CN208460756U - One kind being based on TO-220 lead frame - Google Patents
One kind being based on TO-220 lead frame Download PDFInfo
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- CN208460756U CN208460756U CN201821266883.0U CN201821266883U CN208460756U CN 208460756 U CN208460756 U CN 208460756U CN 201821266883 U CN201821266883 U CN 201821266883U CN 208460756 U CN208460756 U CN 208460756U
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- chip
- lead frame
- terminal pins
- plastic packaging
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Abstract
The utility model discloses a kind of based on TO-220 lead frame, it include: chip Ji Dao, chip placing table, cooling fin, lead weld part, terminal pins, the chip placing table is set to chip base island central part, the left and right sides of the chip Ji Dao is equipped with several through-holes, the chip Ji Dao and the cooling fin joining place are equipped with a boss, terminal pins root front and rear sides are symmetrically arranged at least one salient point, and chip base island front and back is coated by insulation plastic packaging material.The utility model structure is simple, improves the bond strength of lead frame and plastic packaging material, to increase impact strength, and terminal pins are not easy to shake.
Description
Technical field
The utility model relates to semiconductor device packaging technique fields, more particularly to one kind to be based on TO-220 lead frame.
Background technique
The chip portion substrate of current existing TO-220 lead frame, chip and lead frame turns to match carries out plastic packaging afterwards in place,
Since the surrounding of chip Ji Dao is flat, therefore lead frame is low with the bond strength of plastic packaging material, thus cause shock resistance poor,
Pin easily shakes.
Therefore, the prior art is defective, needs to improve.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of based on TO-220 lead frame.
The technical solution of the utility model is as follows: one kind being based on TO-220 lead frame, comprising: chip Ji Dao, chip are contained
Platform, cooling fin, lead weld part, terminal pins are put, the chip placing table is set to chip base island central part, the core
The left and right sides on chip base island is equipped with several through-holes, and the chip Ji Dao and the cooling fin joining place are equipped with a boss, described to draw
Spool heel portion front and rear sides are symmetrically arranged at least one salient point, and chip base island front and back is by insulation plastic packaging material packet
It covers.
Further, the through-hole is round, triangle or rectangle.
Further, the through-hole is circle.
Further, the end face of the boss is rounded, triangle or rectangle.
Further, the end face of the boss is in rectangle.
Further, it is one that the side of the terminal pins, which is equipped with the quantity of the salient point,.
Using the above scheme, the utility model is simple based on TO-220 lead frame structure, and the setting of through-hole can make to mould
Envelope material runs through chip Ji Dao, and the binding force between reinforced leads frame and plastic packaging material improves impact strength；Boss can extend into
In plastic packaging material, increase the binding force between lead frame and plastic packaging material, improves impact strength；Salient point can make terminal pins exist
That fixes in plastic packaging material is more firm, can prevent terminal pins from shaking while increasing binding force.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the utility model based on TO-220 lead frame；
Fig. 2 is the utility model based on the positive structure schematic after TO-220 lead frame plastic packaging；
Fig. 3 is the utility model based on the structure schematic diagram after TO-220 lead frame plastic packaging；
Fig. 4 is another embodiment of the utility model based on the structure schematic diagram after TO-220 lead frame plastic packaging；
Fig. 5 is another embodiment of the utility model based on the structure schematic diagram after TO-220 lead frame plastic packaging.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Referring to Fig. 1, the utility model provides one kind based on TO-220 lead frame, comprising: chip base island 1, chip are contained
Platform 2, cooling fin 3, lead weld part 4, terminal pins 5 are put, the chip placing table 2 is set to 1 central part of chip base island,
The left and right sides on chip base island 1 is equipped with several through-holes 6, and chip base island 1 is convex equipped with one with 3 joining place of cooling fin
Platform 7, the 5 root front and rear sides of terminal pins are symmetrically arranged at least one salient point 8.The through-hole 6 is round, triangle or square
Shape, specifically, the structure design of circular in the present embodiment, circular through hole are more simple.The end face of the boss 7 is in circle
Shape, triangle or rectangle, specifically, the preferred rectangle of the present embodiment, the boss of rectangular section can extend into inside plastic packaging material, with
The contact area of plastic packaging material is bigger, and can preferably increase and plastic packaging material at the top of the boss of rectangular section there are two corner angle
Binding force, to increase the shock resistance of lead frame.The side of the terminal pins 5 is equipped with the quantity of the salient point 8
It is one, 5 front and rear sides of terminal pins are respectively equipped with a salient point, can be good at for the terminal pins 5 being fixed on
In plastic packaging material, prevent the terminal pins 5 from shaking.One salient point molding is easy, and can play good fixed effect.
Fig. 2 and Fig. 3 are please referred to, chip base island 1 needs to be insulated when packaged with three 5 tops of terminal pins
Plastic packaging material 9 coats, and the intermediate terminal pins 5 are connect with chip base island 1, and drain electrode voltage is applied to the described of centre
In terminal pins 5, so chip base island 1 can be coated on completely inside the insulation plastic packaging material 9, given in the present embodiment
As full pack arrangement out.
Fig. 4 and Fig. 5 are please referred to, as set forth above in conjunction with Fig. 2 it is found that chip base island 1 and three fairleads
The positive plastic packaging material 9 that all needs to be insulated coats when packaged on foot 5 top, when the terminal pins 5 and chip base island 1
When disconnection, the drain electrode voltage being applied to originally in the intermediate terminal pins 5 at this time will be changed to be applied to the chip
On base island 1, thus the back surface on chip base island 1 just need it is exposed outside, at this time there are two types of packaged type, the back after encapsulation
Face effect difference is as shown in figs. 4 and 5.Fig. 4 is in another embodiment based on the backside structure after TO-220 lead frame plastic packaging
Schematic diagram is that the back side the right and left on chip base island 1 and bottom edge are covered by the insulation plastic packaging material, this design,
Not only it ensure that the requirement exposed to the back side the chip Ji Dao, but also improved the combination of lead frame and the insulation plastic packaging material 9
Power.Fig. 5 is in another embodiment based on the structure schematic diagram after TO-220 lead frame plastic packaging, is chip base island 1
The back side is not coated completely, and the insulation plastic packaging material 9 can fill the through-hole 6 full at this time, also can guarantee lead frame in this way
With the binding force between the insulation plastic packaging material 9.Specific lead frame structure is not shown in Fig. 4 and Fig. 5 the present embodiment, it is this kind of
Lead frame structure already belongs to the prior art, and the present embodiment is not elaborated.
In conclusion the utility model is based on, TO-220 lead frame structure is simple, and the setting of through-hole can make plastic packaging material
Binding force between chip Ji Dao, reinforced leads frame and plastic packaging material improves impact strength；Boss can extend into plastic packaging
In material, increase the binding force between lead frame and plastic packaging material, improves impact strength；Salient point can make terminal pins in plastic packaging
That fixes in material is more firm, can prevent terminal pins from shaking while increasing binding force.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (6)
1. one kind is based on TO-220 lead frame characterized by comprising chip Ji Dao, chip placing table, cooling fin, interior draw
Wire bonding socket part, terminal pins, the chip placing table are set to chip base island central part, the left and right sides of the chip Ji Dao
Equipped with several through-holes, the chip Ji Dao and the cooling fin joining place are equipped with a boss, the terminal pins root front and back two
Side is symmetrically arranged at least one salient point, and chip base island front and back is coated by insulation plastic packaging material.
2. according to claim 1 be based on TO-220 lead frame, which is characterized in that the through-hole is round, triangle
Or rectangle.
3. according to claim 2 be based on TO-220 lead frame, which is characterized in that the through-hole is circle.
4. according to claim 1 be based on TO-220 lead frame, which is characterized in that the end face of the boss is rounded,
Triangle or rectangle.
5. according to claim 4 be based on TO-220 lead frame, which is characterized in that the end face of the boss is in rectangle.
6. according to claim 1 be based on TO-220 lead frame, which is characterized in that the side of the terminal pins is equipped with
The quantity of the salient point is one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821266883.0U CN208460756U (en) | 2018-08-07 | 2018-08-07 | One kind being based on TO-220 lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821266883.0U CN208460756U (en) | 2018-08-07 | 2018-08-07 | One kind being based on TO-220 lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208460756U true CN208460756U (en) | 2019-02-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821266883.0U Active CN208460756U (en) | 2018-08-07 | 2018-08-07 | One kind being based on TO-220 lead frame |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111739866A (en) * | 2020-07-16 | 2020-10-02 | 无锡市宏湖微电子有限公司 | Lead frame of 100W solid-state relay |
| CN111916408A (en) * | 2020-09-03 | 2020-11-10 | 佛山市蓝箭电子股份有限公司 | Semiconductor plastic packaging structure and packaging method |
-
2018
- 2018-08-07 CN CN201821266883.0U patent/CN208460756U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111739866A (en) * | 2020-07-16 | 2020-10-02 | 无锡市宏湖微电子有限公司 | Lead frame of 100W solid-state relay |
| CN111916408A (en) * | 2020-09-03 | 2020-11-10 | 佛山市蓝箭电子股份有限公司 | Semiconductor plastic packaging structure and packaging method |
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