CN205303509U - Full metal package structure of vertical standard of LED - Google Patents
Full metal package structure of vertical standard of LED Download PDFInfo
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- CN205303509U CN205303509U CN201620045199.4U CN201620045199U CN205303509U CN 205303509 U CN205303509 U CN 205303509U CN 201620045199 U CN201620045199 U CN 201620045199U CN 205303509 U CN205303509 U CN 205303509U
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Abstract
The utility model belongs to the technical field of the LED encapsulation, especially, relate to a full metal package structure of vertical standard of LED, including the frame body, the upper portion of frame body has been seted up the chip and has been placed the recess, the lower part of frame body is cylindrical, just be equipped with connecting thread on all surfaces of the lower part of frame body, wear to be equipped with the wire in the frame body, the one end of wire with groove connection is placed to the chip, the other end of wire is connected with and is located the outer lead of the lower tip of frame body, the wire with be equipped with the insulating layer between the frame body. The utility model relates to a rationally, simple structure, simple to operate is swift, has left out screw and heat sink connection of heat dissipation, and the heat dissipation is good, avoids the lead wire openly to influence the lamps and lanterns outward appearance, not only beautifully but also succinct, is favorable to increasing the aesthetic feeling of lamps and lanterns.
Description
Technical field
This utility model belongs to LED encapsulation technology field, particularly relates to a kind of vertical quasi-metal package structure of LED.
Background technology
LED encapsulation refers to the encapsulation of luminescence chip, and comparing integrated antenna package has relatively big difference. The encapsulation of LED does not require nothing more than can protect wick, but also want can printing opacity.
LED packaging frame is the basic material making and producing semiconductor light-emitting elements. The general basic material making LED packaging frame is copper alloy, LED metal material belt was produced through punching press before this by copper material, it is then passed through plating and does silver-plated on functional area, plastics and copper alloy is used to combine again through Shooting Technique, make plastics form a reflector on copper framework, finally encapsulate manufacturer through LED and load onto chip in functional areas at the bottom of cup, stamp lead-in wire, pour into resin, form a light-emitting component.
In prior art, general power LED package framework is made up of metal and plastics, refill after being packaged into LED on aluminium base, carry out circuit connection and heat radiation, this encapsulating structure has the disadvantage in that when assembling with aluminium base must use screw-driving, and must be connected with heat dispersion heat sink, assemble trouble; It addition, outer lead is in front, causes that connecting wire destroys overall appearance, sometimes has to add shelter, cause structure complicated, improve cost.
Utility model content
Technical problem to be solved in the utility model is: the deficiency existed for prior art, thering is provided a kind of quick and easy for installation, heat radiation is good, it is to avoid lead-in wire positive influences light fixture outward appearance, not only attractive in appearance but also simple and direct, be conducive to increasing the vertical quasi-metal package structure of LED of the aesthetic feeling of light fixture.
For solving above-mentioned technical problem, the technical solution of the utility model is:
The vertical quasi-metal package structure of LED, including frame body, the top of described frame body offers chip and places groove, the bottom of described frame body is cylindrical, and the perimeter surface of the bottom of described frame body is provided with connection screw thread, being equipped with wire in described frame body, one end of described wire is placed groove with described chip and is connected, the other end of described wire is connected to the outer lead of the bottom being positioned at described frame body, is provided with insulating barrier between described wire and described frame body.
Improving as one, described chip is placed the groove face of groove and is included chip placed side, and all sides of described chip placed side are connected to the reflecting surface upwards extended.
Improving as one, described insulating barrier includes placing the upper insulating barrier of groove side and the lower insulating barrier of the lower end side near described frame body near described chip.
Improving as one, the longitudinal section of described frame body is T-shape.
Improving as one, described chip is placed and is coated with reflected coat layer on the groove face of groove. Reflected coat layer can improve reflecting effect.
Improve as one, the outer surface of described frame body is coated with coating for protection against corrosion. Coating for protection against corrosion can improve the corrosion resistance of frame body, extends its service life, effectively protects product.
As improving further, described frame body is metallic bodies. Metallic bodies both can ensure that and connected fixing stablizing, and can ensure that again heat radiation is good.
Owing to have employed technique scheme, the beneficial effects of the utility model are:
The vertical quasi-metal package structure of LED that this utility model provides, for using with LED chip assembling, by described connection screw thread, the LED after encapsulation it is attached fixing and dispels the heat, have only to during installation tighten, eliminate screw and be connected with heat dispersion heat sink, simultaneously, described outer lead is positioned at the bottom of described frame body, facilitate back side line, be conducive to installing and hiding, attractive in appearance without influence on light fixture.
This utility model is reasonable in design, simple in construction, quick and easy for installation, and heat radiation is good, it is to avoid lead-in wire positive influences light fixture outward appearance, not only attractive in appearance but also succinct, is conducive to increasing the aesthetic feeling of light fixture.
Accompanying drawing explanation
The following drawings is only intended to, in this utility model being schematically illustrated and explaining, not limit scope of the present utility model.
Fig. 1 is the structural representation of the vertical quasi-metal package structure of LED that this utility model provides;
Wherein: 1-frame body, 2-chip places groove, and 3-connects screw thread, 4-wire, 5-outer lead, 21-chip placed side, 22-reflecting surface, the upper insulating barrier of 61-, insulating barrier under 62-.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, this utility model is further elaborated. Should be appreciated that specific embodiment described herein is only in order to explain this utility model, be not used to limit this utility model.
Fig. 1 illustrates the structural representation of the vertical quasi-metal package structure of LED that this utility model provides, and for the ease of illustrating, this figure only provides the structure division relevant with this utility model.
As shown in Figure 1, the vertical quasi-metal package structure of LED, for using with LED chip assembling, including frame body 1, the top of described frame body 1 offers chip and places groove 2, the bottom of described frame body 1 is cylindrical, and the perimeter surface of frame body 1 is provided with connection screw thread 3, it is equipped with wire 4 in described frame body 1, one end of described wire 4 is placed groove 2 with described chip and is connected, the other end of described wire 4 is connected to outer lead 5, and described outer lead 5 is positioned at the bottom of described frame body 1, is provided with insulating barrier between described wire 4 and described frame body 1.
Described chip place groove 2 groove face include chip placed side 21, described chip placed side 21 be easy to place LED chip assemble; All sides of described chip placed side 21 are connected to the reflecting surface 22 upwards extended, and described reflecting surface 22 can require design curvature according to LED light.
Described insulating barrier includes insulating barrier 61 and lower insulating barrier 62, described upper insulating barrier 61 places groove 2 side near described chip, described lower insulating barrier 62 is near the lower end side of described frame body 1, described upper insulating barrier 61 can be made up of high temperature setting glue, and described lower insulating barrier 62 can be made up of politef or nylon.The longitudinal section of described frame body 1 is T-shape.
Described chip is placed to be coated with on the groove face of groove 2 and is covered with reflected coat layer, and described reflected coat layer can adopt silver-plated, and reflecting effect is good.
Being coated with on the outer surface of described frame body 1 and be covered with coating for protection against corrosion, described coating for protection against corrosion can be silver coating, and to obtain technological feasibility and reflection light requirement, described coating for protection against corrosion can also be the coating such as nickel plating or other anti-oxidation, corrosion, effectively protects product.
Described frame body 1 is preferably metallic bodies, described metallic bodies can be made up of red copper, pyrite or aluminum, both can ensure that and connected fixing stablizing, can ensure that again heat radiation is good, except the present embodiment is insulant except described insulating barrier, all the other are all made up of metal therefore are called quasi-metal package structure.
By described connection screw thread 3, the LED after encapsulation is attached fixing and heat radiation, has only to during installation tighten, eliminate screw and be connected with heat dispersion heat sink, simultaneously, described outer lead 5 is positioned at the bottom of described frame body 1, facilitates back side line, is conducive to installing and hiding.
This utility model is quick and easy for installation, and heat radiation is good, it is to avoid lead-in wire positive influences light fixture outward appearance, not only attractive in appearance but also succinct, is conducive to increasing the aesthetic feeling of light fixture.
Of the present utility model ultimate principle, principal character and of the present utility model advantage have more than been shown and described. The foregoing is only preferred embodiment of the present utility model; not in order to limit this utility model; all any amendment, equivalent replacement and improvement etc. made within spirit of the present utility model and principle, should be included within protection domain of the present utility model.
Claims (7)
- The vertical quasi-metal package structure of 1.LED, including frame body, it is characterized in that: the top of described frame body offers chip and places groove, the bottom of described frame body is cylindrical, and the perimeter surface of the bottom of described frame body is provided with connection screw thread, being equipped with wire in described frame body, one end of described wire is placed groove with described chip and is connected, the other end of described wire is connected to the outer lead of the bottom being positioned at described frame body, is provided with insulating barrier between described wire and described frame body.
- 2. the vertical quasi-metal package structure of LED as claimed in claim 1, it is characterised in that: described chip is placed the groove face of groove and is included chip placed side, and all sides of described chip placed side are connected to the reflecting surface upwards extended.
- 3. the vertical quasi-metal package structure of LED as claimed in claim 1, it is characterised in that: described insulating barrier includes placing the upper insulating barrier of groove side and the lower insulating barrier of the lower end side near described frame body near described chip.
- 4. the vertical quasi-metal package structure of LED as claimed in claim 1, it is characterised in that: the longitudinal section of described frame body is T-shape.
- 5. the vertical quasi-metal package structure of LED as claimed in claim 1, it is characterised in that: described chip is placed and is coated with reflected coat layer on the groove face of groove.
- 6. the vertical quasi-metal package structure of LED as claimed in claim 1, it is characterised in that: the outer surface of described frame body is coated with coating for protection against corrosion.
- 7. the vertical quasi-metal package structure of LED as described in any one of claim 1-6, it is characterised in that: described frame body is metallic bodies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620045199.4U CN205303509U (en) | 2016-01-18 | 2016-01-18 | Full metal package structure of vertical standard of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620045199.4U CN205303509U (en) | 2016-01-18 | 2016-01-18 | Full metal package structure of vertical standard of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205303509U true CN205303509U (en) | 2016-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620045199.4U Active CN205303509U (en) | 2016-01-18 | 2016-01-18 | Full metal package structure of vertical standard of LED |
Country Status (1)
| Country | Link |
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| CN (1) | CN205303509U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133809A (en) * | 2020-09-06 | 2020-12-25 | 杭州金知科技有限公司 | Vertical packaging structure of full-color gallium nitride-based chip |
-
2016
- 2016-01-18 CN CN201620045199.4U patent/CN205303509U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133809A (en) * | 2020-09-06 | 2020-12-25 | 杭州金知科技有限公司 | Vertical packaging structure of full-color gallium nitride-based chip |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |