CN201741686U - Improved lead frame - Google Patents
Improved lead frame Download PDFInfo
- Publication number
- CN201741686U CN201741686U CN 201020277494 CN201020277494U CN201741686U CN 201741686 U CN201741686 U CN 201741686U CN 201020277494 CN201020277494 CN 201020277494 CN 201020277494 U CN201020277494 U CN 201020277494U CN 201741686 U CN201741686 U CN 201741686U
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- CN
- China
- Prior art keywords
- lead frame
- boss
- model
- unit
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses an improved lead frame, comprising a plurality of frame units, the adjacent frame units are connected via a middle rib and a bottom rib, each frame unit comprises a chip unit, a heat dissipation unit connected with the chip unit, a middle pin at the lower end of the chip unit and a first side pin and a second side pin located at the two sides of the middle pin, a round through hole is disposed between the chip unit and the heat dissipation unit, the middle of the chip is provided with a welding boss, the boss is provided with a plurality of recesses, the bosses can also be replaced by grooves with the depths in the range of from 0.05-0.1 mm, the grooves are provided with a plurality of projections. The lead frame in the utility model is advantaged by stronger adhesiveness with chips, better heat dissipation effect, simple structure, easy practice, and suitability for wide application and use.
Description
Technical field
The utility model relates to a kind of semi-conductor discrete device, more particularly, relates to a kind of lead frame that is used for epoxy seal semiconductor.
Background technology
Lead frame is widely used in electronic product as a kind of semi-conductor discrete device, have support electronic devices and components and chip is provided and circuit board between electricity and the effect of the passage of heat, and associativity is bad between the chip section on chip and the lead frame, and final consequence is exactly the inefficacy that very likely causes electronic product.
The utility model content
The purpose of this utility model provides the modified model lead frame that a kind of its chip section is provided with boss or groove.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of modified model lead frame, comprise frame body with a plurality of unit, be connected with middle muscle by end muscle between the adjacent unit, each frame unit comprises chip section, radiating part, interim pins and lays respectively at the first side pipe pin and the second side pipe pin of the both sides of described interim pins that the middle part of described chip section is provided with a boss or a groove.
Preferably, described boss is provided with several depressions, and further, the surperficial intersection of described depression and described boss is that triangle, bottom are for circular.
Preferably, the bottom land of described groove is provided with several projectioies, and further, the intersection, bottom surface of described projection and described groove is that triangle, end face are for circular.
Preferably, described chip section and the described radiating part place of interconnecting are provided with manhole.
The beneficial effects of the utility model are:
1,, makes that with chips welding on lead frame the time, solder joint is more concentrated, and is stronger in conjunction with dynamics because the chip section in the lead frame of the present utility model is provided with the welding boss;
2, owing to be provided with manhole between chip section in the lead frame of the present utility model and the radiating part, make that heat radiation is more abundant, reduced the influence of heat chip performance;
3, lead frame of the present utility model is simple in structure, easily implements, and is fit to promote the use of.
Description of drawings
Accompanying drawing 1 is the structural representation of modified model lead frame of the present utility model;
Accompanying drawing 2 is the enlarged diagram at I place in the accompanying drawing 1;
Accompanying drawing 3 be in the accompanying drawing 2 A-A to the schematic diagram of view.
In the accompanying drawing: 1, end muscle; 2, middle muscle; 3, chip section; 4, radiating part; 5, interim pins; 6, the first side pipe pin; 7, the second side pipe pin; 8, boss; 9, depression.
Embodiment
Below in conjunction with embodiment shown in the drawings the technical solution of the utility model is done following detailed description the in detail:
As shown in Figure 1, modified model lead frame of the present utility model, comprise several frame units, be connected with middle muscle 2 by end muscle 1 between the adjacent frame unit, each frame unit comprises chip section 3, the radiating part 4 that is connected with chip section 3, the first side pipe pin 6 and the second side pipe pin 7 that are connected the interim pins 5 of chip section 3 belows and are positioned at interim pins 5 both sides, chip section 3 is provided with manhole with the connection of radiating part 4, the bottom of interim pins 5, the bottom of the bottom of the first side pipe pin 6 and the second side pipe pin 7 all is connected on the end muscle 1, the middle part of interim pins 5, the middle part of the middle part of the first side pipe pin 6 and the second side pipe pin 7 is connected by middle muscle 2, the middle part of chip section 3 is provided with welding boss 8, the upper surface of this boss 8 is square, this boss 8 is provided with several depressions 9, this depression 9 be the narrow structure in wide bottom, top, the surperficial intersection of this depression 9 and boss 8 is a triangle, the bottom is circular.
On the other hand, the welding boss in this lead frame also can replace with the groove of a degree of depth in 0.05～0.1mm scope, is provided with several projectioies in this groove, and the intersection, bottom surface of this projection and groove is that triangle, end face are for circular.
Lead frame of the present utility model is provided with welding boss 8 or groove at the middle part of chip section 3, and boss 8 is provided with depression wide at the top and narrow at the bottom (being provided with up-narrow and down-wide projection in the groove), thereby make when welding chip, make pad more concentrated, chip with lead frame between stronger in conjunction with dynamics, in addition, radiating part 4 directly is provided with manhole with chip section 3, makes radiating effect better, and this lead frame structure is simple, easily implement, be fit to promote the use of.
The foregoing description only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present utility model and enforcement according to this, can not limit protection range of the present utility model with this.All equivalences of being done according to the utility model spirit change or modify, and all should be encompassed within the protection range of the present utility model.
Claims (6)
1. modified model lead frame, comprise frame body with a plurality of unit, be connected with middle muscle by end muscle between the adjacent unit, each frame unit comprises chip section, radiating part, interim pins and lays respectively at the first side pipe pin and the second side pipe pin of the both sides of described interim pins that it is characterized in that: the middle part of described chip section is provided with a boss or a groove.
2. a kind of modified model lead frame according to claim 1, it is characterized in that: described boss is provided with several depressions.
3. a kind of modified model lead frame according to claim 2 is characterized in that: the surperficial intersection of described depression and described boss is that triangle, bottom are for circular.
4. a kind of modified model lead frame according to claim 1, it is characterized in that: the bottom land of described groove is provided with several projectioies.
5. a kind of modified model lead frame according to claim 4 is characterized in that: the intersection, bottom surface of described projection and described groove is that triangle, end face are for circular.
6. a kind of modified model lead frame according to claim 1 is characterized in that: described chip section and the described radiating part place of interconnecting are provided with manhole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020277494 CN201741686U (en) | 2010-07-30 | 2010-07-30 | Improved lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020277494 CN201741686U (en) | 2010-07-30 | 2010-07-30 | Improved lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201741686U true CN201741686U (en) | 2011-02-09 |
Family
ID=43556964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020277494 Expired - Fee Related CN201741686U (en) | 2010-07-30 | 2010-07-30 | Improved lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201741686U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103023001A (en) * | 2011-09-28 | 2013-04-03 | 江苏锦丰电子有限公司 | Strip for surge protector |
| CN115611092A (en) * | 2022-11-09 | 2023-01-17 | 常熟市恒源金属制品有限公司 | Screen wire conduction and winding device for screen plate production |
-
2010
- 2010-07-30 CN CN 201020277494 patent/CN201741686U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103023001A (en) * | 2011-09-28 | 2013-04-03 | 江苏锦丰电子有限公司 | Strip for surge protector |
| CN115611092A (en) * | 2022-11-09 | 2023-01-17 | 常熟市恒源金属制品有限公司 | Screen wire conduction and winding device for screen plate production |
| CN115611092B (en) * | 2022-11-09 | 2023-12-19 | 常熟市恒源金属制品有限公司 | Screen wire conduction wire winding device for screen plate production |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110209 Termination date: 20150730 |
|
| EXPY | Termination of patent right or utility model |