TWI644055B - Light emitting device - Google Patents

Abstract

The present invention provides a carrier bracket comprising a frame, the frame comprising at least one support portion, and a carrier comprising a housing and at least one electrode portion; wherein the carrier system is mechanically coupled by the support portion Above the framework. Further, the present invention also provides a method of manufacturing the aforementioned carrier holder; and a light-emitting device and a method of manufacturing the same. In particular, the carrier bracket of the present invention has a carrier body that is separated from each other in advance and is mechanically coupled to the frame, which facilitates rapid material removal after sealing. At the same time, the bearing systems in the bearing bracket of the present invention are electrically separated from each other, and can be electrically measured before cutting. Thereby, the production speed and yield of the light-emitting device produced therefrom can be improved.

Description

Illuminating device

The present invention relates to a carrier support and a light-emitting device made therefrom. In particular, it relates to a holder for accommodating a light-emitting diode wafer and a light-emitting device made therefrom.

The light-emitting diode has advantages such as long life, small volume, high shock resistance, low heat generation, and low power consumption, and thus has been widely used as an indicator or a light source in households and various devices. In recent years, light-emitting diodes have developed toward multiple colors and high brightness, so their application fields have expanded to large outdoor billboards, traffic lights and related fields. In the future, the light-emitting diodes may even become the mainstream of lighting sources that have both power saving and environmental protection functions. In order to make the light-emitting diodes have good reliability, the light-emitting diodes are often subjected to a packaging process to form a durable light-emitting device.

Recently, practitioners in the related art of the present invention have developed a cutting type carrier bracket. A plastic body is molded on a metal material sheet, and then the metal material piece and the plastic material and the plastic body are simultaneously cut by cutting after solidification, wire bonding and sealing, thereby forming a separately separated light-emitting device. However, this cutting is prone to generate a large amount of plastic and metal dust, which seriously contaminates the surface of the final product and thus affects the reliability of the product. In addition, the process cannot perform the pre-lighting test before sealing, and the final product must be singulated before being measured one by one. However, the final product after singulation is scattered and stacked, and it is necessary to adjust the orientation and direction before it can be used for machine measurement. This requires additional equipment and is time consuming.

In view of the above problems, the present invention provides a carrier bracket having a pre-separated carrier mechanically coupled to the frame for facilitating rapid material removal after bonding, wire bonding and sealing. At the same time, the bearing systems in the carrying bracket of the present invention are electrically separated from each other, and the light-emitting diodes can be electrically connected to the carrier and then electrically measured before the blanking. In addition, the present invention also provides a light-emitting device made of the carrier, and the production speed and yield of the light-emitting device can be greatly improved by the advantages of the carrier.

100, 100’, 100” ‧‧‧ carrying bracket

110‧‧‧Carrier

111‧‧‧Shell

111A‧‧‧Shell section

111R‧‧‧ fillet

112‧‧‧Electrode

112A‧‧‧wing

112A1‧‧‧Central Outer Projection Area, Central Area

112A2‧‧‧Outer edge region, edge region, electrode section

112B‧‧‧ inside side

112C‧‧‧ connection surface

1121‧‧‧ recess

120‧‧‧Frame

121‧‧‧Support

122‧‧‧Channel area

123‧‧‧ side

130‧‧ ‧ Vacant Zone

131‧‧‧ gap

132‧‧‧First through slot

133‧‧‧second through slot

140‧‧‧Extension

141‧‧‧Keyhole

142‧‧‧

143‧‧‧ Groove

150‧‧‧ plastic body

151‧‧‧Residual materials

160‧‧‧conductive bracket

1 is a partial schematic view showing an embodiment of a carrier bracket of the present invention.

Figure 2 is a partial schematic view of the conductive support used in the carrier of Figure 1.

Figure 3 is a partial schematic view of the carrier bracket of Figure 1 after forming a plastic body.

Fig. 4 and Fig. 4A are partial schematic views of the carrier bracket of Fig. 1 after removal of residual material.

Fig. 5 is a partial schematic view showing another embodiment of the carrier bracket of the present invention.

Figure 6 is a plan view of a light-emitting device according to an embodiment of the present invention.

Figure 7 is a plan view of a light-emitting device according to another embodiment of the present invention.

Figure 8 is a plan view of a light-emitting device according to still another embodiment of the present invention.

Fig. 9 is a plan view showing a light-emitting device according to still another embodiment of the present invention.

Figure 10 is a plan view of a light-emitting device according to a further embodiment of the present invention.

Figure 11 is a plan view of a light-emitting device according to an embodiment of the present invention.

12A to 12D are top views of the carrier bracket according to an embodiment of the present invention, a full sectional view in the front-rear direction, a full-sectional view in the left-right direction, and a partially enlarged detailed view.

13A to 16 are schematic views showing steps of a method of manufacturing a carrier according to an embodiment of the present invention.

17A to 17D are plan views of a carrier bracket according to an embodiment of the present invention, a full cross-sectional view in the front-rear direction, a full-sectional view in the left-right direction, and a partially enlarged detailed view.

18A to 22 are schematic views showing steps of a method of manufacturing a carrier bracket according to an embodiment of the present invention.

The carrier bracket of the present invention comprises a frame and a carrier, the carrier system comprising a housing and at least one electrode portion. In the present invention, the frame includes at least one support portion and is mechanically coupled to the carrier to support the carrier over the frame. In an embodiment of the invention, the housing may have a recess corresponding to the shape of the support portion, and the support portion and the recess portion are combined to support the carrier on the frame. In the present invention, the position of the depressed portion is not particularly limited, and may be at the side of the carrier or at the boundary between the bottom surface and the side surface. The corresponding support portion is deepened into the interior of the carrier or is only partially exposed on the bottom surface of the carrier.

A partial schematic view of one embodiment of a carrier bracket of the present invention. As shown in FIG. 1 , the carrier bracket 100 includes a carrier 110 and a frame 120 , wherein the carrier 110 further includes a housing 111 and two electrode portions 112 . The frame 120 then includes a plurality of support portions 121. As shown in FIG. 1 , the lower frame 120 of the carrier bracket 100 includes four supporting portions 121 , and the boundary between the side surface and the bottom surface of the housing 111 includes four recessed portions (corresponding to the position of the supporting portion 121 ), thereby The four support portions 121 are located on the bottom surface of the carrier 110 and are half exposed. In an embodiment, the carrier 110 further includes a reflective concave cup for exposing a portion of the electrode portion 112. Wherein, the electrode portion 112 is reflected by the concave cup via the housing 111 Extend to the outside.

The frame 120 can also have a channel region 122 and a side portion 123, and the channel region 122 is disposed on the side portion 123. The passage area 122 is a through-opening area for allowing a plastic body 150 (shown in FIG. 3) to be described later to flow; the support portion 121 is also disposed on the side portion 123.

Further, in the present invention, a keyhole, a groove (a linear slit on the surface of the electrode portion), and a step design may be added to the electrode portion 112. The mechanical bonding force between the housing and the electrode portion in the carrier can be increased by the keyhole, the groove and the step. As shown in FIG. 1 , the two electrode portions 112 of the carrier 110 each include two locking holes 141 and three grooves 143 , and a step 142 is disposed on the edge of the second electrode portion 112 surrounded by the housing 111 . This increases the bonding strength of the housing 111 and the electrode portion 112.

In the carrier bracket of the present invention, each of the carrier systems is supported on the frame by mechanical coupling between the recess and the support, and the electrode portions between the carriers are electrically independent of each other. Therefore, the illuminating device that is not singulated (that is, each illuminating device is still supported on the frame sequentially) can be electrically measured after the subsequent illuminating device is fixed, soldered, and packaged. Among them, because the illuminating devices are arranged neatly, the equipment and working hours for the direction and direction adjustment can be eliminated, and the production speed of the illuminating device can be greatly improved.

The carrier holder of the present invention can be produced by the following method. First, a conductive support is provided. The conductive support comprises a frame, at least one depletion zone and at least one extension, wherein the frame further comprises at least one support. A plastic body is then formed on the electrically conductive support, the plastic system covering at least a portion of the extension and at least a portion of the support and filling at least a portion of the depletion zone. Thereafter, a portion of the exposed portion of the housing and a portion of the plastic body partially filled in the depletion region are removed, thereby forming a carrier. Specifically, after the second removal step, the remaining plastic body forms the housing in the carrier, and the extension remaining on the plastic body forms the electrode portion in the carrier.

The manufacturing process of the carrier bracket 100 in Fig. 1 will be described in detail below with reference to Figs. 2 to 4 . First, as shown in FIG. 2, a conductive support 160 is provided, which includes a frame 120, a plurality of depletion zones 130, and a plurality of extensions 140. The frame 120 also includes a plurality of supporting portions 121, and the extending portion 140 includes a plurality of locking holes 141, a groove 143 and a step portion 142. Finally, the removal portion 140 is partially exposed to expose the housing, i.e., the carrier bracket 100 as shown in Fig. 1 is formed.

In the present invention, the conductive support may be formed of a metal sheet comprising a sheet of a pure metal, an alloy and a metal composite layer, wherein the composite sheet is preferably a metal coated with a conductive layer having a higher oxidation resistance or a higher solder bonding force. Sheets, such as silver-plated copper sheets. And through the appropriate way to form the frame, extension and depletion zone. In the case of a metal sheet, it is preferably formed by stamping; however, it can also be formed by cutting or molding. In addition, if the conductivity of the conductive support is insufficient, a conductive layer (not shown) may be formed on the conductive support after the conductive support is provided (the conductivity of the conductive layer is higher than the conductivity of the conductive support). To increase the reliability of subsequent test results; the material of the conductive layer may comprise a highly conductive material such as silver.

After the conductive support is provided, a plastic body is subsequently formed on the conductive support. The manner of forming the plastic body is not limited, and it can be formed by transfer molding, injection molding, or the like. The raw material of the plastic body is also not limited, and a plastic composite commonly used in the industry, such as an epoxy resin (Epoxy) composition, a silicone composition, a polyphthalamide composition or a poly. Polyethylene terephthalate composition. In one embodiment of the invention, an epoxy resin composition is used and the plastic body is formed by transfer molding. In an embodiment, the plastic body may be a thermosetting material, and may further comprise a reflective material such as titanium dioxide (TiO ₂ ), zirconia (ZnO) or boron nitride (BN).

Subsequently, as shown in FIG. 3, a plastic body 150 is formed on the conductive holder 160. Plastic The body 150 covers a portion of the extension 140 and completely covers all of the keyhole 141 and the recess 143. The plastic body 150 is also filled with a portion of the depletion region 130 (the depletion region 130 above and below the extension portion 140 is not filled) and completely covers all of the support portions 121; the plastic body 150 is also filled in the passage region 122 and adjacent thereto. The other plastic body 150 is integrated.

In other words, in the present invention, the raw material of the plastic body 150 will be filled in the cavity and the depletion section of the mold during the formation process. In this step, the housing 111 and the residual material 151 are still integrated. The defined range of residual material 151 depends on the scope of application of the subsequent product. As shown in Fig. 3, the portion indicated by the broken line is the residual material 151 defined in the present embodiment. Subsequently, as shown in Fig. 4, the defined residual material 151 is removed, thereby forming the casing 111 in the carrier 110.

If the channel region 122 has a filled plastic body 150, it can be divided into at least two steps to remove the residual material 151, for example, after removing the residual material 151 filled in the channel region 122, and then removing the residual material filled in the depletion region 130. 151, vice versa. This simplifies the configuration of the tool for removing the residual material 151 in each step so that the distance between the tools is sufficient and the blade has better strength.

Finally, the extension portion 140 partially exposed outside the casing 111 is removed to form the carrier bracket 100 as shown in FIG. Optionally removing a portion of the frame 120 on both sides of the channel region 122 with a tool having a length greater than the channel region 122 prior to removing the extension 140 to remove any remaining material 151 remaining in the channel region 122, thereby The damage of the residual material 151 to the electrode portion 112 or the light-emitting diode wafer is prevented from occurring. After the partial frame 120 on both sides of the passage area 122 is removed, the length of the passage area 122 is increased as shown in Fig. 4A.

Therefore, the manufacturing method of the present embodiment can selectively perform two or more removal steps on the conductive support 160, or two or more removal steps on the plastic body 150 (residue 151).

In the present invention, the residual material 151 and the extension portion 140 are removed, respectively. Specifically, the order in which the residual material 151 and the extension portion 140 are removed is not particularly limited, but it may be removed separately. For example, all the residual materials 151 can be removed at the same time, and then all the extensions 140 can be removed at the same time. All the extensions 140 can be removed at the same time, and then all the residual materials 151 can be removed, or can be phased. Except for a portion of the residual material 151 and the extension 140, the two can interact. The removal method is not limited. For example, it can be cut, stamped, etc., preferably by stamping. In the embodiment of the invention, stamping is taken as an example.

The present invention can adjust the instrument and work intensity for the mechanical properties of the removed portion. In particular, the separate removal steps can avoid the disadvantages caused by the simultaneous removal of different materials, such as missing surface defects caused by uneven stress, damage to the removal tool (tool), and the like. In addition, dust from the plastic body is usually generated when the plastic body is removed than when the extension is removed. These dusts need to be removed with a strong external force, such as strong wind blowing, jitter or ultrasonic. If the residual material and the extension are removed at the same time, the force between the carrier and the frame may be difficult to support and there is a defect. Accordingly, the present invention preferably performs a cleaning operation (i.e., cleaning the plastic body) after removing the residual material, and then removing the extension. Thereby, the extension portion can be used to strengthen the joint strength between the carrier and the frame, to avoid the occurrence of blanking during cleaning, and finally to remove the extension.

After the removal, the extension portion generates at least one electrode portion cross section on the electrode portion of the carrier, and the residual material after the removal generates a casing cross section on the carrier body. In the present invention, depending on the safety specifications of the final product or the requirements of the customer, the cross section of the electrode portion and the cross section of the casing may be on the same side or different faces of the carrier. Further, in the case where the cross section of the electrode portion and the cross section of the casing are the same surface of the carrier, the cross section of the electrode portion may be flush with the cross section of the casing (constituting a straight surface) or not flush (not forming a flat surface).

As shown in Fig. 1, the electrode portion 112 has a wing portion 112A exposed to the casing, and the wing portion 112A has a central outer protruding portion (or central portion) 112A1 and two outer edge regions (or edge regions) 112A2. . In the embodiment shown in FIG. 1, each edge region 112A2 includes a cross section of the electrode portion which is flush with a partial region of the casing section 111A of the casing 111, and the carrier has A flatter look. However, as shown in FIG. 5, the wing portion 112A of the electrode portion 112 has a central outer protruding portion 112A1 and two outer edge regions 112A2, and the electrode portion cross section of the electrode portion 112 is not flush with the housing portion 111A of the housing 111. In this case, the electrode portion 112 has an additional side area at this time, which can increase the bonding force with the solder, thereby enhancing the strength of the illuminating device after the subsequent hitting.

Further, in the case where the conductive support is a metal composite sheet of an oxidation resistant layer, a cross section which is not covered with the oxidation resistant layer is formed in the cross section of the electrode portion. In the present invention, the cross section not covered with the oxidation resistant layer is preferably integrated with the central portion of the electrode portion. During the subsequent stamping process, the solder can climb along the side of the wing and cover the side surface. At this time, at least part of the section not covered with the anti-oxidation layer can be covered by the solder, which can reduce the probability of oxidation in the cross-section. In addition, the cross section not covered with the anti-oxidation layer is on the same side as the surface of the adjacent central region, and preferably forms a continuous surface to reduce the tip or burr of the electrode portion, thereby causing loss of the subsequent processing machine, and even worse. The effect of charge buildup at the tip or flash edge can affect the reliability of the end product.

The invention also provides a light-emitting device prepared by the carrier of the present invention, the light-emitting device comprising a carrier, a light-emitting diode chip and a package. The LED chip is carried in the carrier and covered by the package. In the present invention, the material of the package may be a composite of a plastic material such as epoxy resin or silicone rubber. In addition, the light-emitting device of the present invention may add a fluorescent material to the package as needed. For example, the fluorescent material is: an aluminate fluorescent substance (such as Doped yttrium aluminum oxide compound, doped yttrium aluminum oxide compound, doped yttrium aluminum oxide compound or a combination thereof, phthalate fluorescent substance, sulfide fluorescent substance, oxynitride A fluorescent substance, a nitride fluorescent substance, a fluoride fluorescent substance, or a combination thereof.

The light-emitting device of the present invention can be produced by the following method. The aforementioned carrier bracket is first provided. A light-emitting diode wafer is then provided and bonded and soldered to the reflective recess of the carrier. The reflective concave cup is then filled with an encapsulant to encapsulate the sealed light-emitting diode wafer, ie, a light-emitting device on the frame is formed. Finally, the illuminating device and the frame are separated (i.e., the separation frame carrier and the frame are separated, for example, by extrusion) to form a separate illuminating device.

In the present invention, a plurality of light emitting diode chips can also be provided in the carrier, and the light emitting diode chips can emit light of the same or different screen spectrum. After the light emitting diode chip is fixed, wire bonding work can be performed to electrically connect the light emitting diode chip to the electrode portion. Other electronic components such as Zener diodes or thermistors can be provided as needed for the final product.

Please refer to FIG. 6, which is a plan view of a light-emitting device according to an embodiment of the present invention. The wing portion 112A of the electrode portion 112 has a central portion 112A1 and two edge regions 112A2, and the central portion 112A1 protrudes from the two edge regions 112A2. The wing portion 112A protrudes beyond the housing section 111A of the housing 111 such that the central portion 1112A1 of the wing portion 112A of the electrode portion 112 and the housing section 111A of the housing 111 are non-coplanar. The interval D1 is the distance between the central portion of the wing portion 112A of the electrode portion 112 and the inner portion of the casing section 111A of the casing 111, which is about 0.1 mm. The interval D2 is the distance between the central region 112A1 of the wing portion 112A of the electrode portion 112 and the outer region of the wing portion 112A of the casing 111, that is, the central portion 112A1 of the wing portion 112A of the electrode portion 112 and the wing portion 112A of the casing 111. , about 0.05mm.

Please refer to FIG. 7 , which is a plan view of a light emitting device according to another embodiment of the present invention. Figure. The wing portion 112A of the electrode portion 112 has a central portion 112A1 and two edge regions 112A2 and protrudes beyond the casing section 111A of the casing 111 such that the wing portion 112A of the electrode portion 112 and the casing section 111A of the casing 111 are Non-coplanar. The interval D1 is the distance between the center of the wing portion 112A of the electrode portion 112 and the inner portion of the casing section 111A of the casing 111, which is about 0.1 mm. The interval D3 is a distance between the central region 112A1 of the wing portion 112A of the electrode portion 112 and the outer region of the section 111A of the casing 111, which is about 0.075 mm.

Please refer to FIG. 8 , which is a plan view of a light emitting device according to still another embodiment of the present invention. The wing portion 112A of the electrode portion 112 has a central portion 112A1 and two edge regions 112A2, and the central portion 112A1 is recessed in the two edge regions 112A2, and the electrode portions of the two edge regions 112A2 are inclined. The wing portion 112A is recessed within the section 111A of the housing 111 such that the wing portion 112A of the electrode portion 112 and the section 111A of the housing 111 are non-coplanar. The interval D4 is the distance between the outer region and the inner region of the section 111A of the casing 111, which is about 0.05 mm. The interval D5 is a distance between the center of the wing portion 112A of the electrode portion 112 and the outer portion of the section 111A of the casing 111, which is about 0.025 mm.

Please refer to FIG. 9, which is a plan view of a light emitting device according to still another embodiment of the present invention. The wing portion 112A of the electrode portion 112 has a central portion 112A1 and two edge regions 112A2, and the central portion 112A1 protrudes from the two edge regions 112A2, and the electrode portions of the two edge regions 112A2 have a sloped portion. The wing portion 112A protrudes beyond the section 111A of the housing 111 such that the wing portion 112A of the electrode portion 112 and the section 111A of the housing 111 are non-coplanar.

Please refer to FIG. 10, which is a plan view of a light emitting device according to a further embodiment of the present invention. The wing portion 112A of the electrode portion 112 is a convex curved surface, that is, the outer surface of the central portion and the outer contour of the edge region (the cross section of the electrode portion) form a continuous convex curved surface. Wing 112A protrudes from the shell The outer portion 111A of the body 111 is such that the wing portion 112A of the electrode portion 112 and the section 111A of the housing 111 are non-coplanar.

Please refer to FIG. 11 , which is a plan view of a light emitting device according to an embodiment of the present invention. The wing portion 112A of the electrode portion 112 is a concave curved surface, that is, the outer surface of the central portion and the outer contour of the edge region (the cross section of the electrode portion) form a continuous concave curved surface. The wing portion 112A is recessed within the section 111A of the housing 111 such that the wing portion 112A of the electrode portion 112 and the section 111A of the housing 111 are non-coplanar.

Please refer to FIG. 12A to FIG. 12D , which are schematic diagrams of the carrier bracket 100 ′ according to an embodiment of the present invention (ie, a top view, a full cross-sectional view in the front-rear direction, a full-section view in the left-right direction, and Partially zoom in detail). The carrier bracket 100' is similar to the foregoing carrier bracket 100. That is, the carrier bracket 100' also includes a frame 120 and a carrier 110. The frame 120 includes at least one supporting portion 121, and the carrier 110 has a shell. The body 111 and the at least one electrode portion 112 are mechanically coupled to the frame 120 by the support portion 121; therefore, the technical content of each of the above components can be referred to the counterpart of the carrier bracket 100.

Preferably, the at least one electrode portion 112 may be a phase-divided two-electrode portion 112 to serve as an anode end and a cathode end of the carrier 110. The two electrode portions 112 are surrounded by the frame 120, that is, the two electrode portions 112 are located in a space surrounded by the frame 120 itself. The two electrode portions 112 and the frame 120 can be separated by at least one depletion region 130 such that the two do not contact each other, thereby electrically isolating the two electrode portions 112 from the frame 120.

The support portion 121 of the frame 120 extends toward one of the two electrode portions 112 but does not contact the electrode portion 112. In this embodiment, the support portions 121 are four and are distributed on both sides of the electrode portion 112. The housing 111 can cover at least the support portion 121 and at least a portion of the two electrode portions 112. And at least partially disposed in the depletion region 130: thereby, the housing 111 is mechanically coupled to the frame 120 by the support portion 121, and the housing 111 and the two electrode portions 112 are also mechanically coupled, so that the housing 111 and The two electrode portions 112 are held in the frame 120 without falling off.

The shape characteristics of the electrode portion 112 will be further described. Referring to FIG. 13A, each of the two electrode portions 112 has a wing portion 112A and an inner side surface 112B which are oppositely disposed (ie, oppositely disposed), and the wing portion 112A can expose the casing section 111A of the casing 111. Referring to the related description of FIGS. 6 to 11 above, and not facing the wing portion 112A of the other electrode portion 112; the inner side surface 112B of the two electrode portion 112 may face each other, and at least part of the The two electrode portions 112 may be covered by the housing 111.

Each of the two electrode portions 112 further has opposite connecting surfaces 112C that connect the wing portion 112A and the inner side surface 112B, that is, an edge (such as the front side) of the connecting surface 112C connects to an edge of the wing portion 112A (such as the left side). And the other edge of the connecting surface 112C (such as the trailing edge) is connected to an edge (such as the left side) of the inner side surface 112B. The wing portion 112A, the inner side surface 112B and the two connecting surfaces 112C may be non-planar, that is, the wing portion 112A, the inner side surface 112B and the two connecting surfaces 112C may be undulating or stepped surfaces.

Each of the two electrode portions 112 may further have at least one concave portion 1121, and the concave portion 1121 may be disposed on the connecting surface 112C such that the connecting surface 112C becomes a undulating surface. The recess 1121 can increase the contact area between the electrode portion 112 and the housing 111 (plastic body 150) and increase the locking effect between the electrode portion 112 and the housing 111 by geometric correspondence, so that the electrode portion 112 and the housing The bonding strength between 111 is strong. If there are a plurality of recesses 1121, the dimensions of the recesses 1121 can be designed to be inconsistent in response to the required bonding force between the electrode portion 112 and the housing 111.

The wing portion 112A of the two electrode portions 112, the inner side surface 112B, and a connecting surface 112C The at least one depletion zone 130 can be divided into a plurality of depletion zones 130, that is, the depletion zones 130 can be a gap 131, two first through slots 132 and two second through slots 133, respectively. The gap 131 is disposed between the inner side surfaces 112B of the two electrode portions 112, and the two first through grooves 132 are disposed along the two connecting surfaces 112C of the two electrode portions 112, that is, one first through slot 132 is An edge of one of the connection faces 112C of one of the electrode portions 112 extends to an edge of the same connection face 112C of the other electrode portion 112; the two first through grooves 132 are spaced apart in position.

The two second through slots 133 are disposed along the wing portion 112A of the two electrode portions 112, that is, one second through slot 133 extends only in the wing portion 112A of one of the electrode portions 112; the second through slots The 133 position is also separated.

The support portion 121 of the frame 120 may extend into one of the two first through grooves 132 of the two electrode portions 112 to extend into one of the two first through grooves 132. The housing 111 is selectively disposed in the two first through slots 132 and/or the gap 131. In addition, the housing section 111A of the housing 111 may include at least one curved surface, for example, may have a rounded corner 111R. As shown in FIG. 12D, the housing has a rounded cross section connected to the electrode portion of the electrode portion 112. Section 112A2. The rounded corner 111R can disperse the impact force, so that the rounded 111R is not easily broken or cracked when the single-grained carrier 110 is subjected to the vibration test. In addition, in the embodiment shown in FIG. 12D, the cross section of the casing and the cross section of the electrode portion do not form a straight surface, that is, the cross section of the casing and the cross section of the electrode portion are not flush.

In summary, the carrying bracket 100 ′ can also make the electrode portions 112 of the respective carrier 110 electrically independent of each other. Therefore, after the subsequent crystallization, wire bonding and packaging of the illuminating device are completed, the illuminating device that is not singulated can be directly performed. Electrical measurement greatly increases the production speed of the illuminating device. It is also noted that the technical content of the carrier bracket 100' can also be referred to by the carrier bracket 100.

One embodiment of the present invention further provides a method of manufacturing a carrier bracket that can at least manufacture the carrier bracket 100'. The manufacturing method of the carrier holder 100' is similar to the method of manufacturing the carrier holder 100 described above, and the method of manufacturing the carrier holder 100' includes the following steps.

Referring to FIGS. 13A-13C, a conductive bracket 160 is first provided. The conductive bracket 160 includes a frame 120, and the frame 120 includes at least one supporting portion 121, at least one depletion region 130, and at least one extending portion 140. The at least one depletion zone 130 can correspond to a gap 131, two first through slots 132, and two second through slots 133 of the carrier 100', but the two first through slots 132 and the second through slots 133 are not yet Connected. The at least one extension portion 140 may correspond to the two electrode portions 112 of the carrier 100', but the second electrode portion 112 is not yet separated from the frame 120.

Referring to Figure 14, then in a second step, a plastic body 150 is formed. The plastic body 150 covers at least a portion of the extension portion 140 and at least a portion of the support portion 121, and the plastic body 150 fills at least a portion of the depletion region 130. For example, the plastic body 150 partially covers the two electrode portions 112 of the extending portion 140, completely covering the generation supporting portion 121, and the plastic body 150 is filled in the gap 131 of the depletion region 130 and the two first through grooves 132, but there is no Filled in the second through groove 133. Additionally, the plastic body 150 can be in contact with the recess 1121 of the extension 140 (as shown in FIG. 13A) to increase the contact area between the plastic body 150 and the extension 140.

Referring to FIG. 15, in the third step, the plastic body 150 partially filled in the depletion region 130 is removed, that is, the portion of the plastic body 150 filled in the two first through grooves 132 is removed. The plastic body 150 to be removed is referred to as a residue 151 (as shown in Fig. 14), and the range of the residue 151 will depend on the specific shape of the product. In the present embodiment, the plastic bodies 150 filled in the both end regions of the two first through grooves 132 are removed, so that the corners of the four corners of the plastic body 150 are removed. The remaining plastic body 150 forms the housing 111 carrying the carrier 100'.

Referring to FIG. 16, in a fourth step, the portion 140 of the exposed plastic body 150 is removed to remove the remaining portion of the extension 140 from the frame 120. In other words, in this step, the extending portion 140 (shown in FIG. 15 ) on both sides of the second through groove 133 is removed, so that the second through groove 133 is connected to the first through groove 132 . The remaining extensions 140 form the electrode portion 112 of the carrier holder 100'.

When the above steps are completed, the carrier holder 100' can be manufactured. For some details of the above steps, reference may be made to the manufacturing method of the carrier 100. For example, a conductive layer may be formed on the conductive bracket 160, and the implementation steps of the third step and the fourth step may be interchanged, and the plastic may be cleaned before the fourth step is implemented. Body 150 and so on.

Please refer to FIGS. 17A to 17D , which are schematic diagrams of the carrier bracket 100 ′′ according to an embodiment of the present invention (ie, a top view, a full cross-sectional view in the front-rear direction, a full-section view in the left-right direction, And partially enlarged detail), which shows more than one carrier bracket 100".

The carrier bracket 100" is similar to the foregoing carrier brackets 100 and 100', so the technical content of each other should be cross-referenced. It is to be noted that the frame 120 of the carrier bracket 100" has a side portion 123 and a channel region 122. The side portion 123 can be shared by the frame 120 of the two carrying brackets 100". In other words, the frames 120 of the two carrying brackets 100" can be integrated by the shared side portions 123; in addition, the carrying of the two carrying brackets 100" The body 110 is separated by the side portion 123. The channel region 122 is disposed in the side portion 123 and communicates with one of the two first through grooves 132 of each of the carrier brackets 100". In addition, the housing section 111A of the housing 111 may include at least one curved surface, for example, may have a rounded corner 111R, and the rounded corner 111R is coupled to the side portion 123 of the frame 120. In addition, the electrode portion of the electrode portion 112 may also include at least one curved surface, and the curved surface described above Not limited to a single curvature. That is, the outline outside its edge area presents a curved line. The cross section of the electrode portion is not adjacent to the rounded corner 111R. The impact force can be dispersed by bending the cross section of the striking portion. Meanwhile, in the embodiment as shown in FIG. 17D, the cross section of the casing and the cross section of the electrode portion do not form a straight surface, that is, the cross section of the casing and the cross section of the electrode portion are not flush.

In terms of efficacy, the carrier brackets 100 ′′ can also make the electrode portions 112 of the respective carrier bodies 110 electrically independent of each other. Therefore, after the subsequent crystallization of the illuminating device, the bonding wires and the packaging are completed, the illuminating device that is not singulated can be directly used. Electrical measurement is carried out to greatly increase the production speed of the illuminating device.

One embodiment of the present invention further provides a manufacturing method of a carrier bracket, which can at least manufacture the above-mentioned carrier bracket 100". The manufacturing method of the carrier bracket 100" is similar to the manufacturing method of the carrier bracket 100', so the two manufacturing methods are The description of the same technical content will be omitted or simplified. The carrier bracket 100" can include the following steps.

Referring to FIGS. 18A to 18C, a conductive bracket 160 is first provided. In this embodiment, the two conductive brackets 160 are taken as an example. Each of the conductive supports 160 includes at least one frame 120, and the frame 120 includes at least one support portion 121, at least one side portion 123, at least one channel region 122, at least one depletion region 130, and at least one extension portion 140. The channel region 122 is disposed on the side portion 123 and is in communication with the depletion region 130.

Referring to Figure 19, in a second step, a plastic body 150 is formed. The plastic body 150 covers at least a portion of the extension portion 140 of each of the conductive brackets 160 and at least a portion of the support portion 121, and the plastic body 150 fills at least a portion of the depletion region 130. The plastic body 150 is also filled in the passage region 122, that is, the plastic body 150 passes through the passage region 122 to cover the other conductive bracket 160. In addition, the plastic body 150 is also in contact with the recess 1121 of the extension 140 (as shown in FIG. 18A) to increase the contact area between the plastic body 150 and the extension 140.

Referring to FIG. 20, in the third step, the plastic body 150 filled in the channel region 122 is removed. Removal of the plastic body 150 can be accomplished in one step or in multiple steps. Specifically, when a step is taken, a tool having a length greater than the channel region 122 is used to remove the portion of the frame 120 on both sides of the channel region 122, along with the plastic body 150 in the channel region 122. Thus, after the plastic body 150 within the channel region 122 is removed, the channel region 122 will be slightly longer.

When multiple steps are taken, a portion of the plastic body 150 in the channel region 122 is first removed using a tool having a length slightly smaller than the channel region 122, and then the remaining plastic body 150 in the channel region 122 is then scraped off using another tool. Wait for the action to remove.

Referring to FIG. 21, in the fourth step, the plastic body 150 partially filled in the depletion region 130 is removed, that is, a portion of the plastic body 150 to be filled in the two first through grooves 132 (for example, four corners) Residual material 151, as shown in Figure 20, is removed. When the third and fourth steps are completed, the remaining plastic body 150 that has not been removed forms the housing 111 carrying the carrier 100".

Referring to FIG. 22, in a fifth step, the portion 140 of the exposed plastic body 150 is removed (as shown in FIG. 21) so that the remaining portion of the extension 140 is separated from the frame 120. In other words, in this step, the extensions 140 on both sides of the second through slot 133 are removed, so that the second through slot 133 is connected to the first through slot 132. The remaining extensions 140 form the electrode portion 112 of the carrier holder 100".

When the above steps are completed, the carrier holder 100" can be manufactured. It is worth mentioning that the order of implementation of the above third to fifth steps is interchangeable and not limited.

While the several embodiments of the disclosure are described above, the scope of the disclosure is not limited to the disclosed embodiments, and is not limited to the disclosed embodiments. More specifically, various deviations and modifications can be made by those skilled in the art based on the disclosed embodiments, and such deviations And improvements are still within the scope of this disclosure. Accordingly, the scope of protection of the patents issued in accordance with the present disclosure is determined by the scope of the patent application provided below.

Claims (10)

A light-emitting device comprising: a carrier; and a light-emitting diode wafer fixed in the carrier; wherein the carrier comprises: at least one electrode portion having an electrode portion cross section; and a housing having a a cross-section of the housing, the housing being at least a portion of the electrode portion; wherein the cross-section of the housing is not flush with the cross-section of the electrode portion. The illuminating device of claim 1, wherein the electrode portion has a central region and a two-edge region, and the electrode portion is located at the edge region. The illuminating device of claim 2, wherein the central region and the edge region both protrude from the housing cross section. The illuminating device of claim 2, wherein the central region protrudes from the edge regions. The illuminating device of claim 1, wherein the electrode portion cross section comprises a slope. The illuminating device of claim 2, wherein the electrode portion cross section is non-coplanar with the central region. The illuminating device of claim 1, wherein the cross section of the housing or the cross section of the electrode portion comprises a curved surface. The illuminating device of claim 1, wherein the housing has a rounded cross section. The illuminating device of claim 1, wherein the cross section of the casing and the cross section of the electrode portion form a continuous convex curved surface. The illuminating device of claim 1, wherein the electrode portion has an oxidation resistant layer having a cross section having a portion not covered with the oxidation resistant layer.