TWI497779B - Method for manufacturing led leadframe - Google Patents

Description

Method for manufacturing bracket structure of light-emitting diode (3)

The invention relates to a light-emitting diode, in particular to a method for fabricating a support structure of a light-emitting diode.

Light-emitting diodes have been widely used in various electronic devices, electrical products or lamps, and the LEDs are developed and improved in the way of high-brightness, multi-color light and heat dissipation. Therefore, the cost of manufacturing the light-emitting diode is increased. In addition to the aforementioned factors, the manufacturing cost of the light-emitting diode is increased, and the production yield of the light-emitting diode is directly reflected in the production cost.

In the production of the conventional light-emitting diode, a metal plate is prepared, and after the metal plate is stamped or etched into the process support structure, a metal frame is arranged on the support structure, and the metal frame is connected with a plurality of metal supports through the connecting portion. The metal bracket comprises a positive electrode piece and a negative electrode piece, and then a thermostatic plastic is used to form a rubber seat on the plurality of metal brackets. After the rubber seat is finished, the exposed functional area of the rubber seat is exposed. On the negative electrode wafer, the solid crystal of the light-emitting chip and the gold wire bonding process are performed. After the solid crystal and the wire bonding process, the silicone powder mixed with the fluorescent powder is inserted into the hollow functional area, and after the dispensing process, Metal brackets are cut and tested.

Since the conventional light-emitting diodes are tested for brightness and chromaticity ratio after the production is completed, the brightness and chromaticity ratio of the hair-emitting diodes do not meet the requirements, so that the light-emitting diodes are made. The yield of production is only about 50%. The main reason is that after the plastic seat is formed on the metal bracket, the connecting portion of the positive electrode and the negative electrode of the metal bracket is not cut, so the positive electrode and the negative electrode of the metal bracket are both It is linked together so that the hollow functional area of the rubber seat cannot be tested immediately after dispensing, and the ratio of brightness and chromaticity of the light-emitting diode is correct. It is necessary to complete the whole process to confirm the quality, so the luminous rate of the defective rate is The polar body cannot be detected even.

Therefore, the main object of the present invention is to solve the conventional problem. After the plastic seat on the metal bracket of the bracket structure of the light-emitting diode is formed, the joint portion of the predetermined metal bracket is cut or cut off, and the subsequent solid is fixed. In the crystal, wire and dispensing process, before the colloid is not dried, the pre-test operation can be performed to detect whether the ratio of brightness and chromaticity of the light-emitting diode is correct, thereby improving the yield of the light-emitting diode after fabrication. It can be more than 90%, which can greatly reduce the production cost.

In order to achieve the above object, the present invention provides a method (3) for fabricating a support structure for a light-emitting diode, comprising: preparing a metal plate; forming a support structure of a metal frame and a plurality of metal supports on the metal plate, the metal support Having a first electrode sheet and a second electrode sheet, the first electrode sheet and the second electrode sheet have a connecting portion, the connecting portion connecting the plurality of metal brackets and the metal frame; forming a glue on the metal bracket a plastic functional area for exposing the first electrode piece and the second electrode piece on the front surface of the formed plastic seat, and a plurality of relocation spaces are formed at adjacent lateral positions of the hollow functional area, so that The connection is exposed; Cutting the exposed connecting portion; fixing a light-emitting chip on the second electrode sheet in the hollow functional area of the rubber seat; electrically connecting a metal wire to the light-emitting chip and the first electrode sheet; Pointing in the hollow functional area; applying a power source to the connection portion of the cut metal bracket, and energizing the first electrode sheet and the second electrode sheet to illuminate the light-emitting chip to perform luminance ratio and chromaticity ratio detection.

Wherein, the metal frame has a plurality of long holes and short holes arranged at intervals, and has a consistent perforation between the two short holes.

The connecting portion is formed on a side of the first electrode sheet that is not adjacent to or corresponding to the second electrode sheet.

Wherein, the connecting portion connects each metal bracket in the longitudinal direction and the lateral direction.

The first electrode sheet has a rectangular shape, and has two corresponding notches on the side adjacent or corresponding to the second electrode sheet.

Wherein, the second electrode sheet has two corresponding two grooves on two sides, and the other side of the second electrode sheet has a notch.

The back surface of the rubber seat has two through holes, and the two through holes are exposed to the first electrode piece and the second electrode piece.

Wherein, after the bracket structure is stamped or etched, a metal film is plated on the metal bracket of the bracket structure.

Wherein, the yield space is that there is no thermosetting plastic on the connecting portion.

Wherein, the illuminating wafer is a monochromatic or multi-colored wafer.

Wherein, the metal wire is a gold wire.

Wherein, the colloid is tannin.

Among them, the colloid is added with a phosphor powder.

In order to achieve the above object, the present invention provides a method (3) for fabricating a support structure for a light-emitting diode, comprising: preparing a metal plate; forming a support structure of a metal frame and a plurality of metal supports on the metal plate, the metal support The first electrode sheet and the second electrode sheet have a connecting portion, the connecting portion is connected to the plurality of metal brackets and the metal frame; and the metal bracket is formed on the metal bracket a plastic seat having a hollow functional area for exposing the first electrode piece and the second electrode piece on the front surface; drilling a hole in the adjacent position of the hollow functional area, and drilling the connecting part Breaking; fixing a light-emitting chip on the second electrode sheet in the hollow functional area of the rubber seat; electrically connecting a metal wire to the light-emitting chip and the first electrode sheet; and inserting the colloid into the hollow functional area; A power source is applied to the connection portion of the cut metal holder, and the first electrode sheet and the second electrode sheet are energized to illuminate the light-emitting wafer to perform luminance ratio and chromaticity ratio detection.

Wherein, the metal frame has a plurality of long holes and short holes arranged at intervals, and has a consistent perforation between the two short holes.

The connecting portion is formed on a side of the first electrode sheet that is not adjacent to or corresponding to the second electrode sheet.

Wherein, the connecting portion connects each metal bracket in the longitudinal direction and the lateral direction.

The first electrode sheet has a rectangular shape, and has two corresponding notches on the side adjacent or corresponding to the second electrode sheet.

Wherein, the second electrode sheet has two corresponding two grooves on two sides, and the other side of the second electrode sheet has a notch.

Wherein, after the bracket structure is stamped or etched, a metal film is plated on the metal bracket of the bracket structure.

The back surface of the rubber seat has two through holes, and the two through holes are exposed to the first electrode piece and the second electrode piece.

Wherein, after the drilling tool is drilled into the rubber seat, the connecting portion is drilled, but the connecting portion is not penetrated or drilled to break the connecting portion to form a through hole.

Wherein, the illuminating wafer is a monochromatic or multi-colored wafer.

Wherein, the metal wire is a gold wire.

Wherein, the colloid is tannin.

Among them, the colloid is added with a phosphor powder.

100~116‧‧‧Steps

10‧‧‧Support structure

1‧‧‧Metal border

11‧‧‧ long hole

12‧‧‧ short holes

13‧‧‧through holes

2‧‧‧Metal bracket

21‧‧‧First electrode sheet

211‧‧ ‧ gap

22‧‧‧Second electrode

221‧‧‧ Groove

222‧‧‧ notch

23‧‧‧Connecting Department

3‧‧‧Glass

31‧‧‧Hollow functional area

32, 33‧‧‧through holes

34‧‧‧Intermediate letting space

35‧‧‧through hole

4‧‧‧Lighting chip

5‧‧‧ Gold wire

6‧‧‧colloid

The first figure is a schematic diagram of the production process of the present invention.

The second figure is a schematic view of the structure of the support of the light-emitting diode of the present invention.

The third figure is a partial enlarged view of the second figure.

The fourth figure is a front view showing a rubber seat formed on the support structure of the light-emitting diode of the present invention.

Fig. 5 is a schematic view showing the back surface of the holder structure of the light-emitting diode of the present invention.

Fig. 6 is a schematic view showing the connection portion of the fourth figure cut off.

Fig. 7 is a top plan view showing the structure of the support of the light-emitting diode of the present invention.

Figure 8 is a side elevational view showing the stent structure of the light-emitting diode of the present invention.

The ninth drawing is a schematic diagram of a manufacturing process of another embodiment of the present invention.

The tenth figure is a front view showing the structure of the stent of the present invention.

Figure 11 is a schematic view of the drilling of the intermediate position of the rubber seat of the present invention.

The technical content and detailed description of the present invention are described below with reference to the following drawings: Please refer to the first, second and third figures, which are the manufacturing process of the present invention, the support structure of the light-emitting diode and a partial enlarged view of the second figure. . As shown in the figure: the bracket structure (3) of the light-emitting diode of the present invention, first, as in step 100, a metal plate is provided.

In step 102, the metal plate is stamped or etched into a support structure 10, and the support structure 10 includes a metal frame 1 and a plurality of metal supports 2. The metal frame 1 has a plurality of long holes 11 and short holes 12 arranged at intervals, and has a continuous through hole 13 between the two short holes 12. The metal bracket 2 has a first electrode sheet 21 and a second portion thereon The electrode sheet 22 has a rectangular shape, and has two corresponding notches 211 on the side adjacent or corresponding to the second electrode sheet 22, and the second electrode sheet 22 has two sides on the side The second side of the second electrode sheet 22 has a recess 222, and the second electrode sheet 22 is formed by the two recesses 221 and the recess 222 of the side. The shape of a piece of clothing. In addition, the first electrode sheet 21 and the second electrode sheet 22 are adjacent to or corresponding to the side without a connecting portion 23, and the other three sides have a connecting portion 23, the connecting portion 23 is a metal bracket 2 that connects the plurality of longitudinal and lateral directions and the metal frame 1.

Step 104, after stamping or etching the stent structure 10, the metal stent 2 of the stent structure 10 is electroplated, and a metal film is plated on the metal stent 2.

Step 106, after the plating of the bracket structure 10 is completed, a metal seat 2 is formed on the metal bracket 2 by thermosetting molding technology, and the rubber seat 3 is molded and coated on the first electrode sheet 21, The two electrode sheets 22 and the connecting portion 23 are provided. The front surface of the plastic holder 3 has a hollow functional area 31. The hollow functional area 31 exposes the first electrode sheet 21 and the second electrode sheet 22 (as shown in the fourth figure). Similarly, the back surface of the plastic holder 3 has two through holes 32, 33 for exposing the first electrode sheet 21 and the second electrode sheet 22, and the first electrode sheet 21 and the second electrode are exposed. When the sheet 22 is turned on to illuminate the light-emitting chip (not shown), the two through holes 32 and 33 serve to dissipate heat from the first electrode sheet 21 and the second electrode sheet 22 (as shown in FIG. 5). After the rubber seat 3 is thermoset, a plurality of yielding spaces (without thermosetting plastics) 34 are formed in the longitudinal and lateral positions adjacent to the hollow functional zone 31 of the rubber seat 3, and the connecting space 23 is connected. Exposed state (as shown in the fifth figure).

Step 108, after the rubber seat 3 of the metal bracket 2 is heat-set, the connecting portion 23 (such as the sixth figure) exposed in the lateral space 34 on the lateral sides of the rubber seat 3 is cut, at the connecting portion 23 After being cut, the rubber seat 3 is connected to the other rubber seats 3.

In step 110, after the exposed connecting portion 23 is cut, a light-emitting wafer 4 (such as sixth and seventh) is fixed on the exposed second electrode sheet 22 in the hollow functional region 31 of the rubber seat 3. In the present drawing, the light-emitting wafer 4 is a single-color or multi-color wafer.

In step 112, the illuminating wafer 4 is electrically connected to a metal wire 5 to the exposed first electrode sheet 21 in the hollow functional region 31. In the figure, the metal line 5 is a gold wire (as shown in the sixth and seventh figures).

In step 114, after the solid crystal and the wire bonding are completed, the dispensing is performed in the hollow functional zone 31 of the rubber seat 3, and the colloid 6 is inserted into the hollow functional zone 31 (as shown in the eighth figure). In this figure, the colloid is tannin.

Step 116, after the dispensing is made, the pre-measurement operation can be performed on the light-emitting diode. The so-called pre-test operation is that after the glue is dispensed, the tester can apply a voltage to the connection portion 23 before being cut off. The first electrode sheet 21 and the second electrode sheet 22 of the single metal holder 2 are formed by mixing the light generated by the light-emitting wafer 4 with the phosphor powder mixed with the colloid 6. Whether the chromaticity and brightness meet the requirements of the previously designed chromaticity and brightness ratio.

For example, when a white light emitting diode is to be fabricated, the light emitting chip is blue light, and the colloid 6 which is inserted into the hollow functional area 31 is mixed with yellow fluorescent powder, and the colloid 6 is not dried after the dot is inserted. The first electrode sheet 21 and the second electrode sheet 22 of the metal holder 2 to which the connecting portion 23 is cut may be powered to perform brightness and color of the light-emitting wafer 4 and the colloid 6 mixed with the yellow phosphor powder. Is the ratio correct?

After the metal holder 2 is completed, the connector 23 of the metal holder 2 is cut after the plastic holder 3 is completed, so that the light-emitting diode can be pre-tested after dispensing, so that the production yield of the light-emitting diode can be Increase to over 90% to reduce the rate of non-performing.

Please refer to the ninth, tenth, and eleventh drawings, which are schematic diagrams of the manufacturing process, the bracket structure front view and the middle position of the rubber seat in another embodiment of the present invention. As shown in the figure, in the manufacturing flow of this embodiment, it is the same as the first figure, and the difference is that the method of cutting the connecting portion 23 is different. After the rubber seat 3 is thermoset, no glue space is formed on the rubber seat 3, and the glue is attached to the joint portion 23 at the adjacent position of the hollow functional area 31 by the drilling tool (not shown). After the seat 3 is drilled, the connecting portion 23 is drilled (but not penetrated through the rubber seat 3) or drilled through the rubber seat 3 to break the connecting portion 23 to form a through hole 35. After the connecting portion 23 is drilled, the rubber seat is broken. 3 is still connected with other rubber seats 3.

After the connecting portion 23 is drilled, an illuminating wafer 4 is fixedly attached to the exposed second electrode sheet 22 in the hollow functional region 31 of the plastic holder 3. The illuminating wafer 4 is electrically connected to the metal wire 5 to the hollow. The first electrode sheet 21 is exposed on the functional area 31. After the solid crystal and the wire bonding are completed, the glue is produced in the hollow functional zone 31 of the rubber seat 3, and after the colloid 6 is clicked into the hollow functional zone 31, the pre-measurement operation of the light-emitting diode can be performed. The pre-measurement operation is that after the dispensing, the first electrode sheet 21 and the second electrode sheet 22 of the metal holder 2 of the single one that is cut by the connection portion 23 can be applied before the colloid 6 has not dried up. In the above, after the light generated by the illuminating wafer 4 is mixed with the phosphor powder mixed with the colloid 6, the chromaticity and brightness formed meet the requirements of the previously designed chromaticity and brightness ratio.

The above are only the preferred embodiments of the present invention and are not intended to limit the scope of the present invention. That is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the invention.

100~116‧‧‧Steps

Claims (24)

A method for fabricating a support structure for a light-emitting diode (3), comprising: a) preparing a metal plate; b) forming a support frame having a metal frame and a plurality of metal supports on the metal plate, the metal support having a first An electrode sheet and a second electrode sheet, the first electrode sheet and the second electrode sheet having a connecting portion, the connecting portion connecting the plurality of metal brackets and the metal frame; c) on the metal bracket of the bracket structure Plating a metal film; d) forming a rubber seat on the metal bracket, and forming a hollow functional area on the front surface of the molded seat for exposing the first electrode piece and the second electrode piece, in the plastic seat Forming a plurality of yielding spaces in adjacent lateral and longitudinal positions, the yielding space exposing the connecting portion; e) cutting the exposed connecting portion to make the first electrode sheet and the second electrode sheet Not connected; f) fixing a light-emitting chip on the second electrode sheet in the hollow functional area of the rubber seat; g) electrically connecting a metal wire to the light-emitting chip and the first electrode sheet; h), Pointing the colloid into the hollow functional zone i), when the colloid is not dried, the power supply is applied to the connection portion of the cut metal holder, and the first electrode sheet and the second electrode sheet are energized to illuminate the light-emitting chip for brightness and chromaticity. Proportion detection. For example, the method for fabricating the structure of the bracket of the first application of the patent scope (3), wherein the step b The metal frame has a plurality of long holes and short holes arranged at intervals, and has a consistent perforation between the two short holes. The method for fabricating a stent structure according to claim 2, wherein the first electrode sheet of the step b has a connecting portion on a side adjacent to or corresponding to the second electrode sheet. The method for manufacturing a bracket structure according to claim 3, wherein the connecting portion connects each metal bracket in a longitudinal direction and a lateral direction. The method for fabricating a stent structure according to claim 4, wherein the first electrode sheet is rectangular, and has a corresponding notch on a side adjacent to or corresponding to the second electrode sheet. The method for fabricating a stent structure according to claim 5, wherein the second electrode sheet has two corresponding two grooves on two sides, and the other side of the second electrode sheet has a concave surface. mouth. The manufacturing method (3) of the bracket structure of claim 6, wherein the back side of the rubber seat has two through holes, and the two through holes are exposed to the first electrode piece and the second electrode piece. The manufacturing method (3) of the bracket structure according to the seventh aspect of the patent application, wherein the retreating space of the step d is that the connecting portion has no thermosetting plastic. The method for fabricating a stent structure according to claim 8 is characterized in that the light-emitting wafer of the step f is a single-color or multi-color wafer. The method for manufacturing a bracket structure according to claim 9 (3), wherein the metal wire of the step g is a gold wire. The method for manufacturing a stent structure according to claim 10, wherein the colloid of the step h is tannin. The method for manufacturing a stent structure according to claim 11 (3), wherein the colloid Added with phosphor powder. A method for fabricating a support structure for a light-emitting diode (3), comprising: a) preparing a metal plate; b) forming a support frame having a metal frame and a plurality of metal supports on the metal plate, the metal support having a first An electrode sheet and a second electrode sheet, the first electrode sheet and the second electrode sheet having a connecting portion, the connecting portion connecting the plurality of metal brackets and the metal frame; c) on the metal bracket of the bracket structure Plating a metal film; d) forming a plastic seat on the metal bracket, the front surface of the rubber seat has a hollow functional area for exposing the first electrode piece and the second electrode piece; e), using a drilling tool Drilling into the adjacent position of the hollow functional area to drill the connecting portion, so that the first electrode piece and the second electrode piece are not connected; f) the second electrode in the hollow functional area of the rubber seat Fixing a light-emitting chip on the chip; g) electrically connecting a metal wire to the light-emitting chip and the first electrode sheet; h), inserting the colloid into the hollow functional area; i), after the colloid is clicked The connection of the cut metal bracket when it is not dry Power is applied so that the first electrode sheet and the second sheet electrode power on as the light emitting chip, for detecting the ratio of luminance and chromaticity. The manufacturing method (3) of the bracket structure of claim 13 , wherein the metal frame of step b has a plurality of long holes and short holes arranged at intervals, and has a consistent perforation between the two short holes. The method for fabricating a stent structure according to claim 14, wherein the first electrode sheet of the step b and the second electrode sheet are adjacent to or corresponding to the second electrode sheet. The method of manufacturing a bracket structure according to claim 15 (3), wherein the connecting portion connects each metal bracket in a longitudinal direction or a lateral direction. The method for fabricating a stent structure according to claim 16 , wherein the first electrode sheet has a rectangular shape, and has a corresponding notch on a side adjacent to or corresponding to the second electrode sheet. The method for fabricating a stent structure according to claim 17, wherein the second electrode sheet has two corresponding two grooves on two sides, and the other side of the second electrode sheet has a concave surface. mouth. The method for manufacturing a stent structure according to claim 18, wherein the back surface of the rubber seat has two through holes, and the two through holes are exposed to the first electrode sheet and the second electrode sheet. For example, in the manufacturing method (3) of the bracket structure of claim 19, after the drilling tool is drilled into the rubber seat in step d, the connecting portion is drilled, but the connecting portion is not penetrated or drilled through the plastic seat. The fracture forms a through hole. The method for fabricating a stent structure according to claim 20, wherein the light-emitting wafer of the step e is a single-color or multi-color wafer. The method for manufacturing a stent structure according to claim 21, wherein the metal wire of the step f is a gold wire. The method for manufacturing a stent structure according to claim 22, wherein the colloid of the step g is silicone. The method for manufacturing a stent structure according to claim 23, wherein the gel is added with a phosphor powder.