TW201403894A - Method for manufacturing LED leadframe - Google Patents

Abstract

A method for manufacturing LED leadframe first prepares a metal plate formed with a metal frame and a plurality of metal racks. The metal racks and the metal frame are connected by a plurality of first connection parts, and one metal rack has a second connection part arranged on one side thereof and connected with the metal frame. After the metal racks are electro-plated, the metal racks are formed with glue stage and yielding space, through the yielding space the second connection part and the metal frame are exposed such that the exposed second connection part and metal frame can be cut. LED die mounting, wire bonding and glue dispensing operations are then performed on the glue stage. The cut second connection part is then applied with electric energy to light the LED die for luminance and chromatic test, thus enhancing the yield of LED device.

Description

Method for manufacturing bracket structure of light-emitting diode (2)

The invention relates to a light-emitting diode, in particular to a method for fabricating a support structure of a light-emitting diode.

Light-emitting diodes have been widely used in various electronic devices, electrical products or lamps, and the LEDs are developed and improved in the way of high-brightness, multi-color light and heat dissipation. Therefore, the cost of manufacturing the light-emitting diode is increased. In addition to the aforementioned factors, the manufacturing cost of the light-emitting diode is increased, and the production yield of the light-emitting diode is directly reflected in the production cost.

In the production of the conventional light-emitting diode, a metal plate is prepared, and after the metal plate is stamped or etched into the process support structure, a metal frame is arranged on the support structure, and the metal frame is connected with a plurality of metal supports through the connecting portion. The metal bracket comprises a positive electrode piece and a negative electrode piece, and then a thermostatic plastic is used to form a rubber seat on the plurality of metal brackets. After the rubber seat is finished, the exposed functional area of the rubber seat is exposed. On the negative electrode wafer, the solid crystal of the light-emitting chip and the gold wire bonding process are performed. After the solid crystal and the wire bonding process, the silicone powder mixed with the fluorescent powder is inserted into the hollow functional area, and after the dispensing process, Metal brackets are cut and tested.

Since the conventional light-emitting diodes are tested for brightness and chromaticity ratio after the fabrication is completed, the brightness and chromaticity ratio of the hair-emitting diodes do not meet the requirements, so that the yield of the light-emitting diodes is only 50. %about. The main reason is that there is no metal after the plastic bracket is formed on the metal bracket. The connecting portion of the positive electrode tab and the negative electrode tab of the bracket is cut, so that the positive electrode tab and the negative electrode tab of the metal bracket are connected together, so that the hollow functional area of the rubber seat cannot be tested immediately after dispensing. Whether the ratio of the brightness and the chromaticity of the polar body is correct, the quality must be confirmed after the completion of the whole process, so that the light-emitting diode which causes the defective rate cannot be detected even.

Therefore, the main object of the present invention is to solve the conventional defect. After the plastic seat on the metal bracket of the bracket structure of the light-emitting diode is formed, the joint portion of the metal bracket is cut, and the subsequent solid crystal, wire and point are cut. In the rubber manufacturing process, before the colloid is not dried, the pre-test operation can be performed to detect whether the ratio of the brightness and the chromaticity of the light-emitting diode is correct, so that the yield after the production of the light-emitting diode can be more than 90%. In addition, the production cost can be greatly reduced.

In order to achieve the above object, the present invention provides a method for fabricating a support structure for a light-emitting diode (2), comprising: preparing a metal plate; forming a metal frame and a plurality of metal supports on the metal plate, the metal support having a first An electrode sheet, a second electrode sheet, and a first connecting portion connecting the first electrode sheet and the second electrode sheet and the metal frame, and only one side of the first electrode sheet and the second electrode of a metal bracket a second connecting portion is connected to the metal frame on the side; a metal seat is formed on the metal bracket, and the molded front surface of the plastic seat has a hollow function for exposing the first electrode piece and the second electrode piece Zone, and a space is formed at a position on one side of the rubber seat, so that the first The second connecting portion is exposed to the metal frame; the exposed portion is cut to the second connecting portion and the metal frame; and the second electrode sheet in the hollow functional area of the rubber seat is fixed with a light emitting chip; Electrically connecting to the illuminating wafer and the first electrode sheet; inserting a colloid into the hollow functional area; applying a power source to the second connecting portion of the cut metal bracket to make the first electrode sheet and the second electrode sheet The illuminating wafer is energized to perform a ratiometric detection of luminance and chromaticity.

Wherein, the metal frame has a plurality of long holes and short holes arranged at intervals, and has a consistent perforation between the two short holes.

Wherein, the first connecting portion connects each metal bracket in a longitudinal direction or a lateral direction.

The first electrode sheet has a rectangular shape, and has two corresponding notches on the side adjacent or corresponding to the second electrode sheet.

Wherein, the second electrode sheet has two corresponding two grooves on two sides, and the other side of the second electrode sheet has a notch.

The back surface of the rubber seat has two through holes, and the two through holes are exposed to the first electrode piece and the second electrode piece.

Wherein, after the bracket structure is stamped or etched, a metal film is plated on the metal bracket of the bracket structure.

Wherein, the yield space is not present on the second connecting portion and the metal frame Thermoset plastic.

Wherein, the illuminating wafer is a monochromatic or multi-colored wafer.

Wherein, the metal wire is a gold wire.

Wherein, the colloid is tannin.

Among them, the colloid is added with a phosphor powder.

The technical content and detailed description of the present invention are described below with reference to the following drawings: Please refer to the first, second and third figures, which are the structure of the support for forming the flow-through diode of the present invention and the partial enlargement of the second figure. schematic diagram. As shown in the figure: the bracket structure (2) of the light-emitting diode of the present invention, first, as in step 100, a metal plate is provided.

In step 102, the metal plate is stamped or etched into a support structure. The support structure 10 includes a metal frame 1 and a plurality of metal supports 2. The metal frame 1 has a plurality of long holes 11 and short holes 12 arranged at intervals, and has a continuous through hole 13 between the two short holes 12. The metal bracket 2 has a first electrode sheet 21, a second electrode sheet 22, and a first connecting portion 23 connecting the first electrode sheet 21 and the second electrode sheet 22 to the metal frame 1. The electrode sheet 21 has a rectangular shape, and has two corresponding notches 211 on the side adjacent or corresponding to the second electrode sheet 22. The second side of the second electrode sheet 22 has two corresponding two grooves. 221, the other side of the second electrode sheet 22 has a notch 222, and the second electrode sheet 22 is in the shape of a piece of clothing by the two recesses 221 of the side and the recess 222. The first electrode sheet 21 of the metal bracket 2 and the second electrode sheet 22 The first connecting portion 23 is not connected to the other first electrode sheets 21 and the second electrode sheets 22, and the second connecting portion 24 is connected to the metal frame 1 only on one side.

Step 104, after stamping or etching the stent structure 10, the metal stent 2 of the stent structure 10 is electroplated, and a metal film is plated on the metal stent 2.

Step 106, after the above-mentioned stent structure 10 is electroplated, a thermostatic molding technique is used to form a rubber seat 3 on the metal bracket 2, and the rubber seat 3 is molded and coated on the first electrode sheet 21, The second electrode sheet 22 and the connecting portion 23 are provided. The front surface of the plastic holder 3 has a hollow functional area 31. The hollow functional area 31 exposes the first electrode sheet 21 and the second electrode sheet 22 (as shown in the fourth figure). Similarly, the back surface of the plastic holder 3 has two through holes 32, 33 for exposing the first electrode sheet 21 and the second electrode sheet 22, and the first electrode sheet 21 and the second electrode are exposed. When the sheet 22 is turned on to illuminate the light-emitting chip (not shown), the two through holes 32 and 33 serve to dissipate heat from the first electrode sheet 21 and the second electrode sheet 22 (as shown in FIG. 5). After the rubber seat 3 is thermoset, a retaining space (without thermosetting plastic) 34 is formed on one side of the rubber seat 3, so that the second connecting portion 24 and the metal frame 1 are exposed (eg, fourth, Five maps).

Step 108, after the rubber seat 3 of the metal bracket 2 on the bracket structure 10 is thermosetting, the second connecting portion 24 and the metal frame 1 are exposed at the exposed portion of the space 34, and the second connecting portion is at the second connecting portion. After the 24 is cut, the rubber seat 3 is connected with the other rubber seats 3 (as shown in the sixth and seventh figures).

Step 110, in the exposed portion, the second connecting portion 24 and the metal frame 1 are After the cutting, a light-emitting wafer 4 is fixed to the exposed second electrode sheet 22 in the hollow functional region 31 of the rubber seat 3. In the present drawing, the light-emitting wafer 4 is a single-color or multi-color wafer (such as Figures 7 and 8).

Step 112, in which the illuminating wafer 4 is electrically connected to a metal wire 5 to the exposed first electrode sheet 21 in the hollow functional region 31. In the figure, the metal wire 5 is a gold wire.

In step 114, after the solid crystal and the wire bonding are completed, the dispensing is performed in the hollow functional zone 31 of the rubber seat 3, and the colloid 6 is inserted into the hollow functional zone 31 (as shown in the eighth figure). In this figure, the colloid is tannin.

Step 116, after dispensing, the pre-measurement operation can be performed on the light-emitting diode. The so-called pre-test operation is that after the glue is dispensed, the tester can apply a voltage to the second connection portion 24 before being cut. The first electrode sheet 21 and the second electrode sheet 22 of the single metal holder 2 are formed by mixing the light generated by the light-emitting wafer 4 with the phosphor powder mixed with the colloid 6. Whether the chroma and brightness meet the requirements of the previously designed chromaticity and brightness ratio.

For example, when a white light emitting diode is to be fabricated, the light emitting chip is blue light, and the colloid 6 which is inserted into the hollow functional area 31 is mixed with yellow fluorescent powder, and the colloid 6 is not dried after the dot is inserted. The first electrode sheet 21 and the second electrode sheet 22 of the metal holder 2 cut by the second connecting portion 24 may be powered to perform the light-emitting wafer 4 and the colloid 6 mixed with the yellow phosphor powder. Whether the brightness and chromaticity ratio are correct.

After the metal holder 2 is completed, the second connector 24 of the metal holder 2 is cut after the plastic seat 3 is completed, so that the light-emitting diode can be inserted after dispensing. Before the line test, the production yield of the light-emitting diode can be increased to more than 90% to reduce the generation of defective rate.

The above are only the preferred embodiments of the present invention and are not intended to limit the scope of the present invention. That is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the invention.

100~116‧‧‧Steps

10‧‧‧Support structure

1‧‧‧Metal border

11‧‧‧ long hole

12‧‧‧ short holes

13‧‧‧through holes

2‧‧‧Metal bracket

21‧‧‧First electrode sheet

211‧‧ ‧ gap

22‧‧‧Second electrode

221‧‧‧ Groove

222‧‧‧ notch

23‧‧‧First connection

24‧‧‧Second connection

3‧‧‧Glass

31‧‧‧Hollow functional area

32, 33‧‧‧through holes

34‧‧‧Let space

4‧‧‧Lighting chip

5‧‧‧ Gold wire

6‧‧‧colloid

The first figure is a schematic diagram of the production process of the present invention.

The second figure is a schematic view of the structure of the support of the light-emitting diode of the present invention.

The third figure is a partially enlarged schematic view of the first figure.

The fourth figure is a front view showing a rubber seat formed on the support structure of the light-emitting diode of the present invention.

Fig. 5 is a schematic view showing the back surface of the holder structure of the light-emitting diode of the present invention.

The sixth figure is a schematic view showing the metal frame and the connecting portion of the third and fourth figures being cut.

Fig. 7 is a top plan view showing the structure of the support of the light-emitting diode of the present invention.

Figure 8 is a side elevational view showing the stent structure of the light-emitting diode of the present invention.

100~116‧‧‧Steps

Claims (12)

A method for fabricating a support structure for a light-emitting diode (2), comprising: a) preparing a metal plate; b) forming a metal frame and a plurality of metal supports on the metal plate, the metal support having a first electrode plate a second electrode sheet and a connecting portion connecting the first electrode sheet and the second electrode sheet to the metal frame, and having only one side of the first electrode sheet and the second electrode of the metal holder a second connecting portion is connected to the metal frame; c) forming a rubber seat on the metal bracket, and forming a hollow function for exposing the first electrode piece and the second electrode piece on the front surface of the formed plastic seat a region, and a position of the one side of the rubber seat is formed to expose the second connecting portion and the metal frame; d) to cut the exposed portion of the second connecting portion and the metal frame; e) fixing a light-emitting chip on the second electrode sheet in the hollow functional area of the rubber seat; f) electrically connecting a metal wire to the light-emitting chip and the first electrode sheet; g), colloidal point Entering the hollow functional zone; h), the metal branch to be cut Applying a second power connection portion such that the first electrode sheet and the second sheet electrode power on as the light emitting chip, for detecting the ratio of luminance and chromaticity. The manufacturing method (2) of the bracket structure of claim 1, wherein the metal frame of step b has a plurality of long holes and short holes arranged at intervals, and has a consistent perforation between the two short holes. For example, the method for fabricating a stent structure according to item 2 of the patent application scope (2), wherein The first connecting portion connects each of the metal brackets in a longitudinal or lateral direction. The method for fabricating a stent structure according to claim 3, wherein the first electrode sheet has a rectangular shape, and has two corresponding notches on a side adjacent to or corresponding to the second electrode sheet. The method for fabricating a stent structure according to the fourth aspect of the invention, wherein the second electrode sheet has two corresponding two grooves on two sides, and the other side of the second electrode sheet has a concave surface. mouth. The method for manufacturing a stent structure according to claim 5, wherein the back surface of the rubber seat has two through holes, and the two through holes are exposed to the first electrode sheet and the second electrode sheet. The method for fabricating a bracket structure according to claim 6 (2), wherein step (b) further comprises a step of plating between the steps b and c, and plating a layer on the metal bracket of the bracket structure after the bracket structure is stamped or etched. Metal film. The manufacturing method (2) of the bracket structure of claim 7 , wherein the retreating space of the step c is that the second connecting portion and the metal frame connected to the second connecting portion have no thermosetting plastic. The method for fabricating a stent structure according to claim 8 is characterized in that the light-emitting wafer of the step e is a single-color or multi-color wafer. The method for fabricating a stent structure according to claim 9 is characterized in that the metal wire of the step f is a gold wire. The method for fabricating a stent structure according to claim 10, wherein the gel of the step g is silicone. The method for fabricating a stent structure according to claim 11 (2), wherein the gel is added with a phosphor powder.