TWI593144B - Heterogeneous LED light-emitting components manufacturing process - Google Patents

Description

Manufacturing process of heterogeneous LED light source component

The invention relates to an LED light source element, and particularly to a heterogeneous LED light source element capable of emitting light all the way and a manufacturing process thereof.

Generally speaking, the material of the LED light-emitting chip is different from that of the substrate, and the principle of the white light of the LED is: the LED chip emits blue light, the yellow phosphor powder on the substrate, and the white light is emitted by the blue light-exciting phosphor powder. Of course, the color temperature or the color of the light can be adjusted by adjusting the proportion of the phosphor in the substrate and the thickness of the substrate. Of course, fluorescent powder can also be omitted in the substrate.

At present, LED light sources have to achieve the goal of light weight and shortness, which are assembled and designed using patch components. Since the patches are single-sided, it is relatively difficult to achieve full-circumference design. The brightness is limited, and it takes a lot of assembly to reach the brightness requirement. Therefore, the development of a heterogeneous LED light source element to achieve full-circumference effect is a very important issue in various lighting fields.

In addition, there is no specific preparation process for the heterogeneous LED light source components that achieve full illumination. The inventors believe that the isolating LED light source components that provide the relevant full-circumference light can promote the development of the technical field. .

In view of the above-mentioned drawbacks of the prior art, the technical problem to be solved by the present invention is to provide a full-period, heterogeneous LED light source element which is capable of achieving full-circumferential illumination.

The present invention also provides a manufacturing process of the above-described light source element.

In order to achieve the above object, the present invention provides a heterogeneous LED light source device, comprising a first substrate, a second substrate, and a metal via, wherein the metal via is fixed on the first substrate, An LED light-emitting chip is fixed on the first substrate, the LED light-emitting chip is connected by a wire, and the second substrate is bonded and fixed integrally with the first substrate.

Further, the metal through body is fixed on the first substrate by one of casting, pressing, and molding.

Further, the first substrate and the second substrate are made of a light transmissive material.

Further, the first substrate and the second substrate are obtained by mixing and curing the epoxy resin and the phosphor powder.

Further, the metal via body is made of copper silver plating or iron silver plating.

Further, the first substrate is disposed in the second substrate.

Further, the metal via body includes an outer segment, an inner block, and a connecting segment connecting the outer segment and the inner block, and the inner block and the connecting segment are fixed in the first substrate.

Further, the second substrate is provided with an auxiliary bonding portion.

Further, the auxiliary bonding portion is at least attached to one side of the first substrate.

The process for preparing the above-mentioned heterogeneous LED light source assembly comprises the following steps: S1, compounding, and uniformly mixing the epoxy resin and the curing agent to form a colloid for preparing the substrate; S2, fixing the metal through body The metal conductive body is placed in the first cavity of the first mold, and the colloid prepared in S1 is injected into the cavity, and the first substrate is formed by molding infusion, wherein the temperature of the molding infusion is 100-160 degrees. Time 3~15 minutes; S3, solid crystal wire bonding; fixing the LED light-emitting chip on the first substrate, and then connecting the LED light-emitting chips fixed on the first substrate in series by a wire bonding process; S4, bonding, and the first step after the solid-crystal bonding in S3 A substrate is placed in the second cavity of the second mold; finally, the colloid disposed in S1 is injected into the second cavity, and the molding is again performed, so that the first substrate and the second substrate are integrated into one body, wherein the temperature of the molding is performed. It is 100~160 degrees and the time is 3~15 minutes.

Further, the method further includes the following steps: S5, cutting, according to the finished product style, cutting the bracket and the material to complete the finished product.

Further, the epoxy resin used in S1 may be bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, tetrabromobisphenol epoxy resin, and rubber modified epoxy resin. One of an alicyclic epoxy resin, an aliphatic epoxy resin, or a blend thereof, and any combination thereof.

Further, the curing agent used in S1 may be an acid anhydride curing agent, and the acid anhydride curing agent is methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride or a blend thereof.

Further, the phosphor powder used in S1 may be YAG phosphor powder, TAG phosphor powder, aluminate (Silicate), nitride (Nitride), and nitrogen oxide (Oxynitride), nitrogen oxide. One of the Oxy-nitride fluorescent materials and any combination thereof.

Further, a light diffusing agent may be added to S1.

Further, the light diffusing agent is one of nanometer barium sulfate, calcium carbonate, cerium oxide, acryl type light diffusing agent, styrene type, acrylic type light diffusing agent or any combination thereof.

Further, the material used for the wire bonding in S3 may be one of a gold wire, an aluminum wire, and an alloy wire, and any combination thereof.

Further, the solid crystal wire in S3 can also be flipped, that is, the equivalent circuit obtained by the wire bonding process is printed on the first substrate, and then the LED light emitting chip is fixed on the first substrate, and at the same time, it is ensured. The LED light-emitting chip is electrically connected to the printed circuit.

Further, a process for preparing an isomeric LED light source component comprises the following steps: S1, compounding, modifying epoxy resin, methyl hexahydrophthalic anhydride, YAG phosphor powder, and light diffusing agent according to a weight ratio of 1 : 1: 0.2: 0.01 ratio is taken out uniformly and mixed to form a colloid; S2, a fixed metal conducting body is taken, and the metal conducting body is placed in the first cavity of the first mold, and the colloid prepared in S1 is injected into the cavity. The first substrate is formed by molding perfusion, wherein the temperature of the molding perfusion is 100 to 160 degrees, and the time is 3 to 15 minutes; S3, solid crystal bonding; fixing the LED light-emitting chip on the first substrate, and then passing the wire bonding process The LED light-emitting chips fixed on the first substrate are connected in series; S4, bonding, placing the first substrate after the solid-crystal wire bonding in S3 in the second cavity of the second mold; finally, colloid disposed in S1 The second cavity is injected into the second cavity, and the first substrate and the second substrate are bonded together, wherein the molding temperature is 100 to 160 degrees and the time is 3 to 15 minutes.

The invention has the beneficial effects that the LED light source element of the invention has a simple structure, and the brightness of the existing LED light source can reach twice that of the existing LED light source, and the energy utilization rate is greatly improved. Has a good market prospects.

The LED light source component preparation process of the invention adopts the molding perfusion, effectively controls the product forming efficiency and improves the product quality. In addition, the process can effectively simplify the process steps and improve the production efficiency by means of molding and infusion. In addition, in the design of the whole process flow, the formulation of the glue can be flexibly adjusted in the glue part to meet different needs, and the molded part of the second substrate can pass through the mold. Designed to achieve the special structure of the product, so overall, the process is not only simple but also highly flexible, and has a strong adaptability.

1‧‧‧First substrate

2‧‧‧LED light-emitting chip

3‧‧‧Wire

4‧‧‧second substrate

5‧‧‧Metal conductors

42‧‧‧Auxiliary fitting part

50‧‧‧cut points

51‧‧‧External section

52‧‧‧Connection section

53‧‧‧Internal block

A‧‧‧ first fit surface

B‧‧‧Second mold

B1‧‧‧ cavity

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the structure of a first embodiment of a method for fabricating a heterogeneous LED light source element according to the present invention.

2 is a schematic view showing the second step of a specific embodiment of a method for manufacturing a heterogeneous LED light source device according to the present invention.

3 is a schematic view showing the structure of a third step of a specific embodiment of a method for manufacturing a heterogeneous LED light source device according to the present invention.

Figure 4 is a left side elevational view of a specific embodiment of a heterogeneous LED light source element of the present invention.

Figure 5 is a diagram showing an improved structure of a specific embodiment of a heterogeneous LED light-emitting source element of the present invention.

6 is a schematic view showing the structure of a fourth step of a specific embodiment of a method for fabricating a heterogeneous LED light source device according to the present invention.

Figure 7 is a right side cross-sectional view of a specific embodiment of a heterogeneous LED light source element of the present invention.

Figure 8 is a right side cross-sectional view of a specific embodiment of a heterogeneous LED light source element of the present invention.

The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

Embodiment 1

Referring to FIG. 1 to FIG. 4, a heterogeneous LED light-emitting source component includes a first substrate 1, a second substrate 4, and a metal via 5, and the metal via 5 is fixed on a top surface of the first substrate 1 (relatively to 4), the LED light-emitting chip 2 is fixed on the top surface of the first substrate 1, the LED light-emitting chip 2 is connected by a wire 3, and the second substrate 4 is pressed against the first substrate 1. Fixed into one.

The metal through body 5 is fixed on the first substrate 1 by casting, pressing, molding, or the like.

The first substrate 1 and the second substrate 4 are made of a light-transmitting material, preferably an epoxy resin and a fluorescent powder are mixed and solidified.

After the LED light-emitting chip of the present invention is electrically light-emitting, light on all the light-emitting surfaces of the LED light-emitting chip can be emitted through the first substrate 1 and the second substrate 4, which achieves the effect of full light emission.

Of course, the color temperature of the last luminescence of the entire illuminating element can be controlled by adjusting the color, concentration, etc. of the phosphor in the substrate.

The existing LED illumination sources generally only emit light on one side, but the energy consumption is not reduced, and the invention can achieve twice the brightness of the original technology under the premise of using the same energy consumption (because the full-circumference illumination is achieved). The effect) greatly improves the energy utilization rate and meets the demand for high-brightness LED illumination sources.

The metal via 5 is made of copper-plated silver or iron-plated silver.

Embodiment 2

Referring to FIG. 5, the structure is an improved structure of the LED light source element, and the main difference from the first embodiment is as follows:

(1) The metal conducting body 5 is divided into three sections, including an outer connecting section 51, an inner block 53, and a connecting section 52 connecting the outer connecting section 51 and the inner block 53, and the metal conducting body 5 can be formed by a potting process at the time of manufacture. The metal substrate 5 is more firmly fixed on the first substrate 1 in order to solve the problem that the metal conductor 5 in FIG. 4 is likely to be loose.

(2) The second substrate 4 is provided with an auxiliary bonding portion 42 for increasing the bonding area of the first substrate 1 and the second substrate 4 such that the first substrate 1 and the second substrate 4 is not easy to stratify and loose.

The second substrate 4 and the first substrate 1 are bonded to each other at least by the first bonding surface A, and the auxiliary bonding portion 42 is a surface of the second substrate 4 and the first substrate 1 The bonding portion other than the bonding surface A may be attached to one side of the first substrate, or may be bonded to both sides of the first substrate, or may be bonded to the three sides of the first substrate and the upper side. Even the second substrate 4 directly encloses the first substrate 1 therein.

Referring to FIG. 7, the structure shown is such that the first substrate 1 and the second substrate 4 are bonded at least by three sides.

Referring to FIG. 8, the structure is such that the first substrate 1 is directly disposed in the second substrate 4.

Embodiment 3

The manufacturing process of the above-mentioned heterogeneous LED light source element comprises the following steps: S1, compounding, uniformly mixing the epoxy resin and the curing agent in any ratio, and of course, adding an appropriate amount of fluorescent powder to uniformly mix according to the actual color temperature. After being configured as a colloid for fabricating a substrate; S2, see FIG. 1 or FIG. 5, fixing the metal via 5, taking the metal via 5 into the first cavity A1 of the first mold A, and preparing the colloid in S1 In the injection cavity A1, the first substrate 1 is formed by molding and infusion, wherein the temperature of the molding perfusion is 100 to 160 degrees, and the time is 3 to 15 minutes; S3, see FIG. 2, the solid crystal bonding; the LED light emitting chip 2 It is fixed on the first substrate 1, and then the LED light-emitting chips 2 fixed on the first substrate 1 are connected in series by a wire bonding process.

S4, referring to FIG. 6, the first substrate 1 after the solid crystal wire bonding in S3 is placed in the second cavity B1 of the second mold B, and the cavity B1 can be actually required according to the second substrate 4. Designed to match the bonding surface of the first substrate 1.

Finally, the colloid disposed in S1 is injected into the second cavity B2, and the molding is again performed, so that the first substrate 1 and the second substrate 4 are integrally formed, wherein the molding temperature is 100 to 160 degrees, and the time is 3 to 15 minutes. .

S5, referring to FIG. 3, cutting, according to the finished product style, cutting the bracket and the material to complete the finished product, wherein the cutting position of the metal conducting body 5 is the cutting point 50 in FIG. 3, of course, according to actual needs Design the position of the cutting point 50.

Further, the epoxy resin used in S1 may be bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, tetrabromobisphenol epoxy resin, and rubber modified epoxy resin. One of an alicyclic epoxy resin, an aliphatic epoxy resin, or a blend thereof, and any combination thereof.

The curing agent used in S1 may be an acid anhydride curing agent, and the acid anhydride curing agent is methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride or a blend thereof.

The phosphor used in S1 may be YAG phosphor powder, TAG phosphor powder, aluminate (Silicate), nitride (Nitride), and nitrogen oxide (Oxynitride), nitrogen oxide (Oxy). -nitride) One of the fluorescent materials and any combination thereof.

Other functional materials, such as a light diffusing agent, may also be added in S1, and the light diffusing agent may be nano barium sulfate, calcium carbonate, cerium oxide, acrylic light diffusing agent, styrene type, acrylic type light diffusion. Agents, etc.

Further, the material used for the wire bonding in S3 may be one of a gold wire, an aluminum wire, and an alloy wire, and any combination thereof.

Further, the die bonding wire in S3 can also be flipped, that is, the equivalent circuit obtained by the wire bonding process is printed on the first substrate 1 by the conductor, and then the LED light emitting chip is fixed on the first substrate, and at the same time It is ensured that the LED light-emitting chip is electrically connected to the printed circuit.

Embodiment 4

The difference between this embodiment and the third embodiment is:

S1, rubber, modified epoxy resin, methyl hexahydrophthalic anhydride, YAG phosphor powder, light diffusing agent according to a weight ratio of 1:1: 0.2: 0.01 ratio of uniform and mixed to form a colloid.

The light diffusing agent can function as a softening and atomizing effect of light.

Embodiment 5

In this embodiment, the preparation process of the fourth embodiment is adopted, wherein: the metal conduction body 5 is a copper-plated silver bracket; the fluorescent powder is a Hongdae YAG-432 phosphor powder; and the LED light-emitting chip is a Sanan photoelectric 10*37 wafer; Materials and Processes After the LED light source elements were prepared, they were lit with a driving current of 20 mA, and the brightness was measured by an LED brightness tester (LED-BNTW-12-XY, Honggang Co., Ltd.). The test results are shown in Table 1 below.

In the prior art, the brightness of the product of the same specification as the present invention is less than 90 lm/W by 20 mA, so that the LED light source assembly of the present invention can achieve twice the brightness of the prior art under the premise of the same energy consumption. .

The above has described in detail the preferred embodiments of the invention. It will be appreciated that many modifications and variations can be made in the present invention without departing from the scope of the invention. Therefore, any technical solution that can be obtained by a person skilled in the art according to the prior art by logic analysis, reasoning or limited experiment according to the prior art should be within the scope of protection determined by the request item.

1‧‧‧First substrate

2‧‧‧LED light-emitting chip

3‧‧‧Wire

4‧‧‧second substrate

42‧‧‧Auxiliary fitting part

51‧‧‧External section

52‧‧‧Connection section

53‧‧‧Internal block

Claims (9)

A process for preparing a heterogeneous LED light-emitting source component, characterized in that: the heterogeneous LED light-emitting source component comprises a first substrate, a second substrate, and a metal conductive body, wherein the metal conductive body is fixed on the first substrate, The LED substrate is fixed on the first substrate, the LED light-emitting chip is connected by wires, and the second substrate is fixedly integrated with the first substrate; the process includes the following steps: S1. The glue is prepared by uniformly mixing the epoxy resin and the curing agent into a colloid for forming the substrate; S2, fixing the metal conduction body, and placing the metal conduction body into the first cavity of the first mold to The colloid prepared in S1 is injected into the cavity, and the first substrate is formed by molding perfusion, wherein the temperature of the molding perfusion is 100-160 degrees, and the time is 3 to 15 minutes; S3, solid crystal bonding; fixing the LED light-emitting chip at On the first substrate, the LED light-emitting chips fixed on the first substrate are connected in series by a wire bonding process; S4, bonding, placing the first substrate after the solid-crystal wire bonding in S3 in the second cavity of the second mold Medium The S1 configured Colloid second cavity, is molded perfused again, the first and second substrates integrally attached to a synthetic, wherein the temperature of the molding 100 to 160 degrees for 3 to 15 minutes. The process for preparing a heterogeneous LED light-emitting source component according to claim 1, wherein the metal-conducting body is made of copper-plated silver or iron-plated silver. The process for preparing a heterogeneous LED light source element according to claim 1, wherein the metal conductive body comprises an outer connecting portion, an inner block, and a connecting portion connecting the outer connecting portion and the inner block, The inner block and the connecting segment are fixed within the first substrate. The process for preparing a heterogeneous LED light source device according to claim 1, wherein the second substrate is provided with an auxiliary bonding portion, and the auxiliary bonding portion is at least one side of the first substrate. fit. The process for preparing a heterogeneous LED light source component according to claim 1, wherein the epoxy resin used in S1 is bisphenol A epoxy resin, bisphenol F epoxy resin, and phenolic type. Epoxy resin, tetrabromobisphenol epoxy resin, and rubber modified epoxy resin, alicyclic epoxy resin, aliphatic epoxy resin or a blend thereof, and any combination thereof; curing used in S1 The agent is methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride or a blend thereof. The process for preparing a heterogeneous LED light source device according to claim 1, characterized in that a phosphor powder or a light diffusing agent is added to the S1, and the phosphor powder is YAG phosphor powder and TAG phosphor powder. And one of any of Aluminate silicate, Nitride, and Oxynitride, Oxy-nitride phosphor materials, and any combination thereof. The process for preparing a heterogeneous LED light source element according to claim 1, wherein the material used for the wire bonding in S3 may be one of a gold wire, an aluminum wire, and an alloy wire, and any combination thereof. The process for preparing a heterogeneous LED light source component according to claim 1, wherein the solid crystal wire in the S3 can also be flipped, that is, the conductor is printed on the first substrate and the wire bonding process is obtained. The equivalent circuit then fixes the LED light-emitting chip on the first substrate while ensuring that the LED light-emitting chip is electrically connected to the printed circuit. The process for preparing a heterogeneous LED light source component according to any one of claims 1-8, characterized in that the method comprises the following steps: S1, compounding, modifying epoxy resin, methyl hexahydrophthalic anhydride, YAG firefly The light powder and the light diffusing agent are uniformly and mixed according to a weight ratio of 1:1:0.2:0.01 to form a colloid; S2, fixing the metal conducting body, taking the metal conducting body into the first cavity of the first mold, injecting the colloid prepared in S1 into the cavity, and adopting the method of molding perfusion to make the first substrate, wherein the temperature of the molding perfusion 100~160 degrees, time 3~15 minutes; S3, solid crystal wire bonding; fixing the LED light-emitting chip on the first substrate, and then connecting the LED light-emitting chips fixed on the first substrate by a wire bonding process; S4, pasting The first substrate after the solid crystal wire bonding in S3 is placed in the second cavity of the second mold; finally, the colloid disposed in S1 is injected into the second cavity, and the molding is again performed to make the first substrate and the first substrate The second substrate is laminated into a whole body, wherein the molding temperature is 100 to 160 degrees and the time is 3 to 15 minutes.