WO2016086533A1

WO2016086533A1 - Oled encapsulation method and oled encapsulation structure

Info

Publication number: WO2016086533A1
Application number: PCT/CN2015/072474
Authority: WO
Inventors: 刘亚伟; 王宜凡
Original assignee: 深圳市华星光电技术有限公司
Priority date: 2014-12-02
Filing date: 2015-02-08
Publication date: 2016-06-09
Also published as: US20160343975A1; CN104576972A

Abstract

Provided are an OLED encapsulation method and an OLED encapsulation structure; the OLED encapsulation method comprises: Step 1: an encapsulation cover panel (1), and a substrate (2) provided with an OLED device (21), are provided; said encapsulation cover panel (1) is provided beforehand with a circular adhesive area (10); Step 2: surface roughening is performed on the adhesive area (10) of said encapsulation cover panel (1) to obtain a circular rough face (11); Step 3: a circular coating of sealant (12) is applied on said rough face (11); Step 4: the inner side of the sealant (12) on said encapsulation cover panel (1) is coated with a layer of liquid desiccant (13); Step 5: the encapsulation cover panel (1) is joined to the substrate (2), and the sealant (12) is cured, such that the encapsulation cover panel (1) and the substrate (2) are bonded together, completing the encapsulation of the OLED device. The method has significantly improved bond strength between the encapsulation cover panel and the substrate, and improved sealing therebetween.

Description

OLED packaging method and OLED package structure

Technical field

The present invention relates to the field of display technologies, and in particular, to an OLED packaging method and an OLED package structure.

Background technique

In the field of display technology, flat panel display technologies such as liquid crystal displays (LCDs) and organic light emitting diodes (OLEDs) have gradually replaced CRT displays. Among them, OLED has self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, near 180° viewing angle, wide temperature range, flexible display and large-area full-color display, etc. It is widely used in mobile phone screens, computer monitors, full-color TVs, etc., and is recognized by the industry as the most promising display device.

The OLED has an anode, an organic light-emitting layer, and a cathode which are sequentially formed on a substrate. The biggest problem that restricts the development of the OLED industry and the biggest drawback of OLEDs is that the lifetime of OLEDs is short, and the reason why the lifetime of OLEDs is short is mainly due to the electrodes of the OLED devices and the organic materials of the luminescent layer for the pollutants, water vapor, and oxygen in the atmosphere. Very sensitive, it is prone to electrochemical corrosion in the environment containing water vapor and oxygen, causing damage to OLED devices. Therefore, the OLED must be effectively encapsulated to prevent moisture and oxygen from entering the OLED.

The OLED package mainly includes the following methods: desiccant package, UV glue package (also known as Dam only package), UV glue and filler package (also known as Dam&Fill package), glass glue package (also known as Frit package). Among them, UV adhesive packaging technology is the earliest and most commonly used technology of OLED packaging. It has the following characteristics: no solvent or a small amount of solvent, which reduces the environmental pollution of solvent; low energy consumption, low temperature curing, suitable for UV sensitivity The material has a fast curing speed and high efficiency, and can be used in a high-speed production line, and the curing equipment has a small footprint. However, the sealant used in the UV adhesive package is an organic material, which has a large molecular gap after curing, and adopts a conventional OLED packaging method because the sealant has curing defects, porosity, and weak adhesion to the substrate and the package cover. For other reasons, water vapor and oxygen are more likely to penetrate into the inner sealing region through the gap, resulting in faster degradation of the performance of the OLED device and shortened life.

Therefore, by effectively encapsulating the OLED, the internal sealing of the OLED device is ensured, and the contact between the OLED device and the external environment in oxygen and water vapor is minimized, which is essential for the stable performance of the OLED device and prolonging the service life of the OLED.

At present, the packaging technology of OLED devices has become a hot topic in related research at home and abroad.

Summary of the invention

The object of the present invention is to provide an OLED packaging method, which can significantly improve the adhesion between the package cover plate and the substrate, improve the sealing property, effectively reduce oxygen and water vapor permeating into the OLED, thereby improving the performance of the OLED device and prolonging The lifetime of OLED devices.

The object of the present invention is to provide an OLED package structure, which can firmly bond the package cover plate and the substrate, has a better sealing effect, and effectively reduces oxygen and moisture permeating into the OLED, thereby improving the performance of the OLED device. Extend the life of OLED devices.

To achieve the above objective, the present invention provides an OLED packaging method, including the following steps:

Step 1. Providing a package cover plate and a substrate provided with an OLED device, wherein the package cover plate is preliminarily provided with a ring of glue application area;

Step 2, performing surface roughening treatment on the rubberized area of the package cover to obtain a ring of matte surface;

Step 3, applying a ring of sealant on the matte surface;

Step 4, applying a layer of liquid desiccant on the inside of the sealant on the package cover;

Step 5: The package cover is pasted on the substrate, and the sealant is cured, and the package cover is bonded to the substrate to complete the packaging of the OLED device.

The package cover and the substrate are both glass substrates.

In the step 2, the matte surface is obtained by a method of grinding wheel rubbing or flannel rubbing.

The matte surface is composed of a plurality of irregular friction marks that are recessed on the surface of the package cover.

The surface of the matte surface is no more than 50 um.

In the step 5, the sealant is cured by ultraviolet light irradiation.

The present invention also provides an OLED package structure, including a package cover, a substrate disposed opposite the package cover, an OLED device disposed on the package cover and the substrate, and the OLED device. Externally bonding a sealant of the package cover and the substrate, filling a liquid desiccant inside the sealant and covering the OLED device; the package cover has a ring of rough surface treated by surface roughening The frame glue is disposed on the matte surface.

The surface of the matte surface is no more than 50 um.

The package cover and the substrate are both glass substrates.

The present invention also provides an OLED package structure, including a package cover, a substrate disposed opposite the package cover, an OLED device disposed on the package cover and the substrate, and the OLED device. Externally bonding a sealant of the package cover and the substrate, filling a liquid desiccant inside the sealant and covering the OLED device; the package cover has a ring of rough surface treated by surface roughening The frame glue is disposed on the matte surface;

Wherein the matte surface is composed of a plurality of irregular friction marks that are recessed on the surface of the package cover;

Wherein, the package cover and the substrate are both glass substrates.

The invention provides an OLED packaging method, which obtains a matte surface by surface roughening treatment on a pre-applied area of a package cover plate, and then applies a sealant on the matte surface to increase the sealant and the sealant. The contact area of the package cover plate enhances the adhesion between the package cover plate and the substrate, improves the sealing property, effectively reduces oxygen and water vapor permeating into the OLED, improves the performance of the OLED device, and prolongs the OLED device. Service life. The invention provides an OLED package structure, wherein the package cover has a ring surface roughened surface, and the frame glue is disposed on the matte surface, thereby increasing the contact area between the sealant and the package cover. The package cover plate and the substrate are firmly bonded together, and the sealing effect is better, and the oxygen and water vapor which penetrate into the OLED are effectively reduced, thereby improving the performance of the OLED device and prolonging the service life of the OLED device.

DRAWINGS

The technical solutions and other advantageous effects of the present invention will be apparent from the following detailed description of embodiments of the invention.

In the drawings,

1 is a flow chart of an OLED packaging method of the present invention;

2 is a schematic diagram of step 1 of the OLED packaging method of the present invention;

3 is a schematic diagram of step 2 of the OLED packaging method of the present invention;

Figure 4 is a cross-sectional view corresponding to Figure 3;

FIG. 5 is a schematic diagram of step 3 of the OLED packaging method of the present invention; FIG.

6 is a schematic diagram of step 4 of the OLED packaging method of the present invention;

FIG. 7 is a schematic diagram of step 5 of the OLED packaging method of the present invention and a schematic diagram of the OLED package structure of the present invention.

detailed description

In order to further clarify the technical means and effects of the present invention, the following detailed description will be made in conjunction with the preferred embodiments of the invention and the accompanying drawings.

Referring to FIG. 1 , the present invention provides an OLED packaging method, including the following steps:

Step 1, please refer to FIG. 2 and FIG. 7 at the same time, and provide a package cover plate 1 and a substrate 2, and the package cover plate 1 is provided with a ring of glue application area 10 in advance.

The package cover 1 and the substrate 2 are both transparent substrates. Preferably, the package cover 1 and the substrate 2 are both glass substrates. The substrate 2 is a substrate provided with an OLED device 21, and preferably, the substrate 2 is a TFT substrate provided with an OLED device 21.

Step 2, please refer to FIG. 3 and FIG. 4 at the same time, and the surface of the glue coating area 10 of the package cover 1 is roughened to obtain a ring surface 11 .

Specifically, the matte surface 11 can be obtained by a method of grinding wheel rubbing or flannel rubbing. Further, the matte surface 11 obtained by the friction of the grinding wheel or the rubbing of the fleece is composed of a plurality of irregular rubbing marks 111 recessed on the surface of the package cover 1. Preferably, the depth of the matte surface 11 is controlled within 50 um.

Step 3. As shown in FIG. 5, a ring of sealant 12 is coated on the matte surface 11.

The sealant 12 is a UV curable adhesive.

Step 4: As shown in FIG. 6, a liquid desiccant 13 is coated on the inside of the sealant 12 on the package cover 1.

Specifically, the liquid desiccant 13 is a liquid desiccant code-named "OleDry-F" developed by Japan Shuangye Electronics Co., Ltd., which is transparent, has certain viscosity, and has good hygroscopicity, and its chemical formula is :

Wherein R is a substituent such as ethyl (CH ₃ CH ₂ -) or the like.

Step 5, as shown in FIG. 7, the package cover 1 and the substrate 2 are relatively adhered, and the sealant 12 is cured by ultraviolet light irradiation, and the package cover 1 and the substrate 2 are bonded together. The packaging of the OLED device 21 is completed.

In the above OLED packaging method, since the surface of the rubberized area 10 on the package cover 1 is roughened to obtain the matte surface 11, the sealant 12 is coated on the matte surface 11 to make the sealant 12 and the package cover. The contact area of the board 1 is increased, the bonding force between the sealant 12 and the package cover 1 is increased, thereby significantly enhancing the adhesion between the package cover 1 and the substrate 2, improving the sealing property and effectively reducing Oxygen and water vapor permeate into the interior of the OLED, and a liquid desiccant 13 is filled inside the sealant 12 for absorbing water vapor intruding into the OLED, which can improve the performance of the OLED device and prolong the service life of the OLED device.

Referring to FIG. 7 , the present invention further provides an OLED package structure, including a package cover plate 1 , a substrate 2 disposed opposite to the package cover plate 2 , and a substrate 2 disposed on the package cover plate 1 and the substrate 2 . The OLED device 21 on the periphery of the OLED device 21, the sealant 12 on the package cover 1 and the substrate 2, and the liquid desiccant 13 filled on the inside of the sealant 12 and covering the OLED device 21 .

The package cover plate 1 has a ring surface roughened surface 11 on the surface of the package cover 1 It is disposed on the matte surface 11.

Specifically, the package cover 1 and the substrate 2 are both transparent substrates. Preferably, the package cover 1 and the substrate 2 are both glass substrates. The substrate 2 is a TFT substrate provided with an OLED device 21.

The matte surface 11 is obtained by grinding wheel rubbing or flannel rubbing, and is composed of a plurality of irregular rubbing marks 111 recessed on the surface of the package cover plate 1. Further, the surface of the matte surface 11 is no more than 50 um.

The liquid desiccant 13 is a liquid desiccant code-named "OleDry-F" developed by Japan Shuangye Electronics Industry Co., Ltd. The liquid desiccant is transparent, has certain viscosity, and has good moisture absorption performance. The chemical formula is:

Wherein R is a substituent such as ethyl (CH ₃ CH ₂ -) or the like.

In the above OLED package structure, the package cover 1 has a ring surface 11 which is subjected to surface roughening treatment, and the sealant 12 is disposed on the matte surface 11 to increase the sealant 12 and the package cover 1 The contact area increases the bonding force between the sealant 12 and the package cover 1, and the package cover 1 and the substrate 2 are firmly bonded together, and the sealing effect is good, thereby effectively reducing oxygen and the penetration into the OLED. The water vapor is filled with a liquid desiccant 13 on the inner side of the sealant 12 for absorbing water vapor intruding into the OLED, thereby improving the performance of the OLED device and prolonging the service life of the OLED device.

In summary, the OLED packaging method of the present invention obtains a matte surface by roughening the pre-applied area of the package cover, and then applies a sealant on the matte surface to increase the sealant and the package cover. The contact area enhances the adhesion between the package cover and the substrate, improves the sealing property, effectively reduces oxygen and water vapor permeating into the OLED, improves the performance of the OLED device, and prolongs the service life of the OLED device. In the OLED package structure of the present invention, the package cover has a ring surface roughened surface, and the frame glue is disposed on the surface of the surface, thereby increasing the contact area between the sealant and the package cover, and enabling the package cover The board and the substrate are firmly bonded together, and the sealing effect is good, and the oxygen and water vapor which penetrate into the OLED are effectively reduced, thereby improving the performance of the OLED device and prolonging the service life of the OLED device.

In the above, various other changes and modifications can be made in accordance with the technical solutions and technical concept of the present invention, and all such changes and modifications can be made by those skilled in the art. All should fall within the scope of protection of the claims of the present invention.

Claims

An OLED packaging method includes the following steps:

Step 1. Providing a package cover plate and a substrate provided with an OLED device, wherein the package cover plate is preliminarily provided with a ring of glue application area;

Step 2, performing surface roughening treatment on the rubberized area of the package cover to obtain a ring of matte surface;

Step 3, applying a ring of sealant on the matte surface;

Step 4, applying a layer of liquid desiccant on the inside of the sealant on the package cover;

Step 5: The package cover is pasted on the substrate, and the sealant is cured, and the package cover is bonded to the substrate to complete the packaging of the OLED device.
The OLED packaging method according to claim 1, wherein the package cover and the substrate are both glass substrates.
The OLED packaging method according to claim 1, wherein the matte surface is obtained by the method of grinding wheel rubbing or flannel rubbing in the step 2.
The OLED packaging method according to claim 1, wherein the matte side is composed of a plurality of irregular rubbing marks recessed on a surface of the package cover.
The OLED packaging method according to claim 4, wherein the matte side has a depth of not more than 50 um.
The OLED packaging method according to claim 1, wherein the sealant is cured by ultraviolet light irradiation in the step 5.
An OLED package structure includes a package cover, a substrate disposed opposite the package cover, an OLED device disposed on the package cover and the substrate, and a periphery of the OLED device a sealant encapsulating the cover plate and the substrate, filling a liquid desiccant inside the sealant and covering the OLED device; the package cover has a ring surface roughened surface, and the frame is glued On the matte side.
The OLED package structure according to claim 7, wherein the matte side is composed of a plurality of irregular rubbing marks recessed on the surface of the package cover.
The OLED package structure of claim 8 wherein said matte side has a depth of no greater than 50 um.
The OLED package structure according to claim 7, wherein the package cover and the substrate are both glass substrates.
An OLED package structure includes a package cover plate, a substrate disposed opposite to the package cover plate, and an OLED device disposed on the package cover plate and the substrate Bonding the encapsulation cover and the substrate to the periphery of the OLED device, filling the inside of the sealant and covering the liquid desiccant of the OLED device; the package cover has a ring surface roughened The matte surface, the frame glue is disposed on the matte surface;

Wherein the matte surface is composed of a plurality of irregular friction marks that are recessed on the surface of the package cover;

Wherein, the package cover and the substrate are both glass substrates.
The OLED package structure of claim 11 wherein said matte side has a depth of no greater than 50 um.