WO2009079892A1 - A led lead frame and manufacturing method of led using the lead frame - Google Patents
A led lead frame and manufacturing method of led using the lead frame Download PDFInfo
- Publication number
- WO2009079892A1 WO2009079892A1 PCT/CN2008/000380 CN2008000380W WO2009079892A1 WO 2009079892 A1 WO2009079892 A1 WO 2009079892A1 CN 2008000380 W CN2008000380 W CN 2008000380W WO 2009079892 A1 WO2009079892 A1 WO 2009079892A1
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- Prior art keywords
- led
- lead frame
- chip
- outer electrode
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000001746 injection moulding Methods 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 16
- 239000008393 encapsulating agent Substances 0.000 claims description 14
- 239000000084 colloidal system Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 3
- 239000000047 product Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Definitions
- the present invention relates to a light emitting diode (LED) technology, and more particularly to an LED manufacturing technique, in particular to a lead frame structure and a method of manufacturing an LED using the lead frame.
- LED light emitting diode
- FIG. 1 and Figure 2 show the known LED structure diagrams, which show the two commonly used LED manufacturing methods.
- Figure 1 shows the PLCC type LED introduced in recent years.
- This structure is a surface mount type with high assembly precision, high density, and high production efficiency.
- the main components are a lead frame 101, an LED chip 102, a connecting lead 103, an encapsulant 104, a reflective cavity 105, and a lens 10 ⁇ .
- the lead frame 101 and the reflective cavity 105 are formed in the manufacturing process, and then the LED chip 102 is placed.
- the lead 103 is connected, and the encapsulant 104 and the lens 106 are placed at the last point.
- This type of LED typically has a reflective cavity 105 to facilitate the packaging of the LED.
- the encapsulant 104 is generally epoxy or silicone.
- the encapsulant 104 and the reflective cavity 105 must have good airtightness to meet the reliability requirements of the product.
- the phenomenon that the encapsulant 104 and the reflective cavity 105 are delaminated often affects the quality of the product, and such products are greatly limited.
- the object of the present invention is to provide a simple structure, easy installation, and good product consistency. LED lead frame.
- Another object of the present invention is to provide a method of fabricating an LED using the above LED lead frame.
- the LED lead frame structure of the present invention is a plate type frame structure, wherein the plate frame is provided with a convex plate extending in the middle and spaced apart from each other by the peripheral frame, and the convex plates respectively constitute a chip mounting portion and an inner lead connecting portion.
- the outer electrode portion and the tube body supporting portion form a connection substrate, and the connection substrate connects the respective components as a whole, the inner lead connecting portion and the chip mounting portion are located at the front end of the outer electrode portion, and the chip mounting portion is provided with a reflection cavity.
- the reflective cavity has a conical or elliptical cone shape.
- the number of the chip mounting portions is one or more, and the number of the corresponding outer electrode portions is one or more; the color is one or more.
- the lead frame is a unit, and the array can be N rows and M columns, wherein N 1, M ⁇ lo
- the method for manufacturing LEDs using the LED lead frame of the present invention mainly includes: - a. metal lead frame preforming: metal sheet metal The workpiece is processed into a metal lead frame having a chip mounting portion, a reflective cavity, an inner lead connecting portion, an outer electrode portion, a tube supporting portion, and a connecting substrate;
- Chip placement Place the LED chip on the chip mounting portion on the metal lead frame and complete the electrical connection;
- Colloid injection molding The LED chip is packaged by a process of encapsulation colloid injection molding, the outer electrode portion and the connection substrate are disposed outside the encapsulant, a part of the tube support portion is embedded in the package colloid, and the feed port is disposed on the LED The bottom of the pipe body;
- the external electrode portion is disconnected from the position connected to the substrate and bent, and the pin bending may be a bottom surface or a side surface of the LED tube body;
- Separation Punching and disconnecting the encapsulant from the support of the tube body to form a separate LED.
- the LED manufactured by the LED manufacturing method provided by the present invention has the following advantages -
- FIG. 1 Colloid injection molding
- FIG. 7 Schematic diagram of the discrete device
- chip mounting portion 301 chip mounting portion 301, inner lead connecting portion 302, outer electrode portion 303, tube body supporting portion 304, connecting substrate 305, reflecting cup 306, gold wire 307, encapsulant 308, tube body supporting portion and connecting substrate Connection portion 309, outer electrode portion and connection substrate connection portion 310
- Embodiment 1 provides a single-chip LED metal lead frame structure and a method of manufacturing the same using the lead frame:
- a pre-formed schematic view of a metal lead frame is formed by processing a sheet metal frame structure having a thickness of 0.3 mm into a convex plate extending from the periphery of the peripheral frame and spaced apart from each other, and the peripheral frame constitutes a connection substrate,
- the convex plates respectively form a metal lead frame of the chip mounting portion 301, the inner lead connecting portion 302, the outer electrode portion 303, the tube supporting portion 304, and the connecting substrate 305;
- the connecting substrate connects the components into one whole
- the lead connecting portion and the chip mounting portion are located at the front end of the outer electrode portion, the chip mounting portion is provided with a reflective cavity, and the chip mounting portion 301 is provided with a reflective cup 306, and the reflective cavity has a conical or elliptical cone shape.
- the number of chips placed is one or more, and the color is one or more.
- the LED chip 306 is placed in the reflective cup 306 of the chip mounting portion 301, and the electrical connection between the chip electrode and the external electrode 303 on the metal lead frame is completed using a gold wire 307 using a ultrasonic bonding process. .
- the LED chip 306 is encapsulated by the method of injection molding, and the external electrode portion 302 and the metal lead frame 304 are disposed outside the encapsulant 308, and a part of the tube support portion 303 is embedded. Inside the encapsulant 308; the feed port at the time of injection is placed at the bottom of the LED.
- the pin bending diagram is shown in Fig. 6: the outer electrode portion 302 is disconnected from the position 309 connected to the metal lead frame 304 and bent.
- the separation diagram shown in Fig. 7 is to smear the connection of the encapsulant colloid 308 to the tube support 303 to form a separate LED.
- Embodiment 2 provides a solution for mass production of lead frames, which is a 4*10 array structure.
- the schematic is shown in Figure 8.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
A LED lead frame is a plate frame structure. The plate frame comprises bulges extending inward from an outer frame and separated each other. The bulges act as a chip mounting portion (301), a connection portion of an inner lead (302), an outer electrode portion (303), and a body supporter (304). The outer frame forms a connection base (305). The connection portion of an inner lead (302) and the chip-mounting portion (301) are located in the front end of the outer electrode portion (303). The chip-mounting portion (301) has a reflecting cup (306). A manufacturing method of a LED comprises that the LED chip is encapsulated by injection moldingmethod; the outer pins of the LED are buckled; and the LED is detached from the connection base (305) to form an independent device.
Description
一种 LED引线框架及利用该引线框架制造 LED的方法 技术领域 LED lead frame and method for manufacturing LED using the same
本发明专利涉及一种发光二极管（LED)技术， 特别是涉及一种 LED 制造技术， 具体是引线框架结构及利用该引线框架制造 LED的方法。 背景技术 The present invention relates to a light emitting diode (LED) technology, and more particularly to an LED manufacturing technique, in particular to a lead frame structure and a method of manufacturing an LED using the lead frame. Background technique
图 1和图 2表示的是已知的 LED组成结构图， 分别表示了当前常用 的两大类 LED制造方法 Figure 1 and Figure 2 show the known LED structure diagrams, which show the two commonly used LED manufacturing methods.
图 1是最近几年推出的 PLCC型 LED,该结构属于表面贴装型，组装 精度高、密度高、生产效率高等优点。其主要组成部分有引线框 101、 LED 芯片 102、 连接引线 103、 封装胶体 104、 反射腔 105、 透镜 10^， 制造过 程中首先完成引线框 101及反射腔 105的成型， 然后安放 LED芯片 102 及连接引线 103， 最后点放封装胶体 104及安放透镜 106。 该类型的 LED 的一般带有反射腔 105， 以方便完成 LED的封装。封装胶体 104—般为环 氧树脂或硅胶， 封装胶体 104与反射腔 105之间必须有很好的气密性， 才 能够满足产品可靠性的要求。但是长时间使用时， 尤其是对于户外等条件 比较恶劣的应用领域，往往会发生封装胶体 104与反射腔 105分层的现象， 从而影响产品的质量， 该类产品受到了极大的限制。 Figure 1 shows the PLCC type LED introduced in recent years. This structure is a surface mount type with high assembly precision, high density, and high production efficiency. The main components are a lead frame 101, an LED chip 102, a connecting lead 103, an encapsulant 104, a reflective cavity 105, and a lens 10^. First, the lead frame 101 and the reflective cavity 105 are formed in the manufacturing process, and then the LED chip 102 is placed. The lead 103 is connected, and the encapsulant 104 and the lens 106 are placed at the last point. This type of LED typically has a reflective cavity 105 to facilitate the packaging of the LED. The encapsulant 104 is generally epoxy or silicone. The encapsulant 104 and the reflective cavity 105 must have good airtightness to meet the reliability requirements of the product. However, when used for a long time, especially in applications where the outdoor conditions are relatively harsh, the phenomenon that the encapsulant 104 and the reflective cavity 105 are delaminated often affects the quality of the product, and such products are greatly limited.
图 2是传统的支架式 LED的结构， 具有制造工艺简单等优点， 但在 使用过程中， 由于其自身的结构特点， 往往导致最终产品的一致性难以得 到很好的控制， 散热性、 装配密度等特性与贴片型 LED无法比拟。 2 is a structure of a conventional bracket type LED, which has the advantages of simple manufacturing process, etc., but in the course of use, due to its own structural characteristics, the consistency of the final product is often difficult to be well controlled, heat dissipation, assembly density. Other characteristics are incomparable with the SMD LED.
发明内容 Summary of the invention
本发明的目的在于提供一种结构简单、 便于安装、 产品一致性好的
LED引线框架。 The object of the present invention is to provide a simple structure, easy installation, and good product consistency. LED lead frame.
本发明的另一目的还在于提供一种利用上述 LED 引线框架制备 LED的方法。 Another object of the present invention is to provide a method of fabricating an LED using the above LED lead frame.
本发明的 LED引线框架结构， 为板式框架结构， 其特征在于， 板式 框架由外围框架内设置有向中间延伸且相互间隔的凸板， 所述凸板分别 构成芯片安放部、 内引线连接部、 外电极部、 管体支撑部， 外围框架构 成连接基板， 连接基板将各组成部分连接为一个整体， 内引线连接部与 芯片安放部位于外电极部的前端， 芯片安放部设置有反射腔。 The LED lead frame structure of the present invention is a plate type frame structure, wherein the plate frame is provided with a convex plate extending in the middle and spaced apart from each other by the peripheral frame, and the convex plates respectively constitute a chip mounting portion and an inner lead connecting portion. The outer electrode portion and the tube body supporting portion form a connection substrate, and the connection substrate connects the respective components as a whole, the inner lead connecting portion and the chip mounting portion are located at the front end of the outer electrode portion, and the chip mounting portion is provided with a reflection cavity.
作为上述方案的进一步说明， 所述反射腔为圆锥或椭圆锥形状。 芯 片安放部数量为 1个或多个， 相应的外电极部的数量为 1个或多个； 颜 色为一种或多种。 As further illustrated in the above aspect, the reflective cavity has a conical or elliptical cone shape. The number of the chip mounting portions is one or more, and the number of the corresponding outer electrode portions is one or more; the color is one or more.
引线框架为一个单元， 可以阵列为 N行 M列， 其中 N 1， M^l o 本发明的采用上述 LED引线框架制造 LED的方法， 主要包括- a.金属引线框架的预成型： 将金属钣金件加工成具有芯片安放部、 反射腔、 内引线连接部、 外电极部、 管体支撑部、 连接基板的金属引线 框架； The lead frame is a unit, and the array can be N rows and M columns, wherein N 1, M^lo The method for manufacturing LEDs using the LED lead frame of the present invention mainly includes: - a. metal lead frame preforming: metal sheet metal The workpiece is processed into a metal lead frame having a chip mounting portion, a reflective cavity, an inner lead connecting portion, an outer electrode portion, a tube supporting portion, and a connecting substrate;
b.芯片安放： 将 LED芯片安放于金属引线框上的芯片安放部， 并完 成电气连接； b. Chip placement: Place the LED chip on the chip mounting portion on the metal lead frame and complete the electrical connection;
c.胶体注塑成型： 采用封装胶体注塑成型的工艺， 将 LED芯片封装 起来， 外电极部、 连接基板设置于封装胶体外部， 管体支撑部的一部分 嵌于封装胶体内部， 进料口设置于 LED管体的底部； c. Colloid injection molding: The LED chip is packaged by a process of encapsulation colloid injection molding, the outer electrode portion and the connection substrate are disposed outside the encapsulant, a part of the tube support portion is embedded in the package colloid, and the feed port is disposed on the LED The bottom of the pipe body;
d.引脚折弯： 将外部电极部从与基板相连的位置断开并折弯， 引脚 折弯可为折向 LED管体的底面或侧面；
e.分离： 冲压断开封装胶体与管体支撑部的连接， 形成独立的 LED。 采用本发明提供的 LED制造方法制造的 LED具有如下优点-d. Pin bending: The external electrode portion is disconnected from the position connected to the substrate and bent, and the pin bending may be a bottom surface or a side surface of the LED tube body; e. Separation: Punching and disconnecting the encapsulant from the support of the tube body to form a separate LED. The LED manufactured by the LED manufacturing method provided by the present invention has the following advantages -
1、 产品一致性好： 采用塑封成型工艺克服了由于插入深度引起的产 品出光特性的大范围波动。 1. Good product consistency: The plastic molding process overcomes a wide range of fluctuations in the light output characteristics of the product due to the insertion depth.
2、 产品可靠性高： 封装胶体一体成型工艺克服了由于胶体与反射腔 之间界面的气密性问题引起的产品可靠性问题。 2. High product reliability: The integrated process of encapsulation colloid overcomes the reliability problem caused by the airtightness of the interface between the colloid and the reflective cavity.
3、 属于表面贴装型： 具有组装精度高、 密度高、 生产效率高等优点。 附图说明 3. It belongs to surface mount type: It has the advantages of high assembly precision, high density and high production efficiency. DRAWINGS
图 1 传统支架式 LED; Figure 1 Traditional bracket LED;
图 2 PLCC型 LED; Figure 2 PLCC type LED;
图 3 金属引线框架的预成型； Figure 3 preforming of a metal lead frame;
图 4 芯片安放及引线连接； Figure 4 chip placement and lead connections;
图 5 胶体注塑成型； Figure 5 Colloid injection molding;
图 6 引脚折弯； Figure 6 pin bending;
图 7 分立器件示意图； Figure 7 Schematic diagram of the discrete device;
图 8 产品阵列结构图。 Figure 8 Product array structure diagram.
附图标记说明： 芯片安放部 301、 内引线连接部 302、 外电极部 303、 管体支撑部 304、 连接基板 305、 反射杯 306、 金线 307、 封装胶体 308、 管体支撑部与连接基板连接处 309、 外电极部与连接基板连接处 310 具体实施方式 DESCRIPTION OF REFERENCE NUMERALS: chip mounting portion 301, inner lead connecting portion 302, outer electrode portion 303, tube body supporting portion 304, connecting substrate 305, reflecting cup 306, gold wire 307, encapsulant 308, tube body supporting portion and connecting substrate Connection portion 309, outer electrode portion and connection substrate connection portion 310
本发明具体实施实例说明如下： The specific embodiments of the present invention are described as follows:
实施实例 1提供了一种单芯片的 LED金属引线框架结构及利用该引 线框架制造 LED的方法：
如图 3所示金属引线框架的预成型示意图， 将 0.3mm厚度的钣金件 板式框架结构加工成由外围框架内设置有向中间延伸且相互间隔的凸 板， 外围框架构成连接基板， 所述凸板分别构成芯片安放部 301、 内引 线连接部 302、 外电极部 303、 管体支撑部 304、 连接基板 305几个组成 部分的金属引线框架； 连接基板将各组成部分连接为一个整体， 内引线 连接部与芯片安放部位于外电极部的前端， 芯片安放部设置有反射腔， 芯片安放部 301设置有反射杯 306， 所述反射腔为圆锥或椭圆锥形状。 芯片安放的数量为 1个或多个， 颜色为一种或多种。 Embodiment 1 provides a single-chip LED metal lead frame structure and a method of manufacturing the same using the lead frame: As shown in FIG. 3, a pre-formed schematic view of a metal lead frame is formed by processing a sheet metal frame structure having a thickness of 0.3 mm into a convex plate extending from the periphery of the peripheral frame and spaced apart from each other, and the peripheral frame constitutes a connection substrate, The convex plates respectively form a metal lead frame of the chip mounting portion 301, the inner lead connecting portion 302, the outer electrode portion 303, the tube supporting portion 304, and the connecting substrate 305; the connecting substrate connects the components into one whole, The lead connecting portion and the chip mounting portion are located at the front end of the outer electrode portion, the chip mounting portion is provided with a reflective cavity, and the chip mounting portion 301 is provided with a reflective cup 306, and the reflective cavity has a conical or elliptical cone shape. The number of chips placed is one or more, and the color is one or more.
如图 4所示的芯片安放示意图，将 LED芯片 306安放于芯片安放部 301的反射杯 306内， 并使用超声焊接的工艺使用金线 307完成芯片电 极与金属引线框上外部电极 303的电气连接。 As shown in the chip placement diagram shown in FIG. 4, the LED chip 306 is placed in the reflective cup 306 of the chip mounting portion 301, and the electrical connection between the chip electrode and the external electrode 303 on the metal lead frame is completed using a gold wire 307 using a ultrasonic bonding process. .
如图 5所示封装示意图， 采用注塑成型的方法， 采用封装胶体 308 将 LED芯片 306封装起来， 外部电极部 302、 金属引线框 304设置于封 装胶体 308的外部， 管体支撑部 303的一部分嵌于封装胶体 308内部； 注胶时的进料口设置于 LED的底部。 As shown in FIG. 5, the LED chip 306 is encapsulated by the method of injection molding, and the external electrode portion 302 and the metal lead frame 304 are disposed outside the encapsulant 308, and a part of the tube support portion 303 is embedded. Inside the encapsulant 308; the feed port at the time of injection is placed at the bottom of the LED.
如图 6所示引脚折弯示意图:将外部电极部 302从与金属引线框 304 相连的位置 309处断开并折弯成型。 The pin bending diagram is shown in Fig. 6: the outer electrode portion 302 is disconnected from the position 309 connected to the metal lead frame 304 and bent.
如图 7所示的分离示意图:冲压断开封装胶体 308与管体支撑部 303 的连接， 形成独立的 LED。 The separation diagram shown in Fig. 7 is to smear the connection of the encapsulant colloid 308 to the tube support 303 to form a separate LED.
实施实例 2提供了一种引线框架批量生产的解决方案，为 4*10的阵 列结构。 示意图如图 8所示。
Embodiment 2 provides a solution for mass production of lead frames, which is a 4*10 array structure. The schematic is shown in Figure 8.
Claims
1、一种 LED引线框架， 该引线框架为板式框架结构， 其特征在于， 板式框架由外围框架内设置有向中间延伸且相互间隔的凸板， 所述凸板 分别构成芯片安放部、 内引线连接部、 外电极部、 管体支撑部， 夕卜围框 架构成连接基板， 连接基板将各组成部分连接为一个整体， 内引线连接 部与芯片安放部位于外电极部的前端， 芯片安放部设置有反射腔。 An LED lead frame, wherein the lead frame is a plate frame structure, wherein the plate frame is provided with a convex plate extending in the middle and spaced apart from each other by the peripheral frame, the convex plates respectively forming a chip mounting portion and an inner lead The connection portion, the outer electrode portion, and the tube support portion form a connection substrate, and the connection substrate connects the respective components into one body, and the inner lead connection portion and the chip placement portion are located at the front end of the outer electrode portion, and the chip placement portion is disposed There is a reflective cavity.
2、 如权利 1所述的 LED引线框架， 其特征在于， 所述反射腔为圆 锥或椭圆锥形状。 2. The LED lead frame of claim 1, wherein the reflective cavity is in the shape of a cone or an elliptical cone.
3、 如权利 1所述的 LED引线框架， 其特征在于， 所述芯片安放部 数量为 1个或多个。 3. The LED lead frame according to claim 1, wherein the number of the chip mounting portions is one or more.
4、 如权利 3所述的 LED引线框架， 其特征在于， 所述外电极部的 数量相应的为 1个或多个。 4. The LED lead frame according to claim 3, wherein the number of the outer electrode portions is one or more.
5、 如权利 1所述的 LED引线框架， 其特征在于， 所述引线框架为 一个单元， 可以阵列为 N行 M列， 其中 N 1， M^ l o 5. The LED lead frame according to claim 1, wherein the lead frame is a unit, and the array is N rows and M columns, wherein N 1, M^ l o
6、 一种采用权利要求 1至 5任一项所述的 LED引线框架制造 LED 的方法， 其特征在于， 它包括如下步骤- a.金属引线框架的预成型： 将金属钣金件加工成具有芯片安放部、 反射腔、 内引线连接部、 外电极部、 管体支撑部、 连接基板的金属引线 框架； A method of manufacturing an LED using the LED lead frame according to any one of claims 1 to 5, characterized in that it comprises the following steps: a. Preforming of the metal lead frame: processing the metal sheet metal member into having a chip mounting portion, a reflective cavity, an inner lead connecting portion, an outer electrode portion, a tube body supporting portion, and a metal lead frame connecting the substrates;
b.芯片安放： 将 LED芯片安放于金属引线框上的芯片安放部， 并完 成电气连接； b. Chip placement: Place the LED chip on the chip mounting portion on the metal lead frame and complete the electrical connection;
c.胶体注塑成型： 采用封装胶体注塑成型的工艺， 将 LED芯片封装 起来， 外电极部、 连接基板设置于封装胶体外部， 管体支撑部的一部分
嵌于封装胶体内部； c. Colloid injection molding: The LED chip is packaged by a process of encapsulation colloid injection molding, and the outer electrode portion and the connection substrate are disposed outside the encapsulant, and part of the tube support portion Embedded in the interior of the encapsulant;
d.引脚折弯： 将外部电极部从与基板相连的位置断开并折弯； e.分离： 冲压断开封装胶体与管体支撑部的连接， 形成独立的 LED。 d. Pin bending: Disconnect and bend the external electrode from the position connected to the substrate; e. Separate: Punch the connection between the encapsulant and the tube support to form a separate LED.
7、 如权利 6所述的 LED制造方法， 其特征在于， 所述第 c步骤中 所述封装胶体注塑成型工艺， 进料口设置于 LED管体的底部。 7. The LED manufacturing method according to claim 6, wherein in the encapsulating colloid injection molding process in the step c, the feed port is disposed at a bottom of the LED tube body.
8、 如权利 6所述的 LED制造方法， 其特征在于， 所述第 d步骤中 引脚折弯为折向 LED管体的底面或侧面。 8. The method of manufacturing an LED according to claim 6, wherein in the step d, the pin is bent to be folded toward a bottom surface or a side surface of the LED tube body.
9、 如权利 6所述的 LED制造方法， 其特征在于， 所述第 a步骤中 反射腔是在 LED引线 AS架上直接冲压而成。
9. The method of manufacturing an LED according to claim 6, wherein in the step (a), the reflective cavity is directly stamped on the LED lead AS frame.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100324227A CN101207170B (en) | 2007-12-13 | 2007-12-13 | LED lead frame and method for manufacturing LED using the lead frame |
| CN200710032422.7 | 2007-12-13 |
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| WO2009079892A1 true WO2009079892A1 (en) | 2009-07-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/CN2008/000380 WO2009079892A1 (en) | 2007-12-13 | 2008-02-22 | A led lead frame and manufacturing method of led using the lead frame |
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| CN (1) | CN101207170B (en) |
| WO (1) | WO2009079892A1 (en) |
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| CN101207170A (en) | 2008-06-25 |
| CN101207170B (en) | 2010-09-22 |
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