201244190 六、發明說明： 【發明所屬之技術領域】 本發明乃是關於一種表面黏著型發光二極體封巢、妹 構及其製造方法，特別是指一種具有平坦式接腳(footpin) 而可利用表面黏著技術(Surface mounted technology)焊接於 電路表面的發光二極體封裝結構。 【先前技術】 表面黏著型（Surface mounted)發光二極體已經廣泛 地應用為近距離感應器（proximity sensor)，設置在行動 電話、電視或攜帶式行動裝置内’以感應使用者的在場 (presence)。為獲得更長的感測距離（detecting distance) ’就需要有小角度、高強度的表面黏著型發光 二極體。其中表面黏著型反射式發光二極體（Surface mounted reflection LED)可以符合上述需求。 請參閱圖1 ’現有的表面黏著型發光二極體具有絕 緣本體9，其包括杯狀(CUp_nke shaped)的容置部92及 位於容置部92外面的導墊設置區920。導墊設置區920 是由容置部92内表面向外並由絕緣本體9的頂面向下 凹設而成的。杯狀的容置部92是用於配合光線照明。 金屬支架的一端延伸至導墊設置區920内而形成一導 墊(bond pad)，另一端延伸至絕緣本體9的外圍以作為 電極（未圖示）。 上述先前技術有些可以改進的地方。首先，由於導 塾位於容置部92的外面，此種封裝結構需要較長的導 線(bonding wire)95。其連帶地造成潛在的信賴度問題 .4/15 201244190 (potential reliabilitv 、, 9的頂面而容易外露:泉95高過絕緣本體 部嶋面的金屬電二：：二戈者’容易因接觸容置 設置區920加大了^產生短路。此外，因導墊 足又’而造成較大的封裝尺寸〇 、， 疋 又明人有感上述問題之可改善，乃潛心研究 並配ά 4·®之朝’而提纟_種設計合理且有效改善上述 問題之本發明。 【發明内容】 本發明所要解決的技術問趙，在於表面黏著 導線的高度，以減少潛在的信 的封裝尺寸。 為了解決上述技術問題， 案，提供一種表面黏著型發光；^ 型發光二極體封裝結構，在於鏑並降低 導線的高度，以減少…後賴度問題，此外減小整體 種方 槔據 換體封裝結構，包括絕 發光二極體晶片及導 本發明之其中 緣本體、第-導電部、第二導電鄯、㈣一性脰曰曰片及導 線。'.、巴緣本體具有一由其頂面向卞位 於該容置部内的配墊島，該容襄部形成置工㈢及一平 ，:面:該配墊島由該杯狀電該 谷置空間突出且形成一導接平面。 立於 該配墊島的該導接平面的第〆换觸部、及一延伸至該絕緣 本體的外表面的二:第〉導電部減-位於該容置 部的底面的第二接觸部、及4%緣本體的外表面 的第二接腳；發光二極體晶片铁於該>第—接觸部上。導線 連接該發光二極體晶片於該第/接觸部 為了解決上述技術問題，拉據本^之其中〜種方 案’提供-種表面黏著型發光，體封裝結構的製造方 5/15 201244190 法，包括至少下列步驟： 提供一絕緣本體，並於該絕緣本體形成一凹陷狀 容置部及一突出於該容置部内的配墊島； 形成一導電層於該絕緣本體的表面，覆蓋該容置 部，並延伸至該絕緣本體的外表面而形成第— 二接腳； $ 移除該導電層的-部份而形成—隔縫，使該隔縫穿 過該配墊島、該容置部及該絕緣本體，將該導電 形成第一導電部及第二導電部； m汗 設置一發光二極體晶片於該容置部的底面且位於 該第二導電部上；及 、 形成一導線，以連接該發光二極體晶片於該 部。 电 本發明至少具有以下有益效果：容置部的配塾島 整體結構的尺寸比先前技術小；導線只延伸至容置部内， 長度變短，高度變低，減少導線成本，也降低導線短路的 風險。導電層同時可作為容置部的反射面。 為了能更進-步瞭解本發明為達成既定目的所採取之 技術、方法及功效，請參閱以下有關本發明之詳細說明、 圖式’相信本發明之目的、概與特點，#可由此得 入且具體之瞭解，㈣所關式與附件僅提供參考與明 用，並非用來對本發明加以限制者。 【實施方式】 杯相2,為本發明之表轉著㈣光 構的立體圖。以下配合本發明的結構一併結 法。本發明之表面黏著型發光二極體封裝結構包括^ = 6/15 201244190 緣本體10、一導電層20形成於絕緣本體1〇的表面、〜 光二極體晶片（LE；D dice)30、及一導線32。前述導電層^ 延伸至該絕緣本體10的外表面(本實關為底面)形成第〜 接腳2_rst _ pin)及第二接腳(s_d驗㈣228，而 供本發明可湘表面減技術(SMT)焊接安裝於電路板 圖示）上。 絕緣本體10為絕緣材料製成，可以用塑膠射出的方 成型。絕緣本體10 I有一由其頂面向下凹陷的容置部12、 及一位於該容置部12内的配墊島（b〇nd_padisland)i4。若以 塑膠射出方式成型的話，本發明在形成絕緣本體的同 時，即可形成該容置部12及該配墊島14。 本實施例的容置部12大體呈杯狀(cup-Hke shape)，具 有-容置空間122及-平坦的底面124;容置部12形成凹 狀弧面的内表面，有利於光線的聚集；平坦的底面124可 供置放發光二極體晶片30。 上述配墊島14是由杯狀的容置部12的内表面部份地 (Partially)朝該容置空間122突出而成的，大體呈楔形 (wedge-shaped) ’並且形成一導接平面⑷於頂面。導接平 面142呈扇形(押11〇|^}/此此1〇。本實施例中該配墊島14具 有-鄰近該平坦底面124的圓筒形弧面141、及一對側邊平 面(未標號)連接該圓筒形弧面141及該容置部12内表面。 然而’本發明配墊島的形狀並不受限於上述例子，例如也 可是部分圓柱形、方柱形…等。 ，，明的導電層20乃形成於該絕緣本體1()的表面， 可以是藉由電鑛或別的·方式形成的。導 部⑴同時延伸至魏緣本體_外表面，本例= 7/15 201244190 伸至、’、巴’.彖本體10的兩相對的側面。不需導電層的部位可以 ’例如用可撥離的膠覆蓋，電鑛後再移除。依 本發明絕緣本體1〇的外型，可以是在一長條型的絕緣材料 Ji形成>個容置部12。麵完錢，以切除的方式 ，將每 -容置部切開，切割的部份形成未電鑛的側面。 然後’形成一橫越該導電層2〇的隔縫(Iswati〇n gap) 201 ’隔縫2〇1可以是用雷射敍刻的方式移除，或在形成導 電層20之别就予以遮蓋。本實施例中，該隔縫2〇1橫過該 配塾島】4、該容置部]2及該絕緣本體1〇，將該導電層加 隔開形成第—導電部21及第二導電部22,以分別將電源導 接至發光二極體晶片3G的兩極。本發明的導電層2〇 的優點在於’也可以作為容置部12的反射面以反 第-導電部2〗具有—位於導接平面142上的第一接 部212、及-延伸至該絕緣本體1〇的外表面的第一 218。本實施例的第-導電部21還包括由第一接觸部 斜向延伸至容置部！2内側面的第—傾斜部214、由第 斜部214延伸至絕緣本體1〇頂面的第一平整部2丨6。、 平整部2㈣躲本體H)科表面延伸㈣成上述第: 腳218，本實施例的第-接腳218乃位於絕緣本體ι〇 面’然而第-接腳是可以依料二極體域結構的設計而 變更位置。 第二導電部22具有—位於該容置部12的底面的第二 接觸部222、及-延伸至該絕緣本體1()的外表面的: 卿2沉本實_的第二導電部22還包括由第—接觸部j 斜向延伸至容置部12内側面的第二傾斜部故、由第二傾 8/15 201244190 斜部224延伸至絕緣本體】〇頂面的第二平整部us。 一 平整部226朝縣本體〗〇的絲面延伸㈣紅述第: 腳228，本實施例的第二接腳228乃位於絕緣本心^ 面，然而第二接腳是可以‘依發光二極體封裝結構的而 變更位置。本實_㈣二導電部22有—部分覆蓋於配塾 島14的圓筒形弧面⑷，使圓筒形弧面⑷也提 線及反射光線的功用。 木尤 發光二極體晶片（LED dice) 30設於該第二接觸部 上。本實施例的發光二極體晶片3〇具有—位於其底 極，可以是陽極(anode)或陰極(cathode)，可藉由導電性樹月= (conductive epoxy)固定並電連接於第二接觸部222丨發曰 極體晶片3G的另-電極藉由導線32連接該於第: 21的第一接觸部212。相較先前技術，本發明的導線32 °口 位於容置部12内’未延伸至容置部外，長度縮短。然而^ 發明的發光二極體晶片並不限制於上述的型式，例如二 電極可以均為打線連接。 —固 請參閱圖3及圖4,分別為本發明之表面黏著型發光二 極體封裝結構的剖視圖及俯視圖。配塾島 二3 即導接平面⑷，乃低於絕緣本體】㈣頂面」=該: 光：極體晶片30的頂面。配墊島142的高度大約為容置‘ 2冰度的一半。當導線32打線(b〇nding)完成後仍遠遠低於 '%緣本體1〇的頂面，不會有先前技術導線外露的問題。 本實施例中該第一導電部21及該第二導電部22由铲 杰忒絕緣本體1〇表面的導電層2〇形成。該導電層％藉^ =縫20〗形成·該第一導電部21及該第二導電部22，以分 電連接發光二極體晶片30的二電極。導電層2〇同時=提 9/15 201244190 供反射及聚集光線的作用。 本發明為達成上述結構，提供_種表面黏著型發光二 極體封裝結構的製造方法，包括至少下列步驟： 首先，形成一絕緣本體10，並於該絕緣本體ι〇形 成凹陷狀的容置部12及突出於該容置部_的配㈣ 二。-種實施的方式’在該容置部12形成杯狀的容置 工間122及一平坦的底面丨24。 —其次，形成一導電層20於該絕緣本體10的表面，覆 盒該容置部12’並延伸至該絕緣本體1()的外表面而形成第 —接腳218及第二接腳228。一種較佳的方式，是以電鑛方 =成該導電層2G。更細部的步驟包括覆蓋該導電層別於 。玄、、巴緣本體1G的頂面及兩側面，並延伸至該絕緣本體1〇 的底面，而形成第-接腳218及第二接腳228於該絕緣本 月旦10底面。 接著，移除該導電I 20 @ 一部份而形成一隔乡 01，使该隔縫201穿過該配墊島丨4、該容置部12』 該絕緣本體10’將該導電層20隔開形成第一導電部2 ^第厂導電部22。—種較佳的方式，是以雷射钮刻方3 ，成5亥隔縫201。更仔細的說，其中包括在該第一導電2 =形成第-接觸部212於該配塾ft 14的頂面，並在該第」 冷電部22形成第二接觸部222於該容置部12的底面124 w後，設置一發光二極體晶片3〇於該容置部12的底 二^位於έ亥第二導電部22上。其中更細的步驟，包括設置 =發光二極體晶片3〇於該容置部丨2的底面〗24且位於該 弟二接觸部222上。 - 末了，提供一導線32以連接該發光二極體晶片3〇於 10/15 201244190 該第一導電部21。更具體的說，是連接於第一導電部21的 第一接觸部212。 縱上所述，本發明具有下述的特點及功能：容置部内 設有配墊島，使得發光二極體封裝結構的尺寸比先前技術 小；導線只延伸至容置部内，長度變短，高度變低，不僅 減少導線成本，也降低導線外露於絕緣本體的可能性及短 . 路的風險。導電層同時可作為容置部的反射面，又作為連 ，· 接二電極至電源的線路。 惟以上所述僅為本發明之較佳可行實施例，非因此即 侷限本發明之專利範圍，故舉凡運用本發明說明書及圖式 内容所為之等效技術變化，均同理皆包含於本發明之範圍 内，合予陳明。 【圖式簡單說明】 圖1 ’為習知的表面黏者型發光二極體的立體圖。 圖2，為本發明表面黏著型發光二極體的立體圖。 圖3，為本發明表面黏著型發光二極體的剖視圖。 圖4，為本發明表面黏著型發光二極體的俯視圖。 【主要元件符號說明】 絕緣本體...............10 容置部...................12 容置空間...............122 124 14 底®........... 配墊·島....... 圓筒形弧面 11/15 141 201244190 導接平面...............142 導電層...................20 隔縫.......................201 第一導電部...........21 第一接觸部...........212 第一傾斜部...........214 第一平整部...........216 第一接腳...............218 第二導電部...........22 第二接觸部...........222 第二傾斜部...........224 第二平整部...........226 第二接腳...............228 發光二極體晶片...30 導線.......................32 12/15201244190 VI. Description of the Invention: [Technical Field] The present invention relates to a surface-adhesive light-emitting diode encapsulation, a sister structure, and a method of manufacturing the same, and particularly to a flat-type pinpin A light-emitting diode package that is soldered to the surface of the circuit using Surface mounted technology. [Prior Art] Surface mounted light-emitting diodes have been widely used as proximity sensors, which are installed in mobile phones, televisions or portable mobile devices to sense the presence of users ( Presence). In order to obtain a longer sensing distance, a small-angle, high-strength surface-adhesive light-emitting diode is required. Among them, a surface-mounted reflective light-emitting diode (LED) can meet the above requirements. Referring to Fig. 1, a conventional surface-adhesive light-emitting diode has an insulating body 9 including a CUp_nke shaped receiving portion 92 and a pad setting portion 920 located outside the receiving portion 92. The guide pad setting area 920 is outwardly recessed from the inner surface of the accommodating portion 92 and recessed from the top surface of the insulating body 9. The cup-shaped accommodating portion 92 is for illuminating with light. One end of the metal bracket extends into the pad setting area 920 to form a bond pad, and the other end extends to the periphery of the insulative housing 9 as an electrode (not shown). Some of the above prior art can be improved. First, since the guide is located outside the accommodating portion 92, such a package structure requires a long bonding wire 95. It also causes potential reliability problems. 4/15 201244190 (potential reliabilitv,, 9 top and easy to expose: spring 95 is higher than the metal body of the insulating body part:: two Geer's easy to contact Setting the area 920 increases the occurrence of a short circuit. In addition, because of the large footprint of the pad, the 封装 明 明 疋 疋 疋 疋 疋 明 明 明 明 明 明 乃 乃 ά ά ά ά ά ά ά ά ά ά ά ά ά ά ά ά ά ά ά ά ά The invention of the present invention is reasonable in design and effective in improving the above problems. SUMMARY OF THE INVENTION The technical problem to be solved by the present invention lies in the height of the surface-adhering wires to reduce the potential package size of the letter. The above technical problem provides a surface-adhesive light-emitting type light-emitting diode package structure, which is to reduce the height of the wire to reduce the problem of the back-difference, and further reduce the overall seed-package structure. The invention comprises an illuminating diode chip and a central body of the invention, a first conductive portion, a second conductive cymbal, a (four) one-sided cymbal and a wire. The bar edge body has a Facing the shimming island located in the accommodating portion, the accommodating portion forms a work (3) and a flat surface: a surface: the shimming island protrudes from the cup-shaped space and forms a guiding plane. a second contact portion of the guiding plane of the mating island, and a second extending from the outer surface of the insulating body: a second conductive portion minus a second contact portion at a bottom surface of the receiving portion, and 4% a second pin of the outer surface of the edge body; a light-emitting diode wafer on the first contact portion; a wire connecting the light-emitting diode chip to the first contact portion to solve the above technical problem </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; a mating island protruding from the accommodating portion; forming a conductive layer on the surface of the insulating body, covering the accommodating portion, and extending to an outer surface of the insulating body to form a second pin; a part of the conductive layer is formed - a gap to make the partition Passing through the mating island, the accommodating portion and the insulative housing, forming the first conductive portion and the second conductive portion by conduction; m sweat is provided with a light emitting diode chip on the bottom surface of the accommodating portion and located at the bottom And a wire is formed to connect the light emitting diode chip to the portion. The present invention has at least the following beneficial effects: the overall structure of the accommodating island of the accommodating portion is smaller than the prior art; Extending into the accommodating portion, the length becomes shorter, the height becomes lower, the wire cost is reduced, and the risk of short-circuiting of the wire is also reduced. The conductive layer can also serve as a reflecting surface of the accommodating portion. In order to further understand the present invention for achieving the intended purpose For the techniques, methods, and effects of the present invention, please refer to the following detailed description of the present invention. The drawings 'believe the purpose, general features and features of the present invention, # can be obtained and understood in detail, (4) the closed type and the attached only provide The use of the invention is not intended to limit the invention. [Embodiment] The cup phase 2 is a perspective view of the (four) optical structure of the present invention. The structure of the present invention is combined with the following method. The surface-adhesive LED package structure of the present invention comprises: ^=6/15 201244190 edge body 10, a conductive layer 20 is formed on the surface of the insulating body 1〇, a photodiode wafer (LE; D dice) 30, and A wire 32. The conductive layer extends to the outer surface of the insulative housing 10 (the bottom is actually the bottom surface) to form the first pin 2_rst_pin) and the second pin (s_d test (4) 228, and the present invention can be used for the surface reduction technique (SMT). ) Soldering is mounted on the board diagram). The insulative housing 10 is made of an insulating material and can be molded by plastic. The insulative housing 10 I has a receiving portion 12 recessed downwardly from the top surface thereof, and a mating island (i4) located in the receiving portion 12. The present invention can form the accommodating portion 12 and the shimming island 14 while forming the insulating body by molding the plastic injection molding method. The accommodating portion 12 of the embodiment has a cup-Hke shape, has a accommodating space 122 and a flat bottom surface 124. The accommodating portion 12 forms an inner surface of the concave curved surface to facilitate light accumulation. A flat bottom surface 124 can be used to place the LED wafer 30. The mating island 14 is partially protruding from the inner surface of the cup-shaped receiving portion 12 toward the receiving space 122, and is generally wedge-shaped and forms a guiding plane (4). On the top. The guiding plane 142 is in the shape of a fan (11 〇|^} / 1 〇. In this embodiment, the mating island 14 has a cylindrical arc surface 141 adjacent to the flat bottom surface 124, and a pair of side planes ( The cylindrical curved surface 141 and the inner surface of the accommodating portion 12 are connected. However, the shape of the mating island of the present invention is not limited to the above examples, and may be, for example, a partial cylindrical shape, a square cylindrical shape, or the like. The conductive layer 20 is formed on the surface of the insulative body 1 (), and may be formed by electric ore or the like. The guide portion (1) extends to the outer surface of the main body at the same time, this example = 7 /15 201244190 Extends to the opposite sides of the body of the 'body'. The part that does not require a conductive layer can be covered, for example, with a peelable glue, and then removed after the electric ore. According to the present invention, the insulating body 1 The shape of the crucible may be formed by a long strip of insulating material Ji. The receiving portion 12 is formed. The surface is cut off, and the per-receiving portion is cut open, and the cut portion forms an uncharged ore. Then, 'formation of a gap across the conductive layer 2 (Iswati〇n gap) 201 'slot 2〇1 can be laser-synchronized The method is removed, or covered by the conductive layer 20. In the embodiment, the gap 2〇1 traverses the distribution island 4, the accommodating portion 2, and the insulating body 1〇. The conductive layer is spaced apart to form the first conductive portion 21 and the second conductive portion 22 to respectively conduct the power source to the two poles of the light emitting diode chip 3G. The conductive layer 2 of the present invention has the advantage that 'may also serve as The reflective surface of the accommodating portion 12 has a first connecting portion 212 on the guiding plane 142 and a first 218 extending to the outer surface of the insulating body 1 以. The first conductive portion 21 further includes a first inclined portion 214 extending obliquely from the first contact portion to the inner side surface of the receiving portion ! 2, and a first flat portion 2 extending from the first inclined portion 214 to the top surface of the insulating body 1丨6., the flat part 2 (four) hides the body H) the surface extension (4) into the above: the foot 218, the first leg 218 of the embodiment is located on the insulating body 〇 ' surface, however the first-pin can be compliant with the second pole Change the position by designing the body structure. The second conductive portion 22 has a second contact portion 222 located on the bottom surface of the receiving portion 12, and a second conductive portion 22 extending to the outer surface of the insulating body 1 () The second inclined portion extending from the first contact portion j obliquely to the inner side surface of the accommodating portion 12 extends from the second inclined 8/15 201244190 inclined portion 224 to the second flat portion us of the insulating body. A flat portion 226 extends toward the silk surface of the county body ( (4) narration: foot 228, the second pin 228 of this embodiment is located on the inner surface of the insulation, but the second pin can be 'light-emitting diode Change the position of the body package structure. The solid (4) two-conducting portion 22 has a cylindrical arc surface (4) partially covering the island 14 so that the cylindrical arc surface (4) also lifts and reflects light. A LED dice chip (LED dice) 30 is provided on the second contact portion. The light-emitting diode wafer 3 of the present embodiment has a bottom electrode, which may be an anode or a cathode, and may be fixed and electrically connected to the second contact by a conductive epoxy. The other electrode of the portion 222 of the cathode wafer 3G is connected to the first contact portion 212 of the 21st portion by the wire 32. Compared with the prior art, the wire 32 of the present invention is located in the accommodating portion 12 and does not extend outside the accommodating portion, and the length is shortened. However, the light-emitting diode chip of the invention is not limited to the above-described type, and for example, the two electrodes may be wire bonding. - Figure 3 and Figure 4 are a cross-sectional view and a plan view, respectively, of a surface mount type light emitting diode package structure of the present invention. With the island 2, the guiding plane (4) is lower than the insulating body. (4) Top surface = this: Light: The top surface of the polar body wafer 30. The height of the mat island 142 is approximately half of the ‘2 ice. When the wire 32 is finished (b〇nding), it is still far below the top surface of the '% edge body 1〇, and there is no problem with the prior art wire being exposed. In this embodiment, the first conductive portion 21 and the second conductive portion 22 are formed by a conductive layer 2 〇 on the surface of the shovel insulating body 1 . The conductive layer % forms the first conductive portion 21 and the second conductive portion 22 by means of a slit 20 to electrically connect the two electrodes of the light-emitting diode wafer 30. Conductive layer 2 〇 simultaneously = mention 9/15 201244190 for reflection and accumulation of light. In order to achieve the above structure, the present invention provides a method for manufacturing a surface-adhesive light-emitting diode package structure, comprising at least the following steps: First, an insulative body 10 is formed, and a recessed receiving portion is formed in the insulating body ι 12 and the four (4) two protruding from the accommodating part _. - A method of carrying out 'the housing portion 12 forms a cup-shaped accommodation chamber 122 and a flat bottom surface 丨24. - Next, a conductive layer 20 is formed on the surface of the insulative housing 10, and the receiving portion 12' is covered and extends to the outer surface of the insulative housing 1 to form a first pin 218 and a second pin 228. A preferred way is to make the conductive layer 2G. A more detailed step includes covering the conductive layer. The top surface and the two sides of the body 1G extend to the bottom surface of the insulating body 1 ,, and the first pin 218 and the second pin 228 are formed on the bottom surface of the insulating moon 10 . Then, the conductive I 20 @ part is removed to form a gate 01, and the gap 201 is passed through the pad island 4, the receiving portion 12. The insulating body 10' separates the conductive layer 20 Opening the first conductive portion 2 ^ the first conductive portion 22 . A preferred way is to use a laser button to engrave a square 3 into a 5 mile septum 201. More specifically, the first conductive portion 2 includes a first contact portion 212 formed on a top surface of the yoke ft 14 and a second contact portion 222 is formed at the accommodating portion After the bottom surface 124 of 12, a light-emitting diode chip 3 is disposed on the bottom of the accommodating portion 12 on the second conductive portion 22. The finer steps include setting the light-emitting diode chip 3 to the bottom surface 24 of the housing portion 2 and on the second contact portion 222. Finally, a wire 32 is provided to connect the light-emitting diode chip 3 to the first conductive portion 21 at 10/15 201244190. More specifically, it is the first contact portion 212 connected to the first conductive portion 21. In the above, the present invention has the following features and functions: the accommodating portion is provided with a mating island, so that the size of the illuminating diode package structure is smaller than that of the prior art; the wire extends only into the accommodating portion, and the length becomes shorter. The height is low, which not only reduces the cost of the wire, but also reduces the possibility of the wire being exposed to the insulating body and the risk of short roads. The conductive layer can also serve as the reflective surface of the accommodating portion, and also serves as a connection for connecting the two electrodes to the power source. However, the above description is only a preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, and the equivalent technical changes of the present specification and the contents of the drawings are all included in the present invention. Within the scope of the agreement, Chen Ming. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 ' is a perspective view of a conventional surface-adhesive light-emitting diode. 2 is a perspective view of a surface-adhesive light-emitting diode of the present invention. Fig. 3 is a cross-sectional view showing a surface-adhesive light-emitting diode of the present invention. 4 is a plan view of a surface-adhesive light-emitting diode of the present invention. [Description of main component symbols] Insulating body..................10 accommodating part........................12 accommodating space ...............122 124 14 Bottom®........... With pad · Island....... Cylindrical curved surface 11/15 141 201244190 Pilot Plane..................142 Conductive Layer...................20 Spacer..... ..................201 First Conductive Part...........21 First Contact........... 212 First inclined part...........214 First flat part........216 First pin............. ..218 Second Conductive Part...........22 Second contact part........222 Second inclined part........... 224 Second flat part...........226 Second pin...............228 Light-emitting diode chip...30 wire... ....................32 12/15