JP2017037917A - Lead frame, package and light-emitting device, and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead frame which allows for manufacturing an unbreakable package or light-emitting device when being separated from the lead frame.SOLUTION: A lead frame 3 includes a pair of electrodes 31, 32, two hanger leads 35, and an outer frame 30, and when it is combined with a support member for supporting the pair of electrodes 31, 32, a box type package having a recess for mounting a light-emitting element is formed. In the central part of a scheduled formation area 20 of the support member, the tips 311a, 321a of the pair of electrodes 31, 32 face a first direction (X axis direction), and the tips 351 of the two hanger leads 35 face a second direction (Y axis direction). The tip 351 of the hanger lead 35 has at least an upper surface, a lower surface, a first intermediate surface, and an inclining first lower side surface, and the upper end of the first lower side surface is located on the outside of the lower end.SELECTED DRAWING: Figure 6A

Description

  The present invention relates to a lead frame, a package, a light emitting device, and a manufacturing method thereof.

Conventionally, a lead frame having a hanger lead, a package using the lead frame, and a light emitting device in which a semiconductor light emitting element is mounted on the package are known (see, for example, Patent Document 1 and Patent Document 2).
The package is formed by performing resin molding or the like on a lead frame in which a plurality of sets of electrodes and hanger leads are connected to an outer frame. The electrode is supported by a support member made of resin, and the support member is supported by a plurality of hanger leads connected to the outer frame of the lead frame on the side surface, and the package is not dispersed when the electrode is separated from the outer frame. It is configured as follows. Thereby, a package assembly in which a plurality of packages are connected to the outer frame by the hanger leads is formed.
Further, the individual packages can be removed from the assembly by extruding the package in a direction perpendicular to the outer frame surface of the lead frame to separate the support member and the hanger lead.

JP 2012-28699 A Utility Model Registration No. 3168024

In the packages described in Patent Document 1 and Patent Document 2, the upper surface of the electrode forms the bottom surface of a recess (cavity) of the package for mounting the semiconductor light emitting element, and the lower surface of the electrode serves as a circuit for the package. This is the mounting surface for secondary mounting on a substrate. In the light emitting device having such a configuration, the bonding strength between the electrode and the support member that supports the electrode is relatively low. Therefore, when the package is separated from the hanger lead, the electrode of the package may be deformed by stress or from the package. There is a risk of coming off.
Moreover, like the package of patent document 1 and patent document 2, when it supports with a hanger lead in the part near four corners, when separating from a hanger lead or after separating, the support member with which the hanger lead was fitted The side walls of the recesses formed at the four corners are easily broken or chipped.

  It is an object of an embodiment of the present disclosure to provide a lead frame, a package and a light emitting device, and a manufacturing method thereof that can manufacture a package and a light emitting device that are not easily broken when separated from the lead frame.

  A lead frame according to an embodiment of the present disclosure includes a pair of electrodes, two hanger leads provided apart from the pair of electrodes, and an outer frame connected to the pair of electrodes and the two hanger leads. And a lead frame for forming a box-shaped package having a first recess for mounting a light emitting element by being combined with a support member that supports the pair of electrodes, the first recess being on the upper surface side And the side surface is formed by the support member, at least a part of the bottom surface is formed by the pair of electrodes, and the pair of electrodes are disposed in a region where the support member is to be formed, and the pair of electrodes The front ends of the support members face each other in the first direction with a space in the center of the region where the support member is to be formed in plan view, and the two hanger leads form the support member from the outer frame. Extending to a fixed region, the tip portion is disposed within the region where the support member is to be formed, and the two hanger leads are second in a center view of the support member perpendicular to the first direction in plan view. The front ends of the hanger leads are opposite to each other in a direction, and a top surface, a bottom surface substantially parallel to the top surface, a first surface substantially parallel to the top surface and the bottom surface and at a height between the top surface and the bottom surface. An intermediate surface, and a first lower side surface provided in a concavely curved or linearly inclined manner from the front end portion of the first intermediate surface to the lower surface, wherein the first lower side surface is a plan view The upper end is configured to be outside the lower end.

  A lead frame according to an embodiment of the present disclosure includes a pair of electrodes, two hanger leads provided apart from the pair of electrodes, an outer frame connected to the two hanger leads, and the pair of electrodes. A lead frame for forming a box-shaped package having a first recess for mounting the light emitting element, the first recess having an opening on the upper surface side, A side surface is formed by the support member, and at least a part of the bottom surface is formed by the pair of electrodes, and the pair of electrodes have a distal end portion spaced apart from each other at a central portion of the support member in a plan view. The two hanger leads are opposed to each other in a second direction perpendicular to the first direction at a central portion of the support member in a plan view. The two hanger leads are opposed to each other in a second direction orthogonal to the first direction at a central portion of the support member in a plan view, and a tip portion of the hanger lead has an upper surface and the upper surface. A substantially parallel lower surface, a first intermediate surface substantially parallel to the upper surface and the lower surface and at a height between the upper surface and the lower surface, and a concave curve from a tip portion of the first intermediate surface to the lower surface. Or at least a first lower side surface provided so as to be linearly inclined, and the first lower side surface is configured such that the upper end is outside the lower end in plan view.

  A package according to an embodiment of the present disclosure includes a pair of electrodes and a support member that supports the pair of electrodes and has a substantially rectangular parallelepiped shape, and has a first recess for mounting a light emitting element. The first recess has an opening on an upper surface side, a side wall is formed by the support member, at least a part of a bottom surface is formed by the pair of electrodes, and the pair of electrodes are planar As viewed, at the central portion of the support member, one end of each of the support members extends in the first direction so as to face each other in the first direction with a space therebetween and the other end is exposed from the side surface of the support member. And a part of the side surface of the support member and a part of the lower surface of each of the pair of side surfaces of the support member facing each other in a second direction orthogonal to the first direction in plan view. A second recess provided in the The second recess includes an upper surface substantially parallel to the lower surface of the support member, a first intermediate surface substantially parallel to the upper surface and at a height between the upper surface and the lower surface of the support member, and the first intermediate At least a first lower side surface provided in a concavely curved or linearly inclined manner from the inner end of the surface to the lower surface of the support member, the upper end of the first lower side surface having a lower end in plan view Rather than inside the support member.

  A light emitting device according to an embodiment of the present disclosure is a light emitting device including a box-shaped package having a first recess and a light emitting element mounted in the first recess, and the package includes a pair of electrodes. And a support member that supports the pair of electrodes and has a substantially rectangular parallelepiped shape. The first recess has an opening on an upper surface side, a side wall is formed of the support member, and at least a bottom surface of the first recess. A part of the electrodes is formed of the pair of electrodes, and each of the pair of electrodes is opposed to each other in the first direction with a gap in the center portion of the support member in plan view, and the other ends of the pair of electrodes. The support member extends along the first direction so as to be exposed from the side surface of the support member, and is disposed on each of the pair of side surfaces of the support member facing the second direction orthogonal to the first direction in plan view. In the middle of the support member side And a second recess provided in a part of the lower surface, the second recess being an upper surface substantially parallel to the lower surface of the support member, and an upper surface substantially parallel to the upper surface and the lower surface of the support member. A first intermediate surface at a height between the first intermediate surface, a first lower side surface provided in a concavely curved or linearly inclined manner from the inner end of the first intermediate surface to the lower surface of the support member, The first lower side surface is configured such that the upper end is inside the support member from the lower end in plan view.

  A method of manufacturing a lead frame according to an embodiment of the present disclosure includes a pair of electrodes, two hanger leads provided apart from the pair of electrodes, and an outer frame connected to the pair of electrodes and the two hanger leads. And a lead frame for forming a box-shaped package having a first recess for mounting the light emitting element by combining with a support member that supports the pair of electrodes, wherein the first recess is The upper surface has an opening, the side surface is formed by the support member, and at least a part of the bottom surface is formed by the pair of electrodes, and the pair of electrodes are within a region where the support member is to be formed. In the plan view, in the central portion of the region where the support member is to be formed, the tips are arranged so as to face each other in the first direction with a space therebetween, and the two hanger leads are seen in a plan view, The lead frame is arranged at the center portion of the support member so that the front ends thereof are opposed to each other in a second direction orthogonal to the first direction, and the lead frame is arranged in a region where the support member is to be formed. By applying pressure on the upper surface side of the tip portions of the two hanger leads at the tip portions of the two hanger leads, the tip portions of the two hanger leads have an upper surface and a lower surface substantially parallel to the upper surface, A first intermediate surface that is substantially parallel to the upper surface and the lower surface and at a height between the upper surface and the lower surface, and is curved in a concave shape or inclined linearly from a tip portion of the first intermediate surface to the lower surface At least a first lower side surface provided, and the first lower side surface is configured to be processed so that the upper end is outside the lower end in plan view.

  A manufacturing method of a package according to an embodiment of the present disclosure includes a pair of electrodes, two hanger leads provided apart from the pair of electrodes, an outer frame connected to the pair of electrodes and the two hanger leads, A lead frame for forming a box-shaped package having a first recess for mounting a light emitting element by combining with a support member supporting the pair of electrodes, wherein the first recess is An opening is formed on the upper surface side, a side surface is formed by the support member, and at least a part of the bottom surface is formed by the pair of electrodes, and the pair of electrodes are within a region where the support member is to be formed. In the center of the region where the support member is to be formed in plan view, the tips are arranged so as to face each other in the first direction with a space therebetween, and the two hanger leads are In the central portion of the holding member, the tips are arranged so as to face each other in a second direction orthogonal to the first direction, and the tip portions of the two hanger leads are arranged in a region where the support member is to be formed. And an upper surface, a lower surface substantially parallel to the upper surface, a first intermediate surface substantially parallel to the upper surface and the lower surface and at a height between the upper surface and the lower surface, and a tip portion of the first intermediate surface At least a first lower side surface provided in a concavely curved or linearly inclined manner from the lower surface to the lower surface, and the first lower side surface has an upper end outside the lower end in plan view. Preparing a frame, sandwiching the pair of electrodes between an upper mold and a lower mold of a mold mold divided into upper and lower parts, injecting a first resin into the mold mold with the pair of electrodes sandwiched; The injected first resin is solidified. Or configured so as to form said supporting member by curing.

  A manufacturing method of a light emitting device according to an embodiment of the present disclosure includes a pair of electrodes, two hanger leads provided apart from the pair of electrodes, and an outer frame connected to the pair of electrodes and the two hanger leads. And a lead frame for forming a box-shaped package having a first recess for mounting the light emitting element by combining with a support member that supports the pair of electrodes, wherein the first recess is The upper surface has an opening, the side surface is formed by the support member, and at least a part of the bottom surface is formed by the pair of electrodes, and the pair of electrodes are within a region where the support member is to be formed. In the plan view, in the central portion of the region where the support member is to be formed, the tips are arranged so as to face each other in the first direction with a space therebetween, and the two hanger leads are arranged in the plan view in the plan view. In the central part of the member, the tips are arranged so as to face each other in a second direction orthogonal to the first direction, and the tip portions of the two hanger leads are arranged in a region where the support member is to be formed. An upper surface, a lower surface substantially parallel to the upper surface, a first intermediate surface substantially parallel to the upper surface and the lower surface and at a height between the upper surface and the lower surface, and a tip portion of the first intermediate surface The lead frame having at least a first lower side surface provided in a concavely curved shape or linearly inclined toward the lower surface, wherein the first lower side surface has an upper end outside the lower end in plan view. The pair of electrodes is sandwiched between an upper mold and a lower mold of a mold mold divided into upper and lower parts, and a first resin is injected into the mold mold in which the pair of electrodes are sandwiched, Solidify the injected first resin Configured to form the support member by curing, mounting the light emitting element within the first recess.

  According to the lead frame, the package, and the light emitting device according to the embodiments of the present disclosure, and the manufacturing method thereof, it is possible to manufacture a package and a light emitting device that are not easily broken when separated from the lead frame.

It is a perspective view which shows the structure of the package which concerns on 1st Embodiment. It is a top view which shows the structure of the package which concerns on 1st Embodiment. It is a bottom view which shows the structure of the package which concerns on 1st Embodiment. It is sectional drawing which shows the structure of the package which concerns on 1st Embodiment, and shows the cross section in the IIC-IIC line | wire of FIG. 2A. It is sectional drawing which shows the structure of the package which concerns on 1st Embodiment, and shows the cross section in the IID-IID line | wire of FIG. 2A. It is a flowchart which shows the procedure of the manufacturing method of the package which concerns on 1st Embodiment. It is a top view which shows the structure of the lead frame formed at the external shape formation process of the manufacturing method of the package which concerns on 1st Embodiment. It is sectional drawing which shows the structure of the lead frame formed at the external shape formation process of the manufacturing method of the package which concerns on 1st Embodiment, and shows the cross section in the IVB-IVB line | wire of FIG. 4A. It is sectional drawing which shows the structure of the lead frame formed at the external shape formation process of the manufacturing method of the package which concerns on 1st Embodiment, and shows the cross section in the IVC-IVC line | wire of FIG. 4A. It is sectional drawing which shows the 1st process in the 1st level | step difference formation process of the manufacturing method of the package which concerns on 1st Embodiment. It is sectional drawing which shows the 2nd process in the 1st level | step difference formation process of the manufacturing method of the package which concerns on 1st Embodiment. It is sectional drawing which shows the 3rd process in the 1st level | step difference formation process of the manufacturing method of the package which concerns on 1st Embodiment. It is sectional drawing which shows the 4th process in the 1st level | step difference formation process of the manufacturing method of the package which concerns on 1st Embodiment. It is a top view which shows the lead frame formed at the 1st level | step difference formation process and 2nd level | step difference formation process of the manufacturing method of the package which concerns on 1st Embodiment. It is sectional drawing which shows the lead frame formed at the 1st level | step difference formation process and 2nd level | step difference formation process of the manufacturing method of the package which concerns on 1st Embodiment, and shows the cross section in the VIB-VIB line | wire of FIG. 6A. It is sectional drawing which shows the lead frame formed at the 1st level | step difference formation process and 2nd level | step difference formation process of the manufacturing method of the package which concerns on 1st Embodiment, and shows the cross section in the VIC-VIC line | wire of FIG. 6A. It is sectional drawing which shows the lead frame formed at the 1st level | step difference formation process and 2nd level | step difference formation process of the manufacturing method of the package which concerns on 1st Embodiment, and shows the cross section in the VID-VID line | wire of FIG. 6A. It is a top view which shows the front-end | tip part of the hanger lead of the lead frame used for the package which concerns on 1st Embodiment. It is a top view which shows the front-end | tip part of the hanger lead of the lead frame used for the package which concerns on the modification of 1st Embodiment. It is a top view which shows the front-end | tip part of the hanger lead of the lead frame used for the package which concerns on the other modification of 1st Embodiment. It is sectional drawing which shows the lead frame installation process in the supporting member formation process of the manufacturing method of the package which concerns on 1st Embodiment. It is a top view which shows the lead frame installation process in the supporting member formation process of the manufacturing method of the package which concerns on 1st Embodiment. It is sectional drawing which shows the 1st resin injection | pouring process in the supporting member formation process of the manufacturing method of the package which concerns on 1st Embodiment, and shows the cross section in the position corresponded to the IXA-IXA line | wire of FIG. 8B. It is sectional drawing which shows the 1st resin injection | pouring process in the supporting member formation process of the manufacturing method of the package which concerns on 1st Embodiment, and shows the cross section in the position corresponded to the IXB-IXB line | wire of FIG. 8B. It is a top view which shows the electrode separation process of the manufacturing method of the package which concerns on 1st Embodiment. It is a perspective view which shows the structure of the light-emitting device which concerns on 1st Embodiment. It is a flowchart which shows the procedure of the manufacturing method of the light-emitting device which concerns on 1st Embodiment.

Hereinafter, a lead frame, a package, a light emitting device, and a manufacturing method thereof according to the embodiment will be described. The drawings referred to in the following description schematically show the present embodiment, and the scale, spacing, positional relationship, etc. of each member are exaggerated, or some of the members are not shown. There may be. Moreover, in the following description, the same name and code | symbol indicate the same or the same member in principle, and detailed description is abbreviate | omitted suitably. The “outer surface” is referred to as “gaisokumen”, and the “inner surface” is referred to as “not sokumen”.
For convenience of explanation, the XYZ coordinate axes are used in each drawing to indicate the observation direction.

<First Embodiment>
Package structure
The configuration of the package according to the first embodiment will be described with reference to FIGS. 1 to 2D.
FIG. 1 is a perspective view showing a configuration of a package according to the first embodiment. FIG. 2A is a plan view showing the configuration of the package according to the first embodiment. FIG. 2B is a bottom view showing the configuration of the package according to the first embodiment. 2C is a cross-sectional view showing the configuration of the package according to the first embodiment, and shows a cross section taken along the line IIC-IIC in FIG. 2A. 2D is a cross-sectional view showing the configuration of the package according to the first embodiment, and shows a cross section taken along the line IID-IID in FIG. 2A.

  The package 1 according to the first embodiment has a substantially rectangular parallelepiped shape as a whole, and is formed in a box shape having a first recess 11 opened on the upper surface. Here, the box shape refers to a hollow shape, and in the present embodiment, the package 1 has a cup shape with an upper surface opened. In a plan view, the cup-like shape having an open upper surface is a substantially quadrangular shape with rounded corners, but may be a circular shape, an elliptical shape, a polygonal shape, or the like. The package 1 also includes a first electrode 31, a second electrode 32 having a polarity different from that of the first electrode 31, and a support member 2 that is a resin molded body that supports the first electrode 31 and the second electrode 32. ing.

  The first recess 11 is a cavity for mounting the light emitting element 4. The side surface of the first recess 11 is surrounded by the wall portion 22 of the support member 2, and the bottom surface 11 a includes the first electrode 31 and the second electrode 32, and the support member 2. In other words, at least a part of the bottom surface 11 a of the first recess 11 is configured by the inner lead portion 311 of the first electrode 31 and the inner lead portion 321 of the second electrode 32. Moreover, the 1st recessed part 11 becomes a shape which expands toward an opening direction (+ direction of a Z-axis). The lower surface 12 of the package 1 is a mounting surface when the lower surfaces of the first electrode 31 and the second electrode 32 are exposed, and the package 1 is mounted on an external mounting substrate or the like. Further, the lower surface of the first electrode 31 and the second electrode 32 and the lower surface 21e of the support member 2 are configured to be flush with each other, that is, the lower surface 12 of the package 1 is a flat surface.

  In each figure, the coordinate axes are determined so that the lower surface 12 which is the mounting surface of the package 1 is a surface parallel to the XY plane. The first direction, which is the direction in which the tip 311a of the first electrode 31 and the tip 321a of the second electrode 32 face each other, is the X-axis direction, and the second direction orthogonal to the first direction is parallel to the mounting surface. The direction is the Y-axis direction. Further, the height direction of the package 1 which is a direction perpendicular to the mounting surface is defined as a Z-axis direction.

The support member 2 includes a wall portion 22 and a flange portion 23. The support member 2 can be formed by molding using a resin material.
The wall portion 22 fixes the first electrode 31 and the second electrode 32 and constitutes the side wall of the first recess 11. The wall portion 22 includes a first outer surface 21a, a second outer surface 21b adjacent to the first outer surface 21a, a third outer surface 21c adjacent to the second outer surface 21b and facing the first outer surface 21a, The first outer surface 21a and the third outer surface 21c are adjacent to a fourth outer surface 21d.

The first outer surface 21a, the second outer surface 21b, the third outer surface 21c, and the fourth outer surface 21d are the lower surface 21e from the lower surface 21e side of the support member 2 to the height of the upper surfaces of the first electrode 31 and the second electrode 32. In a height higher than that, it is inclined inward as it goes upward (in the + direction of the Z axis).
The first outer surface 21a, the second outer surface 21b, the third outer surface 21c, and the fourth outer surface 21d may all be vertical surfaces or inclined surfaces.

  Moreover, the inner side surface 21f of the wall part 22 which comprises the side surface of the 1st recessed part 11 inclines outside, so that it goes to an opening from the bottom face 11a. The inner side surface 21f may be a vertical surface, but is preferably an inclined surface inclined outward. By using the inclined surface, the light that is emitted from the light emitting element mounted in the first recess 11 and propagates in the lateral direction can be reflected in the opening direction to increase the light extraction efficiency.

The flange 23 is provided so as to protrude outward from the first outer surface 21a and the third outer surface 21c of the wall 22 in plan view. The flange 23 is provided on both sides of the outer lead portions 312 and 322 in a plan view with the same thickness as the outer lead portions 312 and 322. The flange 23 is not provided in the third recesses 313 and 323 of the outer lead portions 312 and 322.
Moreover, the wall part 22 and the collar part 23 are integrally formed with the same material. Since it is integrally molded in this way, the bonding strength between the wall portion 22 and the flange portion 23 can be increased.
In addition, the collar part 23 may be provided only on either one or both sides of either one of the outer lead parts 312 and 322, or may not have the collar part 23.

  In the package 1, the first electrode 31 protrudes from the first outer surface 21 a and the second electrode 32 protrudes from the third outer surface 21 c, but from the second outer surface 21 b and the fourth outer surface 21 d, The first electrode 31 and the second electrode 32 are not exposed. That is, all of the second outer surface 21b and all of the fourth outer surface 21d are formed of the same material as the wall portion 22, that is, a resin material. Therefore, when the package 1 is solder-bonded to an external mounting substrate, for example, solder wettability is low, so that solder leakage to the second outer surface 21b and the fourth outer surface 21d can be reduced.

In the package 1, the second outer side surface 21 b and the fourth outer side surface 21 d are substantially at the center in the first direction (X-axis direction) where the tip 311 a of the first electrode 31 and the tip 321 a of the second electrode 32 face each other. Second recesses 24 are respectively provided. The second recess 24 is provided at the lower end of the second outer surface 21b and the fourth outer surface 21d by cutting out or denting a part of the lower surface 21e of the support member 2.
The size of the second recess 24 is not particularly limited, but the width in the X axis direction is preferably 500 to 700 μm, particularly preferably 600 to 650 μm, and the depth (depth) in the Y axis direction is preferably 20 to 90 μm, particularly preferably 40 to 60 μm. . The height of the second recess 24 in the Z-axis direction is the same as the height (thickness) of the lead frame 3.

  The second recess 24 is a trace of two hanger leads formed in advance on a lead frame used for manufacturing the package 1. For example, when the lead frame 3 shown in FIGS. 6A to 6D is used for manufacturing the package 1, the second recess 24 has the same shape as the tip portion 351 of the hanger lead 35. Details of the hanger lead will be described later.

The second recess 24 has a tapered trapezoidal shape that becomes narrower toward the inner side of the support member 2, that is, toward the center, in plan view.
Further, the second recessed portion 24 has a step in the height direction in the cross-sectional structure, and the lower step portion is indented to the inside of the support member 2 rather than the upper step portion. Moreover, the lower step part is indented to the inner side of the support member 2 as the upper part. The upper step portion and the lower step portion are substantially parallel to the upper surface 241 of the second recess 24 and the lower surface 21e of the support member 2, and are virtual surfaces of the intermediate surface 242 that is a flat surface between the upper surface 241 and the lower surface 21e. The extended surface is the boundary surface.

The upper portion of the second recess 24 includes a virtual extension surface of the intermediate surface (first intermediate surface) 242, an upper surface 241, an upper side surface (first upper side surface) 243, and a second outer surface 21b (or fourth). This is a region surrounded by a virtual extension surface of the outer side surface 21d). The upper side surface 243 is a surface substantially perpendicular to the lower surface 21e.
The lower step of the second recess 24 includes an intermediate surface 242 and its virtual extension surface, a lower side surface (first lower side surface) 244, a virtual extension surface of the lower surface 21e of the support member 2, and a second outer surface. This is a region surrounded by a virtual extension surface of 21b (or the fourth outer surface 21d). The lower side surface 244 is concavely curved and is inclined so that the upper end 244a is located inside the support member 2 relative to the lower end 244b in plan view. The lower end 244b is located inside the support member 2 from the rear end (outer end portion) 242a of the intermediate surface 242 in plan view.
Here, when viewed as the outer surface of the support member 2, the lower side surface 244 is a convexly curved surface, and the upper surface 241 is the lower surface of the support member.
Note that the lower side surface 244 is not limited to a convexly curved inclined surface when viewed as the outer surface of the support member 2, and may be a linearly inclined inclined surface without being curved. It may be a curved inclined surface.

Examples of the resin material (first resin) used for the support member 2 include a thermoplastic resin and a thermosetting resin.
In the case of a thermoplastic resin, for example, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester, and the like can be used.
In the case of a thermosetting resin, for example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, or the like can be used.

  In order to efficiently reflect light on the inner side surface 21f of the wall portion 22 of the support member 2, the support member 2 may contain particles of a light reflective substance. The light reflective material is a material having high light reflectivity on the outer surface when contained in a resin material, such as titanium oxide, glass filler, white filler such as silica, alumina, and zinc oxide. The reflectance of the inner side surface 21f with respect to visible light is preferably 70% or more, and more preferably 80% or more. In particular, the reflectance is preferably 70% or more, and more preferably 80% or more in the wavelength range of light emitted from the light emitting element. The content of the light reflecting substance in the resin material may be 5% by mass or more and 50% by mass or less, and is preferably 10% by mass or more and 30% by mass or less, but is not limited thereto.

The first electrode 31 includes, in plan view, an inner lead portion 311 that is disposed in an arrangement region of the wall portion 22 of the support member 2 or inside the wall portion 22, and an outer lead portion 312 that is disposed outside the wall portion 22. It is composed of
The second electrode 32 has the same shape as the first electrode 31 and is arranged so as to be substantially line symmetric with respect to the center line C in the first direction (X-axis direction) in plan view.
The first electrode 31 and the second electrode 32 are formed with substantially the same thickness except for the outer edge portion.

The inner lead portion 311 of the first electrode 31 is disposed in a region inside the outer edge of the wall portion 22 in a plan view, and is used for electrically connecting the light emitting elements by die bonding or / and solder, wires, or the like. Used. The inner lead portion 311 has a substantially rectangular shape in a plan view, but the outer side in the X-axis direction is narrower than the inner side (center side).
Further, the outer lead portion 312 of the first electrode 31 is provided so as to protrude from the first outer surface 21 a of the support member 2, and is formed with the same width as the outer side of the inner lead portion 311 in the X-axis direction. Further, the outer lead portion 312 is provided with the flange portion 23 having the same thickness on both sides in the second direction (Y-axis direction) in plan view, and the third recess portion 313 is provided at the end portion in the X-axis direction. It is.

In addition, the upper surface 31a and the lower surface 31b of the first electrode 31 are plated with Ag, Au, Ni, or the like in a single layer or multiple layers in order to improve light reflectivity and / or bondability with a conductive bonding member such as solder. It is given in. In addition, the end surface 31c of the outer lead portion 312 is not plated, but the side surface 313a of the third recess 313 is plated. As a result, when the third recess 313 is bonded to an external mounting substrate, for example, by soldering, the solder crawls up to the side surface 313a, a solder fillet is formed, and the bonding strength can be increased. Further, by observing the presence or absence of a solder fillet, it is possible to confirm the quality of solder bonding.
The metal used for the plating process may be different depending on the purpose of performing the plating process, in other words, depending on the region to be plated. For example, Ag may be used for the upper surface 31a mainly to improve light reflectivity, and Au may be used for the lower surface 31b and the side surface 313a mainly to improve the bonding property such as solder.

Since the inner lead portion 321, the outer lead portion 322, and the third recessed portion 323 of the second electrode 32 are the same as the inner lead portion 311, the outer lead portion 312, and the third recessed portion 313 of the first electrode 31, a detailed description is provided. Omitted.
Note that only one of the third recesses 313 and 323 may be provided, or not both. Moreover, the shape of the 3rd recessed parts 313,323 can also be defined suitably. Further, the flange portion 23 and the outer lead portions 312 and 322 protruding from the wall portion 22 may not be provided.
Although the shape of the 3rd recessed parts 313,323 is not specifically limited, In planar view, a semicircle shape, a semi-elliptical shape, and a semi-oval shape are preferable. In the case of a semi-elliptical shape or a semi-ellipse shape, the ratio of the minor axis to the major axis is preferably 10:11 to 10:80, more preferably 10:15 to 10:60. For example, the major axis can be 160 to 320 μm with respect to the minor axis of the semi-elliptical shape or the semi-ellipse shape having a minor axis of 50 μm.

  The side surfaces of the first electrode 31 and the second electrode 32 are provided with a step structure in a region in contact with the support member 2 at the outer edge portion in plan view. In the cross-sectional structure, the first electrode 31 has a step in the height direction, and the upper step protrudes outward from the lower step. Moreover, the upper stage part protrudes toward the outer side, as the lower part. The upper step portion and the lower step portion are substantially parallel to the upper surface 31a and the lower surface 31b of the first electrode 31, and an intermediate surface (second intermediate surface) 314 that is a flat surface at a height between the upper surface 31a and the lower surface 31b. Boundary surface.

The upper side surface (second upper side surface) 315 that is also the side surface of the upper stage portion of the first electrode 31 is curved in a concave shape from the lower end 315b that is the tip of the intermediate surface 314 to the upper surface 31a, and the lower end 315b in plan view. Is inclined so as to be located outside the upper end 315a. Moreover, the upper end 315a is located outside the rear end (inner end) 314a of the intermediate surface 314 in plan view.
The upper side surface 315 is not limited to an inclined surface curved in a concave shape, and may be an inclined surface linearly inclined without being curved, or an inclined surface curved in a convex shape.
The lower side surface (second lower side surface) 316 that is the side surface of the lower step portion of the first electrode 31 is a surface that is substantially perpendicular to the upper surface 31a and the lower surface 31b.
The step structure provided at the outer edge of the second electrode 32 is the same as that of the first electrode 31.

  In the present embodiment, a step structure is provided in the entire outer region except for the outer end in the first direction (X-axis direction) that is not in contact with the support member 2 of the first electrode 31 and the second electrode 32. However, it may be provided on at least a part of the outer periphery of the first electrode 31 and the second electrode 32 in contact with the support member 2. For example, the first electrode 31 and the second electrode 32 may be provided only on the inner lead portions 311 and 321, or the entire outer region. May be provided intermittently.

[Package manufacturing method]
Next, a method for manufacturing the package 1 will be described with reference to FIGS.
FIG. 3 is a flowchart showing the procedure of the manufacturing method of the package according to the first embodiment. FIG. 4A is a plan view showing the configuration of the lead frame formed in the outer shape forming step of the package manufacturing method according to the first embodiment. 4B is a cross-sectional view showing the configuration of the lead frame formed in the outer shape forming step of the package manufacturing method according to the first embodiment, and shows a cross section taken along the line IVB-IVB in FIG. 4A. 4C is a cross-sectional view showing the configuration of the lead frame formed in the outer shape forming step of the package manufacturing method according to the first embodiment, and shows a cross section taken along the line IVC-IVC in FIG. 4A. FIG. 5A is a cross-sectional view showing a first step in a first step forming step of the package manufacturing method according to the first embodiment. FIG. 5B is a cross-sectional view showing a second step in the first step forming step of the package manufacturing method according to the first embodiment. FIG. 5C is a cross-sectional view showing a third step in the first step forming step of the package manufacturing method according to the first embodiment. FIG. 5D is a cross-sectional view showing a fourth step in the first step forming step of the package manufacturing method according to the first embodiment. FIG. 6A is a plan view showing a lead frame formed in a first step forming step and a second step forming step of the package manufacturing method according to the first embodiment. 6B is a cross-sectional view showing the lead frame formed in the first step forming step and the second step forming step of the manufacturing method of the package according to the first embodiment, and shows a cross section taken along line VIB-VIB in FIG. 6A. . 6C is a cross-sectional view showing the lead frame formed in the first step formation step and the second step formation step of the package manufacturing method according to the first embodiment, and shows a cross section taken along the line VIC-VIC in FIG. 6A. . 6D is a cross-sectional view showing the lead frame formed in the first step forming step and the second step forming step of the manufacturing method of the package according to the first embodiment, and shows a cross section taken along the line VID-VID in FIG. 6A. . FIG. 7A is a plan view showing a tip portion of a hanger lead of a lead frame used in the package according to the first embodiment. FIG. 7B is a plan view showing the tip of the hanger lead of the lead frame used in the package according to the modification of the first embodiment. FIG. 7C is a plan view showing a tip portion of a hanger lead of a lead frame used in a package according to another modification of the first embodiment. FIG. 8A is a cross-sectional view showing a lead frame installation step in a support member forming step of the package manufacturing method according to the first embodiment. FIG. 8B is a plan view showing a lead frame installation step in a support member formation step of the package manufacturing method according to the first embodiment. FIG. 9A is a cross-sectional view showing a first resin injection step in the support member forming step of the manufacturing method of the package according to the first embodiment, and shows a cross section at a position corresponding to the IXA-IXA line in FIG. 8B. FIG. 9B is a cross-sectional view showing the first resin injection step in the support member forming step of the manufacturing method of the package according to the first embodiment, and shows a cross section at a position corresponding to the line IXB-IXB in FIG. 8B. FIG. 10 is a plan view showing an electrode separation step of the manufacturing method of the package according to the first embodiment.

  In FIG. 6A, the regions where the step structures are formed are indicated by bold lines in the outer edge portions of the first electrode 31 and the second electrode 32 and the tip portion 351 of the hanger lead 35. 6B shows the step structure of the first electrode 31 and the second electrode 32 partially enlarged, and FIG. 6C shows the step structure of the tip portion 351 of the hanger lead 35 partially enlarged.

  The package manufacturing method according to the present embodiment includes a lead frame preparation step S110, a support member formation step S120, and an electrode separation step S130.

  The lead frame preparation step S110 is a step of preparing the lead frame 3 including the first electrode 31, the second electrode 32, and the hanger lead 35 by processing a flat metal plate. The lead frame preparation step S110 includes an outer shape forming step S111, a first step forming step S112, a second step forming step S113, and a plating step S114.

The outer shape forming step S111 is a step of forming the lead frame 3 as shown in FIGS. 4A to 4C by performing a punching process, which is one of press processes, on a flat sheet metal.
The sheet metal as a raw material is not particularly limited as long as it is used for a lead frame of a semiconductor element package. The thickness of the sheet metal is appropriately selected according to the shape and size of the package. For example, a thickness of about 100 to 500 μm is used, and a thickness of 120 to 300 μm is more preferable. Further, as a material for the sheet metal, for example, a Cu-based alloy is used.

  A through hole 36 for forming the outer shape of each member of the first electrode 31, the second electrode 32, and the hanger lead 35 and third recesses 313 and 323 provided at the end portions of the outer lead portions 312 and 322 are formed. For this purpose, a through hole 37 is formed by punching by pressing. The through hole 37 is formed so as to straddle the outline of the region 20 where the support member 2 is to be formed.

  In the lead frame 3 formed in this step, the first electrode 31 and the second electrode 32 are portions formed inside the region 20 in which the support member 2 is to be formed in plan view. The tip 311a of the first electrode 31 and the tip 321a of the second electrode 32 are opposed to each other in the first direction with a gap in the center in the first direction (X-axis direction). Further, the first electrode 31 is connected to the outer frame 30 via a connecting portion 33 provided so as to extend outward from one of a pair of short sides of the formation planned region 20 of the support member 2 that is rectangular in plan view. The second electrode 32 is connected to the outer frame 30 via a connecting portion 34 provided so as to extend outward from the other short side.

  Further, the tip portions 351 of the two hanger leads 35 are opposed to each other in the second direction (Y-axis direction) at the center in the first direction. The hanger lead 35 is arranged such that the tip portion 351 is inside the pair of long sides of the formation planned region 20 of the support member 2 that is rectangular in plan view, and the hanger lead 35 extends outward from the long side where each is arranged. It extends and is connected to the outer frame 30.

  The tip portion 351 has a trapezoidal shape in plan view. The shape of the distal end portion 351 in a plan view may be a rectangular shape, but a shape that is tapered so that the width becomes narrower toward the inside of the formation planned region 20 of the support member 2 is preferable. The size of the trapezoidal shape of the tip portion 351 is not particularly limited, and for example, the upper base can be 400 to 500 μm, the lower base can be 500 to 700 μm, and the height can be 50 to 150 μm. The shape of the distal end portion 351 in plan view may be, for example, a semicircle or a triangle. The two tip portions 351 are arranged so as to bite into a pair of outer surfaces of the support member 2 in order to support the package 1 on the lead frame 3, but by forming a tapered shape, a suitable external force is applied to the hanger. The tip portion 351 of the lead 35 can be removed from the support member 2.

  In addition, although the case where the one package 1 is manufactured is demonstrated, you may make it manufacture so that the several package 1 may be arranged in one dimension or two dimensions. In that case, for example, a lead frame assembly in which the lead frames 3 shown in FIG. 4A are continuously arranged one-dimensionally or two-dimensionally may be formed.

The first step forming step S112 is a step of forming a step at the outer edge portion of the tip portion 351 of the hanger lead 35. This step can be formed by crushing the tip portion 351 with a punch by press working. This process includes the following four sub-processes.
In the first step, the lead frame 3 in which the outer shape of each member is formed in the outer shape forming step S111 is placed on a lower mold (die) 400 having a flat upper surface. At this time, when the package 1 is formed, the first electrode 31 and the second electrode 32 are arranged with their upper surfaces facing upward.
In the second step, the upper die (punch) 410 is lowered toward the tip portion 351 of the hanger lead 35.

In the third step, a step structure is formed in the tip portion 351 by pressing and crushing the tip portion 351 of the hanger lead 35 with the upper mold 410. Details of the step structure will be described later.
In addition, it is preferable that the thickness of the lower part which is a crushed part is about 0.2 to 0.8 times the thickness of the original sheet metal, and about 0.3 to 0.7 times. More preferably. Further, the depth of the tip when crushing is preferably about 0.2 to 2 times the thickness of the original sheet metal, and more preferably about 0.3 to 1 times. As a result, the tip portion 351 of the hanger lead 35 can support the package 1 with the second outer surface 21b and the fourth outer surface 21d of the support member 2 with appropriate strength.
In the fourth step, the upper die 410 is retracted upward, and the pressed lead frame 3 is taken out.

  For convenience, the die that is the fixed die is the lower die 400 and the punch that is the movable die is the upper die 410, but the die is placed on the upper side upside down and the lower side punch. May be arranged, and the punch and the die may be arranged side by side and used.

The second step forming step S113 is a step of forming a step at the outer edge portions of the first electrode 31 and the second electrode 32. This step can be formed by crushing the outer edge portions of the first electrode 31 and the second electrode 32 with a punch by pressing, as in the first step forming step S112 described above. At this time, the outer edge portions of the first electrode 31 and the second electrode 32 are arranged with the surfaces to be the lower surfaces of the first electrode 31 and the second electrode 32 facing upward when the package 1 is formed. That is, the step structure of the outer edge portion of the first electrode 31 and the second electrode 32 is formed so that the step structure of the tip portion 351 of the hanger lead 35 is upside down.
A step structure may not be provided at the outer edge portions of the first electrode 31 and the second electrode 32, but it is preferable to provide them so that the first electrode 31 and the second electrode 32 are less likely to drop off from the support member 2. be able to.

  Note that either the first step forming step S112 or the second step forming step S113 may be performed first, or both may be performed simultaneously.

Here, the step structure of the outer edge portions of the first electrode 31 and the second electrode 32 and the step structure of the tip portion 351 of the hanger lead 35 will be described.
Since the step structure of the outer edge portion of the first electrode 31 is as described above, the description thereof is omitted. The step structure of the outer edge portion of the second electrode 32 is the same as that of the first electrode 31. About the 2nd electrode 32, it replaces with the code | symbol of the 31st series and the 310th series which show each part of the 1st electrode 31, and abbreviate | omits description by attaching | subjecting the 32nd series and the 320th series.

  Further, as described above, the tip portion 351 of the hanger lead 35 is formed to be upside down with respect to the step structure of the outer edge portions of the first electrode 31 and the second electrode 32. That is, the tip portion 351 of the hanger lead 35 has a step in the height direction in the cross-sectional structure, and the lower step protrudes outward from the upper step. Moreover, the lower stage part protrudes outside as the upper part. The lower step portion and the upper step portion are substantially parallel to the upper surface 35a and the lower surface 35b of the hanger lead 35, and are bounded by an intermediate surface (first intermediate surface) 352 that is a flat surface between the upper surface 35a and the lower surface 35b. A surface.

  A lower side surface (first lower side surface) 354 that is a side surface of the lower step portion of the hanger lead 35 is concavely curved from an upper end 354a that is a tip of the intermediate surface 352 to a lower surface 35b, and the upper end 354a is planarly viewed. It inclines so that it may be located outside the lower end 354b. Further, the lower end 354b is located on the outer side (front end side) than the rear end 352a of the intermediate surface 352 in plan view. The lower side surface 354 is not limited to an inclined surface curved in a concave shape, and may be an inclined surface linearly inclined without being curved, or an inclined surface curved in a convex shape. The inclination angle is preferably 60 to 80 degrees with respect to the lower surface 35b.

In other words, by configuring the angle formed by the intermediate surface 352 and the lower side surface 354 to be an acute angle, the upper end 354a of the lower side surface 354 protrudes from the lower end 354b, and the lower side surface 354 is positioned outward as the upper side. It becomes an inclined surface. Thus, the support member 2 is also provided below the lower side surface 354 by performing a support member formation step S120 described later. For this reason, it is difficult for the package 1 to fall off the lead frame 3.
When the lower side surface 354 is curved, the average inclination angle in the entire region of the lower side surface 354 can be regarded as an angle formed with the intermediate surface 352.
Moreover, it is preferable that the lower side surface 354 be a concavely curved inclined surface or a linearly inclined inclined surface so that the package 1 can be detached from the lead frame 3 with an appropriate pushing force.

  Further, the upper side surface (first upper side surface) 353 which is the side surface of the upper step portion of the hanger lead 35 is formed to be a surface substantially perpendicular to the upper surface 35a and the lower surface 35b. The upper side surface 353 is preferably a substantially inclined surface or an obtuse angle with respect to the upper surface 35a and the lower surface 35b, that is, an inclined surface that is inclined so that the vertical surface or the lower surface is outward. As a result, the support member 2 is not provided below the upper side surface 353, so that excessive pushing force is not required when removing the package 1 from the lead frame 3.

In addition, a region where a step structure is formed in the tip portion 351 of the hanger lead 35 is provided on the upper base and two legs of the trapezoid in the tip portion 351 having a trapezoidal shape in plan view. That is, a step is provided in the entire region of the tip portion 351 that bites into the outer surface of the support member 2 (see FIG. 7A). Thereby, the package 1 can be supported more stably.
The region where the step structure is provided is not limited to this, and may be provided in a part of the tip portion 351 that bites into the outer surface of the support member 2. For example, only the upper base portion of the trapezoid in a plan view shape (see FIG. 7B) or only the trapezoidal leg portion (see FIG. 7C) may be used.

The plating step S114 is a step of subjecting the surface of the lead frame 3 to an electrolytic plating process such as Ag in order to improve light reflectivity and / or solder jointability. In this step, the upper and lower surfaces of the lead frame 3 and the side surfaces including the inner surfaces of the through holes 36 and 37 are plated.
Instead of the plating step S114, the outer shape forming step S111 to the second step forming step S113 may be performed using a sheet metal whose surface is plated as a raw material of the lead frame 3.

The support member forming step S120 is a step of molding the support member 2 that supports the first electrode 31 and the second electrode 32 of the lead frame 3 using the first resin. The support member formation step S120 includes a lead frame installation step S121, a first resin injection step S122, and a first resin solidification or curing step S123.
As the resin material (first resin) used for forming the support member 2, the above-described thermoplastic resin or thermosetting resin can be used. The support member 2 can be molded by an injection molding method when a thermoplastic resin such as a polyphthalamide resin is used as the resin material, and by a transfer molding method when a thermosetting resin such as an epoxy resin is used.

The lead frame installation step S121 is a step of installing the lead frame 3 so as to be sandwiched between the upper mold 500 and the lower mold 510, which are mold dies. The upper mold 500 has a cavity 501 corresponding to the shape of the wall part 22 of the support member 2 and a flat part adjacent to the cavity 501. The cavity 501 is connected in a ring shape in plan view.
In the lead frame 3, the plan formation region 20 a of the wall portion of the support member 2 formation region 20 coincides with the outer edge of the cavity 501 of the upper mold 500 and the through hole 37 is outside the cavity 501 in plan view. So that they are aligned.
Further, when the upper mold 500 is aligned with the lead frame 3, the upper mold 500 is located in a region where the through hole 36 of the lead frame 3 is provided in a plan view and outside the region 20 where the support member 2 is to be formed. In addition, a gate 502 for injecting the first resin is provided. The lower mold 510 has a flat upper surface.

The first resin injection step S122 is a step of injecting the first resin from the gate 502 into the mold die while the lead frame 3 is sandwiched between the upper die 500 and the lower die 510.
Here, the gate 502, the through hole 36, and the cavity 501 communicate with each other, and the through hole 37 does not communicate with these spaces. Therefore, the first resin is injected into the through hole 36 and the cavity 501, and no resin is injected into the through hole 37.

The first resin solidification or curing step S123 is a step of solidifying or curing the resin injected into the mold.
Here, when a thermoplastic resin is used as the resin material, cooling and solidifying the heated and melted thermoplastic resin is referred to as “solidification”. When a thermosetting resin is used as the resin material, heating and solidifying the liquid thermosetting resin is called “curing”.

By solidifying or curing the first resin filled in the cavity 501 of the upper mold 500 and the through hole 36 of the lead frame 3, the wall portion 22 is formed in the cavity 501, and the flange portion 23 is formed in the through hole 36. It is formed. The flange 23 is formed in the through hole 36 so that the molded body of the first resin continuously extends to a region outside the region 20 where the support member 2 is to be formed in plan view. . The first electrode 31 and the second electrode 32 of the lead frame 3 are firmly supported by the support member 2 including the wall portion 22 and the flange portion 23. The support member 2 is arranged such that one tip portion 351 in each of the two hanger leads 35 bites into each of the second outer surface 21b and the fourth outer surface 21d, which are a pair of opposing faces of the rectangular parallelepiped that is the outer shape. ing.
Therefore, the package 1 composed of the support member 2 and the first electrode 31 and the second electrode 32 formed in this step is connected to the outer frame 30 of the lead frame 3 by the connecting portions 33 and 34 and the hanger leads 35. Yes.
Further, the first resin remaining in the gate 502 is solidified, whereby the gate mark 25 is formed.

  The electrode separation step S130 is a step of separating the first electrode 31 and the second electrode 32 from the lead frame 3. This step can be performed by punching the connecting portions 33 and 34 that connect the first electrode 31 and the second electrode 32 to the outer frame 30 by pressing. By this punching, the through hole 38 is formed so that the boundary line on the package 1 side coincides with the outline of the formation planned region 20 of the support member 2. At this time, together with the connecting portions 33 and 34, the extended portion of the first resin formed continuously with the flange portion 23 in the through hole 36 is removed. Further, the gate mark 25 formed in the extending portion is also removed. Therefore, the gate mark 25 does not remain in the completed package 1. For this reason, the package 1 can be formed thin.

In addition, since the through hole 38 is formed, a part of the through hole 37 formed so as to straddle the outline of the region 20 in which the support member 2 is to be formed is formed between the first electrode 31 and the second electrode 32. The third recesses 313 and 323 of the outer lead portions 312 and 322 are formed.
Here, the end surfaces 31c of the outer lead portions 312 and 322 formed by the through holes 38 are exposed surfaces of the sheet metal material of the lead frame 3, but the side surfaces 313a and 323a of the third recesses 313 and 323 are subjected to plating. Therefore, it has good wettability with solder. For this reason, when the package 1 is solder-bonded using the lower surfaces 31b and 32b of the first electrode 31 and the second electrode 32 as mounting surfaces, solder fillets can be formed on the side surfaces 313a and 323a to increase the bonding strength.
Further, as described above, whether or not the solder fillet is formed can be determined by confirming whether or not the solder fillet is formed.

  In addition, the first electrode 31 and the second electrode 32 are separated from the lead frame 3 by this process, but the package 1 is supported by the hanger lead 35 and connected to the lead frame 3. The package 1 can be removed from the lead frame 3 by pushing the package 1 from the lower surface side toward the upper surface side (toward the positive direction of the Z axis).

  Here, since the tip portion 351 which is a connection portion between the package 1 and the hanger lead 35 has the above-described step structure, the supporting force is stronger than the case where there is no step structure. For this reason, compared with the case where it does not have a level | step difference structure, the pushing force required when isolate | separating the package 1 from the lead frame 3 becomes large. As a result, the stress applied to the first electrode 31 and the second electrode 32 due to the pushing force increases.

The tip 311a of the first electrode 31 and the tip 321a of the second electrode 32 face each other at a substantially central portion in the first direction (X-axis direction), which is the direction in which the first electrode 31 and the second electrode 32 face each other. Has been placed. Further, the tip portions 351 of the two hanger leads 35 are opposed to the second direction (Y-axis direction) orthogonal to the first direction in plan view, and bite into the support member 2 at a substantially central portion in the first direction. Are arranged as follows.
For this reason, when the package 1 is separated from the lead frame 3, that is, when the tip portion 351 of the hanger lead 35 is removed from the support member 2, stress bias applied to the first electrode 31 and the second electrode 32 is reduced. be able to. As a result, it becomes difficult for the first electrode 31 and the second electrode 32 to be deformed or separated from the support member 2.

  In addition, a second concave portion 24 that is a mark obtained by removing the tip portion 351 of the hanger lead 35 from the support member 2 is formed in the central portion of the support member 2. For this reason, compared with the case where the 2nd recessed part 24 is formed in the corner of the support member 2, the support member 2 becomes difficult to chip or break in the 2nd recessed part 24.

  Furthermore, the first electrode 31 and the second electrode 32, the support member 2, and the tip portion 351 of the hanger lead 35 and a step structure that is upside down are provided on the outer edge portions of the first electrode 31 and the second electrode 32. Can be more difficult to separate.

In the present embodiment, the first electrode 31 and the second electrode 32 are separated from the lead frame 3 by forming the through hole 38 by punching press processing, but the present invention is not limited to this. is not. For example, you may make it cut | disconnect along the outline of the formation plan area | region 20 of the supporting member 2 using a lead cutter.
The support member 2 has a rectangular shape in plan view, but may be a circle, an ellipse, or a polygon other than a rectangle.

[Configuration of light emitting device]
Next, the configuration of the light emitting device using the package according to the first embodiment will be described with reference to FIG. FIG. 11 is a perspective view showing the configuration of the light emitting device according to the first embodiment.
The light emitting device 100 according to the first embodiment includes a package 1A, a light emitting element 4 mounted in the first recess 11 of the package 1A, and a sealing member (second resin) 6 that covers the light emitting element 4. I have. The light emitting element 4 is electrically connected to the first electrode 31 and the second electrode 32 using the wire 5.

The package 1 </ b> A differs from the package 1 described above in that a wall having a mark 26 representing the polarity of the first electrode 31 is formed by cutting out or denting one vertex of the substantially rectangular parallelepiped outer shape instead of the wall portion 22. The difference is that the portion 22A is provided. The shape, size, and arrangement location of the mark 26 are not particularly limited, and may be provided on the second electrode 32 side, for example. Further, instead of the package 1A, the package 1 that does not have the mark 26 may be used.
Since the other configuration of the package 1A is the same as that of the package 1, detailed description thereof is omitted.

The light emitting element 4 is mounted on the second electrode 32 of the package 1A. The light emitting element 4 used here is not particularly limited in shape, size, semiconductor material, and the like. As the luminescent color of the light emitting element 4, the thing of arbitrary wavelengths can be selected according to a use. Having an emission wavelength near ultraviolet to visible light _{region, In X Al Y Ga 1-} X-Y N (0 ≦ X ≦ 1,0 ≦ Y ≦ 1, X + Y ≦ 1) formed of a nitride semiconductor represented by the emission An element can be used suitably.
In the present embodiment, the light emitting element 4 is a face-up mounting type in which positive and negative electrodes are arranged on the same surface side, but may be a face-down mounting type, and the positive and negative electrodes are arranged on different surface sides. May be good.

  The wire 5 is a conductive wiring for electrically connecting electronic components such as the light emitting element 4 and the protection element to the first electrode 31 and the second electrode 32. Examples of the material of the wire 5 include metals such as Au (gold), Ag (silver), Cu (copper), Pt (platinum), Al (aluminum), and alloys thereof. It is preferable to use Au excellent in thermal conductivity and the like. In addition, the thickness of the wire 5 is not specifically limited, It can select suitably according to the objective and a use.

  The sealing member (second resin) 6 covers the light emitting element 4 and the like mounted in the first recess 11 of the package 1A. The sealing member 6 is provided to protect the light emitting element 4 and the like from external force, dust, moisture, and the like, and to improve the heat resistance, weather resistance, and light resistance of the light emitting element 4 and the like. Examples of the material of the sealing member 6 include a transparent material such as a thermosetting resin, for example, a silicone resin, an epoxy resin, or a urea resin. In addition to such a material, a phosphor (wavelength converting substance), a light reflecting substance, a light diffusing substance, and other fillers may be included in order to have a predetermined function.

The sealing member 6 can facilitate the color tone adjustment of the light emitting device 100 by containing phosphor particles, for example. In addition, as fluorescent substance, the specific gravity is larger than the sealing member 6, and what absorbs the light from the light emitting element 4, and converts wavelength can be used. If the specific gravity of the phosphor is larger than that of the sealing member 6, the phosphor can be settled and disposed near the surface of the first electrode 31, the second electrode 32, or the light emitting element 4.
Specifically, for example, yellow phosphors such as YAG (Y ₃ Al ₅ O ₁₂ : Ce) and silicate, or red phosphors such as CASN (CaAlSiN ₃ : Eu) and KSF (K ₂ SiF ₆ : Mn) Can be mentioned.

As the filler to be contained in the sealing member 6, for example, particles such as SiO ₂ , TiO ₂ , Al ₂ O ₃ , ZrO ₂ , and MgO can be suitably used. Further, for the purpose of removing light having an undesired wavelength, for example, an organic or inorganic coloring dye or coloring pigment may be included.

[Method for Manufacturing Light Emitting Device]
Next, a method for manufacturing a light emitting device using the package according to the first embodiment will be described with reference to FIGS. FIG. 12 is a flowchart illustrating the procedure of the method for manufacturing the light emitting device according to the first embodiment.

The light emitting device manufacturing method according to the present embodiment includes a package preparation step S210, a light emitting element mounting step S220, a sealing step S230, and an individualization step S240.
The package preparation step S210 includes a lead frame preparation step S110, a support member formation step S120, and an electrode separation step S130. Since the package preparation step S210 performs the above-described package manufacturing method, a detailed description of each step is omitted.

The light emitting element mounting step S220 is a process of mounting the light emitting element 4 in the first recess 11 of the package 1A.
The light-emitting element 4 is an element having a single-sided electrode structure in which an n-side electrode and a p-side electrode are formed on the upper surface side, and is mounted face up. Therefore, the lower surface side of the light emitting element 4 is bonded to the upper surface of the second electrode 32 with an insulating die bond member. In addition, the n-side electrode and the p-side electrode of the light emitting element 4 are connected to the upper surface of the corresponding polarity electrode of the first electrode 31 and the second electrode 32 by the wire 5, respectively.
The light-emitting element 4 is a face-up mounting type in which positive and negative electrodes are arranged on the same surface side, but may be a face-down (flip chip) mounting type, in which positive and negative electrodes are arranged on different surface sides. But you can.

The sealing step S <b> 230 is a step of covering the light emitting element 4, the protective element, and the wire 5 mounted in the first recess 11 with the sealing member 6.
This step is performed by applying the sealing member 6 in the first recess 11. As a method for applying the sealing member 6, a potting method can be suitably used. The sealing member 6 can be formed by solidifying or curing after filling the first recess 11 with a liquid resin material or the like. The potting method is preferable because air remaining in the first recess 11 can be effectively discharged. Moreover, as a method of filling the sealing member 6 in the first recess 11, various printing methods and resin molding methods can be used.

The separation process S240 is a process of separating the light emitting device 100 connected to the outer frame 30 of the lead frame 3 from the hanger lead 35.
As described above, the package 1 can be separated from the lead frame 3 by pushing the package 1 from the lower surface side toward the upper surface side (toward the + direction of the Z axis) with respect to the lead frame 3. .
The light emitting device 100 can be manufactured by performing each step as described above.

The light emitting element mounting step S220 and the sealing step S230 may be performed between the support member forming step S120 and the electrode separation step S130 in the package preparation step S210. That is, the light-emitting element 4 is mounted and sealed in a state where the package 1A is firmly connected to the lead frame 3 by the connecting portions 33 and 34 in addition to the hanger lead 35 without being separated into individual pieces. Later, the light emitting device 100 may be singulated.
Further, the light emitting element mounting step S220 and the sealing step S230 may be performed after the electrode separation step S130 and the individualization step S240. That is, after the package 1A is separated, the light emitting element 4 may be mounted and sealed.

In addition, the order of each process can also be changed so that the following conditions may be met.
The electrode separation step S130 may be performed before the individualization step S240. Therefore, the electrode separation step S130 may be performed after the light emitting element mounting step S220 and the sealing step S230, or between the light emitting element mounting step S220 and the sealing step S230.
The light emitting element mounting step S220 may be performed after the support member forming step S120 of the package preparation step S210 and before the sealing step S230. Therefore, the light emitting element mounting step S220 may be performed after the electrode separation step S130. In addition, the light emitting element mounting step S220 may be performed after the singulation step S240.
The sealing step S230 may be performed after the light emitting element mounting step S220. Therefore, the sealing step S230 may be performed after the electrode separation step S130 and the individualization step S240.

The light emitting device shown in FIG. 11 is manufactured under the following conditions by the manufacturing method described above.
As a raw material for the lead frame, a Cu sheet metal whose surface is plated with Ag is used.
A polyphthalamide resin is used as a material for the support member, and the support member is formed by an injection molding method.
Further, the resin material of the support member contains titanium oxide particles so that the reflectance of the inner surface of the first recess of the support member is 70% or more. This reflectance is based on the value at the wavelength of the light emission peak of the light emitting element.
The outer shape of the package has a box shape with dimensions of about 2.2 mm in length, about 1.5 mm in width, and about 0.7 mm in height. The wall has a thickness of about 0.1 to 0.3 mm. The thickness of the lead frame and the thickness of the collar are about 0.2 mm. The intermediate surface 242 is formed at a position of 0.1 mm from the lower surface. The hanger lead has a substantially trapezoidal shape in plan view, the upper base is about 0.5 mm, the lower base connected to the outer frame is about 0.66 mm, and the height from the upper base to the lower base is about 0.05 mm. is there. The shape of the third recess is a substantially semi-oval shape in plan view, and the major axis is about 0.3 mm and the minor axis is about 0.05 mm. The second recess matches the shape of the hanger lead.
A nitride blue light emitting diode having a light emission peak near 460 nm is used as the light emitting element.
A silicone resin is used for the sealing member.
After the light emitting element is mounted on the package, the first electrode and the second electrode are cut from the outer frame by punching holes. At this time, the package is supported by the hanger lead.
The manufactured light emitting device (package) is less likely to fall off the lead frame than the comparative example in which the hanger lead has no stepped structure at the tip portion.

  The light emitting device according to the embodiment of the present disclosure can be used for an illumination device, an in-vehicle light emitting device, and the like.

1,1A package 11 first recess 11a bottom surface of first recess 12 lower surface 2,2A support member (first resin)
20 a planned formation region of the support member 20 a a planned formation region of the wall portion 21 a first outer surface 21 b second outer surface 21 c third outer surface 21 d fourth outer surface 21 e lower surface 21 f inner surface 22, 22 A wall portion 23 collar portion 24 second Recessed portion 241 Upper surface 242 Intermediate surface (first intermediate surface)
242a Rear end 243 Upper side (first upper side)
244 Lower side (first lower side)
244a upper end 244b lower end 25 gate mark 26 mark 3 lead frame 30 outer frame 31 first electrode 31a upper surface 31b lower surface 31c end surface 311 inner lead portion 311a tip 312 outer lead portion 313 third recess 313a side surface 314 intermediate surface (second intermediate surface)
314a Rear end 315 Upper side surface (second upper side surface)
315a Upper end 315b Lower end 316 Lower side surface (second lower side surface)
32 Second electrode 32a Upper surface 32b Lower surface 32c End surface 321 Inner lead portion 321a Tip 322 Outer lead portion 323 Third recess 323a Side surface 324 Intermediate surface (second intermediate surface)
324a tip 325 upper side surface (second upper side surface)
325a Upper end 325b Lower end 326 Lower side surface (second lower side surface)
33, 34 connecting portion 35 hanger lead 35a upper surface 35b lower surface 351 tip portion 352 intermediate surface (first intermediate surface)
352a Tip 353 Upper side (first upper side)
354 Lower side (first lower side)
354a Upper end 354b Lower end 36 Through hole 37 Through hole 38 Through hole 4 Light emitting element 5 Wire 6 Sealing member (second resin)
DESCRIPTION OF SYMBOLS 100 Light-emitting device 400 Upper mold 410 Lower mold 500 Upper mold 501 Cavity 502 Gate 510 Lower mold

Claims (20)

A support member for supporting the pair of electrodes, comprising: a pair of electrodes; two hanger leads provided apart from the pair of electrodes; and an outer frame connected to the pair of electrodes and the two hanger leads. By combining, a lead frame for forming a box-shaped package having a first recess for mounting a light emitting element,
The first recess has an opening on the upper surface side, a side surface is formed by the support member, and at least a part of the bottom surface is formed by the pair of electrodes,
The pair of electrodes are disposed in a region where the support member is to be formed,
The front ends of the pair of electrodes are opposed to each other in the first direction at an interval in the central portion of the region where the support member is to be formed, in plan view,
The two hanger leads extend from the outer frame to a region where the support member is to be formed, and a tip portion is disposed within the region where the support member is to be formed.
The two hanger leads are opposed to each other in a second direction orthogonal to the first direction at a central portion of the support member in a plan view.
The front end portion of the hanger lead includes an upper surface, a lower surface substantially parallel to the upper surface, a first intermediate surface substantially parallel to the upper surface and the lower surface and at a height between the upper surface and the lower surface, And at least a first lower side surface provided in a concavely curved or linearly inclined manner from the front end portion of the intermediate surface to the lower surface,
The first lower side surface is a lead frame in which an upper end is located outside a lower end in a plan view.   The lead frame according to claim 1, wherein a front end portion of the lower surface of the hanger lead is disposed in a region immediately below the first intermediate surface in a plan view. The pair of electrodes are substantially parallel to the upper surface, the lower surface substantially parallel to the upper surface of the electrode, and the upper and lower surfaces of the electrode, at least at a part of the outer edge portion disposed in the region where the support member is to be formed. A second intermediate surface at a height between the upper surface of the electrode and the lower surface of the electrode, and a concavely curved or linearly inclined portion from the tip portion of the second intermediate surface to the upper surface of the electrode. And at least a second upper side surface,
3. The lead frame according to claim 1, wherein the second upper side surface has a lower end outside an upper end in plan view. 4.   The lead frame according to any one of claims 1 to 3, wherein tip portions of the two hanger leads have a trapezoidal shape that tapers toward a center of a region where the support member is to be formed in plan view.   5. The lead frame according to claim 1, wherein an angle formed by the first intermediate surface and the first lower side surface in the thickness direction is an acute angle. The support member has a substantially rectangular parallelepiped shape,
The pair of electrodes extends in the first direction from each of a pair of mutually opposing short side surfaces of the rectangular parallelepiped, which is a region where the support member is to be formed, in plan view, and is connected to the outer frame.
The two hanger leads are connected to the outer frame by extending in the second direction from a pair of opposite long side surfaces of the rectangular parallelepiped in plan view. The lead frame according to the item. A pair of electrodes, two hanger leads provided apart from the pair of electrodes, an outer frame connected to the two hanger leads, and a support member that supports the pair of electrodes,
A lead frame for forming a box-shaped package having a first recess for mounting a light emitting element,
The first recess has an opening on the upper surface side, a side surface is formed by the support member, and at least a part of the bottom surface is formed by the pair of electrodes,
The pair of electrodes are disposed in the support member while facing each other in the first direction with a space in the center portion of the support member in plan view.
The two hanger leads are opposed to each other in a second direction perpendicular to the first direction at the center of the support member in plan view.
The two hanger leads are opposed to each other in a second direction orthogonal to the first direction at a central portion of the support member in a plan view.
The front end portion of the hanger lead includes an upper surface, a lower surface substantially parallel to the upper surface, a first intermediate surface substantially parallel to the upper surface and the lower surface and at a height between the upper surface and the lower surface, And at least a first lower side surface provided in a concavely curved or linearly inclined manner from the front end portion of the intermediate surface to the lower surface,
The first lower side surface is a lead frame in which an upper end is located outside a lower end in a plan view. The pair of electrodes is at least part of an outer edge portion disposed in the support member.
An upper surface, a lower surface substantially parallel to the upper surface of the electrode, a second intermediate surface substantially parallel to the upper surface and the lower surface of the electrode and at a height between the upper surface of the electrode and the lower surface of the electrode, and the second A second upper side surface that is provided in a concavely curved or linearly inclined manner from the tip portion of the intermediate surface to the upper surface of the electrode,
The lead frame according to claim 7, wherein the second upper side surface has a lower end outside an upper end in plan view.   9. The lead frame according to claim 7, wherein an angle formed by the first intermediate surface and the first lower side surface is an acute angle in the thickness direction. The support member has a substantially rectangular parallelepiped shape,
The pair of electrodes extends in the first direction from each of the pair of short side surfaces facing each other of the rectangular parallelepiped in plan view and is connected to the outer frame,
The two hanger leads are connected to the outer frame by extending in the second direction from a pair of opposing long side surfaces of the rectangular parallelepiped in plan view. The lead frame according to the item. A box-shaped package having a first recess for mounting a light-emitting element, comprising: a pair of electrodes; and a support member that supports the pair of electrodes and has a substantially rectangular parallelepiped shape,
The first recess has an opening on an upper surface side, a side wall is formed by the support member, and at least a part of a bottom surface is formed by the pair of electrodes,
The pair of electrodes, as seen in a plan view, are arranged such that, in a central portion of the support member, one end of each of the electrodes is opposed to each other in the first direction with a space therebetween, and the other end is exposed from the side surface of the support member. Stretching along the first direction,
Provided on each of a pair of side surfaces of the support member facing a second direction orthogonal to the first direction in a plan view, at a part of the side surface and a part of the lower surface of the support member at a central portion of the support member. Having a second recess,
The second recess includes an upper surface substantially parallel to the lower surface of the support member, a first intermediate surface substantially parallel to the upper surface and at a height between the upper surface and the lower surface of the support member, and the first intermediate A first lower side surface provided at least in a concavely curved or linearly inclined manner from the inner end of the surface to the lower surface of the support member,
The first lower side surface is a package in which an upper end is inside the support member rather than a lower end in a plan view. A light emitting device comprising: a box-shaped package having a first recess; and a light emitting element mounted in the first recess,
The package includes a pair of electrodes and a support member that supports the pair of electrodes and has an outer shape that is a substantially rectangular parallelepiped.
The first recess has an opening on an upper surface side, a side wall is formed by the support member, and at least a part of a bottom surface is formed by the pair of electrodes,
The pair of electrodes, as seen in a plan view, are arranged such that, in a central portion of the support member, one end of each of the electrodes is opposed to each other in the first direction with a space therebetween, and the other end is exposed from the side surface of the support member. Stretching along the first direction,
Provided on each of a pair of side surfaces of the support member facing a second direction orthogonal to the first direction in a plan view, at a part of the side surface and a part of the lower surface of the support member at a central portion of the support member. Having a second recess,
The second recess includes an upper surface substantially parallel to the lower surface of the support member, a first intermediate surface substantially parallel to the upper surface and at a height between the upper surface and the lower surface of the support member, and the first intermediate A first lower side surface provided at least in a concavely curved or linearly inclined manner from the inner end of the surface to the lower surface of the support member,
The first lower side surface is a light emitting device in which an upper end is inside the support member from a lower end in a plan view. A support member for supporting the pair of electrodes, comprising: a pair of electrodes; two hanger leads provided apart from the pair of electrodes; and an outer frame connected to the pair of electrodes and the two hanger leads. By combining, a lead frame for forming a box-shaped package having a first recess for mounting a light emitting element,
The first recess has an opening on the upper surface side, a side surface is formed by the support member, and at least a part of the bottom surface is formed by the pair of electrodes,
The pair of electrodes are arranged in a plan view in a region where the support member is to be formed, in a central portion of the region where the support member is to be formed, with their tips facing each other in the first direction with a space therebetween,
The two hanger leads are provided with the lead frame arranged in a plan view so that tips thereof are opposed to each other in a second direction orthogonal to the first direction at a central portion of the support member,
By applying pressure to the upper surface side of the tip portions of the two hanger leads at the tip portions of the two hanger leads arranged in the region where the support member is to be formed, the tip portions of the two hanger leads An upper surface, a lower surface substantially parallel to the upper surface, a first intermediate surface substantially parallel to the upper surface and the lower surface and at a height between the upper surface and the lower surface, and a tip portion of the first intermediate surface And at least a first lower side surface provided in a concavely curved or linearly inclined manner toward the lower surface,
The method of manufacturing a lead frame, wherein the first lower side surface is processed so that an upper end is located outside a lower end in a plan view.   The method of manufacturing a lead frame according to claim 13, wherein the step is formed by pressing the tip of the hanger lead from the upper surface side as the pressure. A support member for supporting the pair of electrodes, comprising: a pair of electrodes; two hanger leads provided apart from the pair of electrodes; and an outer frame connected to the pair of electrodes and the two hanger leads. By combining, a lead frame for forming a box-shaped package having a first recess for mounting a light emitting element,
The first recess has an opening on the upper surface side, a side surface is formed by the support member, and at least a part of the bottom surface is formed by the pair of electrodes,
The pair of electrodes are arranged in a plan view in a region where the support member is to be formed, in a central portion of the region where the support member is to be formed, with their tips facing each other in the first direction with a space therebetween,
The two hanger leads are arranged in a plan view so that their tips are opposed to each other in a second direction orthogonal to the first direction at the center of the support member,
The tip portions of the two hanger leads are disposed in a region where the support member is to be formed, and an upper surface, a lower surface substantially parallel to the upper surface, and the upper surface and the lower surface substantially parallel to the upper surface and the lower surface. A first intermediate surface at a height between the first intermediate surface and a first lower side surface provided to be concavely curved or linearly inclined from the front end portion of the first intermediate surface to the lower surface. The first lower side surface is provided with the lead frame having an upper end outside the lower end in plan view,
The pair of electrodes is sandwiched between an upper mold and a lower mold of a mold mold divided into upper and lower parts,
Injecting the first resin into the mold mold sandwiched between the pair of electrodes,
A method for manufacturing a package, wherein the support member is formed by solidifying or curing the injected first resin. After solidifying or curing the injected first resin,
The package manufacturing method according to claim 15, wherein the pair of electrodes are cut from the outer frame. A support member for supporting the pair of electrodes, comprising: a pair of electrodes; two hanger leads provided apart from the pair of electrodes; and an outer frame connected to the pair of electrodes and the two hanger leads. By combining, a lead frame for forming a box-shaped package having a first recess for mounting a light emitting element,
The first recess has an opening on the upper surface side, a side surface is formed by the support member, and at least a part of the bottom surface is formed by the pair of electrodes,
The pair of electrodes are arranged in a plan view in a region where the support member is to be formed, in a central portion of the region where the support member is to be formed, with their tips facing each other in the first direction with a space therebetween,
The two hanger leads are arranged in a plan view so that their tips are opposed to each other in a second direction orthogonal to the first direction at the center of the support member,
The tip portions of the two hanger leads are disposed in a region where the support member is to be formed, and an upper surface, a lower surface substantially parallel to the upper surface, and the upper surface and the lower surface substantially parallel to the upper surface and the lower surface. A first intermediate surface at a height between the first intermediate surface and a first lower side surface provided to be concavely curved or linearly inclined from the front end portion of the first intermediate surface to the lower surface. The first lower side surface is provided with the lead frame having an upper end outside the lower end in plan view,
The pair of electrodes is sandwiched between an upper mold and a lower mold of a mold mold divided into upper and lower parts,
Injecting the first resin into the mold mold sandwiched between the pair of electrodes,
The support member is formed by solidifying or curing the injected first resin,
A method for manufacturing a light emitting device, wherein the light emitting element is mounted in the first recess. After solidifying or curing the injected first resin, or after mounting a light emitting element in the first recess,
The method for manufacturing a light-emitting device according to claim 17, wherein the pair of electrodes are cut from the outer frame. After cutting the pair of electrodes from the outer frame,
The method of manufacturing a light emitting device according to claim 17 or 18, wherein the package is singulated by pushing the package from the lower surface side toward the upper surface side.   The light emitting device according to any one of claims 17 to 19, wherein after the light emitting element is mounted, the light emitting element is further sealed by applying a second resin in the first recess. Production method.

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