CN202816919U - SOT223-3L packaging lead frame - Google Patents
SOT223-3L packaging lead frame Download PDFInfo
- Publication number
- CN202816919U CN202816919U CN 201220350772 CN201220350772U CN202816919U CN 202816919 U CN202816919 U CN 202816919U CN 201220350772 CN201220350772 CN 201220350772 CN 201220350772 U CN201220350772 U CN 201220350772U CN 202816919 U CN202816919 U CN 202816919U
- Authority
- CN
- China
- Prior art keywords
- sot223
- pin
- sides
- frame part
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides a SOT223-3L encapsulation lead frame, its reinforcing plastic-sealed body's gas tightness has improved performance stability and reliability, has prolonged the life of device. The SOT223-3L frame comprises three pins, a center pin and two side pins, and is characterized in that: the outer sides of the frame parts of the pins at the two sides are respectively provided with a semicircular flow guide hole, and the two sides of the tail frame part of the central pin are provided with semicircular flow guide holes.
Description
Technical field
The utility model relates to the technical field of encapsulation, is specially a kind of SOT223-3L encapsulating lead.
Background technology
The framework of existing SOT223-3L, its structure is seen Fig. 1, and three pins are arranged, be respectively pin 1, pin 2, pin 3, it is single Ji Dao, the upper placement of Ji Dao a slice chip, the pad of the chip framework that goes between, plastic packaging pin 1, the frame part of pin 3 are combined air-tightness with plastic-sealed body not strong, under the high temperature wet environment, steam can be invaded on the plastic-sealed body inside chip, cause the oxidation of chip surface bonding wire ball, cause to come off or loose contact electrical property early failure.
Summary of the invention
For the problems referred to above, the utility model provides a kind of SOT223-3L encapsulating lead, and the air-tightness that it strengthens plastic-sealed body has improved stability and reliability, has prolonged the useful life of device.
A kind of SOT223-3L encapsulating lead, its technical scheme is such: it comprises the SOT223-3L framework, described SOT223-3L framework comprises three pins, is respectively center pin, the both sides pin, it is characterized in that: the outside of the frame part of described both sides pin has the semicircle pod apertures, and the afterbody frame part both sides of described center pin have the semicircle pod apertures.
It is further characterized in that: the afterbody frame part center of described center pin has circular hole.
After adopting the utility model, because the outside of the frame part of the both sides pin of SOT223-3L framework has the afterbody frame part both sides of semicircle pod apertures, center pin and has the semicircle pod apertures, itself so that during plastic packaging plastic-sealed body can flow through the semicircle pod apertures and make center pin, nead frame top and bottom, both sides in conjunction with good, increased the contact area of plastic-sealed body and framework, thereby improve the sealing property of plastic-sealed body, strengthen the air-tightness of plastic-sealed body, improve stability and reliability, prolonged the useful life of device; In addition, the semicircle pod apertures of setting so that plastic-sealed body has reduced copper material, reduces manufacturing cost.
Description of drawings
Fig. 1 is existing SOT223-3L packaging lead frame structure schematic diagram;
Fig. 2 is front view structural representation of the present utility model.
Embodiment
See Fig. 2, it comprises the SOT223-3L framework, the SOT223-3L framework comprises three pins, is respectively center pin 2, left side pin 1, right side pin 3, the outside of the frame part 6 of left side pin 1 has semicircle pod apertures 4, the outside of the frame part 7 of right side pin 3 has semicircle pod apertures 4, and afterbody frame part 8 both sides of center pin 2 have semicircle pod apertures 4.Afterbody frame part 8 centers of center pin 2 have circular hole 5.
Claims (2)
1. SOT223-3L encapsulating lead, it comprises the SOT223-3L framework, described SOT223-3L framework comprises three pins, is respectively center pin, the both sides pin, it is characterized in that: the outside of the frame part of described both sides pin has the semicircle pod apertures, and the afterbody frame part both sides of described center pin have the semicircle pod apertures.
2. a kind of SOT223-3L encapsulating lead according to claim 1, it is characterized in that: the afterbody frame part center of described center pin has circular hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220350772 CN202816919U (en) | 2012-07-19 | 2012-07-19 | SOT223-3L packaging lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220350772 CN202816919U (en) | 2012-07-19 | 2012-07-19 | SOT223-3L packaging lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202816919U true CN202816919U (en) | 2013-03-20 |
Family
ID=47875759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220350772 Expired - Lifetime CN202816919U (en) | 2012-07-19 | 2012-07-19 | SOT223-3L packaging lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202816919U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102760717A (en) * | 2012-07-19 | 2012-10-31 | 无锡红光微电子有限公司 | SOT223-3L packaging lead frame |
-
2012
- 2012-07-19 CN CN 201220350772 patent/CN202816919U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102760717A (en) * | 2012-07-19 | 2012-10-31 | 无锡红光微电子有限公司 | SOT223-3L packaging lead frame |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2011066327A5 (en) | ||
| TWI315571B (en) | Integrated circuit packaging | |
| JP2007251159A5 (en) | ||
| JP2013247131A5 (en) | Semiconductor device | |
| JP2010171181A5 (en) | ||
| JP2012058243A5 (en) | ||
| SG151188A1 (en) | Integrated circuit package system with dual connectivity | |
| SG149896A1 (en) | Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package | |
| CN103839931A (en) | Double-faced packaging structure of double chips | |
| CN202816919U (en) | SOT223-3L packaging lead frame | |
| CN202816920U (en) | TO-252 packaging lead frame structure | |
| JP2014078646A5 (en) | Power module | |
| CN208596671U (en) | High-power packaging body | |
| CN202816922U (en) | SOT89-3L encapsulation lead frame | |
| CN202816921U (en) | SOT89-5L encapsulation lead frame | |
| CN208460756U (en) | One kind being based on TO-220 lead frame | |
| CN102760717A (en) | SOT223-3L packaging lead frame | |
| CN202712172U (en) | Multi-chip dual-base island SOP package structure | |
| CN201829490U (en) | Chip area punching integrated circuit lead frame | |
| CN205754241U (en) | A kind of encapsulating structure of bulk accoustic wave filter chip | |
| CN204516746U (en) | The fingerprint sensor package structure of pluggable FPC | |
| CN102760716A (en) | TO-252 package lead frame structure | |
| CN202585399U (en) | Lead frame | |
| CN204204830U (en) | Multicarity multi-layer ceramics dual in-line package shell | |
| JP2007134585A5 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130320 |
|
| CX01 | Expiry of patent term |