TW201403890A - Method for manufacturing LED leadframe - Google Patents

Abstract

A method for manufacturing LED leadframe first prepares a metal plate formed with a metal frame and a plurality of metal racks. The metal rack has a first electrode pad, a second electrode pad and connection parts connecting the first electrode pad, the second electrode pad and the metal frame. The metal rack is electrically plated and formed with glue stage for facilitating the cutting of the connection parts in transversal row or vertical rows. LED die mounting, wire bonding and glue dispensing operations are then performed on a hollow function area of the glue stage. The cut connection parts are then applied with electric energy to light the LED die for luminance and chromatic test.

Description

Method for manufacturing bracket structure of light-emitting diode (1)

The invention relates to a light-emitting diode, in particular to a method for fabricating a support structure of a light-emitting diode.

Light-emitting diodes have been widely used in various electronic devices, electrical products or lamps, and the LEDs are developed and improved in the way of high-brightness, multi-color light and heat dissipation. Therefore, the cost of manufacturing the light-emitting diode is increased. In addition to the aforementioned factors, the manufacturing cost of the light-emitting diode is increased, and the production yield of the light-emitting diode is directly reflected in the production cost.

In the production of the conventional light-emitting diode, a metal plate is prepared, and after the metal plate is stamped or etched into the process support structure, a metal frame is arranged on the support structure, and the metal frame is connected with a plurality of metal supports through the connecting portion. The metal bracket comprises a positive electrode piece and a negative electrode piece, and then a thermostatic plastic is used to form a rubber seat on the plurality of metal brackets. After the rubber seat is finished, the exposed functional area of the rubber seat is exposed. On the negative electrode wafer, the solid crystal of the light-emitting chip and the gold wire bonding process are performed. After the solid crystal and the wire bonding process, the silicone powder mixed with the fluorescent powder is inserted into the hollow functional area, and after the dispensing process, Metal brackets are cut and tested.

Since the conventional light-emitting diodes are tested for brightness and chromaticity ratio after the fabrication is completed, the brightness and chromaticity ratio of the hair-emitting diodes do not meet the requirements, so that the yield of the light-emitting diodes is only 50. %about. The main reason is that there is no metal after the plastic bracket is formed on the metal bracket. The connecting portion of the positive electrode tab and the negative electrode tab of the bracket is cut, so that the positive electrode tab and the negative electrode tab of the metal bracket are connected together, so that the hollow functional area of the rubber seat cannot be tested immediately after dispensing. Whether the ratio of the brightness and the chromaticity of the polar body is correct, the quality must be confirmed after the completion of the whole process, so that the light-emitting diode which causes the defective rate cannot be detected even.

Therefore, the main object of the present invention is to solve the conventional defect. After the plastic seat on the metal bracket of the bracket structure of the light-emitting diode is formed, the joint portion of the predetermined metal bracket is cut first, in the subsequent solid crystal, In the line and dispensing process, before the colloid is not dried, the pre-test operation can be performed to detect whether the ratio of the brightness and the chromaticity of the light-emitting diode is correct, thereby improving the yield of the light-emitting diode after fabrication. More than 90%, which can significantly reduce production costs.

In order to achieve the above object, the present invention provides a method (1) for fabricating a support structure for a light-emitting diode, comprising: providing a metal plate; forming a metal frame and a plurality of metal supports arranged longitudinally and laterally, the metal plate The bracket has a first electrode piece and a second electrode piece, and the first electrode piece and the second electrode piece have a connecting portion at least one side thereof, the connecting portion connecting the plurality of longitudinal and lateral metal brackets and the a metal frame; a metal seat is formed on the metal bracket, and a front surface of the rubber seat has a hollow functional area for exposing the first electrode piece and the second electrode piece; The connection portion of the metal bracket a light-emitting chip is fixed on the second electrode sheet in the hollow functional area of the rubber seat; a metal wire is electrically connected to the light-emitting chip and the first electrode sheet; and the colloid is spotted in the hollow functional area; A power source is applied to the connection portion on the cut metal holder, and the first electrode sheet and the second electrode sheet are energized to illuminate the light-emitting wafer to perform luminance ratio and chromaticity ratio detection.

Wherein, the metal frame has a plurality of long holes and short holes arranged at intervals, and has a consistent perforation between the two short holes.

Wherein, the long hole is a connecting portion corresponding to the cutting target.

The connecting portion is formed on a side of the first electrode sheet that is not adjacent to or corresponding to the second electrode sheet.

The first electrode sheet has a rectangular shape, and has two corresponding notches on the side adjacent or corresponding to the second electrode sheet.

Wherein, the second electrode sheet has two corresponding two grooves on two sides, and the other side of the second electrode sheet has a notch.

The back surface of the rubber seat has two through holes, and the two through holes are exposed to the first electrode piece and the second electrode piece.

After the LED is completed, a T-shaped rubber seat is formed between the first electrode sheet and the second electrode sheet, and the T-shaped rubber seat protrudes from the first electrode sheet and the second portion. The height of the plane of the electrode, so It has a colloidal oozing that prevents moisture from penetrating and entering.

Wherein, after the bracket structure is stamped or etched, a metal film is plated on the metal bracket of the bracket structure.

Wherein, the illuminating wafer is a monochromatic or multi-colored wafer.

Wherein, the metal wire is a gold wire.

Wherein, the colloid is tannin.

Among them, the colloid is added with a phosphor powder.

The technical content and detailed description of the present invention are as follows:

Please refer to the first, second and third figures, which are a manufacturing process of the invention, a support structure of the light-emitting diode and a partial enlarged view of the second figure. As shown in the figure: the bracket structure (1) of the light-emitting diode of the present invention, first, step 100 is preceded by a metal plate.

In step 102, the metal plate is stamped or etched into a support structure. The support structure 10 includes a metal frame 1 and a plurality of metal supports 2. The metal frame 1 has a plurality of long holes 11 and short holes 12 arranged at intervals, and has a continuous through hole 13 between the two short holes 12. The metal bracket 2 is composed of a first electrode sheet 21 and a second electrode sheet 22. The first electrode sheet 21 has a rectangular shape and has two sides adjacent to or corresponding to the second electrode sheet 22. Corresponding notches 211, the two sides of the second electrode sheet 22 have two corresponding two grooves 221, and the other side of the second electrode sheet 22 has a notch 222, by the side Two grooves 221 and the notches 222 causes the second electrode sheet 22 to be in the shape of a piece of clothing. In addition, the first electrode sheet 21 and the second electrode sheet 22 are adjacent to or corresponding to the side without a connecting portion 23, and the three sides thereof have a connecting portion, and the connecting portion 23 is a metal bracket 2 that connects the plurality of longitudinal and lateral directions and the metal frame 1.

Step 104, after stamping or etching the stent structure 10, the metal stent 2 of the stent structure 10 is electroplated, and a metal film is plated on the metal stent 2.

Step 106, after the plating structure 10 of the light-emitting diode is completed, using a thermosetting plastic to form a rubber seat 3 on the metal bracket 2 by thermosetting molding technology, and the rubber seat 3 is molded and coated on the first An electrode sheet 21, a second electrode sheet 22, and the connecting portion 23. The front surface of the plastic holder 3 has a hollow functional area 31. The hollow functional area 31 exposes the first electrode sheet 21 and the second electrode sheet 22 (as shown in the fourth figure). Similarly, the back surface of the plastic holder 3 has two through holes 32, 33 for exposing the first electrode sheet 21 and the second electrode sheet 22, and the first electrode sheet 21 and the second electrode are exposed. When the sheet 22 is turned on to illuminate the light-emitting chip (not shown), the two through holes 32 and 33 serve to dissipate heat from the first electrode sheet 21 and the second electrode sheet 22 (as shown in FIG. 5).

Step 108, after the plastic seat 3 of the metal bracket 2 on the bracket structure 10 is completed, before the solid crystal, the wire bonding and the dispensing, a transverse cutting line 20 is cut before the rubber seat 3 is cut. The connecting portion 23 of each of the metal brackets 2 is cut (as shown in the sixth drawing), and the cutting direction is cut by the front or back side of the rubber seat 3 (e.g., Figs. 8 and 9).

Step 110, after the connecting portion 23 is cut, the hollow function of the rubber seat 3 A light-emitting chip 4 (such as the sixth, seventh, eighth, and ninth views) is fixed to the exposed second electrode sheet 22 on the area 31. In the present drawing, the light-emitting wafer 4 is a single-color or multi-color wafer.

In step 112, the illuminating wafer 4 is electrically connected to a metal wire 5 to the exposed first electrode sheet 21 on the hollow functional region 31 (as shown in the sixth, seventh, eighth, and ninth views). In the figure, the metal wire 5 is a gold wire.

Step 114: After the threading is completed, the dispensing is performed in the hollow functional zone 31 of the rubber seat 3, and the colloid 6 is inserted into the hollow functional zone 31. In the present figure, the colloid 6 is a silicone.

Step 116, after the dispensing is completed, the pre-measurement operation can be performed on the light-emitting diode. The so-called pre-test operation is that after the dispensing is completed, the colloid 6 can be applied to the whole column or the single one before the colloid 6 has not dried up. The first electrode sheet 21 and the second electrode sheet 22 of the metal holder 2 of the connecting portion 23 are cut, and the light generated by the light-emitting wafer 4 is mixed with the phosphor powder mixed in the colloid 6. Whether the formed chromaticity and brightness meet the requirements of the previously designed chromaticity and brightness ratio (such as the sixth, seventh, eighth, and ninth figures).

For example, when a white light emitting diode is to be fabricated, the light emitting chip is blue light, and the colloid 6 which is inserted into the hollow functional area 31 is mixed with yellow fluorescent powder, and when the colloid 6 is not dried after being inserted, the detection is performed. The first electrode sheet 21 and the second electrode sheet 22 of the metal holder 2 whose connection portion is cut may be powered to perform brightness and chromaticity of the light-emitting wafer 4 and the colloid 6 mixed with the yellow phosphor powder. Is the ratio correct?

After the LED is completed, a T-shaped rubber seat 3' is formed between the first electrode sheet 21 and the second electrode sheet 22 (as shown in FIG. 7). The T-shaped rubber seat 3' protrudes from the plane height of the first electrode sheet 21 and the second electrode sheet 22, and thus has a colloid 6 which prevents moisture from penetrating and clicking.

After the metal holder 2 is completed, the connector 23 of the metal holder 2 is cut after the plastic holder 3 is completed, so that the light-emitting diode can be pre-tested after dispensing, so that the production yield of the light-emitting diode can be Increase to over 90% to reduce the rate of non-performing.

Please refer to the tenth figure, which is a schematic diagram of another different cutting direction of the bracket structure of the light-emitting diode of the present invention. As shown in the figure: after the production of the rubber holder 3 of the metal support 2 on the support structure of the present invention, before the solid crystal, wire bonding and dispensing, the metal cutting frame 2 is connected by a longitudinal cutting line 30. The connecting portion 23 is cut.

After the connection portion 23 is cut off, a light-emitting chip 4 is fixedly attached to the exposed second electrode sheet 22 on the hollow functional area 31 of the plastic holder 3. The light-emitting chip 4 is electrically connected to a metal wire 5 to the hollow function. The first electrode sheet 21 is exposed on the area 31.

After the solid crystal and the wire are completed, the glue is made in the hollow functional zone 31 of the rubber seat 3, and after the colloid 6 is clicked on the hollow functional zone 31, the finished LED can be pre-coated. In the pre-test operation, after the dispensing process is completed, before the colloid 6 has not dried up, since the connecting portion 23 connecting the metal bracket 2 in the lateral direction has been cut, the detector can also apply a voltage to the entire column or The first electrode sheet 21 and the second electrode sheet 22 of the single metal holder 2 are colored by mixing the light generated by the light-emitting chip 4 with the phosphor powder mixed with the colloid 6. degree And whether the brightness meets the requirements of the previously designed chromaticity and brightness ratio.

Further, the metal frame 1 of the present invention has a plurality of long holes 11 which can serve as cutting targets. When the connecting portions 23 of each of the metal brackets 2 are cut and cut, the cutting tools are cut long. The hole 11 indicates that the connecting portion 23 has been cut and can be judged as a cutting target.

The above are only the preferred embodiments of the present invention and are not intended to limit the scope of the present invention. That is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the invention.

100~116‧‧‧Steps

10‧‧‧Support structure

1‧‧‧Metal border

11‧‧‧ long hole

12‧‧‧ short holes

13‧‧‧through holes

2‧‧‧Metal bracket

21‧‧‧First electrode sheet

211‧‧ ‧ gap

22‧‧‧Second electrode

221‧‧‧ Groove

222‧‧‧ notch

23‧‧‧Connecting Department

3, 3'‧‧‧Glass

31‧‧‧Hollow functional area

32, 33‧‧‧through holes

4‧‧‧Lighting chip

5‧‧‧Metal wire

6‧‧‧colloid

20‧‧‧transverse cutting line

30‧‧‧ longitudinal cutting line

The first figure is a schematic diagram of the production process of the present invention.

The second figure is a schematic view of the structure of the support of the light-emitting diode of the present invention.

The third figure is a partially enlarged schematic view of the first figure.

The fourth figure is a front view showing a rubber seat formed on the support structure of the light-emitting diode of the present invention.

Fig. 5 is a schematic view showing the back surface of the holder structure of the light-emitting diode of the present invention.

Fig. 6 is a top plan view showing the structure of the support of the light-emitting diode of the present invention.

Figure 7 is a side elevational view showing the stent structure of the light-emitting diode of the present invention.

Figure 8 is a front cutaway side view showing the stent structure of the light-emitting diode of the present invention.

Fig. 9 is a side elevational view showing the back side of the stent structure of the light-emitting diode of the present invention.

Fig. 10 is a schematic view showing another different cutting direction of the stent structure of the light-emitting diode of the present invention.

100~116‧‧‧Steps

Claims (13)

A method for fabricating a support structure for a light-emitting diode (1), comprising: a) preparing a metal plate; b) forming a metal frame on the metal plate and a plurality of metal brackets arranged longitudinally and laterally, the metal bracket having a first electrode sheet and a second electrode sheet, the first electrode sheet and the second electrode sheet have a connecting portion on at least one side thereof, the connecting portion connecting the plurality of longitudinal and lateral metal brackets and the metal frame; c) forming a plastic seat on the metal bracket, the front surface of the rubber seat having a hollow functional area for exposing the first electrode sheet and the second electrode sheet; d) for cutting any longitudinal or lateral direction Connecting a connection portion of each of the metal brackets; e) fixing a light-emitting chip on the second electrode sheet in the hollow functional area of the rubber seat; f) electrically connecting a metal wire to the light-emitting chip and the first On the electrode sheet; g), inserting the colloid into the hollow functional area; h) applying a power source to the connection portion on the cut metal bracket, and energizing the first electrode sheet and the second electrode sheet to illuminate the light Wafer for brightness and chromaticity Ratio detection. The manufacturing method (1) of the bracket structure of claim 1, wherein the metal frame of the step b has a plurality of long holes and short holes arranged at intervals, and has a consistent perforation between the two short holes. The method for manufacturing a stent structure according to claim 2, wherein the long hole is a cutting target corresponding to the connecting portion. The method for fabricating a stent structure according to claim 3, wherein the first electrode sheet of the step b has a connecting portion on a side adjacent to or corresponding to the second electrode sheet. The method for fabricating a stent structure according to claim 4, wherein the first electrode sheet is rectangular, and has a corresponding notch on a side adjacent to or corresponding to the second electrode sheet. The method for fabricating a stent structure according to claim 5, wherein the second electrode sheet has two corresponding two grooves on two sides, and the other side of the second electrode sheet has a concave surface. mouth. The method for fabricating a stent structure according to claim 6, wherein the back surface of the rubber seat has two through holes, and the two through holes are exposed to the first electrode sheet and the second electrode sheet. The method for fabricating a stent structure according to claim 7 , wherein after the LED is completed, a T-shaped rubber seat is formed between the first electrode sheet and the second electrode sheet. The T-shaped rubber seat protrudes from the plane height of the first electrode sheet and the second electrode sheet, and thus has a colloidal bleed that prevents moisture from penetrating and pointing in. The method for fabricating a stent structure according to claim 8 is characterized in that, in step b and c, a step of electroplating is further included, and after the stent structure is stamped or etched, a metal layer is plated on the metal bracket of the stent structure. Metal film. The method for fabricating a stent structure according to claim 9 is characterized in that the light-emitting wafer of the step e is a single-color or multi-color wafer. The method for fabricating a stent structure according to claim 10, wherein the metal wire of the step f is a gold wire. The method for manufacturing a stent structure according to claim 11 is as follows, wherein the colloid of the step g is silicone. The method for manufacturing a stent structure according to claim 12, wherein the gel is added with a phosphor powder.