M375297 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種發光二極體封裝技術，特別是一種發光二極 體支架結構。 【先前技術】M375297 V. New Description: [New Technology Field] This creation is about a light-emitting diode package technology, especially a light-emitting diode support structure. [Prior Art]
發光二極體（light-emittingdiodes ’ LED)具有壽命長、省電' 尺寸小等優點，故可廣泛應用於各式電子裝置的光源。此外，近來發 光二極體朝向全彩與高亮度發展，可被應用於大尺寸的顯示器與將交 通號誌上。於發光二極體封裝技術令，發光效率與發光二極體封裝體 的散熱性為重要的課題。 明參考圖1 ’發光二極體晶片（圖上未示)通常固接於一發光二極 體支架100内。膠座110係以塑膠射出成型方式形成於金屬接腳12〇 上。其中，膠座11G具有-碗狀之中空功能區112。金屬接腳12〇係 設置於膠座no之兩側，由中空功能區112内延伸至膠座⑽外。發 光二極體支架10G結構可設置晶片承座13G。為了改善散熱效果與薄 型化需未，“承座13G、金屬接腳12G歸座UG件呈同平面。能 功能區112内之内杯深度相當於功能區外之外杯深度，且晶片 與金屬接腳120設計露出膠體底部散熱。然而，水氣容易從 :=二金屬接腳122與膠座110接合處渗入，進而影響發光 二極體的可靠度與壽命。 【新型内容】 祕堪為=述問題’本創作目的之—係提供—種發光二極體支 二：一錯汉置至少一凹部於金屬接腳與膠座之接合處 ，且與凹部 暴座底部，此結構設計可增加金屬接腳 3 =座的接_魏錄長水氣郷斜部沿金騎腳渗入所需的 熱性並雜供-輕光二極财雜構，可兼顧高散 本㈣目的之—係提供—種發光二鋪支架結構，係包括.— 中f編；以及複數個金屬接腳，係自中空功能區 應二第-2 2中’金屬接腳分別包含至少一第一凹部位與相對 ’、、 °卩，第—凹部係於金屬接腳與膠座接合區域内，·以及第 一凸部之頂表面係暴露於膠座之底部。 【實施方式】 -圖2A所示為根據本創作一實施例發光二極體支架結構之刻 ，不意圖。於本實施例中，發光二極體支架結構係包括：一膠 =ίο，以及複數個金屬接腳20，座1〇具有一中空功能區12。金屬 接腳20係自中空功能區12内往膠座1〇外延伸。 接續上述說明’其中，金屬接腳2G分別包括至少—第一凹部 22與相對應的一第一凸部22,。第一凹部22係位於金屬接腳2〇與膠 上10接合區域内。第—凸部22,之頂表面係暴露於膠座1G之底部。 於實施例中’發光二極體晶片（圖上未示)可設置在暴露於中空功能 區12的金屬接腳20上。 請參照圖2B，於_實施例中，金屬接腳2〇用於放置發光二極 體晶片（圖上未示)處亦可設置—第二凹部24與相對應的—第二凸部 4 °其中’第二凹部24面向中空功能區12，而第二ώ部24,之頂表 面係暴露於膠座10之底部。 _圖3八與圖3Β所示為根據本創作不同實施例之示意圖。如圖3八 所不’於一實施例中，發光二極體支架結構可包括-晶片承座3〇設 M375297 置於中空功能區12内。其中，晶片承座3 %與相對應的一第二凸部34，。第二凸部％之二第：：部 膠座1〇之底部’故可提供其上晶片良好散熱效果面係暴路於 繼續，請參照圖3B，於一實施例中，金 22’之頂部係凸出於膠座1〇之底部可辦: 之第一凸部 面積。於-實施例中（圖上未示），^承座時與錫料之接觸 於其内》 屬承座亦可為膠座包覆 製作而一成般而言，金屬接腳2G係由—金屬片材利用_或沖壓等製程 之底部厚度h可小於金屬接腳2〇其他區域之厚度^。之帛凹邹22 於—實施例中，金屬接腳2〇可設置複數個第一 =所不。如此’以可增加金屬接腳2〇沾錫時與錫料 ’如圖 於一實施例中，如圖4C所示，金屬接腳2〇之第一二，面積。 ，可相_金屬接腳2〇其他區域之厚度h。繼續來 接腳20之第一凹部22可設計成具有階梯狀截面的凹部。，金屬 ▲接續上述說明，本創作中之金屬接腳2〇之第一 種態樣，但本創作亦不限於此，可 、有多 金屬接聊2〇之第二凹部34或24亦可解有^^於金屬承座-或 可為-接凹著穴請參關5，於—軸中，働_之第-凹部22 於本創作+ ’金屬接腳20之^ —凹部η係設置 =之邊緣，如圖2B與圖3B所示。於不同實施 ^接腳20之第—凹部22可切齊或凸出於膠座1〇之外緣，金 』3A所示。因此，當水氣由膠座1〇之側壁渗入時，水2^ 5 會沿著金屬接腳20表面 中空功能區！2。故金屬接腳2〇之^凹部22表面後方能滲入 入路徑，間接拉a 7 疋第—凹部22拉長了水氣滲 -凸部元件的可靠度。另外，金屬接腳2。之第 金屬接腳20之沾依錫需處要 有助於沾錫的結構。當水氣由 壁與其他區域金屬：腳2 著第-凸部22’之侧 區，有效克服了以往水氣容易渗入面的;^能滲入中空功能 合處，對Γ作藉由設置至少―凹部於金屬接腳與膠座之接 膠座的接觸面積進而拉長水氣從膠座外部沿金屬 檐峨高_爾具有凹 杯、，。構之4承座，刊時兼顧高錄性並特其可靠度。 以上所述之Μ施例僅係為說明本創作之技術思想及特點，其目 的在使熟f此項技藝之人士能夠瞭解本創作之内容並據以實施，當不 能以之限定本創作之專利範圍，即大凡依本創作所揭示之精神所作之 均等變化或修飾’仍應涵蓋在本創作之專利範圍内。 M375297 【圖式簡單說明】 圖1所示為習知發光二極體支架之示意圖。 圖2A與圖2B所示為根據本創作不同實施例之示意圖。 圖3A與圖3B所示為根據本創作不同實施例之示意圖。 圖4A、圖4B與圖4C所示為根據本創作中不同實施例之局部示意 圖。 圖5所示為根據本創作一實施例之示意圖。 【要元件符號說明】Light-emitting diodes (LEDs) have the advantages of long life and low power consumption, so they can be widely used in light sources of various electronic devices. In addition, recently, the light-emitting diode has been developed toward full color and high brightness, and can be applied to a large-sized display and a traffic number. In the case of the light-emitting diode package technology, the light-emitting efficiency and the heat dissipation of the light-emitting diode package are important issues. Referring to Figure 1, a light-emitting diode wafer (not shown) is typically affixed to a light-emitting diode support 100. The rubber seat 110 is formed on the metal pin 12A by plastic injection molding. The rubber seat 11G has a bowl-shaped hollow functional zone 112. The metal pins 12 are disposed on both sides of the rubber seat no, and extend from the hollow function area 112 to the outside of the rubber seat (10). The light-emitting diode holder 10G structure can be provided with a wafer holder 13G. In order to improve the heat dissipation effect and thinning requirements, "the bearing 13G and the metal pin 12G are in the same plane as the UG piece. The inner cup depth in the functional area 112 is equivalent to the cup depth outside the functional area, and the wafer and the metal. The pin 120 is designed to expose the heat dissipation at the bottom of the colloid. However, the moisture easily penetrates from the joint of the two metal pins 122 and the rubber seat 110, thereby affecting the reliability and life of the LED. [New content] The problem of 'this purpose' is to provide a kind of light-emitting diode branch two: one wrong place is placed at least one recess at the joint of the metal pin and the rubber seat, and the bottom of the recessed seat, this structure can increase the metal Pin 3 = seat connection _ Wei Lu Chang water gas slanting section infiltrated into the required heat of the gold riding foot and miscellaneous supply - light-light two-pole financial structure, can take into account the high-spreading (four) purpose - provide a kind of luminous two shop The bracket structure includes: - a f-type; and a plurality of metal pins, the hollow metal functional area should be two - 2 - the 'metal pins respectively include at least one first concave portion and the opposite ',, °, The first recess is tied to the metal pin and the rubber seat The top surface of the first convex portion is exposed to the bottom of the rubber seat. [Embodiment] - FIG. 2A shows the structure of the light-emitting diode support according to an embodiment of the present invention, which is not intended. In an example, the light-emitting diode support structure comprises: a glue=ίο, and a plurality of metal pins 20, the seat 1 has a hollow functional area 12. The metal pins 20 are from the hollow functional area 12 to the plastic seat 1 Extending the above description. In the above description, the metal pins 2G respectively include at least a first recess 22 and a corresponding first protrusion 22. The first recess 22 is located on the metal pin 2 and is bonded to the glue 10 In the region, the top surface of the first convex portion 22 is exposed to the bottom of the rubber seat 1G. In the embodiment, the light emitting diode chip (not shown) may be disposed on the metal pin exposed to the hollow functional region 12. Referring to FIG. 2B, in the embodiment, the metal pin 2 can be disposed for placing the LED (not shown) - the second recess 24 and the corresponding second protrusion 4 ° where 'the second recess 24 faces the hollow functional area 12, and the second side 24, the top table The system is exposed to the bottom of the rubber seat 10. _ Figure 3-8 and Figure 3A are schematic views of different embodiments according to the present invention. As shown in Figure 3, the light-emitting diode support structure may include - The wafer holder 3 is provided with M375297 disposed in the hollow functional area 12. The wafer holder is 3% and the corresponding second convex portion 34. The second convex portion is the second:: the partial plastic seat 1 The bottom part can provide a good heat dissipation effect on the upper surface of the wafer. Please refer to FIG. 3B. In an embodiment, the top of the gold 22' protrudes from the bottom of the plastic seat. The area of the convex part. In the embodiment (not shown), the contact between the seat and the tin material is in the seat. The seat can also be made by the rubber seat. The thickness of the bottom of the 2G system from the metal sheet using _ or stamping may be less than the thickness of the other regions of the metal pin 2 ^. In the embodiment, the metal pin 2〇 can be set to a plurality of first = no. Thus, in order to increase the metal pin 2 when the tin is soldered with tin, as shown in an embodiment, as shown in Fig. 4C, the metal pin 2 is the first two, the area. , can be the thickness of the metal pin 2 〇 other areas h. The first recess 22 continuing to the pin 20 can be designed as a recess having a stepped cross section. Metal ▲ continues the above description, the first aspect of the metal pin 2〇 in this creation, but this creation is not limited to this, but the second recess 34 or 24 with multi-metal chat 2〇 can also be solved. There are ^^ in the metal socket - or can be - to the concave hole, please enter the 5, in the - axis, 働 _ the first - concave 22 in the creation + 'metal pin 20 ^ - recess η system set = The edges are as shown in Figures 2B and 3B. In different implementations, the first recess 22 of the pin 20 can be aligned or protruded from the outer edge of the rubber seat 1 ,, as shown by the gold 3A. Therefore, when the water vapor penetrates from the side wall of the rubber seat, the water 2^5 will follow the hollow functional area on the surface of the metal pin 20! 2. Therefore, the metal pin 2 can be infiltrated into the path behind the surface of the recess 22, and the indented a 7 疋 first recess 22 lengthens the reliability of the water gas permeation-projection element. In addition, the metal pin 2 is used. The metal pin 20 of the first metal pin needs to be in a structure that contributes to the tin. When the water vapor is made up of the wall and the metal of the other area: the side of the second convex portion 22' of the foot 2, the water vapor is easily penetrated into the surface; the gas can penetrate into the hollow function joint, and at least ― The contact area of the concave portion between the metal pin and the rubber seat of the rubber seat further elongates the water vapor from the outside of the rubber seat and has a concave cup. The 4th seat of the structure, with a high degree of recordability and special reliability. The above-mentioned embodiments are only for explaining the technical ideas and characteristics of the creation, and the purpose thereof is to enable those skilled in the art to understand the contents of the creation and implement it according to the definition, and the patent of the creation cannot be limited by it. The scope, that is, the equivalent changes or modifications made by the spirit of this creation, should still be covered by the scope of this creation. M375297 [Simple Description of the Drawings] FIG. 1 is a schematic view of a conventional light-emitting diode holder. 2A and 2B are schematic views showing different embodiments according to the present creation. 3A and 3B are schematic views showing different embodiments according to the present creation. 4A, 4B and 4C are partial schematic views showing different embodiments in accordance with the present creation. FIG. 5 is a schematic diagram of an embodiment of the present invention. [Requires symbol description]
10 膠座 12 中空功能區 20 金屬接腳 22 第一凹部 22， 第一凸部 24 第二凹部 24, 第二凸部 30 晶片承座 34 第二凹部 34, 第二凸部 100 發光二極體支架 110 膠座 112 中空功能區 M375297 120 金屬接腳 130 晶片承座10 Plastic seat 12 Hollow function area 20 Metal pin 22 First recess 22, First protrusion 24 Second recess 24, Second protrusion 30 Wafer holder 34 Second recess 34, Second protrusion 100 Light-emitting diode Bracket 110 Plastic seat 112 Hollow functional area M375297 120 Metal pin 130 Wafer bearing