CN205428993U - SMD type LED support and lamp pearl of adopting this support based on aluminium base - Google Patents
SMD type LED support and lamp pearl of adopting this support based on aluminium base Download PDFInfo
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- CN205428993U CN205428993U CN201520366630.0U CN201520366630U CN205428993U CN 205428993 U CN205428993 U CN 205428993U CN 201520366630 U CN201520366630 U CN 201520366630U CN 205428993 U CN205428993 U CN 205428993U
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- aluminium base
- plastic cement
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- smd type
- led support
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Abstract
The utility model relates to a SMD type LED support and lamp pearl of adopting this support based on aluminium base. This application has been adopted and seted up the through -hole on aluminium base board, shaping embedding portion on the plastic seat simultaneously, make embedding portion be embedded into in the through -hole of aluminium base board, embedding portion can realize on the one hand that plastic seat and aluminium base board are between them fixed, on the other hand, the embedding portion in the aluminium base board of imbedding also strengthens the bulk strength of aluminium base board, avoid aluminium base board bending deformation, consequently, need not to adopt the fixed mode of aluminium base board embedding plastic seat, consequently, the bottom surface of lamp pearl is basic is the bottom surface of aluminium base board just all, heat radiating area is big for the lamp pearl, make full use of the heat dispersion of aluminium base board, improve the whole radiating effect of lamp pearl.
Description
Technical field
The application relates to LED package support technical field, particularly to a kind of SMD type LED support based on aluminium base and the lamp bead that uses this support.
Background technology
In the prior art, LED lamp bead is usually on the substrate being made up of iron material or copper material and is coated with plastic cement seat, the end face simultaneously making substrate exposes die bond region and is used for dispelling the heat for die bond, region, exposed portion, bottom surface, and increases the pad of copper material or iron material on plastic cement seat to connect the crystal on crystal bonding area.
The strength ratio of copper material and iron material is higher, it is very suitable for using as substrate, and the most current substrate all uses the LED frame of copper material or iron material, but, copper material and iron material density are high, cost is high, uses copper material and iron material production that LED lamp bead cost can be caused to increase, what is more important, the radiating effect of copper material and iron material is general, and it is well known that for LED lamp bead, radiating effect is the important indicator determining its luminescent properties.For this, attempt in the industry using that density is low, low cost and the more superior aluminium of radiating effect is used as LED support, but, the hardness of aluminium is relatively low, for this, the size of aluminium base is smaller, and typically can use aluminium base is embedded in plastic cement seat form (i.e. the bottom surface of lamp bead be the bottom surface of the bottom surface by plastic cement seat and aluminium base link up constitute), which results in the exposed area in aluminium base bottom surface, to account for the ratio of lamp bead bottom surface entire area less.And the bottom surface of aluminium base is the main path derived by the heat of lamp bead, therefore, this structure cannot effectively play the high heat dispersion of aluminium base.
Utility model content
The purpose of the application is to avoid above-mentioned weak point of the prior art to provide a kind of bulk strength that can be effectively improved aluminium base, can give full play to the LED support of the heat dispersion of aluminium base simultaneously.
The purpose of the application is achieved through the following technical solutions:
Provide a kind of SMD type LED support based on aluminium base, including aluminium base, described aluminium base end face is attached with plastic cement seat, described plastic cement seat offers opening and deviates from the encapsulation groove of aluminium base, a part for described aluminium base end face is exposed to the bottom land of described encapsulation groove to form crystal bonding area, described aluminium base offers through hole, and described plastic cement seat bottom portion is provided with the Embedded Division being embedded in described through hole, and described plastic cement seat is fixed on described aluminium base by Embedded Division.
Wherein, the crystal bonding area plating of described aluminium base is provided with silver layer.
Wherein, described conducting strip is iron plate.
Wherein, described through hole equidistant arrangement around crystal bonding area is arranged.
Wherein, the quantity of described through hole is at least 3, and the quantity of corresponding described Embedded Division is at least 3.
Wherein, described Embedded Division on aluminium base during injection mo(u)lding plastic cement seat plastic cement flow into through hole and formed.
Wherein, described plastic cement seat is also embedded with conducting strip, described conducting strip partial denudation in described encapsulation groove to form bonding wire dish, to form leg outside partial denudation and plastic cement seat.
Wherein, the aperture of described through hole is gradually reduced from the bottom surface of the end face of aluminium base to aluminium base, or first increases, then reduces.
Wherein, the aluminium of the employing of described aluminium base is: by the aluminium alloy of the magnesium synthesis of 94% to 97% aluminum mixing 3% to 6%.
Also provide for a kind of LED lamp bead using above-mentioned SMD type LED support based on aluminium base to make, it is characterised in that: being provided with LED crystal in described crystal bonding area, described LED crystal is connected with the bonding wire dish of described conduction, is filled with packaging plastic in described auxiliary tank
The beneficial effect of the application: the application have employed and offers through hole on aluminium base, molding Embedded Division on plastic cement seat simultaneously, Embedded Division is made to be embedded in the through hole of aluminium base, on the one hand Embedded Division is capable of the fixing of plastic cement seat and aluminium base, on the other hand, embed the Embedded Division in aluminium base and also strengthen the bulk strength of aluminium base, avoid aluminium base flexural deformation, therefore without using aluminium base to embed the fixed form of plastic cement seat, therefore the bottom surface of lamp bead is the most all the bottom surface of aluminium base, lamp bead area of dissipation is big, take full advantage of the heat dispersion of aluminium base, improve lamp bead integral heat sink effect.
Accompanying drawing explanation
Utilize accompanying drawing that the application is described further, but the embodiment in accompanying drawing does not constitute any restriction to the application, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to the following drawings.
Fig. 1 is the decomposition texture schematic diagram of the embodiment of a kind of SMD type LED support based on aluminium base of the application.
Fig. 2 is the structural representation of the embodiment of a kind of SMD type LED support based on aluminium base of the application.
Fig. 3 is the cross-sectional view of the embodiment of a kind of SMD type LED support based on aluminium base of the application.
Fig. 1 to Fig. 3 includes:
1 aluminium base, 11 crystal bonding areas, 12 through holes, 2 plastic cement seats, 21 encapsulation groove, 22 Embedded Divisions, 3 conducting strips, 31 legs.
Detailed description of the invention
With the following Examples the application is further described.
nullThe detailed description of the invention of a kind of SMD type LED support based on aluminium base of the application，As shown in Figure 1 to Figure 3，Include: include aluminium base 1，Described aluminium base 1 end face is attached with plastic cement seat 2，Described plastic cement seat 2 offers opening and deviates from the encapsulation groove 21 of aluminium base 1，A part for the end face of described aluminium base 1 is exposed to the bottom land of described encapsulation groove 21 to form crystal bonding area 11，Described plastic cement seat 2 is also embedded with conducting strip 3，Described conducting strip 3 partial denudation in described encapsulation groove 21 to form bonding wire dish，Partial denudation is outside with plastic cement seat 2 to form leg 31，Described aluminium base 1 offers four through holes 12，These through holes 12 are arranged around crystal bonding area 11 surrounding equidistant arrangement，The Embedded Division 22 being embedded in described through hole 12 it is provided with bottom described plastic cement seat 2，Described Embedded Division 22 on aluminium base 1 during injection mo(u)lding plastic cement seat 2 plastic cement flow into and formed，Process very convenient，And plastic cement seat 2 significantly more efficient can be made to be fixed on described aluminium base 1 by Embedded Division 22.Concrete, the quantity of through hole 12 can be adjusted flexibly, it is recommended that be not less than three, such guarantee plastic cement seat 2 is connected with the most fixing of aluminium base 1.
Compared with prior art, the application uses Embedded Division 22 to realize the fixing of plastic cement seat 2 and both aluminium bases 1, simultaneously, embed the Embedded Division 22 in aluminium base 1 and also strengthen the bulk strength of aluminium base 1, avoid aluminium base 1 flexural deformation, therefore, it is possible to for the aluminium base 1 of larger area, and without using aluminium base 1 to embed the fixed form of plastic cement seat 2, (i.e. plastic cement seat 2 is completely set up above aluminium base 1, cannot be coated with and 1 week edge of aluminium base), therefore the bottom surface of aluminium base 1 is exactly the bottom surface (bottom surface of traditional lamp bead be the bottom surface of aluminium base 1 add the bottom surface of plastic cement seat 2 formed) of lamp bead, lamp bead area of dissipation is big, take full advantage of the heat dispersion of aluminium base 1, improve lamp bead integral heat sink effect.
It should be noted that above supporting structure is for the LED lamp bead that size is bigger, for the LED lamp bead that size is smaller, it is also possible to cancel conducting strip, directly form bonding wire dish and leg by techniques such as plating on aluminium base.
The bottom surface plating of described aluminium base 1 is provided with silver layer.So that aluminium base 1 can strengthen its radiating effect further by soldering to heat dissipation metal frame.
Crystal bonding area 11 plating of described aluminium base 1 is provided with silver layer.On the one hand it is the surface strength strengthening crystal bonding area 11, it is simple to bonding wire, also on the other hand being able to increase the crystal bonding area 11 reflection to light, reduce the absorption to light, both enhanced luminous efficiency, decreasing because absorbing the heat that light produces.
Described conducting strip 3 is iron plate.The present embodiment uses iron plate to be owing to the intensity of iron plate is stronger, it is simple to processing.Certainly, according to actual needs, it is also possible to select other conducting strips 3 such as copper sheet.
The area in aluminium base 1 bottom surface of each through hole 12 is less than the 2% of the base area of aluminium base 1.Guarantee to make plastic cement seat 2 and aluminium base 1 are effectively fixing is connected on the basis of, reduce it as far as possible at the area shared by bottom surface, increase radiating effect.Concrete, the aperture of described through hole 12 is gradually reduced (through hole 12 is in back taper mesa-shaped) from the lower surface of the upper surface of aluminium base 1 to aluminium base 1, thus reduce the through hole 12 area in aluminium base 1 bottom surface while increasing the Embedded Division 22 contact area with aluminium base 1 as far as possible, even, the aperture of through hole 12 can also first increase from the bottom surface of the upper surface of aluminium base 1 to aluminium base 1, reduce (in shuttle shape) again, thus while the area of aluminium base 1 bottom surface, reduce the through hole 12 opening at aluminium base 1 upper surface reducing through hole 12 while increasing the Embedded Division 22 contact area with aluminium base 1 as far as possible, strengthen Embedded Division 22 is more firmly fixed in through hole 12, improve fixed effect.
The aluminium of the employing of described aluminium base 1 is: by the aluminium alloy of the magnesium synthesis of 94% to 97% aluminum mixing 3% to 6%.Using the aluminium that above ratio mixes, its intensity can have compared to fine aluminium and significantly promotes, and heat dispersion is also substantially without decline simultaneously.
Use above-mentioned SMD type LED support based on aluminium base can make LED lamp bead, it is thus only necessary to be provided with LED crystal in described crystal bonding area 11, LED crystal be connected with the bonding wire dish of described conduction, be then filled with packaging plastic in auxiliary tank.
Finally should be noted that; above example is only in order to illustrate the technical scheme of the application; rather than the restriction to the application protection domain; although having made to explain to the application with reference to preferred embodiment; it will be understood by those within the art that; the technical scheme of the application can be modified or equivalent, without deviating from the spirit and scope of technical scheme.
Claims (9)
1. a SMD type LED support based on aluminium base, including aluminium base, described aluminium base end face is attached with plastic cement seat, described plastic cement seat offers opening and deviates from the encapsulation groove of aluminium base, the end face of described aluminium base part is exposed to the bottom land of described encapsulation groove to form crystal bonding area, it is characterized in that: described aluminium base offers through hole, described plastic cement seat bottom portion is provided with the Embedded Division being embedded in described through hole, and described plastic cement seat is fixed on described aluminium base by Embedded Division.
A kind of SMD type LED support based on aluminium base, it is characterised in that: the crystal bonding area plating of described aluminium base is provided with silver layer.
A kind of SMD type LED support based on aluminium base, it is characterised in that: described plastic cement seat is embedded with conducting strip, and described conducting strip is iron plate.
A kind of SMD type LED support based on aluminium base, it is characterised in that: described through hole equidistant arrangement around crystal bonding area is arranged.
A kind of SMD type LED support based on aluminium base, it is characterised in that: the quantity of described through hole is at least 3, and the quantity of corresponding described Embedded Division is at least 3.
A kind of SMD type LED support based on aluminium base, it is characterised in that: described Embedded Division on aluminium base during injection mo(u)lding plastic cement seat plastic cement flow into through hole and formed.
A kind of SMD type LED support based on aluminium base, it is characterized in that: described plastic cement seat is also embedded with conducting strip, described conducting strip partial denudation in described encapsulation groove to form bonding wire dish, partial denudation outside plastic cement seat to form leg.
A kind of SMD type LED support based on aluminium base, it is characterised in that: the aperture of described through hole is gradually reduced from the bottom surface of the end face of aluminium base to aluminium base, or first increases, then reduces.
9. one kind uses in claim 1-8 the LED lamp bead that the SMD type LED support based on aluminium base described in any one is made, it is characterised in that: described crystal bonding area is provided with LED crystal, described encapsulation groove is filled with packaging plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520366630.0U CN205428993U (en) | 2015-06-01 | 2015-06-01 | SMD type LED support and lamp pearl of adopting this support based on aluminium base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520366630.0U CN205428993U (en) | 2015-06-01 | 2015-06-01 | SMD type LED support and lamp pearl of adopting this support based on aluminium base |
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| Publication Number | Publication Date |
|---|---|
| CN205428993U true CN205428993U (en) | 2016-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520366630.0U Expired - Fee Related CN205428993U (en) | 2015-06-01 | 2015-06-01 | SMD type LED support and lamp pearl of adopting this support based on aluminium base |
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| CN (1) | CN205428993U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882524A (en) * | 2015-06-01 | 2015-09-02 | 木林森股份有限公司 | SMD type LED support based on aluminum base material, and lamp bead employing the support |
-
2015
- 2015-06-01 CN CN201520366630.0U patent/CN205428993U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882524A (en) * | 2015-06-01 | 2015-09-02 | 木林森股份有限公司 | SMD type LED support based on aluminum base material, and lamp bead employing the support |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160803 Termination date: 20180601 |
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| CF01 | Termination of patent right due to non-payment of annual fee |