CN108520872A - A kind of more loading type lead frames with insulation protection performance - Google Patents
A kind of more loading type lead frames with insulation protection performance Download PDFInfo
- Publication number
- CN108520872A CN108520872A CN201810409021.7A CN201810409021A CN108520872A CN 108520872 A CN108520872 A CN 108520872A CN 201810409021 A CN201810409021 A CN 201810409021A CN 108520872 A CN108520872 A CN 108520872A
- Authority
- CN
- China
- Prior art keywords
- pin
- area
- slide glass
- lead frames
- protection performance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Securing Of Glass Panes Or The Like (AREA)
Abstract
The present invention discloses a kind of more loading type lead frames with insulation protection performance, including matrix and pin area, described matrix includes heat sink area and main slide glass area, the main slide glass divides into two symmetrical sub-module slide glass areas, each sub-module slide glass area is from top to bottom divided into two submodule slide glass areas, the pin area is equipped with seven pins, include the first pin successively from left to right, second pin, third pin, 4th pin, 5th pin, 6th pin and the 7th pin, two sub-module slide glass areas are connect with the first pin and the 7th pin by connection sheet respectively, it is additionally provided with pin slide glass area at the top of the third pin, second pin, 4th pin, it is welding section at the top of 5th pin and the 6th pin.Multiple submodule slide glass area is arranged in slide glass area in initiative of the invention, considerably increases slide counts, overcomes the single problem of existing product structure, improve chip charging ratio.
Description
Technical field
The invention belongs to technical field of semiconductor encapsulation, and in particular to a kind of more loading type with insulation protection performance are drawn
Wire frame.
Background technology
Chip carrier of the lead frame as integrated circuit is that one kind realizing that chip internal circuits draw by means of bonding material
The electrical connection of outlet and outer lead, forms the key structure part of electric loop, it plays the bridge connected with outer lead
Effect is required in most semiconductor integrated blocks using lead frame, is basic material important in electronics and information industry
Material.Existing lead frame is mostly single base island lead frame frame in the market, can only install 1 chip, structure is single, cannot meet city
The demand of field；In addition, the structure of existing lead frame can usually exist, plastic packaging effect is bad, insulation effect is poor and waterproof effect
The problems such as fruit is poor, and the more difficult demoulding in processing, cause product quality bad.
In invention
Goal of the invention：Present invention aims in view of the deficiencies of the prior art, provide a kind of more dresses with insulation protection performance
Load type lead frame.
Technical solution：A kind of more loading type lead frames with insulation protection performance of the present invention, including matrix
And pin area, described matrix include heat sink area and main slide glass area, the main slide glass divides into two symmetrical sub-modules
Slide glass area, each sub-module slide glass area are from top to bottom divided into two submodule slide glass areas, and the pin area is equipped with seven
Pin, from left to right successively include the first pin, second pin, third pin, the 4th pin, the 5th pin, the 6th pin and
7th pin, described two sub-module slide glass areas are connect with the first pin and the 7th pin by connection sheet respectively, and described
It is additionally provided with pin slide glass area at the top of three pins, is welding section at the top of second pin, the 4th pin, the 5th pin and the 6th pin.
Further, for improve heat dissipation effect and it is easy to process when demould, the heat sink area be equipped with first positioning
Hole, heat sink area both sides are respectively provided with one group of arc groove, and the arc groove side has tapered blind hole；Described matrix is in thickness
It spends on direction to have and flows backwards inclined-plane, and the angle for flowing backwards inclined-plane is 45 ~ 60 °.
Further, submodule slide glass area and pin slide glass area are equipped with waterproof construction, the waterproof construction packet
Include one group of diversion trench in the ramp and ramp of slide glass area both sides.
Further, the transverse ends of the first positioning hole have the arc auxiliary positioning ear stretched out.
Further, described second, four, shrinking zone is arranged in the lower half of six pins, and the height of the shrinking zone is pin
0.2 ~ 0.3 times of height, width are 0.3 ~ 0.35 times of pin beam overall；Described first and third, five, the bottom ends of seven pins is equipped with and draws
Foot mouth.
Further, first pin is divided into pin area and lower pin area, and the upper pin area and lower pin area are by S
Type part connects.
Further, the two submodule slide glass area area ratios of each sub-module slide glass area from top to bottom be 1.5 ~
3：1.
Advantageous effect：What 1, the present invention was initiative is arranged multiple submodule slide glass area in slide glass area, considerably increases slide glass
Quantity overcomes the single problem of existing product structure, improves chip charging ratio, and pin is additionally arranged at the top of pin carries
Section further increases chip charging ratio, meets market and is loaded into demand to lead frame multi-chip；2, by slide glass area
The water resistance that waterproof construction improves lead frame is set；The shape for changing location hole by design, improves frame and is moulding
Locating effect in the process such as envelope, avoids the problem that occurring torticollis in process, leads to bad part；Pass through the company of design
The structure of fitting makes matrix and pin area in the same plane, not processed convenient for plastic packaging.
Description of the drawings
Fig. 1 is the structural diagram of the present invention；
Wherein：1, heat sink area, 2, main slide glass area, the 3, first pin, 4, second pin, 5, third pin, the 6, the 4th pin, 7,
5th pin, the 8, the 6th pin, the 9, the 7th pin, 10, pin slide glass area, 11, first positioning hole, 12, arc groove, 13, anti-
Water-bound.
Specific implementation mode
Technical solution of the present invention is described in detail below by attached drawing, but protection scope of the present invention is not limited to
The embodiment.
Embodiment：A kind of more loading type lead frames with insulation protection performance, including matrix and pin area, the base
Body includes heat sink area 1 and main slide glass area 2, and the main slide glass 2 divides into two symmetrical sub-module slide glass areas, described
Each sub-module slide glass area is from top to bottom divided into two submodule slide glass areas, and the pin area is equipped with seven pins, from left to right
Include the first pin 3, second pin 4, third pin 5, the 4th pin 6, the 5th pin 7, the 6th pin 8 and the 7th pin successively
9, described two sub-module slide glass areas are connect with the first pin 3 and the 7th pin 9 by connection sheet respectively, the third pin
5 tops are additionally provided with pin slide glass area 10, and 8 be welding section at the top of second pin 2, the 4th pin 6, the 5th pin 7 and the 6th pin.
Heat sink area 1 is equipped with first positioning hole 11, and 1 both sides of heat sink area are respectively provided with one group of arc groove 12, described
12 side of arc groove has tapered blind hole；Described matrix has in a thickness direction flows backwards inclined-plane, and flows backwards the angle on inclined-plane
It is 60 °.Submodule slide glass area and pin slide glass area are equipped with waterproof construction 13, and the waterproof construction includes being located at slide glass area two
One group of diversion trench in the ramp and ramp of side.The transverse ends of first positioning hole have the arc auxiliary positioning stretched out
Ear.The second, four, shrinking zone is arranged in the lower half of six pins, and the height of the shrinking zone is 0.25 times of height of pin, and width is
0.3 times of pin beam overall；Described first and third, five, the bottom ends of seven pins be equipped with pin mouth., first pin is divided into pin
Area and lower pin area, the upper pin area and lower pin area are connected by S type parts.Each sub-module slide glass area from top to bottom two
Submodule slide glass area area ratio is 2：1.
As described above, although the present invention has been indicated and described with reference to specific preferred embodiment, must not explain
For the limitation to invention itself.It without prejudice to the spirit and scope of the invention as defined in the appended claims, can be right
Various changes can be made in the form and details for it.
Claims (7)
1. a kind of more loading type lead frames with insulation protection performance, including matrix and pin area, described matrix includes dissipating
Backing area and main slide glass area, it is characterised in that：The main slide glass divides into two symmetrical sub-module slide glass areas, described
Each sub-module slide glass area is from top to bottom divided into two submodule slide glass areas, and the pin area is equipped with seven pins, from left to right
It is described successively including the first pin, second pin, third pin, the 4th pin, the 5th pin, the 6th pin and the 7th pin
Two sub-module slide glass areas connect respectively by connection sheet with the first pin and the 7th pin, also set at the top of the third pin
There is pin slide glass area, is welding section at the top of second pin, the 4th pin, the 5th pin and the 6th pin.
2. a kind of more loading type lead frames with insulation protection performance according to claim 1, it is characterised in that：Institute
It states heat sink area and is equipped with first positioning hole, heat sink area both sides are respectively provided with one group of arc groove, the arc groove side
With tapered blind hole；Described matrix has in a thickness direction flows backwards inclined-plane, and the angle for flowing backwards inclined-plane is 45 ~ 60 °.
3. a kind of more loading type lead frames with insulation protection performance according to claim 1, it is characterised in that：Institute
The waterproof construction that is equipped in submodule slide glass area and pin slide glass area is stated, the waterproof construction includes positioned at the oblique of slide glass area both sides
One group of diversion trench on ramp and ramp.
4. a kind of more loading type lead frames with insulation protection performance according to claim 1, it is characterised in that：Institute
The transverse ends for stating first positioning hole have the arc auxiliary positioning ear stretched out.
5. a kind of more loading type lead frames with insulation protection performance according to claim 1, it is characterised in that：Institute
The lower half setting shrinking zone of second, four, six pins is stated, the height of the shrinking zone is 0.2 ~ 0.3 times of height of pin, width
It is 0.3 ~ 0.35 times of pin beam overall；Described first and third, five, the bottom ends of seven pins be equipped with pin mouth.
6. improved TO-220C7 lead frames according to claim 1, it is characterised in that：First pin is divided into
Pin area and lower pin area, the upper pin area and lower pin area are connected by S type parts.
7. improved TO-220C7 lead frames according to claim 1, it is characterised in that：Each sub-module slide glass
The two submodule slide glass area area ratios of area from top to bottom are 1.5 ~ 3：1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810409021.7A CN108520872A (en) | 2018-05-02 | 2018-05-02 | A kind of more loading type lead frames with insulation protection performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810409021.7A CN108520872A (en) | 2018-05-02 | 2018-05-02 | A kind of more loading type lead frames with insulation protection performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108520872A true CN108520872A (en) | 2018-09-11 |
Family
ID=63429779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810409021.7A Pending CN108520872A (en) | 2018-05-02 | 2018-05-02 | A kind of more loading type lead frames with insulation protection performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108520872A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359539A (en) * | 1999-06-30 | 2002-07-17 | 株式会社日立制作所 | Semiconductor device, method of manufacturing the same, and structure for mounting semiconductor device |
| CN201663159U (en) * | 2010-04-28 | 2010-12-01 | 四川金湾电子有限责任公司 | Strong coating adhesive type plastic package lead frame |
| CN203277357U (en) * | 2013-04-16 | 2013-11-06 | 泰州东田电子有限公司 | Leading wire frame for semiconductor |
| CN203617276U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame with dual loaded chips |
| CN203850280U (en) * | 2014-03-26 | 2014-09-24 | 张轩 | Double-chip plastic-sealed lead frame |
| CN105304600A (en) * | 2014-06-30 | 2016-02-03 | 瑞萨电子株式会社 | Semiconductor device and manufacturing method of semiconductor device |
| CN205920964U (en) * | 2016-06-28 | 2017-02-01 | 无锡市玉祁红光电子有限公司 | Lead frame with two kinds of chips |
| CN206301841U (en) * | 2016-12-09 | 2017-07-04 | 泰州东田电子有限公司 | A kind of LED lead frame with water-proof function |
-
2018
- 2018-05-02 CN CN201810409021.7A patent/CN108520872A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359539A (en) * | 1999-06-30 | 2002-07-17 | 株式会社日立制作所 | Semiconductor device, method of manufacturing the same, and structure for mounting semiconductor device |
| CN201663159U (en) * | 2010-04-28 | 2010-12-01 | 四川金湾电子有限责任公司 | Strong coating adhesive type plastic package lead frame |
| CN203277357U (en) * | 2013-04-16 | 2013-11-06 | 泰州东田电子有限公司 | Leading wire frame for semiconductor |
| CN203617276U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame with dual loaded chips |
| CN203850280U (en) * | 2014-03-26 | 2014-09-24 | 张轩 | Double-chip plastic-sealed lead frame |
| CN105304600A (en) * | 2014-06-30 | 2016-02-03 | 瑞萨电子株式会社 | Semiconductor device and manufacturing method of semiconductor device |
| CN205920964U (en) * | 2016-06-28 | 2017-02-01 | 无锡市玉祁红光电子有限公司 | Lead frame with two kinds of chips |
| CN206301841U (en) * | 2016-12-09 | 2017-07-04 | 泰州东田电子有限公司 | A kind of LED lead frame with water-proof function |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180911 |