CN207705182U - A kind of radiator for driving chip - Google Patents
A kind of radiator for driving chip Download PDFInfo
- Publication number
- CN207705182U CN207705182U CN201721670874.3U CN201721670874U CN207705182U CN 207705182 U CN207705182 U CN 207705182U CN 201721670874 U CN201721670874 U CN 201721670874U CN 207705182 U CN207705182 U CN 207705182U
- Authority
- CN
- China
- Prior art keywords
- heat
- driving chip
- radiator
- dissipating frame
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of radiators for driving chip, belong to technical field of electronic equipment.Radiator provided by the utility model for driving chip includes heat radiator body and positioning body, heat radiator body includes heat-dissipating frame and multiple radiators, the bottom surface of heat-dissipating frame is abutted with driving chip, multiple radiator projections are on the top surface of heat-dissipating frame, positioning body projection is on the side wall of heat-dissipating frame, for being fixedly connected with circuit board.By the bottom surface of heat-dissipating frame is abutted with driving chip can increasing heat radiation area, the heat that driving chip generates is then passed to directly by passing to radiator with the heat-dissipating frame that it is abutted in air, and radiating efficiency is high.Positioning body is set by the way that the side wall in heat-dissipating frame is convex, and positioning body is connect with circuit board, using the weight of circuit board bearing heat radiator body, heat radiator body is avoided to bend the pin of driving chip.
Description
Technical field
The utility model is related to technical field of electronic equipment more particularly to a kind of radiators for driving chip.
Background technology
Driving chip is the chip for being integrated with CMOS control circuitry and DMOS power devices, can be with master using driving chip
Processor, motor and incremental encoder constitute a complete kinetic control system, to be used for driving direct current generator, stepping
The inductive loads such as motor and relay.But driving chip will produce a large amount of heat, flow through during working long hours
The bigger fever of electric current of driving chip is more, when driving chip works long hours under current state, if heat does not have
It distributes in time, it is easy to burn chip, not only increase unnecessary economic loss, and seriously affect work essence
Degree.
For existing radiator when installation is to driving chip, not only installation is complicated, and positioning is inaccurate, and heat dissipation effect is not
It is good.Therefore, there is an urgent need for proposing a kind of radiator, not only installation is quick, accurate positioning and can be when driving chip high current is long
Between when working, the amount of heat that driving chip generates is distributed in time.
Utility model content
The purpose of this utility model is to provide a kind of radiator for driving chip, construction for heat radiating device letters
Single, easy for installation, accurate positioning and good heat dissipation effect.
For this purpose, the utility model uses following technical scheme：
A kind of radiator for driving chip, including：
Heat radiator body, the heat radiator body include heat-dissipating frame and multiple radiators, the bottom surface of the heat-dissipating frame and institute
Driving chip abutting is stated, multiple radiator projections are on the top surface of the heat-dissipating frame；
Positioning body, the positioning body projection is on the side wall of the heat-dissipating frame, for being fixedly connected with circuit board.
Preferably, the quantity of the positioning body is one, it is arranged in the middle part of the side wall of the heat-dissipating frame.
Preferably, the positioning body includes positioning region and interconnecting piece, through-hole, the connection are provided on the circuit board
Portion passes through the through-hole and is connect with the circuit board, and the end of the positioning region is abutted with the circuit board.
Preferably, the positioning body is multi-diameter shaft, the through-hole is round hole, and the diameter of the positioning region is more than described
The diameter of through-hole, the diameter of the through-hole are more than the diameter of the interconnecting piece.
Preferably, the interconnecting piece and the circuit board use Wave crest Welding.
Preferably, the heat-dissipating frame is U-shaped frame, the U-shaped frame includes bottom plate and two side plates, and the radiator is convex
It is located on the bottom plate, and between two side plates.
Preferably, the radiator is column structure, multiple radiators are uniformly arranged in the top surface of the heat-dissipating frame.
Preferably, the height of the radiator is more than the height of the side plate.
Preferably, being provided with threaded hole on the bottom plate, the heat-dissipating frame is fixed on institute by screw across threaded hole
It states on driving chip.
Preferably, the vertical projection of the positioning body is on the outer wall of the side plate.
The beneficial effects of the utility model：
Radiator provided by the utility model for driving chip includes heat radiator body and positioning body, heat radiator body
Including heat-dissipating frame and multiple radiators, the bottom surface of heat-dissipating frame is abutted with driving chip, and multiple radiator projections are in heat sink
On the top surface of frame, positioning body projection is on the side wall of heat-dissipating frame, for being fixedly connected with circuit board.By by heat-dissipating frame
Bottom surface abutted with driving chip can increasing heat radiation area, heat sink of the heat directly by being abutted with it that driving chip generates
Frame passes to radiator, is then passed in air, and radiating efficiency is high.Positioning body is set by the way that the side wall in heat-dissipating frame is convex,
And connect positioning body with circuit board, using the weight of circuit board bearing heat radiator body, avoid heat radiator body by driving chip
Pin is bent.
Description of the drawings
Fig. 1 is the front view of the radiator provided by the utility model for driving chip；
Fig. 2 is the side view of the radiator provided by the utility model for driving chip；
Fig. 3 is the rearview of the radiator provided by the utility model for driving chip；
Fig. 4 is the vertical view of the radiator provided by the utility model for driving chip.
In figure：
1, heat radiator body；11, heat-dissipating frame；111, bottom plate；112, side plate；12, radiator；13, threaded hole；
2, positioning body；21, positioning region；22, interconnecting piece.
Specific implementation mode
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
As shown in Figures 1 to 4, the utility model provides a kind of radiator for driving chip, includes mainly
Heat radiator body 1 and positioning body 2, heat radiator body 1 include heat-dissipating frame 11 and multiple radiators 12, and 12 projection of radiator is in heat sink
On the top surface of frame 11, top surface herein refers to after heat-dissipating frame 11 is installed in place, the end face above heat-dissipating frame 11,
The bottom surface of heat-dissipating frame 11 is abutted with driving chip, and 2 projection of positioning body, will using positioning body 2 on the side wall of heat-dissipating frame 11
Heat-dissipating frame 11 is fixedly connected with circuit board.
The heat dissipation area that heat radiator body 1 can be increased by abutting the bottom surface of heat-dissipating frame 11 with driving chip, works as drive
Dynamic chip was worked under the working condition of high current after the long time, a large amount of heat that driving chip generates directly by with its
The heat-dissipating frame 11 of abutting passes to radiator 12, is then passed in air, and radiating efficiency is high.By in heat-dissipating frame 11
Side wall is convex to set positioning body 2, and positioning body 2 is connect with circuit board, using the weight of circuit board bearing heat radiator body 1, avoids
Heat radiator body 1 bends the pin of driving chip.
In order under the premise of ensureing radiator with circuit board bonding strength, reduce the usage quantity of positioning body 2, to
The material for saving manufacture positioning body 2, reduces the manufacturing cost of radiator, in the present embodiment, as shown in Figure 1, by positioning body 2
Quantity be set as one, and the positioning body 2 is arranged at the middle part of 11 side wall of heat-dissipating frame.Compared to using two or more
Positioning body 2, positioning body 2 is arranged and is also not take up the wiring space of circuit board at the middle part of 11 side wall of heat-dissipating frame, very big
Circuit board wiring is facilitated in degree.
Further, in order to limit the link position of circuit board and heat-dissipating frame 11, positioning body 2 is set as being coaxially disposed
Positioning region 21 and interconnecting piece 22, and be provided with through-hole on circuit boards, will be even when fixing on circuit boards radiator
Socket part 22 passes through through-hole and is fixedly connected with circuit board.The end of positioning region 21 is abutted with circuit board, for limit positioning body 2 with
The relative position of circuit board.In the present embodiment, in order to reduce the difficulty of processing of through-hole, through-hole is provided in round hole, will be determined
Position body 2 is set as multi-diameter shaft, and the diameter of positioning region 21 is set greater than to the diameter of through-hole, and sets the diameter of through-hole to
More than the diameter of interconnecting piece 22.Threaded connection may be used in the connection type of interconnecting piece 22 and circuit board, specifically, in interconnecting piece
22 upper setting external screw thread is fixed positioning body 2 on circuit boards using nut.Connection type can certainly weld, such as
Spot welding, wave-soldering or other connection types.
Further, in order to improve heat dissipation effect, heat-dissipating frame 11 is set to U-shaped frame, the open top of U-shaped frame has
Conducive to the diffusion of heat.Specifically, as shown in Fig. 2, U-shaped frame includes bottom plate 111 and two side plates 112, radiator 12 is vertical convex
It is located on bottom plate 111, and between two side plates 112,2 vertical projection of positioning body is on the outer wall of side plate 112.In order into one
Step improves heat dissipation effect, and the height of radiator 12 is more than to the height of side plate 112.In the present embodiment, radiator 12 is column
Structure, multiple radiators 12 are uniformly arranged in the top surface of heat-dissipating frame 11.Arrangement mode does not limit herein, can be rectangular array
Arrangement, circular array arrangement or other arrangement modes.Radiator shakes under driving chip working condition in order to prevent
Dynamic, there are two threaded holes 13 for setting on bottom plate 111, and heat-dissipating frame 11 is fixed on driving core across threaded hole 13 using screw
On piece.
Driving chip have Multiple Type be with monopole stepper motor driving chip SLA7078MRT in the present embodiment
Example, further limits the size of radiator.112 length of side plate of heat-dissipating frame 11 be 72.8mm, width 20mm,
The whole height of positioning body 2 is 28mm, and positioned at the center of side plate 112.Positioning region 21 a diameter of 10mm, a height of 14mm,
The spacing of a diameter of 5.6mm of interconnecting piece 22, a diameter of M6 of threaded hole 13, two threaded holes 13 are 48.8mm, threaded hole 13
Distance apart from the bottom surface of heat-dissipating frame 11 is 8mm, and each threaded hole 13 is apart from the side of heat-dissipating frame 11 adjacent thereto
Distance is 8mm.
Obviously, above-described embodiment of the utility model is used for the purpose of clearly illustrating the utility model example, and
It is not the restriction to the embodiment of the utility model.For those of ordinary skill in the art, in above description
On the basis of can also make other variations or changes in different ways.There is no need and unable to give all embodiments
It is exhaustive.All any modification, equivalent and improvement made within the spirit and principle of the present invention etc., should be included in
Within the protection domain of the utility model claims.
Claims (10)
1. a kind of radiator for driving chip, which is characterized in that including：
Heat radiator body (1), the heat radiator body (1) include heat-dissipating frame (11) and multiple radiators (12), the heat-dissipating frame
(11) bottom surface is abutted with the driving chip, top surface of multiple radiator (12) projections in the heat-dissipating frame (11)
On；
Positioning body (2), positioning body (2) projection connect on the side wall of the heat-dissipating frame (11) for being fixed with circuit board
It connects.
2. the radiator according to claim 1 for driving chip, which is characterized in that
The quantity of the positioning body (2) is one, is arranged in the middle part of the side wall of the heat-dissipating frame (11).
3. the radiator according to claim 2 for driving chip, which is characterized in that
The positioning body (2) includes positioning region (21) and interconnecting piece (22), and through-hole, the interconnecting piece are provided on the circuit board
(22) it passes through the through-hole and is connect with the circuit board, the end of the positioning region (21) is abutted with the circuit board.
4. the radiator according to claim 3 for driving chip, which is characterized in that
The positioning body (2) is multi-diameter shaft, and the through-hole is round hole, and the diameter of the positioning region (21) is more than the through-hole
Diameter, the diameter of the through-hole are more than the diameter of the interconnecting piece (22).
5. the radiator according to claim 3 for driving chip, which is characterized in that
The interconnecting piece (22) and the circuit board use wave soldering.
6. the radiator according to claim 1 for driving chip, which is characterized in that
The heat-dissipating frame (11) is U-shaped frame, and the U-shaped frame includes bottom plate (111) and two side plates (112), the radiator
(12) projection is on the bottom plate (111), and is located between two side plates (112).
7. the radiator according to claim 6 for driving chip, which is characterized in that
The radiator (12) is column structure, and multiple radiators (12) are uniformly arranged in the top surface of the heat-dissipating frame (11).
8. the radiator according to claim 7 for driving chip, which is characterized in that
The height of the radiator (12) is more than the height of the side plate (112).
9. the radiator according to claim 6 for driving chip, which is characterized in that
Threaded hole (13) is provided on the bottom plate (111), screw passes through threaded hole (13) that the heat-dissipating frame (11) are fixed
On the driving chip.
10. the radiator according to claim 6 for driving chip, which is characterized in that
The vertical projection of the positioning body (2) is on the outer wall of the side plate (112).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721670874.3U CN207705182U (en) | 2017-12-05 | 2017-12-05 | A kind of radiator for driving chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721670874.3U CN207705182U (en) | 2017-12-05 | 2017-12-05 | A kind of radiator for driving chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207705182U true CN207705182U (en) | 2018-08-07 |
Family
ID=63024964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721670874.3U Expired - Fee Related CN207705182U (en) | 2017-12-05 | 2017-12-05 | A kind of radiator for driving chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207705182U (en) |
-
2017
- 2017-12-05 CN CN201721670874.3U patent/CN207705182U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180807 Termination date: 20211205 |