CN209822627U - Packaging structure of electronic device - Google Patents
Packaging structure of electronic device Download PDFInfo
- Publication number
- CN209822627U CN209822627U CN201822170245.5U CN201822170245U CN209822627U CN 209822627 U CN209822627 U CN 209822627U CN 201822170245 U CN201822170245 U CN 201822170245U CN 209822627 U CN209822627 U CN 209822627U
- Authority
- CN
- China
- Prior art keywords
- electronic device
- pad
- central ground
- ground connection
- central
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 19
- 238000005538 encapsulation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Abstract
The utility model provides an electronic device's packaging structure, including setting up in the electronic device bottom and with the central ground connection pad that the PCB board corresponds, wherein, be provided with the through-hole on central ground connection pad. Utilize the utility model discloses, can solve current electron device's packaging structure because of too big and the heat is difficult for distributing away in central ground connection pad for there are many bubbles to produce on the pad, thereby lead to the insecure problem of central ground connection pad welding.
Description
Technical Field
The utility model relates to the field of electronic technology, more specifically relates to a but wide application in the packaging structure of the electron device of encapsulation part.
Background
At present, in the design process of a circuit in a package structure of an electronic device, in order to facilitate heat dissipation, a ground pad is generally designed at a position corresponding to the center of the bottom of the electronic device, fig. 2 shows a ground pad structure of a package structure of an existing electronic device, in an embodiment shown in fig. 2, a central ground pad 2 ' and pins 3 ' arranged around the central ground pad are arranged on a package structure 1 ' of the electronic device, the central ground pad 2 ' and the pins 3 ' are welded with a PCB board, wherein the central ground pad 2 ' is rectangular, the central ground pad 2 ' is too large and heat is not easily dissipated, so that many bubbles are generated on the central ground pad, and the central ground pad is not welded firmly.
Therefore, to solve the above problems, a package structure of an electronic device is needed.
SUMMERY OF THE UTILITY MODEL
In view of the above problem, the present invention is directed to an electronic device package structure to solve the problem that the existing electronic device package structure is not easy to distribute out due to the large central grounding pad and the heat, so that many bubbles are generated on the pad, and the welding of the central grounding pad is not firm.
The utility model provides a packaging structure of an electronic device, which comprises a central grounding bonding pad arranged at the bottom of the electronic device and corresponding to a PCB, wherein,
a through hole is provided on the central ground pad.
Further, it is preferable that the number of through holes is even.
Further, it is preferable that the shape of the through-hole is circular, rhombic, or rectangular.
Further, it is preferable that the through holes are disposed on the central ground pad in a symmetrical structure.
Further, it is preferable that the through holes are provided at four corner positions of the central ground pad.
In addition, it is preferable that the package structure of the electronic device is soldered to the PCB board through the central ground pad.
According to the technical scheme above, the utility model provides an electronic device's packaging structure, through be provided with the through-hole on central ground connection pad, and the through-hole is symmetrical structure and sets up on central ground connection pad, this kind of structural design makes central ground connection pad diminish, the heat that produces at central ground connection pad welding position distributes away from heat radiation structure easily, make central ground connection pad can not the gassing, thereby solve current electronic device's packaging structure because of central ground connection pad is too big and the heat is difficult for distributing away, make to have many bubbles to produce on the pad, thereby lead to central ground connection pad insecure problem of welding.
Drawings
Other objects and results of the invention will be more apparent and readily appreciated by reference to the following description taken in conjunction with the accompanying drawings, and as the invention is more fully understood. In the drawings:
fig. 1 is a schematic diagram of a package structure of an electronic device according to an embodiment of the present invention;
fig. 2 is a schematic view of a package structure of a conventional electronic device.
Wherein the reference numerals include: the packaging structure comprises an electronic device packaging structure 1, an electronic device packaging structure 1 ', a central grounding pad 2 ', a pin 3 ' and a through hole 4.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
The packaging structure to aforementioned current electron device who provides is difficult for distributing away because of central ground connection pad is too big and heat for there are many bubbles to produce on the pad, thereby lead to the insecure problem of central ground connection pad welding, the utility model provides a new electron device's packaging structure, thereby solve above-mentioned problem.
Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
In order to illustrate the technical solution of the packaging structure of the electronic device provided by the present invention, fig. 1 shows the packaging structure of the electronic device according to the embodiment of the present invention.
As shown in fig. 1, the present invention provides an electronic device package structure 1, which includes a central grounding pad 2 disposed at the bottom of the electronic device and corresponding to a PCB board, wherein a through hole 4 is disposed on the central grounding pad 2. Pins 3 are also arranged at the bottom of the electronic device, and the pins 3 are arranged around the central grounding pad 2.
Wherein, be provided with central ground connection pad and limit pad on the PCB board the utility model discloses a central ground connection pad 2 that sets up bottom the electron device is corresponding with the central ground connection pad of PCB board, and pin 3 that the electron device bottom set up is corresponding with the limit pad of PCB board, and at the encapsulation in-process, the central ground connection pad 2 that the electron device bottom set up welds with the central ground connection pad of PCB board mutually, and pin 3 that the electron device bottom set up welds with the limit pad of PCB board mutually.
Firstly, explaining the traditional packaging mode of the integrated IC electronic device, in order to package the packaging structure of the electronic device and a PCB together, a central grounding pad and an edge pad are arranged on the PCB, and then solder paste is scribed on the central grounding pad and the edge pad of the PCB to be welded with the electronic device.
In view of present integrated IC electronic device packaging mode causes IC electronic device packaging product to produce can be bad, in the embodiment shown in fig. 1, the utility model discloses be provided with through-hole 4 on central ground connection pad 2, the effect of through-hole 4 is exactly to dispel the heat that the ground connection pad produced in the center of electronic device preparation for can not produce the bubble on the central ground connection pad, make central ground connection pad 2 firm with the central ground connection pad welding of PCB board, guarantee that IC electronic device packaging product can produce the property well.
In the embodiment shown in fig. 1, the number of the through holes is 4, and the through holes are arranged at four corner positions of the central ground pad 2, and the through holes are circular in shape, the through holes are arranged on the central ground pad 2 in a symmetrical structure, and the packaging structure 1 of the electronic device is welded with the PCB board through the central ground pad 2 and the solder legs 3 arranged around the central ground pad 2.
In the embodiment shown in fig. 1, the shape of the through hole is a circle, and in practical applications, the shape of the through hole is not limited to the circle of the embodiment shown in fig. 1, and other shapes may be set as needed, for example: rhombus or rectangle etc. no matter what shape's through-hole, as long as easily conveniently weld back with electron device and PCB board, the heat that produces behind the central ground pad is whole distribute away can, as long as the heat distributes away, just can not produce the bubble on the central ground pad 2, central ground pad 2 just can be firm with the central ground pad welding of PCB board to guarantee that IC electron device encapsulation produces the good of performance.
In the embodiment shown in fig. 1, four through holes are provided in a symmetrical structure at four corner positions of the central ground pad 2. In order to avoid poor performance of the packaged electronic product caused by uneven welding tension, it is necessary to ensure that the pads on the packaging structure of the electronic device are symmetrical, and the welding tension between the PCB board and the electronic device is uniform, therefore, in the embodiment shown in fig. 1, four through holes are arranged at four corner positions, and the central grounding pad 2 is divided into symmetrical structures by the four through holes, and therefore, in the welding process, the PCB board is welded with the central grounding pad 2 which is symmetrical, so that the welding tension between the PCB board and the central grounding pad 2 is uniform, and the design structure is designed to ensure good performance of the packaged electronic product, so as to ensure the service life of the product.
The utility model discloses an in the embodiment, the through-hole is not only limited to the distribution at central ground connection pad at four bight positions, in practical application, as required, the through-hole is symmetrical structure setting at central ground connection pad 2 can, as long as be symmetrical structure distribution with the through-hole on central ground connection pad 2, make central ground connection pad 2 cut apart to become and be symmetrical structure, in welding process, the PCB board welds with central ground connection pad 2 that is symmetrical structure, when just can guaranteeing electronic device and PCB board welding, the welding pulling force between central ground connection pad of PCB board and the central ground connection pad 2 on the electronic device is even, thereby further guarantee the good performance of encapsulation electronic product.
The number of the through holes is not limited to the number of the embodiment shown in fig. 1, and in practical application, the number may be set as appropriate as needed.
In addition, although the number of the through holes is set according to the actual situation, it should be noted that the number of the through holes is even, and one through hole can be set at the middle position unless the through hole is positioned in the middle of the electronic device package, because the position does not cause the problem of uneven pulling force of the center-grounded welding; except for the middle position, the number of the through holes is even, and only when the number of the through holes is even, the welding tension force when the central grounding welding pad 2 is welded with the PCB can be uniform, so that the good performance of the packaged electronic product is ensured.
According to the above embodiment, the utility model provides an electronic device's packaging structure, through be provided with the through-hole on central ground connection pad, and the through-hole is symmetrical structure and sets up on central ground connection pad, this kind of structural design makes central ground connection pad diminish, the heat that produces at central ground connection pad welding position distributes away from the through-hole easily, make central ground connection pad can not the gassing, thereby solve current electronic device's packaging structure because of central ground connection pad is too big and the heat is difficult for distributing away, make to have many bubbles to produce on the pad, thereby lead to central ground connection pad insecure problem of welding.
The package structure of the electronic device according to the present invention is described above by way of example with reference to the accompanying drawings. However, it should be understood by those skilled in the art that various modifications can be made to the package structure of the electronic device proposed by the present invention without departing from the contents of the present invention. Therefore, the scope of the present invention should be determined by the content of the appended claims.
Claims (5)
1. A package structure of an electronic device, comprising a central ground pad disposed at a bottom of the electronic device and corresponding to a PCB board,
and a through hole is formed in the central grounding bonding pad, and the packaging structure of the electronic device is welded with the PCB through the central grounding bonding pad.
2. The electronic device package structure of claim 1,
the number of the through holes is even.
3. The electronic device package structure of claim 1,
the shape of the through hole is round, diamond or rectangular.
4. The electronic device package structure of claim 1,
the through holes are arranged on the central grounding bonding pad in a symmetrical structure.
5. The electronic device package structure of claim 1,
the through holes are arranged at four corner positions of the central grounding pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822170245.5U CN209822627U (en) | 2018-12-21 | 2018-12-21 | Packaging structure of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822170245.5U CN209822627U (en) | 2018-12-21 | 2018-12-21 | Packaging structure of electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209822627U true CN209822627U (en) | 2019-12-20 |
Family
ID=68869678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822170245.5U Active CN209822627U (en) | 2018-12-21 | 2018-12-21 | Packaging structure of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209822627U (en) |
-
2018
- 2018-12-21 CN CN201822170245.5U patent/CN209822627U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10834826B2 (en) | Glue dispensing method and circuit board | |
| CN209822627U (en) | Packaging structure of electronic device | |
| TW201340792A (en) | Printed circuit board | |
| CN212436044U (en) | Circuit board pad packaging structure | |
| CN208094935U (en) | The steel mesh of PCB | |
| CN210053645U (en) | PCB circuit board | |
| CN107979914A (en) | A kind of circuit board and terminal | |
| CN103415162A (en) | Method for forming holes in steel net | |
| CN106851962A (en) | A kind of encapsulating structure of linear voltage regulator | |
| CN203733790U (en) | Internal decoupling integrated circuit packaging | |
| CN205789927U (en) | Reduce the power supply chip encapsulating structure of heat radiation interference | |
| CN108990312A (en) | It is a kind of for welding the steel mesh of QFN | |
| CN209882204U (en) | PCB board | |
| CN207369411U (en) | A kind of circuit board and its pad structure | |
| CN209994628U (en) | Welding pad of circuit board and circuit board thereof | |
| CN110856338B (en) | Circuit board assembly and electronic equipment | |
| CN207783292U (en) | A kind of circuit board radiating device for IC chip | |
| CN212910203U (en) | Circuit board and packaging structure thereof | |
| CN207720520U (en) | A kind of PCB pad structures | |
| JP2006229177A (en) | Printed circuit board | |
| CN212660141U (en) | Packaging structure of cylindrical crystal oscillator fixed by through hole welding pad | |
| CN210225926U (en) | PCB board for preventing module chip secondary reflow soldering paster from flying | |
| CN217064106U (en) | PCB packaging structure compatible with crystal oscillators of different sizes | |
| CN210167346U (en) | Suspended packaging structure at bottom of product | |
| CN209949564U (en) | Welding structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266100 Qingdao, Laoshan District, North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |