TWI665406B - Light emitting device - Google Patents

Abstract

The present invention provides a supporting bracket, which includes a frame including at least a supporting portion; and a supporting body including a housing and at least an electrode portion; wherein the supporting system is mechanically coupled to the supporting portion through the supporting portion; The frame. In addition, the present invention also provides a method for manufacturing the aforementioned carrier bracket; and a light-emitting device manufactured therefrom and a method for manufacturing the same. In particular, the carrier bracket of the present invention has a carrier body which is separated from each other in advance and is mechanically coupled to the frame, so that the material can be quickly discharged after sealing. At the same time, the load-bearing systems in the load-bearing bracket of the present invention are electrically separated from each other, and electrical measurements can be made before the material is unloaded. Thereby, the production speed and yield of the light-emitting device manufactured from the light-emitting device can be improved.

Description

   Light emitting device   

The invention relates to a supporting bracket and a light-emitting device prepared therefrom. In particular, it relates to a holder for accommodating a light-emitting diode wafer and a light-emitting device prepared therefrom.

Light-emitting diodes have advantages such as long life, small size, high shock resistance, low heat generation, and low power consumption, so they have been widely used as indicators or light sources in households and various devices. In recent years, light-emitting diodes have developed toward multi-color and high brightness, so their application fields have expanded to large outdoor signages, traffic lights, and related fields. In the future, light emitting diodes may even become the mainstream of lighting sources with both power saving and environmental protection functions. In order to make the light-emitting diodes have good reliability, the light-emitting diodes often undergo a packaging process to form a durable light-emitting device.

Recently, a person in the related field of the present invention has developed a cutting type support bracket. One of them is to mold a plastic body on a metal sheet, and then cut the metal sheet and the plastic and plastic body at the same time by cutting after solid crystal bonding, wire bonding, and sealing, so as to form a separate light-emitting device. However, a large amount of plastic and metal dust is easily generated during the cutting, which seriously pollutes the surface of the final product and thus affects the reliability of the product. In addition, the process cannot perform the pre-lighting test before sealing, and the final product must be singulated before measuring one by one. However, the final product after the single pelletization is scattered and stacked, and it is necessary to adjust the orientation and direction first to facilitate the machine measurement. This requires additional equipment and is time consuming.

In view of the above-mentioned problems, the present invention provides a load-bearing bracket. The load-bearing bracket is mechanically coupled to a frame with a carrier body separated in advance. At the same time, the load-bearing systems in the load-bearing bracket of the present invention are electrically separated from each other, so that the light-emitting diode solid-state bonding wire can be electrically measured after the load-bearing body before being cut. In addition, the present invention also provides a light emitting device made of the supporting bracket. With the advantages of the aforementioned supporting bracket, the production speed and yield of the light emitting device can be greatly improved.

100, 100 ’, 100” ‧‧‧bearing bracket

110‧‧‧ Carrier

111‧‧‧shell

111A‧‧‧case section

111R‧‧‧ Rounded

112‧‧‧electrode section

112A‧‧‧wing

112A1‧‧‧Outer central area, central area

112A2‧‧‧ Outside edge area, edge area, electrode section

112B‧‧‧ inside

112C‧‧‧Connecting surface

1121‧‧‧Concave

120‧‧‧Frame

121‧‧‧ support

122‧‧‧Aisle area

123‧‧‧side

130‧‧‧vacant area

131‧‧‧Gap

132‧‧‧First through slot

133‧‧‧Second through slot

140‧‧‧ extension

141‧‧‧ keyhole

142‧‧‧stage

143‧‧‧groove

150‧‧‧ plastic body

151‧‧‧residue

160‧‧‧ conductive bracket

D1, D2, D3, D4, D5 ‧‧‧ intervals

FIG. 1 is a partial schematic view of an embodiment of a bearing bracket of the present invention.

FIG. 2 is a partial schematic view of the conductive bracket used in the bearing bracket of FIG. 1.

Fig. 3 is a partial schematic view of the bearing bracket of Fig. 1 after forming a plastic body.

Figures 4 and 4A are partial schematic views of the load-bearing bracket of Figure 1 after the residual material is removed.

FIG. 5 is a partial schematic view of another embodiment of the bearing bracket of the present invention.

FIG. 6 is a plan view of a light emitting device according to an embodiment of the present invention.

FIG. 7 is a plan view of a light emitting device according to another embodiment of the present invention.

FIG. 8 is a plan view of a light emitting device according to another embodiment of the present invention.

FIG. 9 is a plan view of a light emitting device according to still another embodiment of the present invention.

FIG. 10 is a plan view of a light emitting device according to another embodiment of the present invention.

FIG. 11 is a plan view of a light emitting device according to an embodiment of the present invention.

12A to 12D are a top view, a full cross-sectional view in the front-rear direction, a full cross-sectional view in the left-right direction, and a partially enlarged detailed view of a load bearing bracket according to an embodiment of the present invention.

FIG. 13A to FIG. 16 are schematic diagrams of each step of a manufacturing method of a bearing bracket according to an embodiment of the present invention.

17A to 17D are a top view, a full cross-sectional view in the front-rear direction, a full cross-sectional view in the left-right direction, and a partially enlarged detailed view of a load bearing bracket according to one embodiment of the present invention.

FIG. 18A to FIG. 22 are schematic diagrams of each step of a manufacturing method of a bearing bracket according to an embodiment of the present invention.

The carrying bracket of the present invention includes a frame and a carrying body, and the carrying system includes a casing and at least one electrode portion. In the present invention, the frame includes at least one supporting portion, and is combined with the carrier mechanically to support the carrier on the frame. In a specific embodiment of the present invention, the casing may have a recessed portion that matches the shape of the support portion, and the support body is supported on the frame by a combination between the support portion and the recessed portion. In the present invention, the position of the recessed portion is not particularly limited, and may be on the side surface of the carrier or the boundary between the bottom surface and the side surface. The corresponding supporting portion is deeply penetrated into the inside of the carrier or is only partially exposed on the bottom surface of the carrier.

It is a partial schematic diagram of an embodiment of the bearing bracket of the present invention. As shown in FIG. 1, the supporting bracket 100 includes a supporting body 110 and a frame 120. The supporting body 110 further includes a casing 111 and two electrode portions 112. The frame 120 includes a plurality of supporting portions 121. As shown in FIG. 1, the frame 120 below the supporting bracket 100 includes four supporting portions 121, and the boundary between the side surface and the bottom surface of the housing 111 includes four recessed portions (corresponding to the positions of the supporting portions 121). The four supporting portions 121 are partially exposed on the bottom surface of the carrier 110. In one embodiment, the carrier 110 further includes a reflective concave cup for exposing a part of the electrode portion 112. Among them, the electrode portion 112 extends outward from the reflective concave cup to the outside through the casing 111.

The frame 120 may also have a channel region 122 and a side portion 123, and the channel region 122 is disposed on the side portion 123. The passage area 122 is a hollow area for allowing a plastic body 150 (shown in FIG. 3) described below to flow through; the support portion 121 is also disposed on the side portion 123.

In addition, in the present invention, a keyhole, a groove (a linear slit on the surface of the electrode portion), and a step portion design may be added to the electrode portion 112. The mechanical coupling force between the casing and the electrode portion in the carrier can be increased by the lock hole, the groove and the step portion. As shown in FIG. 1, the two electrode portions 112 in the carrier 110 each include two lock holes 141 and three grooves 143, and a step portion 142 is provided on the edge of the two electrode portion 112 surrounded by the casing 111. This increases the bonding strength of the case 111 and the electrode portion 112.

In the carrying bracket of the present invention, each carrying system is supported on the frame by a mechanical coupling between the recessed portion and the supporting portion, and the electrode portions between the carrying bodies are electrically independent from each other. Therefore, electrical measurement can be performed on the light-emitting devices that have not been singulated (that is, each light-emitting device is still supported on the frame in sequence) after the subsequent light-emitting device is solidified, bonded and packaged. Among them, the light-emitting devices are arranged neatly, which can eliminate the equipment and man-hours for adjusting the orientation and direction, and can greatly increase the production speed of the light-emitting devices.

The carrying bracket of the present invention can be made by the following method. First, a conductive support is provided. The conductive support includes a frame, at least one empty area, and at least one extension portion. The frame further includes at least one support portion. A plastic body is then formed on the conductive support. The plastic system covers at least part of the extension and at least part of the support, and fills at least part of the empty area. After that, a part of the extension part exposing the casing and a part of the plastic body filled in the empty area are removed respectively, thereby forming a carrier. In particular, after these two removal steps, the remaining plastic body forms a housing in the carrier, and the extensions remaining on the plastic body form an electrode portion in the carrier.

The manufacturing process of the supporting bracket 100 in the first figure is described in detail below with reference to FIGS. 2 to 4. First, as shown in FIG. 2, a conductive support 160 is provided, which includes a frame 120, a plurality of empty regions 130, and a plurality of extensions 140. The frame 120 also includes a plurality of support portions 121, and the extension portion 140 includes a plurality of lock holes 141, a groove 143, and a step portion 142. Finally, the extending portion 140 exposed from the casing is removed to form a carrying bracket 100 as shown in FIG. 1.

In the present invention, the conductive support may be formed of a metal sheet, including a pure metal, an alloy, and a metal composite layer. The composite plate is preferably a metal covered with a conductive layer having a higher oxidation resistance or a higher solder bonding force. Sheets, such as silver-plated copper. In addition, the frame, the extension and the empty area are formed by an appropriate method. Taking a metal sheet as an example, it may be formed by stamping; however, it may also be formed by cutting or die casting. In addition, if the conductivity of the conductive bracket is insufficient, a conductive layer (not shown) can be formed on the conductive bracket after the conductive bracket is provided (the conductivity of the conductive layer is higher than that of the conductive bracket), In order to increase the reliability of subsequent test results, the material of the conductive layer may include a highly conductive material such as silver.

After the conductive support is provided, a plastic body is subsequently formed on the conductive support. The method of forming the plastic body is not limited, and it can be formed by transfer molding or injection molding. There are no restrictions on the raw materials of the plastic body, and plastic composites commonly used in the industry, such as epoxy resin composition, silicone composition, polyphthalamide composition, or polymer Polyethylene terephthalate composition. In one embodiment of the present invention, an epoxy resin composition is used, and a plastic body is formed by transfer molding. In one embodiment, the plastic body may be a thermosetting material, and may further include a reflective material, such as titanium dioxide (TiO ₂ ), zirconia (ZnO), or boron nitride (BN).

As shown in FIG. 3, a plastic body 150 is formed on the conductive support 160. The plastic body 150 covers the extension 140 of the part and completely covers all the lock holes 141 and the grooves 143. The plastic body 150 also fills a part of the empty area 130 (the empty area 130 above and below the extension 140 is not filled) and completely covers all the support portions 121; the plastic body 150 will also fill the channel area 122 and be adjacent to it The other plastic body 150 is integrated.

In summary, in the present invention, the raw material of the plastic body 150 will be filled in the cavity and the empty space of the mold during the formation process. In this step, the casing 111 and the residual material 151 are still integrated. The definition of the residual material 151 depends on the application scope of subsequent products. As shown in FIG. 3, the portion shown by the dotted line is the residual material 151 defined in this embodiment. Subsequently, as shown in FIG. 4, the defined residual material 151 is removed, thereby forming the casing 111 in the carrier 110.

If the channel area 122 is filled with the plastic body 150, it can be divided into at least two steps to remove the residual material 151, for example, the residual material 151 filled in the channel area 122 is removed first, and then the residual material filled in the empty area 130 is removed. 151, and vice versa. This can simplify the configuration of the cutters used to remove the residual material 151 in each step, make the distance between the cutters sufficient, and make the cutters have better strength.

Finally, the extending portion 140 exposed from the casing 111 is removed to form the supporting bracket 100 as shown in FIG. 1. Before removing the extension portion 140, a portion of the frame 120 on both sides of the passage area 122 may be removed with a cutter longer than the passage area 122 to remove the remaining material 151 in the passage area 122. It is avoided that the residual material 151 falls off to the electrode portion 112 or the light-emitting diode wafer to cause damage. After part of the frame 120 on both sides of the Tongdang road area 122 is removed, the length of the passage area 122 will increase, as shown in FIG. 4A.

Therefore, the manufacturing method of this embodiment may optionally perform two or more removal steps on the conductive support 160, and may also perform two or more removal steps on the plastic body 150 (residual material 151).

In the present invention, the residual material 151 and the extension 140 are removed separately. Specifically, the order of removing the residual material 151 and the extension 140 is not particularly limited, but they can be removed separately. For example, all the residual material 151 can be removed at the same time and then all the extensions 140 can be removed at the same time, and all the residual material 151 can be removed at the same time and all the residual materials 151 can be removed at the same time. Except for a part of the residual material 151 and the extension 140, the two can be performed interactively. The removal method is not limited. For example, it can be performed by cutting, stamping, and the like, preferably by stamping. In the embodiment of the present invention, punching is taken as an example.

The invention can adjust the appliance and the working intensity according to the mechanical characteristics of the removed part. In particular, the separate removal steps can avoid disadvantages caused by removing different materials at the same time, such as surface defects caused by uneven stress, damage to the removal tool (tool), and the like. In addition, compared to removing the extension, plastic body dust is usually generated when the plastic body is removed. These dusts need to be removed with a strong external force, such as strong wind, jitter or ultrasound. If the residual material and the extension are removed for cleaning at the same time, the force between the carrier and the frame may be difficult to support at this time and there is a risk of falling. Therefore, the present invention preferably removes the residual material and then performs cleaning work (ie, cleaning the plastic body), and then removes the extension. Thereby, the extension portion can be used to strengthen the connection strength between the carrier and the frame, avoiding the situation of blanking during cleaning, and finally removing the extension portion.

After removal, the extension portion generates at least one electrode portion cross section on the electrode portion of the carrier, and the residual material generates a case cross section on the housing of the carrier after removal. In the present invention, depending on the safety specifications of the final product or customer requirements, the cross section of the electrode portion and the cross section of the case may be on the same surface or different surfaces of the carrier. In the case where the cross section of the electrode portion and the cross section of the case are the same surface of the carrier, the cross section of the electrode portion and the cross section of the case may be flush (constituting a straight surface) or uneven (not constituting a straight surface).

As shown in FIG. 1, the electrode portion 112 has a wing portion 112A exposed from the casing. The wing portion 112A has a central outer protruding area (or central area) 112A1 and two outer edge areas (or edge areas) 112A2. . In the embodiment shown in FIG. 1, each edge region 112A2 includes an electrode section cross-section, and the electrode section cross-section is flush with a part of the case section 111A of the case 111. At this time, the carrier has Flatter appearance. However, as shown in FIG. 5, the wing portion 112A of the electrode portion 112 has a central outer protruding region 112A1 and two outer edge regions 112A2. The cross section of the electrode portion of the electrode portion 112 is not the same as the cross section 111A of the case 111. In general, at this time, the electrode portion 112 has an additional side area, which can increase the bonding force with the solder, thereby enhancing the strength of the light emitting device after the subsequent printing.

In addition, in the case where the conductive support is a metal composite sheet having an anti-oxidation layer, a cross-section not covered with an anti-oxidation layer is generated in a cross section of the electrode portion. In the present invention, the section not covered with the anti-oxidation layer is preferably integrated with the central region of the electrode portion. During the covering process, the solder can climb along the side of the wing and cover the side. At this time, at least part of the section not covered with the anti-oxidation layer can be covered by the solder, which can reduce the probability of oxidation of the section. In addition, the section not covered with the anti-oxidation layer is on the same side as the surface of the adjacent central area. It is preferable to form a continuous surface to reduce the occurrence of sharp edges or burrs on the electrode portion, which in turn causes the loss of subsequent processing machines, and even worse The effect of charge accumulation at the tip or burr will affect the reliability of the end product.

The present invention also provides a light-emitting device prepared by the carrying bracket of the present invention. The light-emitting device includes a carrier, a light-emitting diode chip, and a package. The light emitting diode wafer is carried in a carrier and covered by a package. In the present invention, the material of the package body may be a composite of plastic materials such as epoxy resin or silicon rubber. In addition, the light-emitting device of the present invention may add a fluorescent material to the package as required. Examples of the fluorescent material are: aluminate fluorescent materials (such as doped yttrium aluminum oxide compound, doped erbium) Aluminum oxide compound, doped hafnium aluminum oxide compound, or a combination thereof), silicate fluorescent substance, sulfide fluorescent substance, oxynitride fluorescent substance, nitride fluorescent substance, fluoride fluorescent substance Or a combination.

The light-emitting device of the present invention can be produced by the following method. First, the aforementioned supporting bracket is provided. Subsequently, a light-emitting diode wafer is provided and the die-bonding and bonding wires are placed in the reflective concave cup of the carrier. Afterwards, the reflective concave cup is filled with encapsulating gel to encapsulate and seal the light-emitting diode chip, that is, a light-emitting device is formed on the frame. Finally, the light-emitting device and the frame are separated (that is, the frame carrier is separated from the frame, for example, by extruding) to form a separate light-emitting device.

In the present invention, a plurality of light-emitting diode wafers can also be provided in a carrier, and the light-emitting diode wafers can emit light with the same or different screen spectrum. After the light emitting diode wafer is fixed, a wire bonding operation may be performed to electrically connect the light emitting diode wafer and the electrode portion. According to the needs of the final product, other electronic components can also be provided, such as Zener diodes or thermistors.

Please refer to FIG. 6, which is a top view of a light emitting device according to an embodiment of the present invention. The wing portion 112A of the electrode portion 112 has a central region 112A1 and two edge regions 112A2, and the central region 112A1 protrudes from the two edge regions 112A2. The wing portion 112A protrudes beyond the case section 111A of the case 111, so that the central region 1112A1 of the wing portion 112A of the electrode section 112 and the case section 111A of the case 111 are non-coplanar. The interval D1 is the distance between the central region of the wing portion 112A of the electrode portion 112 and the inner region of the cross section 111A of the case 111, and is about 0.1 mm. The interval D2 is the distance between the central region 112A1 of the wing portion 112A of the electrode portion 112 and the outer region of the wing portion 112A of the case 111, that is, the central region 112A1 of the wing portion 112A of the electrode portion 112 and the wing portion 112A of the case 111. , About 0.05mm.

Please refer to FIG. 7, which is a top view of a light emitting device according to another embodiment of the present invention. The wing portion 112A of the electrode portion 112 has a central region 112A1 and two edge regions 112A2, and protrudes beyond the case section 111A of the case 111, so that the wing portion 112A of the electrode portion 112 and the case section 111A of the case 111 are Non-coplanar. The interval D1 is a distance between the center of the wing portion 112A of the electrode portion 112 and the inner region of the case cross section 111A of the case 111, and is about 0.1 mm. The interval D3 is a distance between the central region 112A1 of the wing portion 112A of the electrode portion 112 and the outer region of the cross-section 111A of the case 111, and is about 0.075 mm.

Please refer to FIG. 8, which is a top view of a light emitting device according to another embodiment of the present invention. The wing portion 112A of the electrode portion 112 has a central region 112A1 and two edge regions 112A2, and the central region 112A1 is recessed in the two edge regions 112A2, and the cross section of the electrode portions of the two edge regions 112A2 is an inclined surface. The wing portion 112A is recessed within the cross-section 111A of the case 111, so that the wing portion 112A of the electrode portion 112 and the cross-section 111A of the case 111 are non-coplanar. The interval D4 is the distance between the outer region and the inner region of the cross-section 111A of the casing 111, and is about 0.05 mm. The interval D5 is a distance between the center of the wing portion 112A of the electrode portion 112 and the outer area of the cross-section 111A of the case 111, and is about 0.025 mm.

Please refer to FIG. 9, which is a top view of a light emitting device according to another embodiment of the present invention. The wing portion 112A of the electrode portion 112 has a central region 112A1 and two edge regions 112A2, and the central region 112A1 protrudes from the two edge regions 112A2, and the cross section of the electrode portions of the two edge regions 112A2 is an inclined surface. The wing portion 112A protrudes beyond the cross-section 111A of the case 111 so that the wing portion 112A of the electrode portion 112 and the cross-section 111A of the case 111 are non-coplanar.

Please refer to FIG. 10, which is a top view of a light emitting device according to another embodiment of the present invention. The wing portion 112A of the electrode portion 112 is a convex surface, that is, the outer surface of the central region and the outer contour of the edge region (section of the electrode portion) form a continuous convex surface. The wing portion 112A protrudes beyond the cross-section 111A of the casing 111 so that the wing portion 112A of the electrode portion 112 and the cross-section 111A of the case 111 are non-coplanar.

Please refer to FIG. 11, which is a top view of a light emitting device according to an embodiment of the present invention. The wing portion 112A of the electrode portion 112 is a concavely curved surface, that is, the outer surface of the central region and the outer contour of the edge region (section of the electrode portion) form a continuous concavely curved surface. The wing portion 112A is recessed within the cross-section 111A of the case 111, so that the wing portion 112A of the electrode portion 112 and the cross-section 111A of the case 111 are non-coplanar.

Please refer to FIG. 12A to FIG. 12D, which are schematic diagrams of a supporting bracket 100 'according to an embodiment of the present invention (i.e., a top view, a full sectional view in the front-rear direction, a full sectional view in the left-right direction, and Partial zoom detail). The carrying bracket 100 ′ is similar to the aforementioned carrying bracket 100, that is, the carrying bracket 100 ′ also includes a frame 120 and a carrying body 110. The frame 120 includes at least one supporting portion 121, and the carrying body 110 has a shell. The body 111 and at least one electrode portion 112, and the casing 111 is mechanically coupled to the frame 120 by the supporting portion 121; therefore, the technical content of the above-mentioned components can refer to the counterpart of the supporting bracket 100.

Preferably, the at least one electrode portion 112 may be two electrode portions 112 spaced apart from each other to serve as an anode end and a cathode end of the carrier 110. The two electrode portions 112 are surrounded by the frame 120, that is, the two electrode portions 112 are located in a space surrounded by the frame 120 itself. The two electrode portions 112 and the frame 120 may be separated by at least one empty region 130 so that the two electrodes do not contact each other, and the two electrode portions 112 are electrically isolated from the frame 120.

The supporting portion 121 of the frame 120 extends toward one of the two electrode portions 112 but does not contact the electrode portion 112. In this embodiment, there are four support portions 121, which are distributed on both sides of the electrode portion 112. The housing 111 may cover at least the supporting portion 121 and at least a part of the two-electrode portion 112, and is disposed at least in a part of the empty area 130: thereby, the housing 111 is mechanically coupled to the frame 120 through the supporting portion 121. The casing 111 and the two electrode portions 112 are also mechanically coupled, so that the casing 111 and the two electrode portions 112 are held in the frame 120 without falling off.

The shape characteristics of the electrode portion 112 will be further described. Please refer to FIG. 13A for reference. Each of the two electrode portions 112 has a wing portion 112A and an inner side surface 112B which are oppositely disposed (that is, oppositely disposed). (Refer to the related descriptions in FIGS. 6 to 11 described above), and do not face the wing portion 112A of the other electrode portion 112; the inner side surface 112B of the two electrode portions 112 may face each other, and at least part of the The two electrode portions 112 may be covered by the case 111.

Each of the two electrode portions 112 further has two connecting surfaces 112C opposite to each other, which connect the wing portion 112A and the inner side surface 112B, that is, an edge (such as the front side) of the connection surface 112C connects with an edge (such as the left side) of the wing portion 112A. ), And the other edge (such as the back side) of the connecting surface 112C is connected to an edge (such as the left side) of the inner side surface 112B. The wing portion 112A, the inner side surface 112B, and the two connection surfaces 112C may be non-planar, that is, the wing portion 112A, the inner side surface 112B, and the two connection surfaces 112C may be uneven surfaces or stepped surfaces.

Each of the two electrode portions 112 may further have at least one recessed portion 1121, and the recessed portion 1121 may be disposed on the connection surface 112C, so that the connection surface 112C becomes an uneven surface. The concave portion 1121 can increase the contact area between the electrode portion 112 and the case 111 (the plastic body 150) and increase the clamping effect between the electrode portion 112 and the case 111 through a geometric correspondence relationship, so that the electrode portion 112 and the case The binding force between 111 is strong. When there are a plurality of recessed portions 1121, the dimensions of each recessed portion 1121 may be designed to be inconsistent, so as to correspond to the required bonding force between the electrode portion 112 and the casing 111 at different places.

The wing portion 112A, the inner side surface 112B, and the two connecting surfaces 112C of the two electrode portions 112 may distinguish the at least one empty area 130 into a plurality of empty areas 130, that is, the empty areas 130 may be a gap 131 and a second The through groove 132 and the two second through grooves 133 are in communication with each other. The gap 131 is disposed between the inner side surfaces 112B of the two electrode portions 112, and the two first through grooves 132 are provided along the two connection surfaces 112C of the two electrode portions 112, that is, one first through groove 132 is formed by An edge of a connecting surface 112C of one of the electrode portions 112 extends to an edge of a connecting surface 112C of the same surface of the other electrode portion 112; the two first through grooves 132 are spaced apart from each other.

The two second through grooves 133 are arranged along the wings 112A of the two electrode portions 112, that is, one second through groove 133 extends only in the wings 112A of one of the electrode portions 112; the two second through grooves They are also separated at position 133.

The support portion 121 of the frame 120 may extend toward one of the two connection surfaces 112C of the two electrode portions 112 to one of the two first through grooves 132. The casing 111 is optionally disposed in the two first through grooves 132 and / or the gap 131. In addition, the case section 111A of the case 111 may include at least one curved surface, for example, it may have a rounded corner 111R. As shown in FIG. 12D, the case section is rounded and is connected to the electrode portion of the electrode portion 112. Section 112A2. The rounded corner 111R can disperse the impact force, so that when the single-grained carrier 110 is subjected to a vibration test, the rounded corner 111R is not easily broken or cracked. In addition, in the embodiment shown in FIG. 12D, the cross section of the case and the cross section of the electrode portion do not form a flat surface, that is, the cross section of the case and the cross section of the electrode portion are not flush.

In summary, the carrier bracket 100 'can also make the electrode portions 112 of the respective carrier bodies 110 electrically independent from each other. Therefore, after the subsequent light-emitting device is solidified, the bonding wire and the packaging can be directly performed on the non-singulated light-emitting device Electrical measurement greatly improves the production speed of light-emitting devices. It is further explained that the technical content of the supporting bracket 100 'can also be referred to by the supporting bracket 100'.

One embodiment of the present invention further provides a method for manufacturing a supporting bracket, which can manufacture at least the above-mentioned supporting bracket 100 '. The manufacturing method of the carrier bracket 100 'is similar to the manufacturing method of the aforementioned carrier bracket 100. The manufacturing method of the carrier bracket 100' includes the following steps.

Please refer to FIG. 13A to FIG. 13C. First, a conductive support 160 is provided. The conductive support 160 includes a frame 120, and the frame 120 includes at least one support portion 121, at least one empty area 130, and at least one extension portion 140. The at least one empty area 130 may correspond to a gap 131, two first through slots 132, and two second through slots 133 of the supporting bracket 100 ', but at this time, the two first through slots 132 and the two second through slots 133 have not yet Connected. The at least one extending portion 140 may correspond to the two electrode portions 112 of the supporting bracket 100 ', but at this time, the two electrode portions 112 are not separated from the frame 120.

Referring to FIG. 14, in a second step, a plastic body 150 is formed. The plastic body 150 covers at least a portion of the extension portion 140 and at least a portion of the support portion 121, and the plastic body 150 fills at least a portion of the empty area 130. For example, the plastic body 150 partially covers the two electrode portions 112 of the extension 140, completely covers the replacement support portion 121, and the plastic body 150 fills the gap 131 and two first through grooves 132 in the empty area 130, but does not have Filled in the second through groove 133. In addition, the plastic body 150 may be in contact with the recessed portion 1121 of the extension portion 140 (as shown in FIG. 13A) to increase the contact area between the plastic body 150 and the extension portion 140.

Referring to FIG. 15, in a third step, the plastic body 150 partially filled in the empty region 130 is removed, that is, a portion of the plastic body 150 filled in the two first through grooves 132 is removed. The plastic body 150 to be removed is called a residual material 151 (as shown in FIG. 14), and the range of the residual material 151 will depend on the specific shape of the product. In this embodiment, the plastic bodies 150 filled in the two end regions of the two first through grooves 132 are removed, so that the convex corners of the four corners of the plastic body 150 are removed. The remaining plastic body 150 forms the casing 111 of the carrier 100 '.

Referring to FIG. 16, in a fourth step, the extending portion 140 of the plastic body 150 is partially exposed to remove the remaining portion of the extending portion 140 from the frame 120. In other words, in this step, the extensions 140 (as shown in FIG. 15) on both sides of the second through slot 133 are removed, so that the second through slot 133 communicates with the first through slot 132. The remaining extensions 140 form the electrode portion 112 of the carrier 100 '.

After the above steps are completed, the carrier bracket 100 'can be manufactured. For some detailed technical contents of the above steps, please refer to the manufacturing method of the supporting bracket 100. For example, a conductive layer can be formed on the conductive bracket 160 first, the implementation order of the third step and the fourth step can be interchanged, and the plastic can be cleaned before the fourth step is implemented. Body 150 and so on.

Please refer to FIG. 17A to FIG. 17D, which are schematic diagrams of a supporting bracket 100 according to an embodiment of the present invention (i.e., a top view, a full sectional view in the front-rear direction, a full sectional view in the left-right direction, And a partial enlarged detail view), which shows more than one load bearing bracket 100 ".

The supporting bracket 100 "is similar to the aforementioned supporting brackets 100 and 100 ', so the technical content of each other should be able to refer to each other. It should be noted that the frame 120 of the supporting bracket 100" has a side portion 123 and a channel area 122, The side portion 123 can be shared by the frame 120 of the two load-bearing brackets 100 ", in other words, the frame 120 of the two load-bearing brackets 100" can be integrated by the shared side portion 123; The body 110 is separated by the side portion 123. The channel region 122 is disposed in the side portion 123 and communicates with one of the two first through grooves 132 of each of the supporting brackets 100 ". It is further noted that the section 111A of the casing 111 may include at least one curved surface, for example, it may have a rounded corner 111R, and the rounded corner 111R is connected to the side portion 123 of the frame 120. In addition, the cross section of the electrode portion of the electrode portion 112 may also include at least one curved surface, and the curved surfaces described above are not limited to a single curvature. That is, the outline outside the edge region presents a curved line. The electrode section is not adjacent to the fillet 111R system. With the curved cross section of the striking part, the impact force can be dispersed. Meanwhile, in the embodiment shown in FIG. 17D, the cross section of the case and the cross section of the electrode portion do not constitute a flat surface, that is, the cross section of the case and the cross section of the electrode portion are not flush.

In terms of efficacy, the supporting bracket 100 "can also make the electrode portions 112 of the respective carrier bodies 110 electrically independent from each other. Therefore, after the subsequent light-emitting device fixation, bonding and packaging are completed, the light-emitting device that has not been singulated can be directly used. Conduct electrical measurement to greatly increase the production speed of light-emitting devices.

One embodiment of the present invention further proposes a manufacturing method of a bearing bracket, which can manufacture at least the above-mentioned bearing bracket 100 ". The manufacturing method of the bearing bracket 100" is similar to the manufacturing method of the bearing bracket 100 ', so the two manufacturing methods The same technical content will be omitted or simplified. The carrying bracket 100 "may include the following steps.

Please refer to FIG. 18A to FIG. 18C. First, a conductive support 160 is provided. In this embodiment, two conductive supports 160 are used as an example. Each conductive support 160 includes at least one frame 120, and the frame 120 includes at least one support portion 121, at least one side portion 123, at least one channel region 122, at least one empty region 130, and at least one extension portion 140. The passage area 122 is disposed on the side portion 123 and communicates with the empty area 130.

Referring to FIG. 19, in a second step, a plastic body 150 is formed. The plastic body 150 covers at least a portion of the extension portion 140 and at least a portion of the support portion 121 of each conductive bracket 160, and the plastic body 150 fills at least a portion of the empty area 130. The plastic body 150 is also filled in the channel region 122, that is, the plastic body 150 passes through the channel region 122 to cover another conductive bracket 160. In addition, the plastic body 150 will also be in contact with the recessed portion 1121 of the extension portion 140 (as shown in FIG. 18A) to increase the contact area between the plastic body 150 and the extension portion 140.

Referring to FIG. 20, in a third step, the plastic body 150 filled in the channel region 122 is removed. Removal of the plastic body 150 may be performed in one step or in multiple steps. Specifically, when a step is taken, a tool longer than the passage area 122 is used to remove part of the frame 120 on both sides of the passage area 122 and the plastic body 150 in the passage area 122. Therefore, after the plastic body 150 in the channel region 122 is removed, the channel region 122 will become slightly longer.

When taking multiple steps, first use a cutter slightly shorter than the channel region 122 to remove part of the plastic body 150 in the channel region 122, and then use another tool to scrape off the remaining plastic body 150 in the channel region 122 through the scrape. Wait for action to remove.

Referring to FIG. 21, in a fourth step, the plastic body 150 partially filled in the empty area 130 is removed, that is, a part of the plastic body 150 (for example, the four corners) filled in the two first through grooves 132 is removed. Residual material 151, as shown in Figure 20) is removed. After the third and fourth steps are completed, the remaining plastic body 150 that has not been removed forms the casing 111 of the carrying bracket 100 ″.

Referring to FIG. 22, in a fifth step, the extending portion 140 (as shown in FIG. 21) that partially exposes the plastic body 150 is removed, so that the remaining portion of the extending portion 140 is separated from the frame 120. In other words, in this step, the extending portions 140 on both sides of the second through slot 133 are removed, so that the second through slot 133 communicates with the first through slot 132. The remaining extensions 140 form the electrode portion 112 of the supporting bracket 100 ".

After the above steps are completed, the supporting bracket 100 "can be manufactured. It is worth mentioning that the implementation order of the above third to fifth steps is interchangeable and is not limited.

Although several embodiments of the present disclosure are described above, the scope of the present disclosure is not limited to the disclosed embodiments and cannot be limited to the disclosed embodiments. More specifically, those skilled in the art can make various deviations and improvements based on the disclosed embodiments, and these deviations and improvements are still within the scope of the present disclosure. Therefore, the scope of protection of patents issued under this disclosure is determined by the scope of patent applications provided below.

Claims (10)

A light-emitting device includes: a carrier; and a light-emitting diode wafer fixed in the carrier; wherein the carrier includes a casing and at least one electrode portion, and the casing partially covers the at least An electrode portion, and the at least one electrode portion includes a wing portion, the wing portion is exposed outside the casing, and includes a central region and at least one edge region, the at least one edge region protruding from the central region; wherein The at least one electrode portion includes a cross-section of the electrode portion, and the casing includes at least a cross-section of the casing. The light-emitting device according to claim 1, wherein the at least one edge region and / or the central region includes a cross section of the electrode portion. The light-emitting device according to claim 1, wherein a cross section of the electrode portion is not flush with a cross section of the at least one case. The light-emitting device according to claim 1, wherein one of the cross-section of the at least one case and the cross-section of the electrode portion includes a curved surface. The light emitting device according to claim 1, wherein the at least one edge region of the wing portion is in a concave state with respect to a cross section of the casing. The light-emitting device according to claim 5, wherein the wing portion includes a concave curved surface. The light-emitting device according to claim 1, wherein the at least one edge region of the wing portion protrudes from a cross section of the casing. The light-emitting device according to claim 1, wherein the cross-section of the at least one casing includes a rounded corner, and the rounded corner is adjacent to the cross-section of the electrode portion. The light-emitting device according to claim 1, wherein the cross-section of the at least one casing includes a rounded corner, and the rounded corner is not adjacent to the cross-section of the electrode portion. The light-emitting device according to claim 1, wherein the at least one edge region includes two edge regions, and the central region is disposed between the two edge regions.