TWM540399U - Heterogeneous LED lighting source component - Google Patents

Description

Heterogeneous LED light source components

The invention relates to an LED illumination source component, and particularly to design a heterogeneous LED illumination source assembly capable of emitting light all the way.

Generally speaking, the material of the LED light-emitting chip is different from that of the substrate, and the principle of the white light of the LED is: the LED chip emits blue light, the yellow phosphor powder on the substrate, and the white light is emitted by the blue light-exciting phosphor powder. Of course, the color temperature or the color of the light can be adjusted by adjusting the proportion of the phosphor in the substrate and the thickness of the substrate. Of course, fluorescent powder can also be omitted in the substrate.

At present, LED light sources have to achieve the goal of light weight and shortness, which are assembled and designed using patch components. Since the patches are single-sided, it is relatively difficult to achieve full-circumference design. The brightness is limited, and it takes a lot of assembly to reach the brightness requirement. Therefore, the development of a heterogeneous LED light source element to achieve full-circumference effect is a very important issue in various lighting fields.

In view of the above-mentioned drawbacks of the prior art, the technical problem to be solved by the present invention is to provide a full-period, heterogeneous LED light source element which is capable of achieving full-circumferential illumination.

The present invention also provides a manufacturing process of the above-described light source element.

In order to achieve the above object, the present invention provides a heterogeneous LED light source device, comprising a first substrate, a second substrate, and a metal via, wherein the metal via is fixed on the first substrate. The LED substrate is fixed on the first substrate, the LED light-emitting chip is connected by wires, and the second substrate is fixedly integrated with the first substrate.

Further, the metal through body is fixed on the first substrate by one of casting, pressing, and molding.

Further, the first substrate and the second substrate are made of a light transmissive material.

Further, the first substrate and the second substrate are obtained by mixing and curing the epoxy resin and the phosphor powder.

Further, the metal via body is made of copper silver plating or iron silver plating.

Further, the first substrate is disposed in the second substrate.

Further, the metal via body includes an outer segment, an inner block, and a connecting segment connecting the outer segment and the inner block, and the inner block and the connecting segment are fixed in the first substrate.

Further, the second substrate is provided with an auxiliary bonding portion.

Further, the auxiliary bonding portion is at least attached to one side of the first substrate.

An LED lamp using the above-described heterogeneous LED light source element.

The process for preparing the above-mentioned heterogeneous LED light source assembly comprises the following steps: S1, compounding, and uniformly mixing the epoxy resin and the curing agent to form a colloid for preparing the substrate; S2, fixing the metal through body The metal conductive body is placed in the first cavity of the first mold, and the colloid prepared in S1 is injected into the cavity, and the first substrate is formed by molding infusion, wherein the temperature of the molding infusion is 100-160 degrees. Time 3~15 minutes; S3, solid crystal wire bonding; fixing the LED light-emitting chip on the first substrate, and then connecting the LED light-emitting chips fixed on the first substrate in series by a wire bonding process; S4, bonding, placing the first substrate after the solid crystal wire bonding in S3 in the second cavity of the second mold; finally, injecting the colloid disposed in S1 into the second cavity, and performing the molding infusion again, so that A substrate and a second substrate are integrally formed, wherein the molding temperature is 100 to 160 degrees and the time is 3 to 15 minutes.

Further, the method further includes the following steps: S5, cutting, according to the finished product style, cutting the bracket and the material to complete the finished product.

Further, the epoxy resin used in S1 may be bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, tetrabromobisphenol epoxy resin, and rubber modified epoxy resin. One of an alicyclic epoxy resin, an aliphatic epoxy resin, or a blend thereof, and any combination thereof.

Further, the curing agent used in S1 may be an acid anhydride curing agent, and the acid anhydride curing agent is methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride or a blend thereof.

Further, the phosphor powder used in S1 may be YAG phosphor powder, TAG phosphor powder, aluminate (Silicate), nitride (Nitride), and nitrogen oxide (Oxynitride), nitrogen oxide. One of the Oxy-nitride fluorescent materials and any combination thereof.

Further, a light diffusing agent may be added to S1.

Further, the light diffusing agent is one of nanometer barium sulfate, calcium carbonate, cerium oxide, acryl type light diffusing agent, styrene type, acrylic type light diffusing agent or any combination thereof.

Further, the material used for the wire bonding in S3 may be one of a gold wire, an aluminum wire, and an alloy wire, and any combination thereof.

Further, the solid crystal wire in S3 can also be flipped, that is, the equivalent circuit obtained by the wire bonding process is printed on the first substrate, and then the LED light emitting chip is fixed on the first substrate, and at the same time, it is ensured. The LED light-emitting chip is electrically connected to the printed circuit.

Further, a process for preparing an isomeric LED light source component comprises the following steps: S1, compounding, modifying epoxy resin, methyl hexahydrophthalic anhydride, YAG phosphor powder, and light diffusing agent according to a weight ratio of 1 : 1: 0.2: 0.01 ratio is taken out uniformly and mixed to form a colloid; S2, a fixed metal conducting body is taken, and the metal conducting body is placed in the first cavity of the first mold, and the colloid prepared in S1 is injected into the cavity. The first substrate is formed by molding perfusion, wherein the temperature of the molding perfusion is 100 to 160 degrees, and the time is 3 to 15 minutes; S3, solid crystal bonding; fixing the LED light-emitting chip on the first substrate, and then passing the wire bonding process The LED light-emitting chips fixed on the first substrate are connected in series; S4, bonding, placing the first substrate after the solid-crystal wire bonding in S3 in the second cavity of the second mold; finally, colloid disposed in S1 The second cavity is injected into the second cavity, and the first substrate and the second substrate are bonded together, wherein the molding temperature is 100 to 160 degrees and the time is 3 to 15 minutes.

The beneficial effect of the novel is that the LED light source component of the novel has a simple structure, and the brightness of the existing LED light source can reach twice that of the existing LED light source, thereby greatly improving the energy utilization rate. Has a good market prospects.

1‧‧‧First substrate

2‧‧‧LED light-emitting chip

3‧‧‧Wire

4‧‧‧second substrate

5‧‧‧Metal conductors

42‧‧‧Auxiliary fitting part

50‧‧‧cut points

51‧‧‧External section

52‧‧‧Connection section

53‧‧‧Internal block

A‧‧‧ first fit surface

B‧‧‧Second mold

B1‧‧‧ cavity

1 is a schematic structural view of a first step of a specific embodiment of a method for manufacturing a heterogeneous LED light source device according to the present invention.

2 is a schematic structural view of a second step of a specific embodiment of a method for manufacturing a heterogeneous LED light source device according to the present invention.

3 is a schematic structural view of a third step of a specific embodiment of a method for manufacturing a heterogeneous LED light source device of the present invention;

4 is a left side view of a specific embodiment of a heterogeneous LED light source element of the present invention.

Figure 5 is a block diagram showing an improved structure of a specific embodiment of a heterogeneous LED light source element of the present invention.

6 is a schematic structural view of a fourth step of a specific embodiment of a method for manufacturing a heterogeneous LED light source device according to the present invention.

Figure 7 is a right side cross-sectional view of a specific embodiment of a heterogeneous LED light source element of the present invention.

Figure 8 is a right side cross-sectional view of a specific embodiment of a heterogeneous LED light source element of the present invention.

The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

Embodiment 1

Referring to FIG. 1 to FIG. 4, a heterogeneous LED light-emitting source component includes a first substrate 1, a second substrate 4, and a metal via 5, and the metal via 5 is fixed on a top surface of the first substrate 1 (relatively 4), the top surface of the first substrate 1 is fixed with an LED light-emitting chip 2, the LED light-emitting chip 2 is connected by a wire 3, and the second substrate 4 and the first substrate 1 are pressed. Combined and integrated.

The metal through body 5 is fixed on the first substrate 1 by casting, pressing, molding, or the like.

The first substrate 1 and the second substrate 4 are made of a light-transmitting material, preferably an epoxy resin and a fluorescent powder are mixed and solidified.

After the LED light-emitting chip of the present invention is energized and emitted, light on all the light-emitting surfaces of the LED light-emitting chip can be emitted through the first substrate 1 and the second substrate 4, which achieves the effect of full light emission.

Of course, the color temperature of the last luminescence of the entire illuminating element can be controlled by adjusting the color, concentration, etc. of the phosphor in the substrate.

The existing LED illumination sources generally only emit light on one side, but the energy consumption is not reduced, and the novel can achieve twice the brightness of the original technology under the premise of using the same energy consumption (because the full-circumference illumination is achieved). The effect) greatly improves the energy utilization rate and meets the demand for high-brightness LED illumination sources.

The metal via 5 is made of copper-plated silver or iron-plated silver.

Embodiment 2

Referring to FIG. 5, the structure is an improved structure of the LED light source element, and the main difference from the first embodiment is as follows:

(1) The metal conducting body 5 is divided into three sections, including an outer connecting section 51, an inner block 53, and a connecting section 52 connecting the outer connecting section 51 and the inner block 53, and the metal conducting body 5 can be formed by a potting process at the time of manufacture. The metal substrate 5 is more firmly fixed on the first substrate 1 in order to solve the problem that the metal conductor 5 in FIG. 4 is likely to be loose.

(2) The second substrate 4 is provided with an auxiliary bonding portion 42 for increasing the bonding area of the first substrate 1 and the second substrate 4 such that the first substrate 1 and the second substrate 4 is not easy to stratify and loose.

The second substrate 4 and the first substrate 1 are bonded to each other at least by the first bonding surface A, and the auxiliary bonding portion 42 is a surface of the second substrate 4 and the first substrate 1 The bonding portion other than the bonding surface A may be attached to one side of the first substrate, or may be bonded to both sides of the first substrate, or may be bonded to the three sides of the first substrate and the upper side. Even the second substrate 4 directly encloses the first substrate 1 therein.

Referring to FIG. 7, the structure shown is such that the first substrate 1 and the second substrate 4 are bonded at least by three sides.

Referring to FIG. 8, the structure is such that the first substrate 1 is directly disposed in the second substrate 4.

Embodiment 3

The manufacturing process of the above heterogeneous LED light source element comprises the following steps:

S1, with glue, the epoxy resin and the curing agent are uniformly mixed in any proportion. Of course, an appropriate amount of fluorescent powder may be added and uniformly mixed according to the actual color temperature, and then configured as a colloid for preparing the substrate;

S2, referring to FIG. 1 or FIG. 5, the metal through body 5 is fixed, and the metal through body 5 is placed in the first cavity A1 of the first mold A, and the colloid prepared in S1 is injected into the cavity A1, and is molded by infusion. The first substrate 1 is prepared in a manner that the temperature of the molding perfusion is 100 to 160 degrees and the time is 3 to 15 minutes;

S3. Referring to FIG. 2, the solid crystal wire is fixed; the LED light-emitting chip 2 is fixed on the first substrate 1, and then the LED light-emitting chips 2 fixed on the first substrate 1 are connected in series by a wire bonding process.

S4, referring to FIG. 6, the first substrate 1 after the solid crystal wire bonding in S3 is placed in the second cavity B1 of the second mold B, and the cavity B1 can be actually required according to the second substrate 4. Designed to match the bonding surface of the first substrate 1.

Finally, the colloid disposed in S1 is injected into the second cavity B2, and the molding is again performed, so that the first substrate 1 and the second substrate 4 are integrally formed, wherein the molding temperature is 100 to 160 degrees, and the time is 3 to 15 minutes. .

S5, referring to FIG. 3, cutting, according to the finished product style, cutting the bracket and the material to complete the finished product, wherein the cutting position of the metal conducting body 5 is the cutting point 50 in FIG. 3, of course, according to actual needs Design the position of the cutting point 50.

Further, the epoxy resin used in S1 may be bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, tetrabromobisphenol epoxy resin, and rubber modified epoxy resin. One of an alicyclic epoxy resin, an aliphatic epoxy resin, or a blend thereof, and any combination thereof.

The curing agent used in S1 may be an acid anhydride curing agent, and the acid anhydride curing agent is methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride or a blend thereof.

The phosphor used in S1 may be YAG phosphor powder, TAG phosphor powder, aluminate (Silicate), nitride (Nitride), and nitrogen oxide (Oxynitride), nitrogen oxide (Oxy). -nitride) One of the fluorescent materials and any combination thereof.

Other functional materials, such as a light diffusing agent, may also be added in S1, and the light diffusing agent may be nano barium sulfate, calcium carbonate, cerium oxide, acrylic light diffusing agent, styrene type, acrylic type light diffusion. Agents, etc.

Further, the material used for the wire bonding in S3 may be one of a gold wire, an aluminum wire, and an alloy wire, and any combination thereof.

Further, the die bonding wire in S3 can also be flipped, that is, the equivalent circuit obtained by the wire bonding process is printed on the first substrate 1 by the conductor, and then the LED light emitting chip is fixed on the first substrate, and at the same time It is ensured that the LED light-emitting chip is electrically connected to the printed circuit.

Embodiment 4

The difference between this embodiment and the third embodiment is that: S1, rubber, modified epoxy resin, methyl hexahydrophthalic anhydride, YAG fluorescent powder, light diffusing agent according to the weight ratio of 1:1: 0.2:0.01 The ratio is taken out uniformly and mixed to form a gel.

The light diffusing agent can function as a softening and atomizing effect of light.

Embodiment 5

In this embodiment, the preparation process of the fourth embodiment is adopted, wherein: the metal conduction body 5 is a copper-plated silver bracket; the fluorescent powder is a Hongdae YAG-432 phosphor powder; and the LED light-emitting chip is a Sanan photoelectric 10*37 wafer; Materials and Processes After the LED light source elements were prepared, they were lit with a driving current of 20 mA, and the brightness was measured by an LED brightness tester (LED-BNTW-12-XY, Honggang Co., Ltd.). The test results are shown in Table 1 below.

In the prior art, the brightness of the product of the same specification as that of the present invention is less than 90 lm/W, so the LED light source component of the present invention can achieve twice the brightness of the prior art under the premise of the same energy consumption. .

The preferred embodiment of the present invention has been described in detail above. It will be appreciated that many modifications and variations can be made by those skilled in the art in light of the inventive concept. Therefore, any technical solution that can be obtained by a person skilled in the art according to the prior art by logic analysis, reasoning or limited experiment based on the prior art concept should be within the protection scope determined by the request item.

1‧‧‧First substrate

2‧‧‧LED light-emitting chip

3‧‧‧Wire

4‧‧‧second substrate

42‧‧‧Auxiliary fitting part

51‧‧‧External section

52‧‧‧Connection section

53‧‧‧Internal block

Claims (9)

A heterogeneous LED light emitting source device, comprising: a first substrate, a second substrate, and a metal conductive body, wherein the metal conductive body is fixed on the first substrate, and the first substrate is fixed on the first substrate There is an LED light emitting chip, the LED light emitting chip is connected by a wire, and the second substrate is fixedly integrated with the first substrate. A heterogeneous LED light source element according to claim 1, wherein the metal conductive body is made of copper silver plating or iron silver plating. A heterogeneous LED light source element according to claim 1 or 2, wherein the metal conductive body comprises an outer connecting portion, an inner block, and a connecting portion connecting the outer connecting portion and the inner block, The inner block and the connecting segment are fixed within the first substrate. The heterogeneous LED light source device of claim 1, wherein the second substrate is provided with an auxiliary bonding portion, and the auxiliary bonding portion is at least one side of the first substrate. . A heterogeneous LED light source element according to claim 4, wherein the first substrate is disposed in the second substrate. A heterogeneous LED light source element according to claim 1, wherein the metal conductive body is fixed on the first substrate by one of casting, pressing, and molding. The heterogeneous LED light source device of claim 1, wherein the first substrate and the second substrate are integrally formed by press molding. The heterogeneous LED light source device of claim 1, wherein the first substrate and the second substrate are made of a light transmissive material. The heterogeneous LED light source device according to claim 1 or 8, wherein the first substrate and the second substrate are obtained by mixing an epoxy resin and a phosphor powder.