CN203850281U - Plastic-coated lead frame with anti-vibration grooves - Google Patents
Plastic-coated lead frame with anti-vibration grooves Download PDFInfo
- Publication number
- CN203850281U CN203850281U CN201420137765.5U CN201420137765U CN203850281U CN 203850281 U CN203850281 U CN 203850281U CN 201420137765 U CN201420137765 U CN 201420137765U CN 203850281 U CN203850281 U CN 203850281U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- fin
- plastic packaging
- vibration
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 claims description 16
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a plastic-coated lead frame with anti-vibration grooves, which is composed of a plurality of lead frame units in one row. The lead frame units are interconnected through a connecting rib. Each lead frame unit comprises a heat radiating fin and lead legs. The connecting parts between the heat radiating fin and the pin legs are bent. The back surface of each heat radiating fin is provided with an anti-vibration groove. The shape of the section of each anti-vibration groove is a symmetrical pattern which is obtained through combining a rectangle and a trapezoid. The length of the triangle is 0.55mm, and the width is 0.15mm. The length of the upper side of the trapezoid is 0.21mm; the length of the lower side of the trapezoid is 0.35mm; and the height of the trapezoid is 0.15mm. The anti-vibration grooves endow the frame body with an anti-vibration function so that longer service life of the plastic-coated lead frame in electrical equipment is realized.
Description
Technical field
The utility model relates to a kind of plastic packaging lead frame.
Background technology
Plastic packaging lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use plastic packaging plastic packaging lead frame, is basic material important in electronics and information industry.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of plastic packaging lead frame with shockproof ditch.
In order to solve the problems of the technologies described above, the utility model provides a kind of plastic packaging lead frame with shockproof ditch, by multiple lead frames unit single composition, each lead frame interconnects by dowel between unit, described lead frame unit comprises fin and terminal pin, bend in fin and terminal pin junction, the described fin back side is provided with shockproof ditch.
As further improvement of the utility model, the cross section of described shockproof ditch is by a rectangle and a trapezoidal symmetric figure combining, the long 0.55mm of rectangle, wide 0.15mm, trapezoidal upper base 0.21mm, the 0.35mm that goes to the bottom, high 0.15mm.
As further improvement of the utility model, described lead frame unit is provided with louvre, and the diameter of louvre is 3.84 ± 0.04mm.
As further improvement of the utility model, described fin thickness is 1.27 ± 0.015mm, and terminal pin thickness is 0.38 ± 0.015mm, and fin and terminal pin plane of living in is at a distance of 2.67 ± 0.05mm.
As further improvement of the utility model, described lead frame cell width is 11.405 ± 0.025mm.
Adopt said structure, its beneficial effect is: this plastic packaging lead frame is mainly provided with shockproof ditch at the fin back side, makes chassis body possess shockproof function, can in electric equipment, have longer useful life.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is that the A-A of Fig. 1 is to schematic diagram.
In figure: 1-lead frame unit, 2-fin, 3-terminal pin, the shockproof ditch of 4-, 5-louvre.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail.
As shown in Fig. 1 and 2, a kind of plastic packaging lead frame with shockproof ditch, by 1 single composition of multiple lead frames unit, between each lead frame unit 1, interconnect by dowel, lead frame unit 1 comprises fin 2 and terminal pin 3, bend in fin 2 and terminal pin 3 junctions, described fin 2 back sides are provided with shockproof ditch 4, the cross section of described shockproof ditch 4 is by a rectangle and a trapezoidal symmetric figure combining, the long 0.55mm of rectangle, wide 0.15mm, trapezoidal upper base 0.21mm, 0.35mm goes to the bottom, high 0.15mm, described lead frame unit 1 is provided with louvre 5, the diameter of louvre 5 is 3.84 ± 0.04mm, described fin 2 thickness are 1.27 ± 0.015mm, terminal pin 3 thickness are 0.38 ± 0.015mm, fin 2 and terminal pin 3 plane of living in are at a distance of 2.67 ± 0.05mm, described lead frame unit 1 width is 11.405 ± 0.025mm.
This plastic packaging lead frame is mainly provided with shockproof ditch 4 at fin 2 back sides, makes chassis body possess shockproof function, can in electric equipment, have longer useful life.
Within the similar designed plastic packaging lead frame of technical characterictic of any employing and the utility model will fall into protection range of the present utility model.
Claims (5)
1. the plastic packaging lead frame with shockproof ditch, by multiple lead frames unit (1) single composition, between each lead frame unit (1), interconnect by dowel, it is characterized in that: described lead frame unit (1) comprises fin (2) and terminal pin (3), bend in fin (2) and terminal pin (3) junction, described fin (2) back side is provided with shockproof ditch (4).
2. a kind of plastic packaging lead frame with shockproof ditch according to claim 1, it is characterized in that: the cross section of described shockproof ditch (4) is by a rectangle and a trapezoidal symmetric figure combining, the long 0.55mm of rectangle, wide 0.15mm, trapezoidal upper base 0.21mm, the 0.35mm that goes to the bottom, high 0.15mm.
3. a kind of plastic packaging lead frame with shockproof ditch according to claim 1, is characterized in that: described lead frame unit (1) is provided with louvre (5), and the diameter of louvre (5) is 3.84 ± 0.04mm.
4. a kind of plastic packaging lead frame with shockproof ditch according to claim 1, it is characterized in that: described fin (2) thickness is 1.27 ± 0.015mm, terminal pin (3) thickness is 0.38 ± 0.015mm, and fin (2) and terminal pin (3) plane of living in are at a distance of 2.67 ± 0.05mm.
5. a kind of plastic packaging lead frame with shockproof ditch according to claim 1, is characterized in that: described lead frame unit (1) width is 11.405 ± 0.025mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420137765.5U CN203850281U (en) | 2014-03-26 | 2014-03-26 | Plastic-coated lead frame with anti-vibration grooves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420137765.5U CN203850281U (en) | 2014-03-26 | 2014-03-26 | Plastic-coated lead frame with anti-vibration grooves |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203850281U true CN203850281U (en) | 2014-09-24 |
Family
ID=51563261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420137765.5U Expired - Fee Related CN203850281U (en) | 2014-03-26 | 2014-03-26 | Plastic-coated lead frame with anti-vibration grooves |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203850281U (en) |
-
2014
- 2014-03-26 CN CN201420137765.5U patent/CN203850281U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: TAIZHOU YOURUN ELECTRONIC CO., LTD. Free format text: FORMER OWNER: ZHANG XUAN Effective date: 20150731 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150731 Address after: 225300, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee after: Taizhou Yourun Electronic Co., Ltd. Address before: 225324, Jiangsu Taizhou hi tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard workshop area 126 Patentee before: Zhang Xuan |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 225300, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee after: Friends of Taizhou run electronic Polytron Technologies Inc Address before: 225300, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee before: Taizhou Yourun Electronic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140924 Termination date: 20170326 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |