CN109873072A - Light emitting device, light-emitting diode encapsulation structure and its manufacturing method - Google Patents
Light emitting device, light-emitting diode encapsulation structure and its manufacturing method Download PDFInfo
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- CN109873072A CN109873072A CN201711250625.3A CN201711250625A CN109873072A CN 109873072 A CN109873072 A CN 109873072A CN 201711250625 A CN201711250625 A CN 201711250625A CN 109873072 A CN109873072 A CN 109873072A
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Abstract
The present invention discloses a kind of light emitting device and its manufacturing method, light-emitting diode encapsulation structure and its manufacturing method.Light-emitting diode encapsulation structure includes: an insulating body, one first conductive unit, one second conductive unit and an at least light-emitting diode chip for backlight unit.First conductive unit and the second conductive unit are arranged on insulating body and are separated from each other.At least a light-emitting diode chip for backlight unit is electrically connected between the first conductive unit and the second conductive unit.First conductive unit has a first groove, and first an electrically conductive outer surface of conductive unit first be separated from each other is distinguished by first groove, second conductive unit has a second groove, and second an electrically conductive outer surface of conductive unit second be separated from each other is distinguished by second groove, the light emitting region of light-emitting diode encapsulation structure is flow to avoid solder.The present invention can maintain emergent light in scheduled luminous intensity and maintain stable, accurate luminescent properties.
Description
Technical field
The present invention relates to a kind of light emitting device and its manufacturing methods, light-emitting diode encapsulation structure and its manufacturing method, special
Be not be related to it is a kind of for prevent solder from flowing to the region unfavorable on light-emitting diode encapsulation structure and influence light emitting diode hair
Light emitting device and its manufacturing method, the light-emitting diode encapsulation structure and its manufacturing method of light transmittance efficiency.
Background technique
The light-emitting diode encapsulation structure of SMD LED surface-mount device LED (surface mounted) has been widely used in each portable
In formula electronic device.In general, in process, it is mostly solid by a reflow step light-emitting diode encapsulation structure using solder
It is scheduled on circuit substrate.
However, the light-emitting diode encapsulation structure of the prior art still has improved space.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of light emitting device and its system in view of the deficiencies of the prior art
Method, light-emitting diode encapsulation structure and its manufacturing method are made, can prevent solder from flowing to light-emitting diode encapsulation structure
The unfavorable region of luminous efficiency, such as reflection region.
In order to solve the above technical problems, a wherein technical solution of the present invention is to provide a kind of luminous two
Pole pipe encapsulating structure comprising: an insulating body, one first conductive unit, one second conductive unit and at least one luminous two
Pole pipe chip.First conductive unit is arranged on the insulating body.Second conductive unit is arranged in the insulation
It is separated from each other on ontology and with first conductive unit.At least one light-emitting diode chip for backlight unit is electrically connected at described first
Between conductive unit and second conductive unit.Wherein, first conductive unit has a first groove, and described first
One outer surface of conductive unit is distinguished into two first be separated from each other by the first groove, wherein described first is conductive
The outer surface of unit is electrically conductive.Second conductive unit has a second groove, and second conductive unit
One outer surface is distinguished into two second be separated from each other by the second groove, wherein second conductive unit it is described
Outer surface is electrically conductive.
Further, first conductive unit and second conductive unit are covered each by the insulating body
Two sides and the bottom surface for extending to the insulating body.
Further, first conductive unit include one first layers of copper, one be arranged in first layers of copper
One nickel layer and one the first layer gold on first nickel layer is set, and the first groove is formed in first layer gold
On, so that first layer gold is separated into two described first and exposes first nickel layer to the open air, wherein described second is conductive
Unit include one second layers of copper, one be arranged in the second nickel layer in second layers of copper and one be arranged on second nickel layer
The second layer gold, and the second groove is formed in second layer gold, so that second layer gold is separated into two institutes
It states second and exposes second nickel layer to the open air.
In order to solve the above technical problems, an other technical solution of the present invention is to provide a kind of dress that shines
It sets comprising: a circuit substrate and a light-emitting diode encapsulation structure.The light emitting diode construction is by solder to weld
On the circuit substrate.Wherein, the light-emitting diode encapsulation structure includes: an insulating body, one first conductive unit, one
Second conductive unit and at least a light-emitting diode chip for backlight unit.One first conductive unit is arranged on the insulating body.
Second conductive unit is arranged on the insulating body and is separated from each other with first conductive unit.At least one hair
Luminous diode chip its be electrically connected between first conductive unit and second conductive unit.Wherein, described first
Conductive unit has a first groove, and an outer surface of first conductive unit is distinguished by the first groove to be separated from each other
Two first, wherein the outer surface of first conductive unit be it is electrically conductive, and the first groove prevent described in
Solder from wherein one described first flow to other one described first.Wherein, second conductive unit has one second ditch
Slot, the outer surface of second conductive unit are distinguished into two second be separated from each other by the second groove, wherein described
The outer surface of second conductive unit is electrically conductive, and the second groove prevents the solder from wherein one described second
Flow to other one described second.
Further, first conductive unit and second conductive unit are covered each by the insulating body
Two sides and the bottom surface for extending to the insulating body.
Further, first conductive unit include one first layers of copper, one be arranged in first layers of copper
One nickel layer and one the first layer gold on first nickel layer is set, and the first groove is formed in first layer gold
On, so that first layer gold is separated into two described first and exposes first nickel layer to the open air, wherein described second is conductive
Unit include one second layers of copper, one be arranged in the second nickel layer in second layers of copper and one be arranged on second nickel layer
The second layer gold, and the second groove is formed in second layer gold, so that second layer gold is separated into two institutes
It states second and exposes second nickel layer to the open air.
In order to solve the above technical problems, other yet another aspect of the present invention is to provide a kind of shine
The manufacturing method of diode package structure comprising: a LED encapsulation body, the LED encapsulation body packet are provided
Include: an insulating body, one first conductive unit are arranged on the insulating body, one second conductive unit, are arranged in institute
It states on insulating body and is separated from each other with first conductive unit, and an at least light-emitting diode chip for backlight unit, be electrically connected
Between first conductive unit and second conductive unit；A first groove is formed on first conductive unit,
Wherein, an outer surface of first conductive unit is distinguished into two first be separated from each other by the first groove；And
A second groove is formed on second conductive unit, wherein an outer surface of second conductive unit is by described second
Groove is distinguished into two second be separated from each other.
Further, the first groove and the second groove are formed with a laser ablation method.
In order to solve the above technical problems, other yet another aspect of the present invention is to provide a kind of shine
The manufacturing method of device comprising: a LED encapsulation body is provided, the LED encapsulation body includes: an insulation
Ontology, one first conductive unit are arranged on the insulating body, one second conductive unit, and setting is in the insulation sheet
It is separated from each other on body and with first conductive unit；And an at least light-emitting diode chip for backlight unit, it is electrically connected at described
Between one conductive unit and second conductive unit；A first groove is formed on first conductive unit, wherein described
One outer surface of the first conductive unit is distinguished into two first be separated from each other by the first groove；It is conductive described second
A second groove is formed on unit, wherein an outer surface of second conductive unit is distinguished into each other by the second groove
Two second of separation；And the LED encapsulation body is electrically connected at a circuit base by a welding method
Plate.
Further, the LED encapsulation body is soldered to the circuit substrate via a solder, wherein institute
State first groove prevent the solder from wherein one described first flow to other one described first, and the second groove hinders
Only the solder from wherein one described second flow to other one described second.
A wherein beneficial effect of the invention is, light emitting device provided by the present invention and its manufacturing method shine two
Pole pipe encapsulating structure and its manufacturing method, can be by " on first conductive unit forming a first groove, wherein institute
The outer surface for stating the first conductive unit is distinguished into two first be separated from each other by the first groove, wherein described
The outer surface of one conductive unit is electrically conductive " and " second conductive unit has a second groove, and described second
One outer surface of conductive unit is distinguished into two second be separated from each other by the second groove, wherein described second is conductive
The outer surface of unit is electrically conductive " technical solution so that the first groove prevents the solder from wherein described in one
First flows to other one described first, and the second groove prevent the solder from wherein one described second flow to it is another
Outer one described second.
Be further understood that feature and technology contents of the invention to be enabled, please refer to below in connection with it is of the invention specifically
Bright and attached drawing, however provided attached drawing is merely provided for reference and description use, is not intended to limit the present invention.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of the light emitting device with light-emitting diode encapsulation structure of first embodiment of the invention.
Fig. 2 is the enlarged diagram of the part II in Fig. 1.
Fig. 3 is the side of LED encapsulation body provided by the manufacturing method of the light emitting device of first embodiment of the invention
Depending on schematic diagram.
Fig. 4 is the flow chart of the manufacturing method of the light emitting device of first embodiment of the invention.
Fig. 5 is the light emitting device diagrammatic cross-section with light-emitting diode encapsulation structure of the second embodiment of the present invention.
Fig. 6 is the enlarged diagram of the part VI in Fig. 5.
Fig. 7 is the diagrammatic cross-section of the light emitting device with light-emitting diode encapsulation structure of third embodiment of the invention.
Specific embodiment
Be below illustrated by specific specific example it is presently disclosed it is related " light emitting device and its manufacturing method,
The embodiment of light-emitting diode encapsulation structure and its manufacturing method ", those skilled in the art can be by disclosed in this specification
Content understands advantages of the present invention and effect.The present invention can be implemented or be applied by other different specific embodiments, this
Every details in specification may be based on different viewpoints and application, carried out in the case where not departing from design of the invention it is various modification with
Change.In addition, attached drawing of the invention is only simple schematically illustrate, not according to the description of actual size, stated.Reality below
The mode of applying will be explained in further detail the relevant technologies content of the invention, but disclosure of that is not intended to limit the invention
Technical scope.
First embodiment:
It please refers to Fig.1 to Fig.4.The present embodiment provides a light-emitting diode encapsulation structure L and there is the light emitting diode
The light emitting device D of encapsulating structure L.Light-emitting diode encapsulation structure L includes an insulating body 1, one first conductive unit 2,1 the
Two conductive units 3 and at least a light-emitting diode chip for backlight unit 4.
Insulating body 1 can be the material with insulating properties, such as plastics or ceramics, and by way of plastic injection or pressure
Mold technique forms.In the present embodiment, insulating body 1 forms required shape and size by stamping technique.Insulation is originally
Body 1 can have the holding part 10 from the top surface of insulating body 1 to lower recess.As shown in Figure 1, holding part 10 of the invention has
One bottom surface 110, one is by the oblique outwardly extending concavity cambered surface 120 in bottom surface 110 and a hierarchic structure 130.
First conductive unit 2 of the invention is arranged on insulating body 1；Second conductive unit 3 is arranged on insulating body 1
And it is separated from each other with the first conductive unit 2.First conductive unit 2 and the second conductive unit 3 of the invention is formed in insulation originally
The surface of body 1 can be formed by plating metal or sputtering way.The position for being not necessary to covering conductive unit can first be covered, example
It is such as covered with strippable glue, is removed again after plating.
From the above, as shown in Figures 1 and 2, the first conductive unit 2 and the second conductive unit 3 cover insulating body 1
Top surface, and be covered each by the two sides of insulating body 1 and extend to two bottom surfaces.It is described in detail, understands for convenience, it can will be exhausted
Edge ontology 1 is divided into first area and second area.As shown in Figures 1 and 2, the first conductive unit 2 covering insulating body 1 pushes up
Face corresponds to the part of first area, and extends to the hierarchic structure 130 of holding part 10.First conductive unit 2, which has, to be extended to absolutely
First pin 21 of the outer surface of edge ontology 1.In the present embodiment, the position of the first pin 210 is positioned at the bottom of insulating body 1
Face, right first pin 210 can according to the design of light-emitting diode encapsulation structure L change of location, therefore it is without being limited thereto.
Similarly, the second conductive unit 3 covering 1 top surface of insulating body corresponds to the bottom of the part of second area, holding part 10
Face 110, holding part concavity cambered surface 120 and extend to hierarchic structure 130.Although it is worth noting that, the first conductive unit 2 with
And second conductive unit 3 all cover the hierarchic structure 130 of a part, the first conductive unit 2 and the second conductive unit 3 is divide each other
From.Second conductive unit 3 extends to the second pin 310 of the outer surface of insulating body 1 with bottom surface.The second of the present embodiment is drawn
Foot 310 is the bottom surface for being located at insulating body 1, so without being limited thereto.
It is separated from each other between first conductive unit 2 and the second conductive unit 3, to realize insulation effect.It is noted that the
The boundary of one region and second area can do various change according to practical practice condition, and the invention is not limited thereto.
Referring to Fig. 2, its enlarged drawing for a portion of Fig. 1.As shown in Fig. 2, the first conductive unit 2 includes first
Layers of copper 21, the first nickel layer 22 and the first layer gold 23.The first layers of copper is arranged in by the modes such as being electroplated or being coated in first nickel layer 22
On 21, and the first layers of copper 21 is set on insulating body 1.The first nickel is arranged in by the modes such as being electroplated or being coated in first layer gold 23
On layer 22.In the same manner, the second conductive unit 3 includes the second layers of copper 31, the second nickel layer 32 and the second layer gold 33.Second nickel layer 32
It is arranged in the second layers of copper 31 by the modes such as being electroplated or being coated with, the second layer gold 33 is arranged in by the modes such as being electroplated or being coated with
On two nickel layers 32.Copper material and nickel material are herein mainly as the use of electrical conduction, and layer gold is then due to good light reflectivity
Bowl-shape luminous and reflected light region optical performance in the present embodiment can be made to be promoted, and have good stick between solder
Property.It is solder to weld LED encapsulation body to circuit substrate since solder can have good mobility in layer gold
Key.Nickel layer is then to increase the adhesion between copper and gold.
Refering to fig. 1 and Fig. 2, according to the present embodiment, the first conductive unit 2 has first groove 200, and the first conductive unit
2 outer surface is distinguished into two parts being separated from each other by first groove 200；Second conductive unit 3 has second groove 300,
And second the outer surface of conductive unit 3 two parts being separated from each other are distinguished by second groove 300.In detail, in order to maintain
Electric conductivity, while preventing solder from flowing to unfavorable region, such as: holding part 10, the first conductive unit 2 are adjacent to the part of holding part 10
And second conductive unit 3 adjacent to the part of holding part 10, the present invention forms a first groove 200 in the first layer gold 23,
First layer gold 23 is divided into two first be separated from each other and exposes the first nickel layer 22 by middle first groove 200；And second
A second groove 300 is formed in layer gold 33, wherein the second layer gold 33 is divided into two second be separated from each other by second groove 300
And expose the second nickel layer 32.In this way, first groove 200 and second groove 300 solder 50 can be prevented across first groove 200 and
Second groove 300 and so that solder 50 is rested on the edge of the top surface light emitting device D first groove 200 and second groove 300.In this reality
It applies in example, the present invention is to be formed to etch in the outer surface of the first conductive unit 2 and the second conductive unit 3 respectively by laser-induced thermal etching
Groove.
The etching of first groove 200 and second groove 300 it is deep-controlled in certain depth, i.e. the first layer gold 23 and
The thickness of two layer gold 33, width is then between 20 μm to 40 μm.It is worth noting that, first groove 200 and second groove 300
Width depending on actual demand, be not limited to above-mentioned.In other embodiments, to form first groove 200 and the second ditch
The etch depth of slot 300 may be slightly larger than the thickness of the first layer gold 23 and the second layer gold 33 to expose the first nickel layer 22 and second
Nickel layer 32, and in the present embodiment, the depth of first groove 200 and second groove 300 is equal to the first layer gold 23 and the second layer gold
33 thickness.According to Fig. 1, the first groove 200 and second groove 300 of the present embodiment are to be set to the two sides of holding part 10,
First conductive unit 2 and the second conductive unit 3 correspond to the part of the top surface of insulating body 1.
The electric connection of an at least light-emitting diode chip for backlight unit 4 is set between the first conductive unit 2 and the second conductive unit 3.
As shown in Figure 1, light-emitting diode chip for backlight unit 4, which is electrically connected at the first conductive unit 2 by a conducting wire, is located at hierarchic structure 130
Part.The present embodiment is with a light-emitting diode chip for backlight unit 4 as an example, so without being limited thereto.The light emitting diode of the present embodiment
Chip 4 has the electrode positioned at its bottom surface, and electrode can be anode or cathode, can fix and be electrically connected by electroconductive resin
In the second conductive unit 3.
From the above, when light-emitting diode encapsulation structure L is placed on circuit substrate 5 to form light emitting device D, weldering
Material 50 can rise along the surface for the first conductive unit 2 and the second conductive unit 3 that 1 two sides of insulating body are arranged in.So, by
The first of the first nickel layer 22 and the second nickel layer 32 is exposed in being provided in the first conductive unit 2 and the second conductive unit 3
Groove 200 and second groove 300, the solder 50 that can be flowed originally along layer gold surface can the stopping when flowing to slot wedge.Cause
This, the present invention can prevent solder 50 from flowing to another part from a part of the first conductive unit 2 and the second conductive unit 3, whereby
Can prevent solder 50 from flowing into unfavorable region, such as: in holding part 10, the first conductive unit 2 adjacent to holding part 10 part and
Second conductive unit 3 avoids influencing optical effect and luminous efficiency adjacent to the part of holding part 10.Simultaneously as reducing solder
It is trapped in the area of the outer surface of the first conductive unit 2 holding part corresponding with the second conductive unit 3.
In practice, in general, solder can have good mobility in layer gold, therefore can penetrate into packing colloid,
Its material of packing colloid is usually silicon or other sealing materials, thus affects the reflectivity properties and packing colloid pair on layer gold surface
In the tackness of layer gold.Therefore technological means through the invention, encapsulating material (packaging plastic unit as shown in Figure 1 can be reduced
S) probability for being influenced and being removed is flowed in the first layer gold 23 and the second layer gold 33 by solder.
Please refer to Fig. 3 and Fig. 4, the manufacturing method of the light emitting device D of the present embodiment explained below.Firstly, see Fig. 3,
The manufacturing method of the present embodiment includes step S100: providing a LED encapsulation body L ' comprising an insulating body 1 ', one
First conductive unit 2 ', one second conductive unit 3 ', at least a light-emitting diode chip for backlight unit 4 ', the first conductive unit 2 ' are arranged exhausted
On edge ontology 1 ', the second conductive unit 3 ' is arranged on insulating body 1 ' and is separated from each other with the first conductive unit 2 ', and luminous two
Pole pipe chip 4 ' is electrically connected between the first conductive unit and the second conductive unit.
Then, Fig. 1 and Fig. 2 is please referred to, the manufacturing method of the present embodiment further includes step S102: in the first conductive unit 2 '
One first groove 200 of upper formation a, wherein outer surface of the first conductive unit 2 ' is distinguished by first groove 200 to be separated from each other
Two first；S104: a second groove 300 is formed on the second conductive unit 3 ', wherein the one of the second conductive unit 3 '
Outer surface is distinguished into two second be separated from each other by second groove 300.
Finally, the manufacturing method of the present embodiment further comprises step S106: LED encapsulation body L is passed through a weldering
It connects method and is electrically connected at a circuit substrate 5.Specifically, LED encapsulation body L is welded via a solder 50
It is connected on circuit substrate 5, wherein first groove 200 prevents solder 50 from flowing to other one first from wherein one first, and the
Two grooves 300 prevent solder 50 from flowing to other one second from wherein one second.
In the present embodiment, first groove 200 and second groove 300 are with a laser in step S102 and step S104
Engraving method and formed.By laser-induced thermal etching, second layer gold 33 of the first a part of layer gold 23 and a part is etched
And form first groove 200 and second groove 300.
In summary, the present embodiment can prevent solder from flowing to unfavorable region from a soldered pin and influence the effect that shines
Rate, such as: holding part 10, the first conductive unit 2 are adjacent to the part of holding part 10 and the second conductive unit 3 adjacent to holding part 10
Part, and the smoothness of the scheduled reflector shape of holding part 10 and reflecting surface can be therefore kept, to keep the row of light
Route line, and can have stable luminous efficiency.Furthermore, light emitting device D, its light-emitting diode encapsulation structure L, luminous dress
The manufacturing method for setting D and light-emitting diode encapsulation structure L can prevent the consistent of reflection efficiency on layer gold surface to be affected, therefore can
Emergent light is maintained in scheduled luminous intensity and maintains stable, accurate luminescent properties.Further, institute technical side of the present invention
Case can also reduce the component spoilage of light emitting device.The reason of component damages usually solder flow into encapsulating material and layer gold it
Between, gap is caused, penetrates into aqueous vapor and pollutant wherein.
Second embodiment
Please refer to Fig. 5 and Fig. 6, second embodiment of the invention provides a kind of light-emitting diode encapsulation structure L and have should
The light emitting device D of light-emitting diode encapsulation structure L.Light-emitting diode encapsulation structure L includes insulating body 1, the first conductive unit
2, the second conductive unit 3 and at least a light-emitting diode chip for backlight unit 4.Light-emitting diode encapsulation structure L is arranged on circuit substrate 5
Form light emitting device D.The light-emitting diode encapsulation structure L of the present embodiment and light-emitting diode encapsulation structure L of first embodiment
Structure it is similar, the difference is that, the second groove 300 of the present embodiment setting position and first embodiment setting position not
Together.Bottom surface bottom surface bottom surface from the above, is identical with the first embodiment, and first conductive unit 2 of the present embodiment is led with second
Electric unit 3 is separated from each other, and the first area of corresponding insulating body is arranged with second area, to realize effect insulated from each other
Fruit.
Furthermore, it is understood that the light-emitting diode encapsulation structure L of the present embodiment has first groove 200 and second groove
300.In the present embodiment, the outside insulating body 1 of the corresponding holding part 10 of the first conductive unit 2 is arranged in first groove 200
On top surface, and second groove 300 is arranged on the outer surface of the side of the corresponding insulating body 1 of the second conductive unit 3.From Fig. 6
It can be seen that, the second conductive unit 3 includes the second layers of copper 31, the second nickel layer 32 and the second layer gold 33, and second groove 300 is arranged
In the second layer gold 33.
As shown in figure 3, the outer surface region of the first conductive unit 2 is divided into and dividing each other by first groove 200 from the point of view of from the appearance
From Liang Ge first part, and the outer surface region of the second conductive unit 3 is divided into two second be separated from each other by second groove 300
Part.When light-emitting diode encapsulation structure L is arranged on circuit substrate 5 to form light emitting device D, due to first groove
200 and second groove 300 setting formed in smooth outer surface of first conductive unit 2 with the second conductive unit 3 it is recessed
First conductive unit 2 and the second conductive unit 3 are simultaneously divided into two parts respectively by slot, therefore solder 50 passes through surface tension and capillary
Phenomenon will stop after flowing upward to 300 edge of first groove 200 and second groove with second pin 310 from the first pin 210, no
It can flow into first groove 200 and second groove 300.Whereby, it can avoid solder 50 from two distinguished by first groove 200 the
A portion of a part flows to other first part, while also can avoid solder 50 from being distinguished by second groove 300
A portion of two second parts flows to other second part.
Effect in addition to can reach first embodiment, the present embodiment is by being arranged in light emitting device D's for second groove 300
Side, the solder 50 that can avoid a part rises to the top surface of light emitting device D, therefore can reduce light emitting device D whole height
The case where raising.In the trend of current development in science and technology, space occupied by saving part is quite important, it is therefore prevented that solder
50 to flow to the top surface of light emitting device D and increase the height of light emitting device D be the present embodiment wherein main advantage.
3rd embodiment
Referring to FIG. 7, third embodiment of the invention provides a kind of light-emitting diode encapsulation structure L and shines with this again
The light emitting device D of diode package structure L.Light-emitting diode encapsulation structure L includes insulating body 1, the first conductive unit 2,
Two conductive units 3 and at least a light-emitting diode chip for backlight unit 4.Light-emitting diode encapsulation structure L setting is formed on circuit substrate 5
Light emitting device D.The aforementioned components of the present embodiment and first and second embodiment are all the same, repeat no more in this.The present embodiment with
Previous embodiment the difference is that, first groove 200 and second groove 300 are separately positioned on the first conductive unit 2 and second
On the outer surface of the two sides of the corresponding insulating body 1 of conductive unit 3.
From the above, the outer surface region of the first conductive unit 2 is divided into two first be separated from each other by first groove 200
Point, and the outer surface region of the second conductive unit 3 is divided into two second parts being separated from each other by second groove 300.When luminous two
When pole pipe encapsulating structure L is arranged on circuit substrate 5 to form light emitting device D, due to first groove 200 and second groove
300 setting forms groove in the smooth outer surface of the first conductive unit 2 and the second conductive unit 3, therefore solder 50 passes through
After being upwardly into groove with second pin 310 from the first pin 210 by surface tension and capillary phenomenon, the side of groove will stay on
Edge.Whereby, can avoid solder 50 from first groove 200 far from holding part 10 first flow to close to holding part 10 first
Portion, while also can avoid second from second groove 300 far from holding part 10 of solder 50 and flowing to second close to holding part 10
Portion.
Effect in addition to can reach first embodiment, the present embodiment is by all setting second groove 300 and second groove
It sets in the side of light emitting device D, can avoid the top surface that solder 50 rises to light emitting device D, therefore more effectively reduce the dress that shines
Set the case where D whole height increases.In the trend of current development in science and technology, space occupied by saving part is quite important, because
This, the height for preventing solder 50 from flowing to the top surface of light emitting device D and increasing light emitting device D is that the present embodiment is wherein one main excellent
Point.
The beneficial effect of embodiment
A wherein beneficial effect of the invention is, light emitting device D and its manufacturing method provided by the embodiment of the present invention,
Light-emitting diode encapsulation structure L and its manufacturing method, can be by the way that " the first conductive unit 2 has first groove 200, and first
The outer surface of conductive unit 2 is divided into two parts being separated from each other by first groove area 200 " and " the second conductive unit 3 has the
The technology of two grooves 300, and the outer surface of the second conductive unit 3 is distinguished into two parts being separated from each other by second groove 300 "
Scheme flows to another part from a portion to avoid solder 50.
Therefore, according to the technical solution of the present invention, light emitting device D, light-emitting diode encapsulation structure L and its manufacturing method can
Reach following technical effect:
1. preventing solder 50 from flowing to the region unfavorable on light emitting device D from the first pin 210 and second pin 310 and influencing
Luminous efficiency, such as: the part and the neighbouring appearance of the second conductive unit 3 of holding part 10, the first conductive unit 2 adjacent to holding part 10
The part in portion 10 is set, and can therefore keep the scheduled reflector shape of holding part 10 and reflecting surface smoothness, to keep light
Travelling route, and can have stable luminous efficiency.
2. preventing unanimously being affected for the reflection efficiency on layer gold surface, therefore emergent light can be maintained in scheduled luminous intensity
And maintain stable, accurate tuorbillion rotation rotary light performance.
3. the component spoilage that institute's technical solution of the present invention can also reduce light emitting device.
4. preventing the whole height of light emitting device from increasing due to solder is climbed to top surface.
Content disclosed above is only preferred possible embodiments of the invention, not thereby limits to right of the invention and wants
The protection scope of book is sought, so all equivalence techniques variations done with description of the invention and accompanying drawing content, are both contained in
In the protection scope of claims of the present invention.
Claims (10)
1. a kind of light-emitting diode encapsulation structure, which is characterized in that the light-emitting diode encapsulation structure includes:
One insulating body；
One first conductive unit is arranged on the insulating body；
One second conductive unit is arranged on the insulating body and is separated from each other with first conductive unit；And
An at least light-emitting diode chip for backlight unit is electrically connected between first conductive unit and second conductive unit；
Wherein, first conductive unit has a first groove, and an outer surface of first conductive unit is by described the
One groove is distinguished into two first be separated from each other, wherein the outer surface of first conductive unit is electrically conductive；
Wherein, second conductive unit has a second groove, and an outer surface of second conductive unit is by described the
Two grooves are distinguished into two second be separated from each other, wherein the outer surface of second conductive unit is electrically conductive.
2. light-emitting diode encapsulation structure according to claim 1, which is characterized in that first conductive unit and institute
The second conductive unit is stated to be covered each by the two sides of the insulating body and extend to the bottom surface of the insulating body.
3. light-emitting diode encapsulation structure according to claim 1, which is characterized in that first conductive unit includes one
The first gold medal on first nickel layer is arranged in first layers of copper, first nickel layer being arranged in first layers of copper and one
Layer, and the first groove is formed in first layer gold, so that first layer gold is separated into two described first
And expose first nickel layer to the open air, wherein second conductive unit includes one second layers of copper, a setting in second layers of copper
The second nickel layer and one the second layer gold on second nickel layer is set, and the second groove is formed in second gold medal
On layer, so that second layer gold is separated into two described second and exposes second nickel layer to the open air.
4. a kind of light emitting device, which is characterized in that the light emitting device includes:
One circuit substrate；And
One light-emitting diode encapsulation structure, by solder to be welded on the circuit substrate, wherein the light emitting diode
Encapsulating structure includes:
One insulating body；
One first conductive unit is arranged on the insulating body；
One second conductive unit is arranged on the insulating body and is separated from each other with first conductive unit；And
An at least light-emitting diode chip for backlight unit is electrically connected between first conductive unit and second conductive unit；
Wherein, first conductive unit has a first groove, and an outer surface of first conductive unit is by described first
Groove is distinguished into two first be separated from each other, wherein the outer surface of first conductive unit is electrically conductive, and institute
State first groove prevent the solder from wherein one described first flow to other one described first；
Wherein, second conductive unit has a second groove, and the outer surface of second conductive unit is by second ditch
Slot is distinguished into two second be separated from each other, wherein the outer surface of second conductive unit is electrically conductive and described
Second groove prevent the solder from wherein one described second flow to other one described second.
5. light emitting device according to claim 4, which is characterized in that first conductive unit and second conduction
Unit is covered each by the two sides of the insulating body and extends to the bottom surface of the insulating body.
6. light emitting device according to claim 4, which is characterized in that first conductive unit include one first layers of copper,
One the first nickel layer being arranged in first layers of copper and one the first layer gold on first nickel layer, and described are set
One groove is formed in first layer gold, so that first layer gold is separated into two described first and exposes described to the open air
One nickel layer, wherein second conductive unit include one second layers of copper, one be arranged in the second nickel layer in second layers of copper with
And one be arranged in the second layer gold on second nickel layer, and the second groove is formed in second layer gold, so that institute
The second layer gold is stated to be separated into two described second and expose second nickel layer to the open air.
7. a kind of manufacturing method of light-emitting diode encapsulation structure, which is characterized in that the system of the light-emitting diode encapsulation structure
The method of making includes:
A LED encapsulation body is provided, the LED encapsulation body includes:
One insulating body；
One first conductive unit is arranged on the insulating body；
One second conductive unit is arranged on the insulating body and is separated from each other with first conductive unit；And
An at least light-emitting diode chip for backlight unit is electrically connected between first conductive unit and second conductive unit；
A first groove is formed on first conductive unit, wherein an outer surface of first conductive unit is described
First groove is distinguished into two first be separated from each other；And
A second groove is formed on second conductive unit, wherein an outer surface of second conductive unit is described
Second groove is distinguished into two second be separated from each other.
8. the manufacturing method of light-emitting diode encapsulation structure according to claim 7, which is characterized in that the first groove
And the second groove is formed with a laser ablation method.
9. a kind of manufacturing method of light emitting device, which is characterized in that the manufacturing method of the light emitting device includes:
A LED encapsulation body is provided, the LED encapsulation body includes:
One insulating body；
One first conductive unit is arranged on the insulating body；
One second conductive unit is arranged on the insulating body and is separated from each other with first conductive unit；And
An at least light-emitting diode chip for backlight unit is electrically connected between first conductive unit and second conductive unit；
A first groove is formed on first conductive unit, wherein an outer surface of first conductive unit is described
First groove is distinguished into two first be separated from each other；
A second groove is formed on second conductive unit, wherein an outer surface of second conductive unit is described
Second groove is distinguished into two second be separated from each other；And
The LED encapsulation body is electrically connected at a circuit substrate by a welding method.
10. the manufacturing method of light emitting device according to claim 9, which is characterized in that the LED encapsulation body
The circuit substrate is soldered to via a solder, wherein the first groove prevents the solder from wherein one described first
Portion flows to other one described first, and the second groove prevent the solder from wherein one described second flow to other one
Described second.
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