CN205739310U - A kind of feeding-distribution device of semiconductor lead frame - Google Patents
A kind of feeding-distribution device of semiconductor lead frame Download PDFInfo
- Publication number
- CN205739310U CN205739310U CN201620698758.1U CN201620698758U CN205739310U CN 205739310 U CN205739310 U CN 205739310U CN 201620698758 U CN201620698758 U CN 201620698758U CN 205739310 U CN205739310 U CN 205739310U
- Authority
- CN
- China
- Prior art keywords
- main body
- sub
- material main
- feeding
- distribution device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Lead Frames For Integrated Circuits (AREA)
Abstract
This utility model provides the feeding-distribution device of a kind of semiconductor lead frame, this feeding-distribution device includes interconnective point mouth and sub-material main body, sub-material main body is cuboid, point mouth is identical with the end surface shape of sub-material main body with the end face that sub-material main body connects, the upper and lower surface of point mouth is with the long limit isosceles triangle as base of point mouth end face, and upper surface constitutes circular arc inclined-plane along the axial length of sub-material main body, the dual-side of upper surface with the dual-side of lower surface along the lower surface that is shorter in length than that sub-material main body is axial.By the way, two lead frames can be separated enough distances by this utility model.
Description
Technical field
This utility model relates to semiconductor lead frame processing technique field, particularly relates to a kind of semiconductor lead frame
Feeding-distribution device.
Background technology
The lead frame of semiconductor separation part currently mainly has chip and two kinds of punching press rewinding techniques of rolling, rolling punching press
Rewinding technique is exactly not cut off after direct punching press, uses disk coiled strip, and chip punching press rewinding technique is then according to product requirement
Length, cuts into lamellar the most strip punching.For chip punching press rewinding technique, it is contemplated that the utilization rate of material, punching
During compression mould design, it is desirable to the copper product width of use is the least, and the required distance between two lead frames is designed as
2mm.In order to improve production efficiency, chip punching press rewinding technique is used to need when producing to use automatic material receptacle, automatic material receptacle
Require to have between two lead frames enough distances (much larger than 2mm), just can ensure that two lead frames receive difference respectively
Two magazines in.
Utility model content
This utility model is mainly solving the technical problems that provide the feeding-distribution device of a kind of semiconductor lead frame, it is possible to will
Article two, lead frame separates enough distances.
For solving above-mentioned technical problem, the technical scheme that this utility model uses is: provide a kind of semiconductor leads
The feeding-distribution device of framework, described feeding-distribution device includes interconnective point mouth and sub-material main body, and described sub-material main body is rectangular
The bodily form, described point mouth is identical with the end surface shape of described sub-material main body with the end face that described sub-material main body connects, described point mouth
The upper and lower surface in portion is with the long limit isosceles triangle as base of described point mouth end face, and described upper surface edge
What described sub-material main body was axial be shorter in length than described lower surface is along the axial length of described sub-material main body, the both sides of described upper surface
Limit constitutes circular arc inclined-plane with the dual-side of described lower surface.
Preferably, the lower section of described sub-material main body offers lightening grooves.
Preferably, described sub-material main body offers two away from the end face of described point mouth and is connected with described lightening grooves
Screw.
Preferably, described point mouth is one-body molded with sub-material main body.
Being different from the situation of prior art, the beneficial effects of the utility model are: put by the tip of point mouth lower surface
Putting and guide two lead frames to separate between two lead frames, the circular arc inclined-plane of point mouth both sides is again by two lead frames
Separately, two lead frames are kept enough distances to frame by sub-material main body such that it is able to separate enough by two lead frames
Distance.
Accompanying drawing explanation
Fig. 1 is the schematic front view of the feeding-distribution device of this utility model embodiment semiconductor lead frame.
Fig. 2 is the schematic top plan view of Fig. 1.
Fig. 3 is the cross-sectional schematic in the A-A direction of Fig. 2.
Fig. 4 is the feeding-distribution device of this utility model embodiment semiconductor lead frame schematic diagram when specifically applying.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the present utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under making creative work premise
The every other embodiment obtained, broadly falls into the scope of this utility model protection.
Seeing Fig. 1 to Fig. 3, the feeding-distribution device of the semiconductor lead frame of this utility model embodiment includes interconnective
Point mouth 1 and sub-material main body 2, sub-material main body 2 be cuboid, end face that point mouth 1 is connected with sub-material main body 2 and sub-material main body
The end surface shape of 2 is identical, say, that the end face that point mouth 1 is connected with sub-material main body 2 is rectangle.In the present embodiment, point
Mouth 1 is one-body molded with sub-material main body 2, and certainly, in some other embodiment, point mouth 1 can also weld with sub-material main body 2
Connect.
The point upper surface 11 of mouth 1 and lower surface 12 are the isosceles triangle with the long limit of point mouth 1 end face as base,
And upper surface 11 is shorter than lower surface 12 along axial length L2 of sub-material main body 2, upper surface 11 along length L1 that sub-material main body 2 is axial
The dual-side of dual-side and lower surface 12 constitute circular arc inclined-plane 13.
In the present embodiment, the lower section of sub-material main body 2 offers lightening grooves 21, and sub-material main body 2 is away from the end face of point mouth 1
Offer two screws 22 being connected with lightening grooves 21.
Referring to Fig. 4, the feeding-distribution device 100 of this utility model embodiment is when specifically applying, and feeding-distribution device 100 is fixed on
On conveyer belt 300, the tip of the lower surface 12 of the sharp mouth 1 of feeding-distribution device 100 between two lead frames 201,202,
Along with the transmission of conveyer belt 300, the most advanced and sophisticated of the lower surface 12 of point mouth 1 guides two lead frames 201,202 to separate, point mouth
Two lead frames 201,202 are drifted apart from by the circular arc inclined-plane 13 of the both sides of 1 again, and final sub-material main body 2 is by two lead-in wires
Framework 201,202 keeps enough distances (as shown in two lead frames at feeding-distribution device 100 rear are cut in Fig. 4).
The foregoing is only embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model, every
Utilize equivalent structure or equivalence flow process conversion that this utility model description and accompanying drawing content made, or be directly or indirectly used in
Other relevant technical fields, are the most in like manner included in scope of patent protection of the present utility model.
Claims (4)
1. the feeding-distribution device of a semiconductor lead frame, it is characterised in that described feeding-distribution device includes interconnective point mouth
Portion and sub-material main body, described sub-material main body is cuboid, and the end face that described point mouth is connected with described sub-material main body is with described
The end surface shape of sub-material main body is identical, and the upper and lower surface of described point mouth is and with the long limit of described point mouth end face is
The isosceles triangle on base, and described upper surface along described sub-material main body axial be shorter in length than described lower surface along described sub-material
The length that main body is axial, the dual-side of described upper surface constitutes circular arc inclined-plane with the dual-side of described lower surface.
The feeding-distribution device of semiconductor lead frame the most according to claim 1, it is characterised in that under described sub-material main body
Side offers lightening grooves.
The feeding-distribution device of semiconductor lead frame the most according to claim 2, it is characterised in that described sub-material main body away from
The end face of described point mouth offers two screws being connected with described lightening grooves.
The feeding-distribution device of semiconductor lead frame the most according to claim 1, it is characterised in that described point mouth and sub-material
Main body is one-body molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620698758.1U CN205739310U (en) | 2016-07-05 | 2016-07-05 | A kind of feeding-distribution device of semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620698758.1U CN205739310U (en) | 2016-07-05 | 2016-07-05 | A kind of feeding-distribution device of semiconductor lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205739310U true CN205739310U (en) | 2016-11-30 |
Family
ID=57380947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620698758.1U Expired - Fee Related CN205739310U (en) | 2016-07-05 | 2016-07-05 | A kind of feeding-distribution device of semiconductor lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205739310U (en) |
-
2016
- 2016-07-05 CN CN201620698758.1U patent/CN205739310U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20200705 |