TWI509858B - Organic semiconductor apparatus - Google Patents

Description

Organic semiconductor device

The present invention relates to a semiconductor device, and more particularly to an organic semiconductor device.

In recent years, due to the vigorous development of organic semiconductor products, organic light emitting diodes (OLEDs), polymer light emitting diodes (PLEDs), organic photovoltaic cells (OPVs), and thin films have been developed. Thin film photovoltaics, flexible LCDs, and electric papers have already played a pivotal role in the current and future markets.

Most of the current OLEDs use active metals with low work functions to make metal cathodes, so the lifetime of OLEDs is closely related to the water and oxygen content of the display elements. As the use time increases, moisture and oxygen in the environment easily penetrate into the display element, and interact with the active metal cathode, which easily causes peeling between the metal cathode and the organic light-emitting layer, material cracking, electrode oxidation, Defects such as darkspots, which greatly reduce the luminous quality such as the luminous intensity and uniformity of the display elements.

However, in the case of displays made of OLEDs, in order to meet the requirements of modern technology for electronic products, plastic substrates are used to replace traditional glass substrates. As a display substrate, it has become a trend of technology development. The plastic substrate not only provides thinner and lighter properties, but also has better flexibility, which further improves the lack of impact and fragility of the conventional glass substrate. However, the biggest disadvantage of plastic substrates over glass substrates is their poor resistance to moisture and oxygen in the external environment. At this time, components in these organic electronic products may cause damage to the components as long as they are exposed to moisture and oxygen in the air.

In order to solve the above disadvantages, the use of a gas barrier film for packaging is a recent and widely adopted improvement method for protecting components in organic electronic products from the interference of water oxygen and oxygen in the air. In turn, they maintain their functionality and extend their useful life. However, in the current production process of the gas barrier film, the choice of the gas barrier film material or the type of the process is often caused by the inability to balance between the two phases in the process, or the surface quality of the substrate is uneven, resulting in a film. Poor surface roughness and defects in various sizes. Furthermore, since some commonly used gas barrier film materials have less flexible properties, such as inorganic materials, in the process of flexing, if further applied to the flexible electronic products currently prevailing in flexibility, It is also prone to problems such as film surface rupture. It is not difficult to imagine that the above defects will reduce the gas barrier capacity of the gas barrier film, allowing molecular-scale water vapor and oxygen to enter the organic electronic product through these defects. Traditionally, the component is damaged by moisture and oxygen. Hard to eradicate.

In view of the above, the main object of the present invention is to provide an organic semiconductor device capable of sealing an organic semiconductor element through a gel and an encapsulation layer, which is effective Water vapor or gas that blocks the outside environment erodes organic semiconductor components.

To achieve the above objective, the present invention provides an organic semiconductor device comprising: a first encapsulation layer; a second encapsulation layer corresponding to the first encapsulation layer, and an internal space defined between the first encapsulation layer a first substrate disposed in the internal space; an organic semiconductor component disposed on the first substrate; a second substrate disposed on the organic semiconductor component corresponding to the first substrate for covering the organic a semiconductor element; and a solid body filled in the inner space for sealing the organic semiconductor element in cooperation with the first encapsulation layer and the second encapsulation layer. Further, the gel is matched with the first encapsulation layer and the second encapsulation layer for blocking moisture or gas in the external environment.

In a preferred embodiment of the invention, the first encapsulation layer and the second encapsulation layer are one material having a plurality of static pores. In addition, the gel is used to fill a portion of the static pores, wherein the condensation system is one of the materials without static pores.

In the preferred embodiment, the coagulation system is a liquid material or a colloidal substance. Preferably, the liquid material is a polar or non-polar liquid. The polar liquid includes or adds a hydrogen bond molecule, a functional group molecule, or a charged ion. The functional group molecule added to the gel includes -OH, -O-, =CO, -F, -NH2, or -N=N functional groups.

In a preferred embodiment of the invention, the liquid material is a non-polar liquid. In addition, the liquid substance may also be a non-volatile liquid, and the non-volatile liquid may be selected from free lubricating oil, eucalyptus oil, glycerin, ionic liquid, non-food. A group consisting of soybean oil and non-volatile organic alcohols.

In a preferred embodiment of the invention, the first encapsulation layer and/or the second encapsulation layer are made of a polymer material. More specifically, the first substrate and the second substrate are made of the same material as the first encapsulation layer and the second encapsulation layer. Preferably, the first substrate and/or the second substrate have an adhesive layer disposed on a side corresponding to the first substrate and/or the second substrate for reducing the first substrate And a temperature at which the second substrate is thermocompression bonded.

In a preferred embodiment of the invention, the organic semiconductor component is selected from the group consisting of an organic light emitting diode, a polymer light emitting diode, an organic solar cell, and an organic thin film transistor.

The organic semiconductor device of this embodiment further includes at least one lead connecting the organic semiconductor element and an external element. In addition to this, the gel is added with an anti-corrosion additive. Furthermore, the at least one pin comprises a protective coating.

In the preferred embodiment, the first encapsulation layer and the second encapsulation layer are thermocompression bonded around the inner space. More specifically, a portion of the at least one pin is clamped to the thermal compression of the first encapsulation layer and the second encapsulation layer.

In another preferred embodiment of the present invention, the organic semiconductor device further includes an adhesive for bonding between the first encapsulation layer and the second encapsulation layer and defining the internal space. In addition, the at least one pin is connected to the external component through the sealant. In the preferred embodiment, the sealant comprises an ultraviolet curable resin or a solid material, and the solid material can be a metal Material, an organic material or an inorganic material.

The invention utilizes a liquid or gel-like gel to encapsulate the organic semiconductor component in the first and second encapsulation layers, so that the gel fills the first and second encapsulation layer portions on the interface with the encapsulation layer. The static pores thereby eroding the organic semiconductor element by moisture or gas that blocks the external environment. Accordingly, the present invention achieves the object of the present invention by merely forming a solid-liquid interface to effectively block the erosion of the organic semiconductor element by moisture or gas in the external environment.

10‧‧‧Organic semiconductor devices

20‧‧‧Organic semiconductor devices

120‧‧‧First encapsulation layer

130‧‧‧Internal space

140‧‧‧Second encapsulation layer

150‧‧‧First substrate

160‧‧‧Organic semiconductor components

170‧‧‧second substrate

180‧‧‧ condensate

190‧‧‧ pin

210‧‧‧Packing

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional view showing an organic semiconductor device according to a preferred embodiment of the present invention.

Fig. 2 is a schematic plan view of the organic semiconductor device of Fig. 1.

Figure 3 is a schematic cross-sectional view showing an organic semiconductor device according to another preferred embodiment of the present invention.

Fig. 4 is a schematic plan view of the organic semiconductor device of Fig. 3.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the organic semiconductor device of the present invention will be described in detail with reference to the accompanying drawings. Please refer to FIG. 1. FIG. 1 is a schematic cross-sectional view showing an organic semiconductor device according to a preferred embodiment of the present invention. The organic semiconductor device 10 of the present invention includes a first encapsulation layer 120, a second encapsulation layer 140, a first substrate 150, an organic semiconductor device 160, a second substrate 170, and a condensed matter 180.

As shown in FIG. 1 , the second encapsulation layer 140 corresponds to the first seal The layer 120 is disposed, and an internal space 130 is defined between the first package layer 120 and the first package layer 120. In the preferred embodiment, the first encapsulation layer 120 and/or the second encapsulation layer 140 are made of a polymer material. Preferably, the first encapsulation layer 120 and the second encapsulation layer 140 are made of the same material. However, the present invention is not limited thereto, and the first encapsulation layer 120 and the second encapsulation layer 140 may also be two different materials.

Specifically, the first encapsulation layer 120 and the second encapsulation layer 140 are made of a flexible material, which may be polyethylene (PE), polyethylene terephthalate (PET), or polypropylene (PP). ), polyvinyl chloride (PVC), etc. Among them, PET and PE materials are often used, and because PET materials are cheaper and have certain cost advantages, they are more commonly used for soft electronic products. In addition, it is further explained that when the first encapsulation layer 120 and the second encapsulation layer 140 provided by the present invention are to be applied to an optoelectronic electronic product, the transmittance of the material selected herein needs to be greater than 85%.

The first substrate 150 is disposed in the internal space 130 formed by the first encapsulation layer 120 and the second encapsulation layer 140. Next, the organic semiconductor device 160 is disposed on the first substrate 150. Further, the organic semiconductor device 160 is selected from the group consisting of an organic light emitting diode (OLED), a polymer light emitting diode (PLED), an organic solar cell (OPV), and an organic thin film transistor (Organic Thin-Film Transistor, OFTF). One of the groups formed. The second substrate 170 is disposed on the organic semiconductor device 160 corresponding to the first substrate 150 for covering the organic semiconductor device 160.

It is to be noted that the first substrate 150 and/or the second substrate 170 have an adhesive layer (not shown), and the adhesive layer is disposed on the first substrate 150. And a side corresponding to the second substrate 170 for reducing the temperature at which the first substrate 150 and the second substrate 170 are thermally pressed. For example, the adhesive layer is made of a polymer material having a low glass transition temperature (Tg), which reduces the influence of thermal energy on the organic semiconductor device 160 during thermocompression bonding. Preferably, the adhesive layer is an Ethylene Vinyl Acetate Copolymer (EVA) or an Ethylene Vinyl Alcohol Copolymer (EVOH) material.

In this embodiment, the organic semiconductor device 160 is an organic light emitting diode having a multilayer structure such as an anode, a cathode, a hole transport layer, a light emitting layer and an electron transport layer, which are well known to those skilled in the art (not shown). I will not repeat them here. It should be noted that the first substrate 150 and the second substrate 170 are made of the same material as the first encapsulation layer 120 and the second encapsulation layer 140, and are, for example, a flexible polymer material.

As shown in FIG. 1 , the solid body 180 is filled in the internal space 130 for sealing the organic semiconductor device 160 , the first substrate 150 and the second with the first encapsulation layer 120 and the second encapsulation layer 140 . Substrate 170. Accordingly, the condensed body 180 cooperates with the first encapsulating layer 120 and the second encapsulating layer 140 to block the external environment from moisture or gas from eroding the organic semiconductor device 160.

The principle of the barrier 180 blocking moisture or gas will be described in detail below. The first encapsulation layer and the second encapsulation layer are one material having a plurality of static pores, and the static pores may be a free volume between molecules or a defect in the structure thereof. The body 180 and the first encapsulation layer 120 and the second seal The layer 140 forms an interface around the interior space 130. The body 180 is used to fill the static pores near the interface portion, thereby forming a high barrier effectiveness interface.

Further, in accordance with the present invention, the aforementioned gel 180 is formed of a substance which is not solid or has a continuous phase, such as a liquid substance or a colloidal substance. Therefore, the gel 180 can fill a portion of the static pores of the first and second encapsulation layers 120, 140 close to the interface. Thereby, when the moisture or gas of the external environment (especially oxygen) passes through the path of the static pores in the first and second encapsulating layers 120, 140, a high concentration gradient is formed near the barrier interface, and It is not conducive to the diffusion phenomenon required for moisture or gas to enter the condensate 180, and therefore the moisture or gas of the external environment is more difficult to enter the condensate 180.

Specifically, the gel 180 is a substance having no static pores. For example, the gel 180 is a liquid substance or a colloidal substance, wherein the liquid substance is a polar or non-polar liquid. As described above, the gel 180 of the present invention mainly utilizes the continuity of the liquid to achieve the effect of blocking water and gas. The liquid selected for the gel 180 can be a volatile liquid, a non-volatile liquid or a flowable colloid. In a preferred embodiment, the thickness of the gel 180 is between 10 and 100 μm. In addition, the gel 180 is preferably a non-volatile liquid, and the non-volatile liquid may be selected from the group consisting of lubricating oil, eucalyptus oil, glycerin, ionic liquid, non-edible soybean oil and non-volatile organic alcohol. . However, as mentioned above, the gel 180 of the present invention may also be a volatile liquid or a flowable colloid, and substantially the material used for the gel 180 may be the same as the first encapsulating layer 120 and the The material used for the second encapsulation layer 140 may have good compatibility, and the present invention is not limited to the above materials.

Moreover, in an embodiment of the invention, the gel 180 may further comprise or add a plurality of polar molecules. Polar molecules can then include hydrogen bonding molecules, chelating functional group molecules or charged ions. Thereby, the effect of the barrier can be further improved. There is a strong force between the gas molecules and the liquid molecules, so that moisture or gas (especially oxygen) is adsorbed to the barrier layer formed between the first and second encapsulating layers 120, 140 and the gel 180, and The aforementioned strong force, the adsorbed water gas or gas (especially oxygen) is not easy to get out of the interface, which is not conducive to the diffusion of water vapor or gas (especially oxygen) and its absorption by the solid body 180, that is, its diffusion phenomenon is therefore greatly cut back. Therefore, according to the polar molecules in the foregoing embodiments of the present invention, the effect of the moisture or gas of the external environment on the erosion of the organic semiconductor element 160 can be further reduced.

In an embodiment of the present invention, the selected colloid 180 may further comprise or add at least one chemical molecule including a specific functional group for generating hydrogen bonds or generating polar molecules with water molecules in moisture. . Furthermore, the chemical molecule may also include a specific functional group for oxygen molecules in oxygen, and the following figure is an example of a coordination compound with oxygen molecules (for example, Heme Heme):

Another example of a coordination compound for oxygen molecules:

Or a carbon dioxide molecule in the external environment to produce a coordination complex. Examples of coordination compounds with carbon dioxide:

Also, the selected body 180 may further include or add a plurality of polar molecules. Polar molecules include hydrogen bond molecules, specific functional group molecules or charged ions, and there may be strong forces between gas molecules and liquid molecules, such as -OH, -O-, =CO, -F. , -NH2, -N=N, etc. The moisture or gas (especially oxygen) is adsorbed to the selected colloid 180, and due to the aforementioned strong force, the diffusion coefficient thereof is lowered, and the transmittance of the control gas molecules is lowered. As can be appreciated from the above formulation techniques, the present invention can control the formulation to control the penetration of different gas molecules, and thus in embodiments of the invention, the package structure has different transmittance characteristics for at least two gas molecules.

The package structure provided by the present invention can be completed by a wet coating process, but the present invention utilizes the interface between the first and second encapsulation layers 120, 140 and the gel to form a barrier. The external environment moisture or gas barrier. Therefore, the process is not limited to all using a full wet coating process, or using a full wet coating process with a bonding process. That is, the present invention mainly coats the first and second encapsulating layers 120, 140 with a wet coating. Follow up with other processes or similar processes. Furthermore, the wet coating process may be a wire bar coating process, a blade coating process, a roller coating process, a dip coating process, a rotary coating process, or a precision slit coating process. Any coating method such as a process, a curtain coating process, or a swash plate coating is produced by piece by piece or roll to roll.

In summary, in the present invention, the wet coating process is applied to the first and second encapsulating layers 120 and 140 by a wet coating process, which is suitable for mass production because of low cost. According to the present invention, it is only necessary to form at least one interface to effectively block the moisture or gas of the external environment, thereby achieving the object of the present invention. At the same time, compared with the conventional technology, it is no longer necessary to carry out technical development with specificity and limitation for individual products and articles, and the manufacturing cost is also greatly reduced.

Please refer to FIG. 1 and FIG. 2 together. FIG. 2 is a schematic plan view of the organic semiconductor device of FIG. 1. The first encapsulation layer 120 and the second encapsulation layer 140 are thermocompression bonded around the inner space 130, thereby forming a rectangular inner space 130 as shown in FIG. In addition, the organic semiconductor device 10 of the embodiment further includes at least one pin 190, and the at least one pin 190 is connected to the The semiconductor component 160 and an external component (not shown). In this embodiment, the pins 190 are respectively connected to the anode and cathode of the organic semiconductor device 160 of the OLED, thereby providing power required for illumination.

It should be noted that the pin 190 is preferably a very thin copper foil, so that a portion of the at least one pin 190 is clamped between the first encapsulation layer 120 and the second encapsulation layer 140. Does not affect the sealing of hot pressing.

Specifically, since the metal pin 190 is in contact with the gel 180, the gel 180 may be added with an anti-corrosion additive to further prevent the metal pin 190 from being rusted or aged, taking into account the reliability of the overall component, such as: An oxidizing agent, or a corrosion inhibitor for a specific metal (eg, copper of copper), causes the metal pin 190 to be less susceptible to oxidation or metal ions to form an electrochemical cell reaction and rust. Specifically for inorganic copper pins, inorganic additives such as chromium CrO42-, molybdate MoO42- and tetraborate B4O72- can be used. Or the following organic additives, (1) Azoles such as: 2-amino-5-ethyl-1, 3,4-thiadiazole and 5-phenyl-tetrazol; (2) Amines such as: N-phenyl-1,4-phenylenediamine; (3) Amino acids, such as: tryptophan; (4) Triphenylmethane derivatives; (5) Thiole group compounds, such as: 1-phenyl-2,5-dithio hydrazodicarbonamide; (6) Phosphates (triethyl phosphate) such as: triethyl phosphate; 7) Other: dithiouracil, 3-mercapto-propyltrimethoxy-silane (PropS-SH). On the other hand, the at least one pin 190 may further comprise a protective coating, that is, the metal pin 190 may be advanced as a protective coating for protection.

Hereinafter, an organic semiconductor device according to another embodiment of the present invention will be described. Referring to FIG. 3 and FIG. 4, FIG. 3 is a schematic cross-sectional view showing an organic semiconductor device according to another preferred embodiment of the present invention, and FIG. 4 is a view 3 is a schematic top view of an organic semiconductor device. The organic semiconductor device 20 of the preferred embodiment of the present invention includes a first encapsulation layer 120, and a second encapsulation layer 140 corresponding to the first encapsulation layer 120 and defined between the first encapsulation layer 120 and the first encapsulation layer 120. An internal space 130; a first substrate 150 disposed in the internal space 130; an organic semiconductor device 160 disposed on the first substrate 150; a second substrate 170 corresponding to the first substrate 150 disposed thereon The organic semiconductor device 160 is used to cover the organic semiconductor device 160; and a solid body 180 is filled in the internal space 130 for sealing the organic semiconductor device with the first encapsulation layer 120 and the second encapsulation layer 140. 160. In the present embodiment, the same components as those in the above embodiment are referred to the foregoing, and are not described herein.

Different from the foregoing embodiments, the organic semiconductor device 20 of the further preferred embodiment further includes a sealant 210 for bonding between the first encapsulation layer 120 and the second encapsulation layer 140. And the internal space 130 is defined. Specifically, the sealant 210 comprises an ultraviolet curable resin or a solid material, and the solid material may be a metal material, an organic material or an inorganic material.

Similarly, the organic semiconductor device 20 of this preferred embodiment includes at least one pin 190 that connects the organic semiconductor device 160 and an external component (not shown). In this embodiment, as shown in FIG. 4, The at least one pin 190 is connected to the external component through the sealant 190. However, the present invention does not limit the specific location of the lead 190 in the sealant 190 through the sealant 190.

In summary, the present invention utilizes a liquid or gel-like gel 180 to encapsulate the organic semiconductor component 160 in the first and second encapsulation layers 120, 140 such that the gel 180 is on the interface with the encapsulation layer. The static pores of the first and second encapsulation layers 120, 140 are filled, thereby blocking the erosion of the organic semiconductor element 160 by moisture or gas from the external environment. Accordingly, the present invention achieves the object of the present invention by merely forming a solid-liquid interface to effectively block the erosion of the organic semiconductor element 160 by moisture or gas in the external environment.

While the invention has been described above in terms of preferred embodiments, it is not intended to limit the invention. Various changes and modifications may be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10‧‧‧Organic semiconductor devices

120‧‧‧First encapsulation layer

130‧‧‧Internal space

140‧‧‧Second encapsulation layer

150‧‧‧First substrate

160‧‧‧Organic semiconductor components

170‧‧‧second substrate

180‧‧‧ condensate

190‧‧‧ pin

Claims (23)

An organic semiconductor device includes: a first encapsulation layer; a second encapsulation layer corresponding to the first encapsulation layer, and an internal space defined between the first encapsulation layer; a first substrate disposed on the In the internal space, an organic semiconductor component is disposed on the first substrate; a second substrate is disposed on the organic semiconductor component corresponding to the first substrate for covering the organic semiconductor component; and a solid body is filled In the internal space, the organic semiconductor element is sealed in cooperation with the first encapsulation layer and the second encapsulation layer, wherein a hydrogen bond molecule, a functional group molecule or a charged ion is added to the gel. The organic semiconductor device according to claim 1, wherein the first and second encapsulating layers are used to block moisture or gas from the external environment. The organic semiconductor device according to claim 1, wherein the first encapsulation layer and the second encapsulation layer are one of a plurality of static pores. An organic semiconductor device according to claim 3, wherein the gel is used to fill a portion of the static pores. The organic semiconductor device according to claim 1, wherein the condensed system is one of no static pores. An organic semiconductor device according to claim 1, wherein the functional group molecule added to the gel comprises -OH, -O-, =CO, -F, -NH2, or -N=N functional groups. The organic semiconductor device according to claim 5, wherein the coagulation system is a liquid substance or a colloidal substance. The organic semiconductor device according to claim 7, wherein the liquid substance is a polar or non-polar liquid. An organic semiconductor device according to claim 8 wherein the polar liquid comprises a hydrogen bond molecule, a functional group molecule or a charged ion. The organic semiconductor device according to claim 9, wherein the functional group molecule comprises -OH, -O-, =CO, -F, -NH2, or -N=N functional groups. The organic semiconductor device according to claim 7, wherein the liquid material is a non-volatile liquid, and the non-volatile liquid is selected from the group consisting of free lubricating oil, eucalyptus oil, glycerin, ionic liquid, non-edible soybean oil and non-volatile organic alcohol. A group of classes. The organic semiconductor device according to claim 1, wherein the first encapsulation layer and/or the second encapsulation layer are made of a polymer material. The organic semiconductor device according to claim 1, wherein the first substrate and the second substrate are made of the same material as the first encapsulating layer and the second encapsulating layer. The organic semiconductor device of claim 1, wherein the first substrate and/or the second substrate have an adhesive layer disposed on a side corresponding to the first substrate and/or the second substrate It is used to reduce the temperature at which the first substrate and the second substrate are thermocompression bonded. The organic semiconductor device according to claim 1, wherein the organic semiconductor device is one selected from the group consisting of an organic light emitting diode, a polymer light emitting diode, an organic solar cell, and an organic thin film transistor. The organic semiconductor device according to claim 1, further comprising at least one pin connected to the organic semiconductor element and an external element. An organic semiconductor device according to claim 16 wherein the gel is added with an anti-corrosion additive. The organic semiconductor device according to claim 16, wherein the at least one pin comprises a protective coating. The organic semiconductor device according to claim 16, wherein the first encapsulation layer and the second encapsulation layer are thermocompression bonded around the inner space. The organic semiconductor device according to claim 19, wherein a part of the at least one pin is sandwiched between the first package layer and the second package layer. The organic semiconductor device according to claim 16 further comprising a glue for bonding between the first encapsulation layer and the second encapsulation layer and defining the internal space. The organic semiconductor device according to claim 21, wherein the at least one pin is connected to the external component through the sealant. The organic semiconductor device according to claim 22, wherein the sealant comprises an ultraviolet curable resin or a solid material, and the solid material may be a metal material, an organic material or an inorganic material.