CN205754241U - A kind of encapsulating structure of bulk accoustic wave filter chip - Google Patents
A kind of encapsulating structure of bulk accoustic wave filter chip Download PDFInfo
- Publication number
- CN205754241U CN205754241U CN201620462631.XU CN201620462631U CN205754241U CN 205754241 U CN205754241 U CN 205754241U CN 201620462631 U CN201620462631 U CN 201620462631U CN 205754241 U CN205754241 U CN 205754241U
- Authority
- CN
- China
- Prior art keywords
- wave filter
- ceramic package
- filter chip
- accoustic wave
- bulk accoustic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
nullThis utility model provides the encapsulating structure of a kind of bulk accoustic wave filter chip，Its packaging air tightness is high，It is difficult to suck moisture，Package reliability is good，Disclosure satisfy that the use requirement of harsh outdoor environment，Thus the comprehensive cost performance of improving product，Including bulk accoustic wave filter chip and the ceramic package being encapsulated in described bulk accoustic wave filter chip exterior，The upper end of described ceramic package is provided with opening，The front portion making described bulk accoustic wave filter chip is exposed，Cover plate is arranged on the upper end of described ceramic package and is sealed by described opening，Top pad it is provided with in described ceramic package，Described top pad connects the chip surface pad of described bulk accoustic wave filter chip by gold thread，The lower surface of described ceramic package arranges bottom land，It is connected by being arranged on the Gold plated Layer outside described ceramic package between described top pad and described bottom land，It is additionally provided with grounding through hole in described ceramic package.
Description
Technical field
This utility model relates to a kind of bulk accoustic wave filter technical field, the encapsulating structure of a kind of bulk accoustic wave filter chip.
Background technology
Existing bulk accoustic wave filter, it is common that use silicon base plate, manufacture by MEMS technology and thin film technique, and use flip chip bonding to encapsulate.But when product uses flip chip bonding encapsulation, its humiture grade can only achieve 2, when at harsh outdoor environment, such as outdoor base station, the encapsulation of existing flip chip bonding is due to shortcomings such as packaging air tightness, reliability are the highest, it is impossible to meet the use requirement of harsh outdoor environment.
Utility model content
For the problems referred to above, this utility model provides the encapsulating structure of a kind of bulk accoustic wave filter chip, and its packaging air tightness is high, is difficult to suck moisture, and package reliability is good, it is possible to meet the use requirement of harsh outdoor environment, thus the comprehensive cost performance of improving product.
The technical scheme that the above-mentioned technical problem of this utility model solution is used is: the encapsulating structure of a kind of bulk accoustic wave filter chip, including bulk accoustic wave filter chip and the ceramic package being encapsulated in described bulk accoustic wave filter chip exterior, it is characterized in that: the upper end of described ceramic package is provided with opening, the front portion making described bulk accoustic wave filter chip is exposed, cover plate is arranged on the upper end of described ceramic package and is sealed by described opening, top pad it is provided with in described ceramic package, described top pad connects the chip surface pad of described bulk accoustic wave filter chip by gold thread, the lower surface of described ceramic package arranges bottom land, it is connected by being arranged on the Gold plated Layer outside described ceramic package between described top pad and described bottom land, it is additionally provided with grounding through hole in described ceramic package.
Further, it is connected by seam welding layer between described cover plate and described ceramic package.
Further, bottom that described ceramic package includes arranging from bottom to top, cavity layer, step layer, described bulk accoustic wave filter chip is arranged on the receiving intracavity that described bottom is constituted with cavity layer, and described top pad is arranged between described cavity layer and described step layer.
Further, described grounding through hole is arranged in described step layer, and one end of described grounding through hole connects described top pad, and the other end of described grounding through hole connects described seam welding layer.
Further, the outside of described ceramic package is provided with circular groove, and the plating of described Gold plated Layer is attached on described circular groove.
Further, described gold thread connects described top pad and described chip surface pad by ball bonding respectively.
The encapsulating structure of bulk accoustic wave filter chip of the present utility model, uses ceramic package to be packaged, compared with the face-down bonding technique that market is the most commonly used, there is air-tightness good, humiture grade reaches 1, highly reliable advantage, it is adaptable to such as the harsh outdoor environment of outdoor base station；By using gold thread connector acoustic wave filter chip and ceramic package, gold thread has the advantages such as electrical conductivity big, corrosion-resistant, toughness, good in oxidation resistance, so that using the bulk accoustic wave filter of ceramic package to be suitably applied various complex environment, enhance the competitiveness of product；The lower surface of ceramic package is only had to have bottom land after having encapsulated, and upper casing need not exit pad and lead-in wire, therefore the quantity of exit pad is decreased, optimize overall structure, circuit is made more to concentrate, the design difficulty of exit pad distribution when reducing encapsulation, overall package is more prone to.
Accompanying drawing explanation
Fig. 1 is the diagrammatic side-view cross-sectional schematic diagram of the encapsulating structure of bulk accoustic wave filter chip of the present utility model；
Fig. 2 is the top perspective structural representation of the encapsulating structure of bulk accoustic wave filter chip of the present utility model.
Detailed description of the invention
The following is specific embodiment of the utility model and combine accompanying drawing, the technical solution of the utility model is further described, but this utility model is not limited to these embodiments.
nullSuch as Fig. 1、Shown in Fig. 2，The encapsulating structure of a kind of bulk accoustic wave filter chip of the present utility model，Including bulk accoustic wave filter chip 1 be encapsulated in the ceramic package 2 outside bulk accoustic wave filter chip 1，The upper end of ceramic package 2 is provided with opening 3，The front portion making bulk accoustic wave filter chip 1 is exposed，Cover plate 4 is arranged on the upper end of ceramic package 2 and is sealed by opening 3，Cover plate 4 is metal cover board，It is connected by seam welding layer 5 between cover plate 4 and ceramic package 2，Ceramic package 2 includes the bottom 6 arranged from bottom to top、Cavity layer 7、Step layer 8，Bulk accoustic wave filter chip 1 arranges the receiving intracavity that bottom 6 is constituted with cavity layer 7，Top pad 9 is arranged between cavity layer 7 and step layer 8，The top pad 9 chip surface pad 11 by gold thread 10 connector acoustic wave filter chip 1，Gold thread 10 connects top pad 9 and chip surface pad 11 by ball bonding respectively，The lower surface of ceramic package 2 arranges bottom land 12，The outside of ceramic package 2 is provided with circular groove 13，Gold plated Layer 14 plating is attached on circular groove 13，It is connected by Gold plated Layer 14 between top pad 9 with bottom land 12，Grounding through hole 15 it is additionally provided with in ceramic package 2，Grounding through hole 15 is arranged in step layer 8，Connection top, one end pad 9 of grounding through hole 15，The other end connecting sewing layer 5 of grounding through hole 15.
In Fig. 1, Fig. 2 visible, top pad 9, bottom land 12, chip surface pad 11, gold thread 10 are respectively arranged with 6.
nullThe encapsulating structure of bulk accoustic wave filter chip of the present utility model，Employing ceramic package is packaged，Ceramic package forms air tight structure after passing through to have welded with cover plate，Can effectively block the entrance of air and moisture，Internal bulk accoustic wave filter chip is defined an airtight guard space structure，Improve the humiture grade of product，The use requirement of harsh outdoor environment can be met，Compared with the face-down bonding technique that market is the most commonly used，There is air-tightness good，Humiture grade reaches 1，Highly reliable advantage，It is applicable to the harsh outdoor environment such as outdoor base station，By using gold thread connector acoustic wave filter chip and ceramic package，It is big that gold thread has electrical conductivity、Corrosion-resistant、Toughness、The advantages such as good in oxidation resistance，So that using the bulk accoustic wave filter of ceramic package to be suitably applied various complex environment,Enhance the competitiveness of product，This packaging appearance shape is regular simultaneously、Size matches，Both connections easily realize，Thus be conducive to improving the efficiency of overall package，The lower surface of ceramic package is only had to have bottom land after having encapsulated，And upper casing need not exit pad and lead-in wire，Therefore the quantity of exit pad is decreased，Optimize overall structure，Circuit is made more to concentrate，The design difficulty of exit pad distribution when reducing encapsulation，Overall package is more prone to.
Bulk accoustic wave filter is less sensitive to variations in temperature, and it also has extremely low loss and the most precipitous wave filter shirt rim (filter skirt) simultaneously, and it is especially suitable for processing AF panel problem the most thorny between successive bands.Therefore bulk accoustic wave filter is relative to being applicable to higher frequency for SAW filter, and energy loss is little, and temperature susceplibility is little, and power bearing ability is strong, and Q-value is big, and volume is little waits actual filtering demands.
Above-described embodiment only illustrative principle of the present utility model and effect thereof, not for limiting this utility model.Above-described embodiment all can be modified under spirit and the scope of the present utility model or change by any person skilled in the art.Therefore, art has all equivalence modification or changes that usually intellectual is completed under without departing from the spirit disclosed in this utility model and technological thought such as, must be contained by claim of the present utility model.
Claims (7)
1. the encapsulating structure of a bulk accoustic wave filter chip, including bulk accoustic wave filter chip and the ceramic package being encapsulated in described bulk accoustic wave filter chip exterior, it is characterized in that: the upper end of described ceramic package is provided with opening, the front portion making described bulk accoustic wave filter chip is exposed, cover plate is arranged on the upper end of described ceramic package and is sealed by described opening, top pad it is provided with in described ceramic package, described top pad connects the chip surface pad of described bulk accoustic wave filter chip by gold thread, the lower surface of described ceramic package arranges bottom land, it is connected by being arranged on the Gold plated Layer outside described ceramic package between described top pad and described bottom land, it is additionally provided with grounding through hole in described ceramic package.
The encapsulating structure of a kind of bulk accoustic wave filter chip the most according to claim 1, it is characterised in that: it is connected by seam welding layer between described cover plate and described ceramic package.
The encapsulating structure of a kind of bulk accoustic wave filter chip the most according to claim 2, it is characterized in that: bottom that described ceramic package includes arranging from bottom to top, cavity layer, step layer, described bulk accoustic wave filter chip is arranged on the receiving intracavity that described bottom is constituted with cavity layer, and described top pad is arranged between described cavity layer and described step layer.
The encapsulating structure of a kind of bulk accoustic wave filter chip the most according to claim 3, it is characterized in that: described grounding through hole is arranged in described step layer, one end of described grounding through hole connects described top pad, and the other end of described grounding through hole connects described seam welding layer.
The encapsulating structure of a kind of bulk accoustic wave filter chip the most according to claim 1, it is characterised in that: the outside of described ceramic package is provided with circular groove, and the plating of described Gold plated Layer is attached on described circular groove.
The encapsulating structure of a kind of bulk accoustic wave filter chip the most according to claim 1, it is characterised in that: described gold thread connects described top pad and described chip surface pad by ball bonding respectively.
The encapsulating structure of a kind of bulk accoustic wave filter chip the most according to claim 1, it is characterised in that: described cover plate is metal cover board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620462631.XU CN205754241U (en) | 2016-05-20 | 2016-05-20 | A kind of encapsulating structure of bulk accoustic wave filter chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620462631.XU CN205754241U (en) | 2016-05-20 | 2016-05-20 | A kind of encapsulating structure of bulk accoustic wave filter chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205754241U true CN205754241U (en) | 2016-11-30 |
Family
ID=57364379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620462631.XU Active CN205754241U (en) | 2016-05-20 | 2016-05-20 | A kind of encapsulating structure of bulk accoustic wave filter chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205754241U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105897215A (en) * | 2016-05-20 | 2016-08-24 | 爱普科斯科技（无锡）有限公司 | Packaging structure with bulk acoustic wave filter chip |
-
2016
- 2016-05-20 CN CN201620462631.XU patent/CN205754241U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105897215A (en) * | 2016-05-20 | 2016-08-24 | 爱普科斯科技（无锡）有限公司 | Packaging structure with bulk acoustic wave filter chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105281706B (en) | A kind of SAW filter encapsulating structure and manufacturing method | |
| WO2018224051A1 (en) | Anti-electromagnetic interference radio frequency module and implementation method therefor | |
| CN205177839U (en) | System level packaging circuit of airtight type ceramic package | |
| CN203503623U (en) | Monolithic integrated MEMS chip based on conductive pole wafer level packaging | |
| CN103050467B (en) | Encapsulating structure and manufacture method thereof | |
| CN105897215A (en) | Packaging structure with bulk acoustic wave filter chip | |
| CN205754241U (en) | A kind of encapsulating structure of bulk accoustic wave filter chip | |
| CN205622875U (en) | MEMS microphone | |
| CN103839931A (en) | Double-faced packaging structure of double chips | |
| CN105993207A (en) | Printed circuit board for mounting a microphone component and microphone module with such a printed circuit board | |
| CN106229276A (en) | A kind of BGA integrative packaging device based on ltcc substrate | |
| CN107910313A (en) | A kind of novel semi-conductor encapsulating structure and its method for packing and electronic product | |
| CN205303443U (en) | A highly reliable tube for encapsulating semiconductor device | |
| JP2002033444A (en) | Semiconductor device | |
| TWM540449U (en) | Stack structure of multifunctional system-level package | |
| CN209000955U (en) | A kind of encapsulating structure of sound surface filtering chip | |
| CN100481407C (en) | Pin ball grid array encapsulation structure of wafer | |
| CN203085519U (en) | A chip leading wire frame | |
| CN209545851U (en) | Loudspeaker mould group | |
| CN209183532U (en) | A kind of microelectronic component integrative packaging structure | |
| CN202111082U (en) | Multi-loop arrangement integrated circuit (IC) chip package element | |
| CN207781588U (en) | The ceramic four side lead flat packages of flip-chip installation | |
| CN207354537U (en) | Mems microphone | |
| CN203775157U (en) | Resin-packaged SMD quartz crystal oscillator | |
| CN205159317U (en) | Anti -interference semiconductor integrated circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 214028 Jiangsu city of Wuxi province Quxi Shi Wu New Road No. 17 Patentee after: Full spectrum radio frequency technology (Wuxi) Co., Ltd. Address before: 214028, 2, Xindu Road, Wuxi Singapore Industrial Park, Xin Wu District, Jiangsu, Wuxi Patentee before: EPCOS Technology (Wuxi) Co., Ltd. |
|
| CP03 | Change of name, title or address |