TWI512928B - Carrier member - Google Patents
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- TWI512928B TWI512928B TW102138629A TW102138629A TWI512928B TW I512928 B TWI512928 B TW I512928B TW 102138629 A TW102138629 A TW 102138629A TW 102138629 A TW102138629 A TW 102138629A TW I512928 B TWI512928 B TW I512928B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
- H01L2224/78705—Mechanical holding means in the upper part of the bonding apparatus, e.g. in the capillary or wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Description
本發明係有關一種承載件，尤指一種承載半導體元件之承載件。The invention relates to a carrier, in particular to a carrier carrying a semiconductor component.
隨著電子產業的蓬勃發展，電子產品也逐漸邁向多功能、高性能的趨勢。隨著電子產業的蓬勃發展，許多電子產品都逐漸朝往輕、薄、短、小等高集積度方向發展，半導體封裝件也發展出許多種不同的封裝模組，例如，覆晶封裝(Flip Chip Package)、打線接合(Wire Bond)等。With the rapid development of the electronics industry, electronic products are gradually moving towards multi-functional and high-performance trends. With the rapid development of the electronics industry, many electronic products are gradually moving towards light, thin, short, and small high integration. Semiconductor package parts have also developed many different package modules, for example, flip chip package (Flip) Chip Package), Wire Bond, etc.
目前打線接合技術常以導線架作為承載晶片之承載件。如第1A圖所示，習知打線式封裝件9中，其導線架1包含一承載晶片90之承載座(die pad)10、位於該承載座10角落之複數支撐肋條(tie bar)13(如第1C圖所示)、及位於該承載座10邊緣之複數導腳12，各該導腳12具有外腳部(outer leads portion)120及內腳部(inner leads portion)121，且該外腳部120係用以電性連接至一外部電路(圖未示)。該晶片90以銀膠90a固著於該承載座10上，且該晶片90具有複數銲墊900，以利用複數導線(bonding wire)91電性連接該導腳12之內腳部121。又 藉由如環氧樹脂(epoxy)製成絕緣材料之封裝膠體92包覆該晶片90、承載座10、導腳12之內腳部121、及銲線91。另外，該支撐肋條13相對該承載座10傾斜且設有低置(down set)結構11，以降低該承載座20之位置，使該承載座20之位置低於該內腳部121之位置，且於封裝時平衡上、下模流空間。At present, the wire bonding technology often uses a lead frame as a carrier for carrying a wafer. As shown in FIG. 1A, in the conventional wire-wound package 9, the lead frame 1 includes a die pad 10 for carrying the wafer 90, and a plurality of tie bars 13 at the corner of the carrier 10. As shown in FIG. 1C, and a plurality of guide pins 12 at the edge of the carrier 10, each of the guide pins 12 has an outer lead portion 120 and an inner leads portion 121, and the outer lead portion 121 The leg portion 120 is for electrically connecting to an external circuit (not shown). The wafer 90 is fixed to the carrier 10 by a silver paste 90a. The wafer 90 has a plurality of pads 900 for electrically connecting the inner legs 121 of the pins 12 by a bonding wire 91. also The wafer 90, the carrier 10, the inner leg portion 121 of the guide pin 12, and the bonding wire 91 are covered by an encapsulant 92 made of an insulating material such as epoxy. In addition, the support rib 13 is inclined with respect to the carrier 10 and is provided with a down set structure 11 to lower the position of the carrier 20 so that the position of the carrier 20 is lower than the position of the inner leg 121. And balance the upper and lower mold flow space during packaging.
於習知封裝件9進行打線製程時，需以固定治具將導線架與晶片固定至打線機台上。如第1B圖所示，習知固定治具8係包括一熱板80、二軌道81及一窗型壓板82。 該熱板80具有一吸附面80a，用以支撐一承載有複數晶片90之導線架版面1’，並提供熱能至該導線架版面1’，以利於打線製程。所述之導線架版面1’係具有複數如第1A圖所示之導線架1，待封裝後，再進行切單製程，以獲取複數具有該導線架1之封裝件9。再者，該些軌道81係位於該熱板80之二側，以支撐該導線架版面1’之二側，且該窗型壓板82係用以壓合該導線架版面1’之上側。When the conventional package 9 is subjected to the wire bonding process, the lead frame and the wafer are fixed to the wire bonding machine with a fixing jig. As shown in FIG. 1B, the conventional fixture 6 includes a hot plate 80, two rails 81, and a window platen 82. The hot plate 80 has an adsorption surface 80a for supporting a lead frame layout 1' carrying a plurality of wafers 90 and providing thermal energy to the lead frame layout 1' to facilitate the wire bonding process. The lead frame layout 1' has a plurality of lead frames 1 as shown in FIG. 1A. After being packaged, a singulation process is performed to obtain a plurality of packages 9 having the lead frames 1. Furthermore, the tracks 81 are located on two sides of the hot plate 80 to support the two sides of the lead frame 1', and the window plate 82 is used to press the upper side of the lead frame 1'.
於置放該導線架版面1’時，如第1C及1C’圖所示，該導線架1係對應置放於該熱板80之容置槽800中，且因該低置結構11之兩側係接觸連結該支撐肋條13，故該熱板80需額外形成開槽801，供該支撐肋條13之部分結構及該低置結構11位於該開槽801上方，使該熱板80避開該低置結構11，以避免該低置結構11受熱變形。惟，於製作不同產品而更換該導線架1時，需更換該熱板80，故需將該支撐肋條13精準的調整至該熱板80之開槽801之中心 點，以將該低置結構11置放於該開槽801中，因而往往造成整個製程時間增加，致使不利量產。When the lead frame 1' is placed, as shown in FIGS. 1C and 1C', the lead frame 1 is placed in the receiving groove 800 of the hot plate 80, and two of the low-profile structures 11 The side plate is in contact with the supporting rib 13 , so that the hot plate 80 needs to additionally form a slot 801 , and a part of the structure of the supporting rib 13 and the low structure 11 are located above the slot 801 , so that the hot plate 80 avoids the The structure 11 is lowered to prevent the low structure 11 from being thermally deformed. However, when the lead frame 1 is replaced for making different products, the hot plate 80 needs to be replaced, so the support rib 13 needs to be accurately adjusted to the center of the slot 801 of the hot plate 80. In order to place the low-profile structure 11 in the slot 801, the entire process time is often increased, resulting in unfavorable mass production.
再者，相鄰該支撐肋條13之導腳12’經常會位移至該開槽801內，致使該導腳12’懸空，因而不能進行銲接該導線91之作業，導致良率降低。Further, the lead pins 12' adjacent to the support ribs 13 are often displaced into the slots 801, so that the lead pins 12' are suspended, so that the work of soldering the wires 91 cannot be performed, resulting in a decrease in yield.
另外，目前該導線架1的製作中，該內腳部121之間距(Inner Lead Pitch,ILP)設計有越來越小之趨勢，如ILP為0.148mm以下，致使上述問題更為嚴重。In addition, in the manufacture of the lead frame 1, the inner lead P121 (ILP) design has a smaller and smaller trend, such as ILP of 0.148 mm or less, which causes the above problem to be more serious.
因此，如何克服上述習知技術之種種問題，實已成目前亟欲解決的課題。Therefore, how to overcome the various problems of the above-mentioned prior art has become a problem that is currently being solved.
鑑於上述習知技術之種種缺失，本發明係揭露一種承載件，係包括：一承載座；複數導電部，係設於該承載座周圍；複數支撐條，係設於該承載座周圍；以及至少一低置結構，係位於該支撐條與該承載座之間且接觸連結該承載座，使該支撐條與該承載座具有一高度差，且該低置結構與該承載座非共平面。In view of the above-mentioned various deficiencies of the prior art, the present invention discloses a carrier comprising: a carrier; a plurality of conductive portions disposed around the carrier; a plurality of support bars disposed around the carrier; and at least A low-profile structure is disposed between the support strip and the carrier and is in contact with the carrier, such that the support strip and the carrier have a height difference, and the low-profile structure is non-coplanar with the carrier.
前述之承載件中，該承載件係為導線架，且該承載座係用以承載半導體元件。In the foregoing carrier, the carrier is a lead frame, and the carrier is used to carry a semiconductor component.
前述之承載件中，該承載座之邊緣具有轉折處，且該支撐條係位於該轉折處，例如，該承載座係為多邊形。In the foregoing carrier, the edge of the carrier has a turning point, and the supporting strip is located at the turning point, for example, the carrying seat is polygonal.
前述之承載件中，該低置結構具有相對之第一側與第二側，該第一側接觸結合該承載座，且該第二側接觸結合該支撐條，例如，該第一側與第二側之間的距離係為0.15 至0.3mm。In the foregoing carrier, the low-profile structure has opposite first and second sides, the first side contact is coupled to the carrier, and the second side is coupled to the support bar, for example, the first side and the first side The distance between the two sides is 0.15 To 0.3mm.
另外，前述之承載件中，該低置結構係為架體，且相對該承載座傾斜，例如，該低置結構與該承載座形成一夾角，如30度角至50度角。In addition, in the foregoing carrier, the low-profile structure is a frame body and is inclined with respect to the carrier. For example, the low-profile structure forms an angle with the carrier, such as an angle of 30 degrees to 50 degrees.
由上可知，本發明之承載件，係藉由該低置結構接觸連結該承載座，使該低置結構與該承載座之投影面積相連，以令打線製程用之固定治具之熱板無需額外形成開槽，故相鄰該支撐條之導電部不會產生懸空狀態，因而能順利進行銲接導線之作業，致使良率提高。It can be seen that the carrier of the present invention is connected to the carrier by the low-profile structure, so that the low-profile structure is connected with the projected area of the carrier, so that the hot plate of the fixing fixture for the wire-cutting process is not needed. The slot is additionally formed, so that the conductive portion adjacent to the support strip does not become in a suspended state, so that the work of soldering the wire can be smoothly performed, resulting in an increase in yield.
再者，於量產中更換該承載件及該熱板時，只需將該低置結構與該承載座置放於該容置槽中即可，而不需進行該支撐條之對位，故相較於習知技術，本發明之承載件能大幅降低打線製程之時間，因而有利於量產。Moreover, when the carrier and the hot plate are replaced in mass production, the low-profile structure and the carrier are only required to be placed in the receiving slot, and the alignment of the support bar is not required. Therefore, compared with the prior art, the carrier of the present invention can greatly reduce the time of the wire bonding process, thereby facilitating mass production.
1‧‧‧導線架1‧‧‧ lead frame
1’‧‧‧導線架版面1'‧‧‧ lead frame layout
10,20‧‧‧承載座10,20‧‧‧ bearing seat
11,21‧‧‧低置結構11,21‧‧‧low structure
12,12’‧‧‧導腳12,12’‧‧ ‧ lead
120‧‧‧外腳部120‧‧‧ outside foot
121‧‧‧內腳部121‧‧‧foot
13‧‧‧支撐肋條13‧‧‧Support ribs
2‧‧‧承載件2‧‧‧Carrier
20a‧‧‧轉折處20a‧‧‧ turning point
21a‧‧‧第一側21a‧‧‧ first side
21b‧‧‧第二側21b‧‧‧ second side
22,22’‧‧‧導電部22,22’‧‧‧Electrical Department
23‧‧‧支撐條23‧‧‧Support bars
8‧‧‧固定治具8‧‧‧Fixed fixture
80,70‧‧‧熱板80,70‧‧‧hot plate
80a‧‧‧吸附面80a‧‧‧Adsorption surface
800,700‧‧‧容置槽800,700‧‧‧ accommodating slots
801‧‧‧開槽801‧‧‧ slotting
81‧‧‧軌道81‧‧‧ Track
82‧‧‧窗型壓板82‧‧‧Window type pressure plate
9‧‧‧封裝件9‧‧‧Package
90‧‧‧晶片90‧‧‧ wafer
90a‧‧‧銀膠90a‧‧‧Silver glue
900‧‧‧銲墊900‧‧‧ solder pads
91‧‧‧導線91‧‧‧Wire
92‧‧‧封裝膠體92‧‧‧Package colloid
h‧‧‧高度差H‧‧‧ height difference
L‧‧‧距離L‧‧‧ distance
θ‧‧‧夾角Θ‧‧‧ angle
第1A圖係為習知半導體封裝件之剖面示意圖；第1B圖係為習知打線製程之固定作業之立體示意圖；第1C圖係為習知導線架與熱板之局部上視示意圖；其中，第1C’圖係為第1C之剖面示意圖；以及第2圖係為本發明之承載件與熱板之局部上視示意圖；其中，第2’圖係為第2圖的剖視圖。1A is a schematic cross-sectional view of a conventional semiconductor package; FIG. 1B is a schematic perspective view of a conventional wire bonding process; FIG. 1C is a partial top view of a conventional lead frame and a hot plate; 1C' is a schematic cross-sectional view of the first embodiment; and FIG. 2 is a partial top view of the carrier and the hot plate of the present invention; wherein the second view is a cross-sectional view of FIG.
以下藉由特定的具體實施例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.
須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如“上”、“第一”、“第二”、及“一”等之用語，亦僅為便於敘述之明瞭，而非用以限定本發明可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本發明可實施之範疇。It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. In the meantime, the terms "upper", "first", "second", "one" and "the" are used in the description, and are not intended to limit the scope of the invention. Changes or adjustments in the relative relationship are considered to be within the scope of the invention without substantial changes.
第2及2’圖係為本發明之承載件2及其應用於打線製程之示意圖。The 2nd and 2' drawings are schematic views of the carrier 2 of the present invention and its application to the wire bonding process.
如第2圖所示，所述之承載件2係為導線架，其包括：一承載座20、設於該承載座20周圍之複數導電部22與複數支撐條23、以及接觸連結該承載座20之至少一低置結構21。As shown in FIG. 2, the carrier 2 is a lead frame, and includes a carrier 20, a plurality of conductive portions 22 disposed around the carrier 20 and a plurality of support bars 23, and a contact connection bracket. At least one low-profile structure 21 of 20.
所述之承載座20係用以承載如晶片之半導體元件(圖略)。於本實施例中，該承載座20之邊緣具有轉折處20a，例如，該承載座20係為矩形，且該轉折處20a係為角落。The carrier 20 is used to carry a semiconductor component such as a chip (not shown). In this embodiment, the edge of the carrier 20 has a turning point 20a. For example, the bearing seat 20 is rectangular, and the turning point 20a is a corner.
所述之導電部22係為導腳而位於該承載座20之邊緣外，而所述之支撐條23係為較該導腳寬之支撐肋條，且該支撐條23位於該承載座20之轉折處20a。The conductive portion 22 is a guide pin and is located outside the edge of the carrier 20, and the support bar 23 is a support rib wider than the guide pin, and the support bar 23 is located at the turn of the carrier 20 At 20a.
所述之低置結構21係為網狀片形架體，其位於該支撐 條23與該承載座20之間，且相對該承載座20傾斜，使該支撐條23與該承載座20具有一高度差h，如第2’圖所示，以令該低置結構21與該承載座20呈現非共平面。The low-profile structure 21 is a mesh-shaped sheet-shaped frame body, which is located at the support Between the strip 23 and the carrier 20, and inclined relative to the carrier 20, the support strip 23 and the carrier 20 have a height difference h, as shown in FIG. 2', so that the low-profile structure 21 and The carrier 20 presents a non-coplanar plane.
於本實施例中，該低置結構21具有相對之第一側21a與第二側21b，該第一側21a接觸結合該承載座20之轉折處20a，且該第二側21b接觸結合該支撐條23。In the embodiment, the low-profile structure 21 has a first side 21a and a second side 21b opposite to each other. The first side 21a contacts the turning point 20a of the bearing seat 20, and the second side 21b contacts and supports the support. Article 23.
再者，該第一側21a與第二側21b之間的距離L係為0.15至0.3mm，如第2’圖所示。Further, the distance L between the first side 21a and the second side 21b is 0.15 to 0.3 mm as shown in Fig. 2'.
又，該低置結構21係相對該承載座20傾斜，因而該低置結構21與該承載座20(或熱板70)形成一夾角θ，如第2’圖所示，且該夾角θ係為30°至50°。Moreover, the low-profile structure 21 is inclined with respect to the carrier 20, and thus the low-profile structure 21 forms an angle θ with the carrier 20 (or the hot plate 70), as shown in FIG. 2', and the angle θ is It is 30° to 50°.
另外，當該承載座20係為矩形或其它幾何形狀時，該低置結構21之數量可依需求設計，於該承載座20周圍設計至少一低置結構21即可，例如，於矩形承載座20之至少一轉折處20a上設有該低置結構21；若該轉折處20a上未設計有該低置結構21，則該支撐條23係接觸結合該承載座20之轉折處20a。In addition, when the carrier 20 is rectangular or other geometric shape, the number of the low-profile structures 21 can be designed according to requirements, and at least one low-profile structure 21 can be designed around the carrier 20, for example, in a rectangular carrier. The low-profile structure 21 is disposed on at least one of the turning points 20a; if the low-profile structure 21 is not designed on the turning-over portion 20a, the supporting strips 23 are in contact with the turning point 20a of the bearing base 20.
本發明之低置結構21係接觸連結該承載座20，使該低置結構21與該承載座20之投影面積相連，故於打線製程之固定作業中，該低置結構21與該承載座20均位於固定治具(圖略)之一熱板70之容置槽700中，如第2圖所示，因而該熱板70上無需形成如同習知技術之用以收納該支撐條23之開槽。The low-profile structure 21 of the present invention is in contact with the carrier 20 so that the low-profile structure 21 is connected to the projected area of the carrier 20, so in the fixing operation of the wire-drawing process, the low-profile structure 21 and the carrier 20 Each of them is located in the receiving slot 700 of the hot plate 70 of the fixed fixture (not shown), as shown in FIG. 2, so that the hot plate 70 does not need to be formed to receive the support strip 23 as in the prior art. groove.
因此，於更換該承載件2及該熱板70時，只需將該低 置結構21與該承載座20置放於該容置槽700中，而不需將該支撐條23進行對位，即可完成固定作業，故能大幅降低製程時間，因而利於量產。Therefore, when replacing the carrier 2 and the hot plate 70, it is only necessary to lower the carrier The mounting structure 21 and the carrier 20 are placed in the receiving slot 700, and the fixing operation can be completed without aligning the supporting strip 23, so that the processing time can be greatly reduced, thereby facilitating mass production.
再者，因該熱板70上並無開槽，故即使相鄰該支撐條23之導電部22’產生位移，仍不會呈現懸空狀態，因而能順利進行銲接導線之作業，以有效提高良率。Moreover, since the hot plate 70 is not grooved, even if the conductive portion 22' adjacent to the support strip 23 is displaced, it does not appear to be in a suspended state, so that the work of welding the wire can be smoothly performed, thereby effectively improving the good rate.
綜上所述，本發明之承載件，主要藉由該低置結構接觸連結該承載座，使該低置結構與該承載座之投影面積相連，以令打線製程用之固定治具之熱板無需額外形成開槽，故不僅利於量產，且能提高良率。In summary, the carrier of the present invention is mainly connected to the carrier by the low-profile structure, and the low-profile structure is connected with the projected area of the carrier to enable the hot plate of the fixture for the wire-cutting process. There is no need to form additional grooves, which not only facilitates mass production, but also improves yield.
上述實施例係用以例示性說明本發明之原理及其功效，而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修改。因此本發明之權利保護範圍，應如後述之申請專利範圍所列。The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.
2‧‧‧承載件2‧‧‧Carrier
20‧‧‧承載座20‧‧‧Hosting
20a‧‧‧轉折處20a‧‧‧ turning point
21‧‧‧低置結構21‧‧‧Low structure
22,22’‧‧‧導電部22,22’‧‧‧Electrical Department
23‧‧‧支撐條23‧‧‧Support bars
70‧‧‧熱板70‧‧‧ hot plate
700‧‧‧容置槽700‧‧‧ accommodating slots
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102138629A TWI512928B (en) | 2013-10-25 | 2013-10-25 | Carrier member |
| CN201310548223.7A CN104576544B (en) | 2013-10-25 | 2013-11-07 | Bearing part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102138629A TWI512928B (en) | 2013-10-25 | 2013-10-25 | Carrier member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201517232A TW201517232A (en) | 2015-05-01 |
| TWI512928B true TWI512928B (en) | 2015-12-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102138629A TWI512928B (en) | 2013-10-25 | 2013-10-25 | Carrier member |
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| Country | Link |
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| CN (1) | CN104576544B (en) |
| TW (1) | TWI512928B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM375297U (en) * | 2009-08-04 | 2010-03-01 | Fu Sheng Ind Co Ltd | Frame structure for light emitting diodes |
| TW201203627A (en) * | 2010-07-15 | 2012-01-16 | Lextar Electronics Corp | Light emitting diode and method for forming supporting frame thereof and improved structure of the supporting frame |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3512628A1 (en) * | 1984-04-11 | 1985-10-17 | Moran, Peter, Cork | PACKAGE FOR AN INTEGRATED CIRCUIT |
| JP3034814B2 (en) * | 1997-02-27 | 2000-04-17 | 沖電気工業株式会社 | Lead frame structure and method of manufacturing semiconductor device |
| CN101459154B (en) * | 2007-12-11 | 2010-06-23 | 晶致半导体股份有限公司 | Conductive wire rack and encapsulation construction applying the conductive wire rack |
| CN202003989U (en) * | 2011-03-23 | 2011-10-05 | 南通富士通微电子股份有限公司 | Semiconductor packaging framework |
-
2013
- 2013-10-25 TW TW102138629A patent/TWI512928B/en active
- 2013-11-07 CN CN201310548223.7A patent/CN104576544B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM375297U (en) * | 2009-08-04 | 2010-03-01 | Fu Sheng Ind Co Ltd | Frame structure for light emitting diodes |
| TW201203627A (en) * | 2010-07-15 | 2012-01-16 | Lextar Electronics Corp | Light emitting diode and method for forming supporting frame thereof and improved structure of the supporting frame |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201517232A (en) | 2015-05-01 |
| CN104576544A (en) | 2015-04-29 |
| CN104576544B (en) | 2017-07-04 |
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