CN104659006B - A kind of plastic sealed IPM lead frame structure - Google Patents
A kind of plastic sealed IPM lead frame structure Download PDFInfo
- Publication number
- CN104659006B CN104659006B CN201310587295.2A CN201310587295A CN104659006B CN 104659006 B CN104659006 B CN 104659006B CN 201310587295 A CN201310587295 A CN 201310587295A CN 104659006 B CN104659006 B CN 104659006B
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- lead frame
- recess
- convex portion
- edge
- plastic sealed
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Abstract
The invention discloses a kind of plastic sealed IPM lead frame structure, igbt chip and diode chip for backlight unit are welded with lead frame, the edge of lead frame is provided with least one recess and/or convex portion, and recess and/or convex portion are horizontally disposed with.By being provided with least one recess and/or convex portion in the edge of lead frame, recess and/or convex portion are horizontally disposed, and are generally aligned in the same plane with lead frame interior.Due to the edge that the contact site of lead frame and injection epoxy is lead frame, by setting recess or convex portion to change the planform of leadframe edges line in the edge of lead frame, the edge line of so lead frame significantly increases, then lead frame is also accordingly increased with being molded the contact area of epoxy, realize effective fixation to lead frame, it is ensured that the reliability and stability of product.
Description
Technical field
Field is manufactured the invention belongs to plastic sealed IPM, and in particular to a kind of plastic sealed IPM lead frame structure.
Background technology
Plastic sealed IPM（Intelligent Power Module, SPM）, it is by igbt chip and its driving
The novel control module that the protection circuit such as circuit, control circuit and excessively stream, under-voltage, short-circuit, overheat is integrated in one.It is a kind of
Complicated, advanced power model, excessively stream can be realized automatically, it is under-voltage, short-circuit and overheat etc. complicated protection function, thus with intelligence
Feature.Simultaneously it have the advantages that low cost, minimize, it is highly reliable, easily use, be widely used in frequency-conversion domestic electric appliances, inverter,
The fields such as Industry Control, Social benefit and economic benefit is very considerable.
For common plastic sealed IPM, its internal structure is by lead frame, chip and the big portion of injection epoxy three
It is grouped, lead frame is the carrier of whole module, surface soldered power chip, finally by injection epoxy by whole module
It is encapsulated.
Driving protection inside IPM is generally by by power chip（Igbt chip and diode chip for backlight unit）It is welded on one group
On lead frame, driving chip is welded on another group of lead frame, then completes driving chip with drawing with the mode of wire bonding
Electrical connection between wire frame and power chip.
It is widely applied in plastic sealed IPM modules at present to be the structure of lead frame, and welded on lead frame
The region of igbt chip and diode chip for backlight unit is rectangular configuration.After injection, the edge of lead frame is carried out by injection epoxy
It is fixed, but the contact area of the lead frame of rectangular configuration and epoxy is smaller, is possible to lead to not after injection fully solid
Determine lead frame；Have a strong impact on the reliability of product with stably
In view of problem above, it is necessary to propose a kind of new lead frame structure, to increase lead frame and injection ring
The contact area of oxygen, effective anchor leg framework, it is ensured that the reliability and stability of product.
The content of the invention
In view of this, the invention provides a kind of plastic sealed IPM lead frame structure, by changing leadframe edges
Planform, to increase the contact area of lead frame and injection epoxy, effective anchor leg framework, it is ensured that the reliability of product
With stability.
It is welded with a kind of plastic sealed IPM lead frame structure proposed according to the purpose of the present invention, the lead frame
Igbt chip and diode chip for backlight unit, the edge of the lead frame are provided with least one recess and/or convex portion, the recess
And/or convex portion is horizontally disposed with.
It is preferred that, the recess is generally aligned in the same plane interior with the convex portion with the lead frame.
It is preferred that, the recess is castellated shape or wavy shape with the convex portion.
It is preferred that, the recess and/or convex portion are uniformly distributed in the periphery of the lead frame, the side of the lead frame
Edge line is curve shape.
It is preferred that, the geomery of recess and convex portion, the recess and convex portion is set simultaneously at the leadframe edges
Unanimously, and quantity is identical.
Compared with prior art, the advantage of plastic sealed IPM lead frame structure disclosed by the invention is：The lead frame
Edge is provided with least one recess and/or convex portion, and recess and/or convex portion are horizontally disposed, and is located at lead frame same
In one plane.Due to the edge that the contact site of lead frame and injection epoxy is lead frame, by the side of lead frame
Recess or convex portion is set to change the planform of leadframe edges line at edge, the edge line of such lead frame significantly increases
Long, then lead frame is also accordingly increased with being molded the contact area of epoxy, realizes effective fixation to lead frame, it is ensured that production
The reliability and stability of product.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
The plastic sealed IPM of Fig. 1 structural representation.
Fig. 2 is a kind of structural representation of plastic sealed IPM lead frame structure embodiment 1 disclosed by the invention.
Fig. 3 is a kind of structural representation of plastic sealed IPM lead frame structure embodiment 2 disclosed by the invention.
The title of digital or alphabetical representative corresponding component in figure：
1st, igbt chip 2, diode chip for backlight unit 3, lead frame 4, recess 5, convex portion
Embodiment
It is widely applied in plastic sealed IPM modules at present to be the structure of lead frame, and welded on lead frame
The region of igbt chip and diode chip for backlight unit is rectangular configuration.After injection, the edge of lead frame is carried out by injection epoxy
It is fixed, but the contact area of the lead frame of rectangular configuration and epoxy is smaller, is possible to lead to not after injection fully solid
Determine lead frame；Have a strong impact on the reliability and stability of product.
The present invention is drawn for of the prior art not enough there is provided a kind of plastic sealed IPM lead frame structure by changing
The planform at wire frame edge, to increase the contact area of lead frame and injection epoxy, effective anchor leg framework, it is ensured that
The reliability and stability of product.
Technical scheme will be clearly and completely described by embodiment below.Obviously, retouched
The embodiment stated is only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, sheet
The every other embodiment that field those of ordinary skill is obtained under the premise of creative work is not made, belongs to the present invention
The scope of protection.
Embodiment 1
Please also refer to Fig. 1 and Fig. 2, the plastic sealed IPM of Fig. 1 structural representation.Fig. 2 is a kind of plastic packaging disclosed by the invention
The structural representation of Formulas I PM lead frame structure embodiment 1.As illustrated, a kind of plastic sealed IPM lead frame structure, lead
Igbt chip 1 and diode chip for backlight unit 2 are welded with framework, the edge of lead frame 3 is provided with a recess 4 and a convex portion
5, recess 4 and convex portion 5 are horizontally disposed with, and in recess 4 and convex portion 5 be generally aligned in the same plane with lead frame 3.It is recessed by setting
Portion and convex portion so that the edge line overall length increase of rectangular lead frame, can be effective so when by being molded epoxy encapsulated modules
Increase lead frame and injection epoxy contact area, realize effective fixation to lead frame, it is ensured that the reliability of product
With stability.
Wherein, the planform of recess and convex portion is trapezoidal dentation, wherein, recess 4 is consistent with the geomery of convex portion 5,
And quantity is identical, it is ensured that the overall volume of lead frame is constant.
Wherein, in addition to using stepped tooth shape, the planform of recess and convex portion can also be cone gear form or rectangle etc., tool
Depending on body planform needs according to use.
Wherein, the quantity of recess and convex portion can be also 2,3,4 or multiple, depending on using needing, it is ensured that have
Anchor leg framework is imitated, particular number is not limited.
Embodiment 2
As shown in figure 3, remaining is same as Example 1, difference is, on lead frame simultaneously set recess 4 with it is convex
Portion 5, and recess 4 and convex portion 5 are wavy shape, and quantity is identical, it is ensured that the overall volume of lead frame is constant.
The recess 4 of wavy shape is uniformly distributed in the periphery of lead frame 3 with convex portion 5, and the edge line of lead frame 3 is in
Curve shape.By the way that the edge of lead frame is arranged into curve shape, the girth of lead frame is a significant increase, so,
The contact area of injection epoxy and leadframe edges is accordingly increased, and realizes effective fixation to lead frame, is ensureing to draw
On the basis of wire frame constancy of volume, it is ensured that the reliability and stability of product.
The invention discloses a kind of plastic sealed IPM lead frame structure, igbt chip and two poles are welded with lead frame
Die, the edge of lead frame is provided with least one recess and/or convex portion, and recess and/or convex portion are horizontally disposed with.It is logical
Cross the edge in lead frame and be provided with least one recess and/or convex portion, recess and/or convex portion are horizontally disposed, and with
In lead frame is generally aligned in the same plane.Due to the edge that the contact site of lead frame and injection epoxy is lead frame, pass through
Recess or convex portion is set to change the planform of leadframe edges line, the side of such lead frame in the edge of lead frame
Edge line significantly increases, then lead frame is also accordingly increased with being molded the contact area of epoxy, and realization has to lead frame
Effect is fixed, it is ensured that the reliability and stability of product.
By the way that convex portion and the planform of recess are designed, consistent and quantity is identical, it is ensured that the overall volume of lead frame is not
Become.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (4)
1. being welded with igbt chip and diode chip for backlight unit on a kind of plastic sealed IPM lead frame structure, the lead frame, it is special
Levy and be, the edge of the lead frame is provided with a recess and a convex portion, and the recess and convex portion are horizontally disposed with；
The recess is trapezoidal dentalation with convex portion, and size is consistent, and recess is respectively arranged at lead frame with convex portion
Recess on both sides, two neighboring lead frame is corresponding with convex portion, and the overall volume of lead frame is constant.
2. plastic sealed IPM lead frame structure as claimed in claim 1, it is characterised in that the recess and the convex portion are equal
It is generally aligned in the same plane with the lead frame interior.
3. plastic sealed IPM lead frame structure as claimed in claim 1, it is characterised in that the recess is with the convex portion
Castellated shape or wavy shape.
4. plastic sealed IPM lead frame structure as claimed in claim 1, it is characterised in that the recess and/or convex portion are uniform
The periphery of the lead frame is distributed in, the edge line of the lead frame is curve shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310587295.2A CN104659006B (en) | 2013-11-19 | 2013-11-19 | A kind of plastic sealed IPM lead frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310587295.2A CN104659006B (en) | 2013-11-19 | 2013-11-19 | A kind of plastic sealed IPM lead frame structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104659006A CN104659006A (en) | 2015-05-27 |
| CN104659006B true CN104659006B (en) | 2017-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310587295.2A Active CN104659006B (en) | 2013-11-19 | 2013-11-19 | A kind of plastic sealed IPM lead frame structure |
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| Country | Link |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110880496B (en) * | 2018-09-05 | 2023-10-31 | 万国半导体(开曼)股份有限公司 | Molding intelligent power module for motor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201741688U (en) * | 2010-07-30 | 2011-02-09 | 吴江恒源金属制品有限公司 | Lead frame |
| CN102224587A (en) * | 2008-11-25 | 2011-10-19 | 株式会社三井高科技 | Lead frame, semiconductor device using the lead frame, intermediate product thereof, and methods for producing same |
| CN202042481U (en) * | 2011-03-24 | 2011-11-16 | 比亚迪股份有限公司 | Power module |
| CN202487565U (en) * | 2011-02-28 | 2012-10-10 | 三垦电气株式会社 | Semiconductor device |
| CN103187409A (en) * | 2011-12-31 | 2013-07-03 | 刘胜 | Light-emitting diode (LED) array packaging light source module based on lead frame |
-
2013
- 2013-11-19 CN CN201310587295.2A patent/CN104659006B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102224587A (en) * | 2008-11-25 | 2011-10-19 | 株式会社三井高科技 | Lead frame, semiconductor device using the lead frame, intermediate product thereof, and methods for producing same |
| CN201741688U (en) * | 2010-07-30 | 2011-02-09 | 吴江恒源金属制品有限公司 | Lead frame |
| CN202487565U (en) * | 2011-02-28 | 2012-10-10 | 三垦电气株式会社 | Semiconductor device |
| CN202042481U (en) * | 2011-03-24 | 2011-11-16 | 比亚迪股份有限公司 | Power module |
| CN103187409A (en) * | 2011-12-31 | 2013-07-03 | 刘胜 | Light-emitting diode (LED) array packaging light source module based on lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104659006A (en) | 2015-05-27 |
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Address after: 710016 No. 15 Wenjingbei Road, Jingkai District, Xi'an City, Shaanxi Province Patentee after: Xi'an Zhongche Yongji Electric Co. Ltd. Address before: 710016 No. 15 Wenjingbei Road, Jingkai District, Xi'an City, Shaanxi Province Patentee before: Xi'an Yongdian Electric Co., Ltd. |