WO2023025099A1

WO2023025099A1 - Pcb printed circuit board

Info

Publication number: WO2023025099A1
Application number: PCT/CN2022/113994
Authority: WO
Inventors: 卢亚佟; 郭耀斌; 校焕庆
Original assignee: 中兴通讯股份有限公司
Priority date: 2021-08-27
Filing date: 2022-08-22
Publication date: 2023-03-02
Also published as: CN115734452A

Abstract

Embodiments of the present disclosure provide a PCB printed circuit board, comprising: a large board 1, a copper block 2, a power amplifier subcard 3, and a conductive structure layer 4, the copper block 2 being embedded in the large board 1, and the power amplifier subcard 3 being disposed on an upper surface of the large board 1; and the conductive structure layer 4 being disposed on contact surfaces of at least two among the power amplifier subcard 3, the large board 1, and the copper block 2. The problems in the related technology that the grounding path is discontinuous and the grounding path is lengthened due to a gap being present between some or all of the devices in the large board 1, the copper block 2, and the subcard 3 are solved, thereby improving grounding continuity and shortening the grounding path.

Description

A PCB printed circuit board

Cross References to Related Applications

This disclosure is based on the Chinese patent application CN202110997356.7 filed on August 27, 2021 with the title of "a PCB printed circuit board", and claims the priority of this patent application, and all the disclosed contents are incorporated by reference This disclosure.

technical field

Embodiments of the present disclosure relate to the communication field, and in particular, relate to a PCB printed circuit board.

Background technique

With the development of high integration of communication technology in modern society, the high-density and diversified design of printed circuit board (Printed Circuit Board, referred to as PCB) is promoted. With the integrated design of power amplifier PA and transceiver TRX board, high-frequency and high-speed PCB needs to adapt to the high power consumption environment of high-power devices (such as power amplifier tubes). Therefore, it is particularly important to solve the problem of PCB heat dissipation. At present, a more effective way is to embed metal copper blocks in the PCB. Embedding copper blocks will bring the following problems while solving the heat dissipation problem.

Figure 1 is a schematic diagram of PCB welding in the related art. As shown in Figure 1, ideally, the large board 1 and the copper block 2 (usually bonded by glue), the large board 1 and the sub-card 3, and the sub-card 3 and the copper block 2 is good close contact welding.

Fig. 2 is a schematic diagram 2 of PCB soldering in the related art. As shown in Fig. 2, there is a gap between the large board 1 and the copper block 2, resulting in a discontinuous grounding path and an elongated grounding path, which will deteriorate the performance of the power amplifier (saturation power, efficiency and linear), which deteriorates the consistency of mass production, reduces production efficiency, and increases production costs.

No solution has been proposed for the problem in the related art that the grounding path is discontinuous and the grounding path is lengthened due to gaps between some or all devices in the large board 1 , copper block 2 , and daughter card 3 .

Contents of the invention

The embodiment of the present disclosure provides a PCB printed circuit board to at least solve the problems in the related art that the ground path is discontinuous and the ground path is lengthened due to gaps between some or all devices in the large board 1, copper block 2, and daughter card 3 question.

According to an embodiment of the present disclosure, a PCB printed circuit board is provided, including: a large board 1, a copper block 2, a power amplifier daughter card 3, and a conductive structure layer 4, wherein the copper block 2 is embedded in the large In the board 1, the power amplifier sub-card 3 is arranged on the upper surface of the large board 1;

The conductive structure layer 4 is disposed on at least two contact surfaces of the power amplifier daughter card 3 , the large board 1 and the copper block 2 .

In an exemplary embodiment, the conductive structural layer 4 includes a first structural layer 41 and a second structural layer 42, wherein the first structural layer 41 is disposed on the same side of the large board 1 and the copper block 2 The second structural layer 42 is disposed on the contact surface of the large board 1 and the copper block 2 on the other side.

In an exemplary embodiment, the copper block 2 includes a first sub-block 21 and a second sub-block 22, the first sub-block 21 is embedded in the central area of the large board 1, and the second sub-block The block 22 is arranged on the lower surface of the large plate 1, located below the first sub-block 21, and the second sub-block 22 is connected to the first sub-block 21;

The first structural layer 41 is disposed on the contact surface of the large plate 1, the second sub-block 22 and one side of the first sub-block 21 by welding, and the second structural layer 42 is welded It is arranged on the contact surface of the large plate 1 , the second sub-block 22 and the other side of the first sub-block 21 .

In an exemplary embodiment, the first structural layer 41 is disposed on the contact surface of the power amplifier daughter card 3 , the large board 1 and one side of the copper block 2 , and the second structural layer 42 is disposed On the contact surface of the power amplifier daughter card 3 , the large board 1 and the other side of the copper block 2 .

The first structural layer 41 is disposed on the contact surface of the power amplifier sub-card 3 , the large board 1 , the second sub-block 22 and one side of the first sub-block 21 by welding. The second structural layer 42 is disposed on the contact surface of the power amplifier daughter card 3 , the large board 1 , the second sub-block 22 and the other side of the first sub-block 21 by welding.

In an exemplary embodiment, the PCB printed circuit board further includes: a power amplifier tube 5, wherein the power amplifier tube 5 is arranged through the power amplifier daughter card 3 and is located above the copper block 2,

The conductive structure layer 4 is disposed on the contact surfaces of the large board 1 , the copper block 2 and the power amplifier daughter card 3 .

The conductive structure layer 4 is arranged on the contact surface between the large board 1 and the power amplifier daughter card 3, the contact surface between the copper block 2 and the power amplifier daughter card 3, and the copper block 2 and the power amplifier the contact surface of tube 5; or

The conductive structure layer 4 is disposed on the contact surface between the copper block 2 and the power amplifier daughter card 3, and the contact surface between the copper block 2 and the power amplifier tube 5; or

The conductive structure layer 4 is disposed on the contact surface between the copper block 2 and the power amplifier tube 5 .

In an exemplary embodiment, the portion of the conductive structure layer 4 disposed on the contact surface between the power amplifier tube 5 and the copper block 2 is hollowed out.

In an exemplary embodiment, the hollow shape includes at least one of the following shapes: circle, triangle, ellipse, square, rectangle, and irregular figures.

In an exemplary embodiment, the conductive structure layer 4 is integrally formed.

In an exemplary embodiment, the conductive structure layer 4 is made of non-metallic conductive material or metal.

The PCB printed circuit board of the embodiment of the present disclosure includes: a large board 1, a copper block 2, a power amplifier daughter card 3 and a conductive structure layer 4, wherein the copper block 2 is embedded in the large board 1, and the power amplifier The sub-card 3 is arranged on the upper surface of the large board 1; the conductive structure layer 4 is arranged on the contact surface of at least two of the power amplifier sub-card 3, the large board 1 and the copper block 2, which can solve the problem of In the related art, there are gaps between some or all devices in the large board 1, copper block 2, and daughter card 3, resulting in discontinuous and lengthened grounding paths. The grounding continuity is improved and the grounding path is shortened.

Description of drawings

Fig. 1 is a schematic diagram 1 of PCB welding in the related art;

FIG. 2 is a second schematic diagram of PCB welding in the related art;

3 is a structural block diagram of a PCB printed circuit board according to an embodiment of the disclosure;

4 is a structural block diagram 1 of a PCB printed circuit board according to a preferred embodiment of the present disclosure;

FIG. 5 is a second structural block diagram of a PCB printed circuit board according to a preferred embodiment of the present disclosure;

6 is a structural block diagram three of a PCB printed circuit board according to a preferred embodiment of the present disclosure;

7 is a structural block diagram four of a PCB printed circuit board according to a preferred embodiment of the present disclosure;

8 is a structural block diagram five of a PCB printed circuit board according to a preferred embodiment of the present disclosure;

Fig. 9 is a structural block diagram six of a PCB printed circuit board according to a preferred embodiment of the present disclosure;

Fig. 10 is a schematic diagram of a hollow shape according to a preferred embodiment of the present disclosure.

In the figure, 1-large board, 2-copper block, 3-power amplifier daughter card, 4-conductive structure layer, 5-power amplifier tube, 21-first sub-block, 22-second sub-block, 41-first structure layer And 42 - the second structural layer.

Detailed ways

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings and in combination with the embodiments.

It should be noted that the terms "first" and "second" in the specification and claims of the present disclosure and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence.

An embodiment of the present disclosure provides a PCB printed circuit board. FIG. 3 is a structural block diagram of a PCB printed circuit board according to an embodiment of the present disclosure. As shown in FIG. 3 , it includes: a large board 1, a copper block 2, and a power amplifier daughter card 3 And a conductive structure layer 4, wherein the copper block 2 is embedded in the large board 1, and the power amplifier daughter card 3 is arranged on the upper surface of the large board 1;

The conductive structure layer 4 is arranged on the contact surface of at least two of the power amplifier daughter card 3, the large board 1 and the copper block 2. Specifically, as shown in FIG. 3, the conductive structure layer 4 (the solid line part) is arranged on the power amplifier daughter card 3 , the contact surface of the large plate 1 and the copper block 2; the conductive structural layer 4 (dashed line part) is arranged on the contact surface of the large plate 1 and the copper block 2; the conductive structural layer 4 (not shown separately in the figure) can also be provided On the contact surface between the large board 1 and the power amplifier daughter card 3 .

In an optional embodiment, the conductive structural layer 4 includes a first structural layer 41 and a second structural layer 42, wherein the first structural layer 41 is disposed on the contact surface of the large plate 1 and the copper block 2, and the second The second structure layer 42 is disposed on the contact surface of the large board 1 and the other side of the copper block 2 .

Fig. 4 is a structural block diagram 1 of a PCB printed circuit board according to a preferred embodiment of the present disclosure. As shown in Fig. 4, the copper block 2 includes a first sub-block 21 and a second sub-block 22, and the first sub-block 21 is embedded in a large In the central area of the plate 1, the second sub-block 22 is arranged on the lower surface of the large plate 1, located below the first sub-block 21, and the second sub-block 22 is connected to the first sub-block 21;

The first structural layer 41 is arranged on the contact surface of the large plate 1, the second sub-block 22 and the first sub-block 21 by welding, and the second structural layer 42 is arranged on the large plate 1 and the second sub-block by welding. The sub-block 22 and the contact surface on the other side of the first sub-block 21 .

In another optional embodiment, the first structural layer 41 is arranged on the contact surface of the power amplifier daughter card 3, the large board 1 and the copper block 2, and the second structural layer 42 is arranged on the power amplifier daughter card 3 and the large board. 1 and the contact surface on the other side of the copper block 2.

Fig. 5 is a structural block diagram 2 of a PCB printed circuit board according to a preferred embodiment of the present disclosure. As shown in Fig. 5, the copper block 2 includes a first sub-block 21 and a second sub-block 22, and the first sub-block 21 is embedded in a large In the central area of the plate 1, the second sub-block 22 is arranged on the lower surface of the large plate 1, located below the first sub-block 21, and the second sub-block 22 is connected to the first sub-block 21;

The first structural layer 41 is set on the contact surface of the power amplifier daughter card 3, the large board 1, the second sub-block 22 and the first sub-block 21 by welding, and the second structural layer 42 is set on the power amplifier by welding The other side of the contact surface of the daughter card 3 , the large board 1 , the second sub-block 22 and the first sub-block 21 .

Fig. 6 is a structural block diagram three of a PCB printed circuit board according to a preferred embodiment of the present disclosure. As shown in Fig. 6, the PCB printed circuit board further includes: a power amplifier tube 5, wherein the power amplifier tube 5 is arranged through the power amplifier sub-card 3, And located above the copper block 2,

In another optional embodiment, the above-mentioned PCB printed circuit board further includes: a power amplifier tube 5, wherein the power amplifier tube 5 is arranged through the power amplifier sub-card 3 and is located above the copper block 2. In one embodiment , the conductive structure layer 4 is arranged on the contact surface of the large board 1 and the power amplifier sub-card 3, the contact surface of the copper block 2 and the power amplifier sub-card 3, and the contact surface of the copper block 2 and the power amplifier tube 5, and FIG. 7 is according to the present disclosure The structural block diagram 4 of the PCB printed circuit board of the preferred embodiment, as shown in FIG. The conductive structure layer 4 is an inverted hat device, which is welded during the production of the single board, so that the grounding of the large board 1 and the copper block 2 can be continuously shortened; Block 2 has good contact welding to improve the problem of virtual welding; the bottom of the inverted hat device can also be set in a hollow shape, so that the welding void rate of power amplifier tube 5 and copper block 2 is reduced to improve the grounding effect of power amplifier tube 5 .

In another embodiment, the conductive structure layer 4 can also be arranged on the contact surface between the copper block 2 and the power amplifier daughter card 3, and the contact surface between the copper block 2 and the power amplifier tube 5; FIG. 8 is a diagram according to a preferred embodiment of the present disclosure Structural block diagram five of the PCB printed circuit board, as shown in FIG.

In another embodiment, the conductive structure layer 4 can also be arranged on the contact surface between the copper block 2 and the power amplifier tube 5. FIG. 9 is a structural block diagram six of a PCB printed circuit board according to a preferred embodiment of the present disclosure, as shown in FIG. 9 As shown, the conductive structure layer 4 is disposed on the contact surface between the copper block 2 and the power amplifier tube 5 .

FIG. 10 is a schematic diagram of a hollow shape according to a preferred embodiment of the present disclosure. As shown in FIG. 10 , the part of the conductive structure layer 4 disposed on the contact surface between the power amplifier tube 5 and the copper block 2 is set in a hollow shape. Specifically, the hollow shape includes at least one of the following shapes: circle, triangle, ellipse, square, rectangle, and irregular figures.

In one embodiment, the conductive structure layer 4 is integrally formed.

In another embodiment, the conductive structure layer 4 is made of non-metallic conductive material or metal.

The embodiments of the present disclosure are applied to fields involving power amplification, such as broadcasting, communication, and medical treatment, which can improve the grounding continuity between the large board and the copper block, shorten the grounding path, and improve the problem of virtual welding between the large board and the sub-card, and between the sub-card and the copper block; Reduce the void rate of the power amplifier tube and copper block welding, improve the grounding effect of the power amplifier tube; improve the power amplifier performance (saturated power, efficiency and linearity) and the consistency of mass production, improve production efficiency, and reduce production costs.

Obviously, those skilled in the art should understand that each module or each step of the above-mentioned disclosure can be realized by a general-purpose computing device, and they can be concentrated on a single computing device, or distributed in a network composed of multiple computing devices In fact, they can be implemented in program code executable by a computing device, and thus, they can be stored in a storage device to be executed by a computing device, and in some cases, can be executed in an order different from that shown here. Or described steps, or they are fabricated into individual integrated circuit modules, or multiple modules or steps among them are fabricated into a single integrated circuit module for implementation. As such, the present disclosure is not limited to any specific combination of hardware and software.

The above are only preferred embodiments of the present disclosure, and are not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

A PCB printed circuit board, comprising: a large board (1), a copper block (2), a power amplifier daughter card (3) and a conductive structure layer (4), wherein the copper block (2) is embedded in the large In the board (1), the power amplifier sub-card (3) is arranged on the upper surface of the large board (1);

The conductive structural layer (4) is arranged on the contact surface of at least two of the power amplifier daughter card (3), the large board (1) and the copper block (2).
The PCB printed circuit board according to claim 1, wherein,

The conductive structural layer (4) includes a first structural layer (41) and a second structural layer (42), wherein the first structural layer (41) is arranged on the large plate (1) and the copper block (2) On the contact surface on one side, the second structural layer (42) is arranged on the contact surface of the large plate (1) and the copper block (2) on the other side.
The PCB printed circuit board according to claim 2, wherein,

The copper block (2) includes a first sub-block (21) and a second sub-block (22), the first sub-block (21) is embedded in the central area of the large plate (1), and the second Two sub-blocks (22) are arranged on the lower surface of the large plate (1), located below the first sub-block (21), the second sub-block (22) and the first sub-block (21) )connect;

The first structural layer (41) is arranged on the contact surface of the large plate (1), the second sub-block (22) and one side of the first sub-block (21) by welding, so that The second structural layer (42) is arranged on the contact surface of the large plate (1), the second sub-block (22) and the other side of the first sub-block (21) by welding.
The PCB printed circuit board according to claim 2, wherein,

The first structural layer (41) is arranged on the contact surface of the power amplifier daughter card (3), the large board (1) and the copper block (2), and the second structural layer (42 ) is arranged on the contact surface of the power amplifier daughter card (3), the large board (1) and the other side of the copper block (2).
The PCB printed circuit board according to claim 4, wherein,

The copper block (2) includes a first sub-block (21) and a second sub-block (22), the first sub-block (21) is embedded in the central area of the large plate (1), and the second Two sub-blocks (22) are arranged on the lower surface of the large plate (1), located below the first sub-block (21), the second sub-block (22) and the first sub-block (21) )connect;

The first structural layer (41) is arranged on the power amplifier daughter card (3), the large board (1), the second sub-block (22) and the first sub-block (21) by welding. ) on one side of the contact surface, the second structural layer (42) is arranged on the power amplifier daughter card (3), the large board (1), the second sub-block (22) and the The contact surface on the other side of the first sub-block (21).
The PCB printed circuit board according to claim 1, wherein the PCB printed circuit board further comprises: a power amplifier tube (5), wherein the power amplifier tube (5) is arranged through the power amplifier daughter card (3) , and located above the copper block (2),

The conductive structural layer (4) is arranged on the contact surface of the large plate (1), the copper block (2) and the power amplifier daughter card (3).
The PCB printed circuit board according to claim 1, wherein the PCB printed circuit board further comprises: a power amplifier tube (5), wherein the power amplifier tube (5) is arranged through the power amplifier daughter card (3) , and located above the copper block (2),

The conductive structural layer (4) is arranged on the contact surface between the large board (1) and the power amplifier daughter card (3), the contact surface of the copper block (2) and the power amplifier daughter card (3), And the contact surface between the copper block (2) and the power amplifier tube (5); or

The conductive structure layer (4) is arranged on the contact surface between the copper block (2) and the power amplifier daughter card (3), and the contact surface between the copper block (2) and the power amplifier tube (5) ;or

The conductive structure layer (4) is arranged on the contact surface between the copper block (2) and the power amplifier tube (5).
The PCB printed circuit board according to claim 7, wherein,

The part of the conductive structure layer (4) disposed on the contact surface between the power amplifier tube (5) and the copper block (2) is hollowed out.
The PCB printed circuit board according to claim 8, wherein,

The hollow shape includes at least one of the following shapes: circle, triangle, ellipse, square, rectangle, and irregular figures.
According to the PCB printed circuit board according to any one of claims 7 to 9, the conductive structure layer (4) is integrally formed.
The PCB printed circuit board according to any one of claims 1 to 9, wherein,

The conductive structural layer (4) is made of non-metallic conductive material or metal.