CN101344236B - Short-pitch thin LED lead frame - Google Patents

Short-pitch thin LED lead frame Download PDF

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Publication number
CN101344236B
CN101344236B CN2008101968512A CN200810196851A CN101344236B CN 101344236 B CN101344236 B CN 101344236B CN 2008101968512 A CN2008101968512 A CN 2008101968512A CN 200810196851 A CN200810196851 A CN 200810196851A CN 101344236 B CN101344236 B CN 101344236B
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CN
China
Prior art keywords
lead frame
led
pitch
pin leads
short
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101968512A
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Chinese (zh)
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CN101344236A (en
Inventor
彭会银
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hubei Kuangtong Ltd By Share Ltd
Original Assignee
HUBEI KUANGTONG ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by HUBEI KUANGTONG ELECTRONIC CO Ltd filed Critical HUBEI KUANGTONG ELECTRONIC CO Ltd
Priority to CN2008101968512A priority Critical patent/CN101344236B/en
Publication of CN101344236A publication Critical patent/CN101344236A/en
Application granted granted Critical
Publication of CN101344236B publication Critical patent/CN101344236B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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Abstract

The invention relates to a short pitch thin LED lead frame, which comprises a fabrication rim, wherein, fabrication holes are evenly opened on the fabrication rim that is connected with a plurality of LED double-pin leads which are connected with each other by upper connection ribs. The distance between the center lines of the two adjacent LED double-pin leads, namely, the pitch a, is less than 7.26 mm while the thickness of the steel belt which is used for manufacturing the lead frame is less than 0.5mm. In the invention, the distance between the center lines of the two adjacent LED double-pin leads on the single LED lead frame is shortened, and the thickness of the used steel belt is reduced, therefore, more LED double-pin leads can be arranged on each lead frame, the use quantity of the steel belt is reduced, and the production cost is lowered.

Description

Short-pitch thin LED lead frame
Technical field
The present invention relates to the lead frame that a kind of LED of production is a Light-Emitting Diode, particularly a kind of short-pitch thin LED lead frame.
Background technology
LED is that light emitting diode belongs to the environmental protection light source, find broad application at indicator lamp, ornament lamp, Landscape Lamp, torch with light fixtures such as lamp, traffic lights, auto lamp, road lighting lamps, progressively will replace the traditional lighting lamp, LED with peculiar cold light source, energy consumption is low, efficient is high, the life-span is long etc., and performance makes its purposes more and more wider, but because encapsulation cost of manufacture height, cause the LED cost higher, influenced and hindered utilization and the development of LED.The general lead frame technology edge lengths of present direct insertion LED encapsulation is 152.4 millimeters, and pitch is 7.62 millimeters, and thickness of strips is 0.5 millimeter, and pitch is bigger, makes steel band thicker, has increased the consumption of steel band.
Summary of the invention
The objective of the invention is to provide a kind of on the basis that ensures the LED quality, reduce the steel using amount of LED lead frame, the short-pitch thin LED lead frame that reduces production costs.
The object of the present invention is achieved like this: a kind of short-pitch thin LED lead frame, comprise the technology limit, evenly have fabrication hole on the technology limit, vertical many LED two pin leads that are connected with the technology limit, connect by the last muscle that connects between LED two pin leads, the distance between adjacent two LED, the two pin leads center lines is that pitch a is less than 7.62 millimeters.Be used to make the thickness of strips of lead frame less than 0.5 millimeter.Distance between adjacent two LED, the two pin leads center lines is that pitch a is 5.08 millimeters.The thickness of strips that is used to make lead frame is 0.4 millimeter.
Short-pitch thin LED lead frame provided by the invention, the distance that has shortened between two LED, the two pin leads center lines adjacent on the single LED lead frame is a pitch, can arrange more LED two pin leads on former 20 every the lead frame.LED lead frame pitch is 5.08 millimeters, thickness of strips 0.4 for the LED lead frame of millimeter just is 7.62 millimeters than traditional pitch, and thickness of strips is 0.5 millimeter LED lead frame steel band consumption saving 46.66%, has reduced production cost.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is a structural representation of the present invention.
The specific embodiment
As shown in Figure 1, the present invention includes technology limit 1, evenly have fabrication hole 2 on the technology limit 1,, connect by the last muscle 4 that connects between LED two pin leads 3 with technology limit 1 vertical many LED two pin leads 3 that are connected with.
Among the present invention, lead frame technology edge lengths b is 152.4 millimeters, and is identical with the length of common lead frame.Distance between adjacent two LED, two pin leads, 3 center lines is that pitch a is less than 7.62 millimeters, it is 7.5 millimeters, 7.1 millimeters, 6.8 millimeters, 6 millimeters, 5.8 millimeters, 5.1 millimeters, 5.08 millimeters, 5.01 millimeters, 4.98 millimeters etc., satisfying the shortening of pitch a that tries one's best under the prerequisite of technological requirement, to save the steel band consumption.
The thickness of strips that is used to make lead frame is less than 0.5 millimeter, and commonly used is 0.4 millimeter.

Claims (3)

1. short-pitch thin LED lead frame, comprise technology limit (1), evenly have fabrication hole (2) on the technology limit (1), vertical many LED two pin leads (3) that are connected with technology limit (1), connect by the last muscle (4) that connects between LED two pin leads (3), it is characterized in that: the distance between adjacent two LED two pin leads (3) center line be pitch a less than 7.62 millimeters, be used to make the thickness of strips of lead frame less than 0.5 millimeter.
2. short-pitch thin LED lead frame according to claim 1 is characterized in that: the distance between adjacent two LED two pin leads (3) center line is that pitch a is 5.08 millimeters.
3. short-pitch thin LED lead frame according to claim 1 is characterized in that: the thickness of strips that is used to make lead frame is 0.4 millimeter.
CN2008101968512A 2008-09-03 2008-09-03 Short-pitch thin LED lead frame Expired - Fee Related CN101344236B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008101968512A CN101344236B (en) 2008-09-03 2008-09-03 Short-pitch thin LED lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008101968512A CN101344236B (en) 2008-09-03 2008-09-03 Short-pitch thin LED lead frame

Publications (2)

Publication Number Publication Date
CN101344236A CN101344236A (en) 2009-01-14
CN101344236B true CN101344236B (en) 2010-06-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101968512A Expired - Fee Related CN101344236B (en) 2008-09-03 2008-09-03 Short-pitch thin LED lead frame

Country Status (1)

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CN (1) CN101344236B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102544339A (en) * 2010-12-18 2012-07-04 湖北匡通电子有限公司 SMD(surface mount device) type LED short-pitch lead frame

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018125645B3 (en) * 2018-10-16 2020-01-23 Ledvance Gmbh Process for producing a tube lamp and corresponding tube lamp

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2580606Y (en) * 2002-11-02 2003-10-15 潍坊华光新能电器有限公司 Power type light-emitting diode frame
CN1154183C (en) * 2001-04-11 2004-06-16 彭会银 Composite Ag-Sn LED lead frame
CN101005109A (en) * 2006-01-16 2007-07-25 榎本股份有限公司 Low height lead frame for LED device and the manufacturing method thereof
CN101207170A (en) * 2007-12-13 2008-06-25 佛山市国星光电股份有限公司 LED lead frame and method for manufacturing LED using the lead frame
CN201265825Y (en) * 2008-09-03 2009-07-01 湖北匡通电子有限公司 Short-pitch thin LED lead frame

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1154183C (en) * 2001-04-11 2004-06-16 彭会银 Composite Ag-Sn LED lead frame
CN2580606Y (en) * 2002-11-02 2003-10-15 潍坊华光新能电器有限公司 Power type light-emitting diode frame
CN101005109A (en) * 2006-01-16 2007-07-25 榎本股份有限公司 Low height lead frame for LED device and the manufacturing method thereof
CN101207170A (en) * 2007-12-13 2008-06-25 佛山市国星光电股份有限公司 LED lead frame and method for manufacturing LED using the lead frame
CN201265825Y (en) * 2008-09-03 2009-07-01 湖北匡通电子有限公司 Short-pitch thin LED lead frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102544339A (en) * 2010-12-18 2012-07-04 湖北匡通电子有限公司 SMD(surface mount device) type LED short-pitch lead frame
CN102544339B (en) * 2010-12-18 2015-08-19 湖北匡通电子股份有限公司 SMD type LED short pitch lead frame

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Publication number Publication date
CN101344236A (en) 2009-01-14

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Address after: 443600 Zigui City, Yichang province Mao Ping Town, East Road, building

Patentee after: HUBEI KUANGTONG LIMITED BY SHARE LTD.

Address before: 443600, No. 18, East Main Road, Mao Ping Town, Zigui County, Hubei

Patentee before: HUBEI KUANGTONG ELECTRONIC Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100602

Termination date: 20210903

CF01 Termination of patent right due to non-payment of annual fee