CN207783292U - A kind of circuit board radiating device for IC chip - Google Patents
A kind of circuit board radiating device for IC chip Download PDFInfo
- Publication number
- CN207783292U CN207783292U CN201820171277.4U CN201820171277U CN207783292U CN 207783292 U CN207783292 U CN 207783292U CN 201820171277 U CN201820171277 U CN 201820171277U CN 207783292 U CN207783292 U CN 207783292U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pads
- chip
- radiating device
- chip according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of circuit board radiating devices for IC chip, including circuit board, the crisscross IC pads for being set to the circuit board upper surface, through be distributed in the heat emission hole of IC pads upper surface, be layed in the heat conduction tin paste layer of IC pads upper surface and fitted closely with the heat conduction tin paste layer and with the IC chip of the IC pad solders, the circuit board is provided with multiple through-holes at the position for welding the IC pads, the heat emission hole is arranged up and down with the through-hole, and setting is spaced between the adjacent IC pads.With this structure design, quickly by heat derives, the radiating efficiency of powerful IC chip can be effectively promoted with this by the setting of IC pads, using cross-ventilated effect.
Description
Technical field
The utility model is related to circuit board technology field more particularly to a kind of circuit board radiating devices for IC chip.
Background technology
IC chip under the prior art is all directly welded in circuit board, and the heat that IC chip distributes later is dissipated by circuit board
Go out, when IC chip power is larger, design by this method so that IC chip radiating efficiency is extremely low, in addition between adjacent IC chip
Closely, it therefore is readily formed " tropical island effect ", needle is in this, it is necessary to improve to it.
Utility model content
The purpose of this utility model is to provide a kind of simple in structure, circuit board radiating devices of good heat dissipation effect.
For this purpose, the utility model uses following technical scheme：
A kind of circuit board radiating device for IC chip, including circuit board, crisscross be set on the circuit board
The IC pads on surface, through the heat conduction for being distributed in the heat emission hole of IC pads upper surface, being layed in IC pads upper surface
Tin paste layer and fitted closely with the heat conduction tin paste layer and with the IC chip of the IC pad solders, the circuit board is used for
It welds and is provided with multiple through-holes at the position of the IC pads, the heat emission hole is arranged up and down with the through-hole, adjacent institute
Interval is arranged between stating IC pads.
Wherein, the intersection on the adjacent both sides of the bottom surface of the circuit board is downwardly convex is equipped with cushion block, the adjacent pad
The thickness of block is equal.
Wherein, setting is spaced between the bottom surface and the upper surface of the circuit board of the IC pads.
Wherein, the two lateral walls of the IC pads are evenly equipped with multiple legs, the leg one bending along its length
And it is arranged in Z-shaped.
Wherein, the pad is set as metal pad.
Wherein, the cushion block is integrally formed with the circuit board.
Wherein, the cushion block is set as resilient rubbber cushion, and the resilient rubbber cushion is fastened with the circuit board.
The beneficial effects of the utility model：The utility model includes circuit board, crisscross is set on the circuit board
The IC pads on surface, through the heat conduction for being distributed in the heat emission hole of IC pads upper surface, being layed in IC pads upper surface
Tin paste layer and fitted closely with the heat conduction tin paste layer and with the IC chip of the IC pad solders, the circuit board is used for
It welds and is provided with multiple through-holes at the position of the IC pads, the heat emission hole is arranged up and down with the through-hole, adjacent institute
Interval is arranged between stating IC pads.With this structure design, can by the setting of IC pads, using cross-ventilated effect, and
When quickly by heat derives, the radiating efficiency of powerful IC chip is effectively promoted with this.
Description of the drawings
Fig. 1 is the front view after a kind of circuit board radiating device removal IC chip for IC chip of the utility model.
Fig. 2 is the Section A-A figure of Fig. 1.
Fig. 3 is the partial enlarged view at B in Fig. 2.
Fig. 4 is the structural schematic diagram that Fig. 3 coordinates with IC chip and heat conduction tin paste layer.
Specific implementation mode
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
In conjunction with shown in Fig. 1 to Fig. 4, a kind of circuit board radiating device for IC chip in the present embodiment, including circuit board
1, the crisscross IC pads 2 for being set to 1 upper surface of the circuit board, through the heat dissipation for being distributed in 2 upper surface of IC pads
Hole 21, the heat conduction tin paste layer 3 for being layed in 2 upper surface of IC pads and fitted closely with the heat conduction tin paste layer 3 and with institute
The IC chip 4 of the welding of IC pads 2 is stated, the circuit board 1 is provided with multiple through-holes at the position for welding the IC pads 2
11, the heat emission hole 21 is arranged up and down with the through-hole 11, and setting is spaced between the adjacent IC pads 2.
Further, in the present embodiment, the intersection on the adjacent both sides of the bottom surface of the circuit board 1 is downwardly convex to be equipped with
The thickness of cushion block 12, the adjacent cushion block 12 is equal.With this so that forming certain gap between circuit board and mounting surface, after
And it radiates conducive to IC chip.In the present embodiment, the cushion block 12 is integrally formed with the circuit board 1, can also be by the cushion block
12 are set as resilient rubbber cushion, and the resilient rubbber cushion is fastened with the circuit board 1.
In addition, in the present embodiment, setting is spaced between the bottom surface and the upper surface of the circuit board 1 of the IC pads 2,
The two lateral walls of the IC pads 2 are evenly equipped with multiple legs 22 along its length, the integrated bending of the leg 22 and be in Z-shaped
Setting, and the pad is set as metal pad.It designs by this method, the further radiating efficiency for promoting IC chip so that
Using cross-ventilated effect, accelerated heat distributes.
The technical principle of the utility model is described above in association with specific embodiment.These descriptions are intended merely to explain this reality
With novel principle, and it cannot be construed to the limitation to scope of protection of the utility model in any way.Based on the explanation herein,
Those skilled in the art would not require any inventive effort the other specific implementation modes that can associate the utility model,
These modes are fallen within the scope of protection of the utility model.
Claims (7)
1. a kind of circuit board radiating device for IC chip, it is characterised in that：Including circuit board, it is crisscross be set to it is described
The IC pads of circuit board upper surface, through being distributed in the heat emission hole of IC pads upper surface, be layed in the IC pads upper table
The heat conduction tin paste layer in face and fitted closely with the heat conduction tin paste layer and with the IC chip of the IC pad solders, the electricity
Road plate is provided with multiple through-holes at the position for welding the IC pads, and the heat emission hole is set up and down with the through-hole
It sets, setting is spaced between the adjacent IC pads.
2. a kind of circuit board radiating device for IC chip according to claim 1, it is characterised in that：The circuit board
Bottom surface adjacent both sides intersection it is downwardly convex be equipped with cushion block, the thickness of the adjacent cushion block is equal.
3. a kind of circuit board radiating device for IC chip according to claim 1, it is characterised in that：The IC pads
Bottom surface and the upper surface of the circuit board between be spaced be arranged.
4. a kind of circuit board radiating device for IC chip according to claim 1, it is characterised in that：The IC pads
Two lateral walls be evenly equipped with multiple legs along its length, the leg one bending and be arranged in Z-shaped.
5. a kind of circuit board radiating device for IC chip according to claim 1, it is characterised in that：The pad is set
It is set to metal pad.
6. a kind of circuit board radiating device for IC chip according to claim 2, it is characterised in that：The cushion block with
The circuit board is integrally formed.
7. a kind of circuit board radiating device for IC chip according to claim 2, it is characterised in that：The cushion block is set
It is set to resilient rubbber cushion, the resilient rubbber cushion is fastened with the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820171277.4U CN207783292U (en) | 2018-01-31 | 2018-01-31 | A kind of circuit board radiating device for IC chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820171277.4U CN207783292U (en) | 2018-01-31 | 2018-01-31 | A kind of circuit board radiating device for IC chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207783292U true CN207783292U (en) | 2018-08-28 |
Family
ID=63210970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820171277.4U Active CN207783292U (en) | 2018-01-31 | 2018-01-31 | A kind of circuit board radiating device for IC chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207783292U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108112169A (en) * | 2018-01-31 | 2018-06-01 | 深圳市德彩光电有限公司 | A kind of circuit board radiating device for IC chip |
-
2018
- 2018-01-31 CN CN201820171277.4U patent/CN207783292U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108112169A (en) * | 2018-01-31 | 2018-06-01 | 深圳市德彩光电有限公司 | A kind of circuit board radiating device for IC chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207783292U (en) | A kind of circuit board radiating device for IC chip | |
| CN204761831U (en) | PCB board encapsulation heat radiation structure | |
| CN204157160U (en) | The radiator structure of pcb board | |
| CN108112169A (en) | A kind of circuit board radiating device for IC chip | |
| CN205071464U (en) | Pad | |
| CN209994628U (en) | Welding pad of circuit board and circuit board thereof | |
| CN205789927U (en) | Reduce the power supply chip encapsulating structure of heat radiation interference | |
| CN201298958Y (en) | MOSFET soldering pad design circuit board with heat dissipation holes | |
| CN108882504A (en) | A kind of radiator | |
| CN102543929A (en) | QFP (Quad Flat Package) grounding welding plate | |
| CN206365137U (en) | It is a kind of be unlikely to deform, the printed circuit board (PCB) that easy for installation and thermal diffusivity is good | |
| CN201718150U (en) | Radiator mounting structure | |
| CN205510636U (en) | Radiactor fin lock device | |
| CN207283898U (en) | One kind heat dissipation pcb board | |
| WO2023025099A1 (en) | Pcb printed circuit board | |
| CN207705182U (en) | A kind of radiator for driving chip | |
| CN205218254U (en) | Reflow soldering increases strutting arrangement | |
| CN221127558U (en) | Improved electronic component assembly | |
| CN209949534U (en) | Surface-mounted element heat dissipation device | |
| CN219305113U (en) | PCB structure capable of increasing power through-flow | |
| CN212809132U (en) | Big data network dispatching platform | |
| CN202384399U (en) | Patch type LED (light emitting diode)support of metallic reflection cavity body | |
| CN205428993U (en) | SMD type LED support and lamp pearl of adopting this support based on aluminium base | |
| CN207926528U (en) | A kind of effective mounting structure of power amplification | |
| CN213186709U (en) | PCB pad structure and PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | "change of name, title or address" | ||
| CP03 | "change of name, title or address" |
Address after: 518000 201, No. 13, Huiye Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Patentee after: Shendecai photoelectric (Shenzhen) Co., Ltd Address before: 518000 Guangdong province Shenzhen Guangming New District Gongming building village community Zhongtai road 18 German color Industrial Park Patentee before: Shenzhen Dicolor Optoelectronics Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 201, No. 13, Huiye Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Patentee after: Shendecai Technology (Shenzhen) Co., Ltd Address before: 518000 201, No. 13, Huiye Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Patentee before: Shendecai photoelectric (Shenzhen) Co.,Ltd. |