by pressure and formed lead wire frame |
| CN101312112A (en) * | 2007-05-21 | 2008-11-26 | 中芯国际集成电路制造(上海)有限公司 | Chip packaging outer lead wire molding die |
| JP2009272491A (en) * | 2008-05-08 | 2009-11-19 | Musashi Eng Co Ltd | Jig for aligning leadframe |
| CN202239431U (en) * | 2011-08-29 | 2012-05-30 | 江阴康强电子有限公司 | Forging and pressing forming mold for copper strips |
| CN202239159U (en) * | 2011-08-29 | 2012-05-30 | 江阴康强电子有限公司 | Height limiting device for lead frame punch forming equipment |
| CN102909268A (en) * | 2012-09-20 | 2013-02-06 | 浙江捷华电子有限公司 | Concave pit notching and cutting composite mould for integrated chip lead frame |
| CN203565661U (en) * | 2013-11-06 | 2014-04-30 | 天津市英贝特航天科技有限公司 | Forming die of double-row flat packaging chip pins |
| CN203721685U (en) * | 2014-01-23 | 2014-07-16 | 珠海格力电器股份有限公司 | Lead bonding machine and metal base thereof |
-
2016
- 2016-09-29 CN CN201610863979.4A patent/CN106298560A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030162330A1 (en) * | 2002-02-27 | 2003-08-28 | Sanyo Electric Co., Ltd. | Method for manufacturing a semiconductor device |
| CN1534747A (en) * | 2003-03-27 | 2004-10-06 | �¹������ҵ��ʽ���� | Device and method for mfg. leal wire frame formed by pressure and formed lead wire frame |
| CN101312112A (en) * | 2007-05-21 | 2008-11-26 | 中芯国际集成电路制造(上海)有限公司 | Chip packaging outer lead wire molding die |
| JP2009272491A (en) * | 2008-05-08 | 2009-11-19 | Musashi Eng Co Ltd | Jig for aligning leadframe |
| CN202239431U (en) * | 2011-08-29 | 2012-05-30 | 江阴康强电子有限公司 | Forging and pressing forming mold for copper strips |
| CN202239159U (en) * | 2011-08-29 | 2012-05-30 | 江阴康强电子有限公司 | Height limiting device for lead frame punch forming equipment |
| CN102909268A (en) * | 2012-09-20 | 2013-02-06 | 浙江捷华电子有限公司 | Concave pit notching and cutting composite mould for integrated chip lead frame |
| CN203565661U (en) * | 2013-11-06 | 2014-04-30 | 天津市英贝特航天科技有限公司 | Forming die of double-row flat packaging chip pins |
| CN203721685U (en) * | 2014-01-23 | 2014-07-16 | 珠海格力电器股份有限公司 | Lead bonding machine and metal base thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112453262A (en) * | 2020-11-17 | 2021-03-09 | 中国科学院长春光学精密机械与物理研究所 | Lead forming device for integrated circuit |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170104 |
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| WD01 | Invention patent application deemed withdrawn after publication |