CN209880602U - Lead frame - Google Patents

Lead frame Download PDF

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Publication number
CN209880602U
CN209880602U CN201920918333.0U CN201920918333U CN209880602U CN 209880602 U CN209880602 U CN 209880602U CN 201920918333 U CN201920918333 U CN 201920918333U CN 209880602 U CN209880602 U CN 209880602U
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CN
China
Prior art keywords
frame
lead frame
groove
embossing
pin
Prior art date
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Active
Application number
CN201920918333.0U
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Chinese (zh)
Inventor
沈健
高迎阳
陈奉明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TAIZHOU DONGTIAN ELECTRONICS Co Ltd
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TAIZHOU DONGTIAN ELECTRONICS Co Ltd
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Priority to CN201920918333.0U priority Critical patent/CN209880602U/en
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Publication of CN209880602U publication Critical patent/CN209880602U/en
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Abstract

The utility model discloses a lead frame belongs to semiconductor element technical field. The utility model comprises a plurality of same basic units which are formed by extending horizontally and repeatedly, a left lead frame group and a right lead frame group are arranged in the basic units, two frame units which are arranged end to end in a reverse way are arranged in the longitudinal direction of the left lead frame group and the right lead frame group, and the radiating fins of the upper frame unit and the lower frame unit are connected; one end of the base island of each frame unit, which is close to the radiating fins, is provided with an embossing groove and a through groove. The utility model relates to a rationally, compact structure has improved the firm degree of bed island department plastic envelope through the setting in impression groove and logical groove.

Description

Lead frame
Technical Field
The utility model relates to a semiconductor element technical field, concretely relates to lead frame.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of a bonding material to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to use a plastic package lead frame in most semiconductor integrated blocks, and is an important basic material in the electronic information industry.
In the prior art, the stamping grooves of the lead frame are only arranged on the surface of the base island, and the plastic packaging effect needs to be improved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an effectual lead frame of plastic envelope.
The technical scheme of the utility model is that: a lead frame comprises a plurality of same basic units, wherein the basic units are formed by connecting upper and lower side bands and then transversely and repeatedly extending, adjacent basic units are connected through connecting parts, a left lead frame group and a right lead frame group are arranged in each basic unit, the left lead frame group and the right lead frame group are connected through ribs, two frame units which are reversely arranged from head to tail are longitudinally arranged on the left lead frame group and the right lead frame group, each frame unit comprises a base island, a radiating fin is arranged above the base island and provided with a mounting hole, a collector pin is connected to the middle position of the lower portion of the base island, a base pin and an emitter pin are respectively arranged on the left side and the right side of the collector pin, the base pin and the emitter pin are connected through middle ribs, and the lower portions of the collector pin, the base pin and the emitter pin are respectively connected, The upper part of the base pin is connected with a frame part, the upper part of the emitter pin is connected with a wire splashing part, and the radiating fins of the upper frame unit in the left frame group and the right frame group are respectively connected with the radiating fins of the lower frame unit; the periphery of the base island is provided with an embossing frame, an inwardly concave embossing groove is formed in the embossing frame close to one side of the radiating fin, the embossing groove is in a sawtooth shape, and a through groove is formed in the embossing frame.
According to the further technical scheme, a transverse cutting reserved hole is formed in the joint of the radiating fin of the upper frame unit and the radiating fin of the lower frame unit, a positioning hole is formed in the connecting portion, longitudinal cutting reserved openings are formed in the side bands on the upper side and the lower side, and the positioning hole and the rib piece are located on the same axis; the rib is also provided with coaxial fabrication holes.
According to a further technical scheme, the mounting hole is in an omega shape.
The utility model has the advantages that:
1. the utility model discloses a set up the impression frame that the basis island is close to the fin into inside sunken impression groove to the impression groove sets up to the cockscomb structure, and the entering of plating solution when can effectively preventing to electroplate still is equipped with logical groove in the impression frame, makes the resin associativity in slide district better, makes the plastic envelope more firm.
2. The utility model discloses a plurality of cutting openings that vertically reserve have been seted up in the lower band side, are provided with between adjacent frame element and transversely reserve a cutting mouth, make things convenient for the later stage to cut and unpack the frame element who links together apart.
Drawings
FIG. 1 is a schematic structural view of the present invention,
figure 2 is a side view of the present invention,
figure 3 is a schematic mechanical diagram of the base unit of figure 1,
figure 4 is a partial schematic view of figure 3,
figure 5 is a partial schematic view of figure 2,
wherein, 1, sideband; 11. longitudinally cutting a reserved opening; 2. a base unit; 21. a left lead frame group; 22. a right lead frame group; 23. a rib piece; 231. a fabrication hole; 24. a connecting portion; 241. positioning holes; 3. a heat sink 31, a mounting hole; 32. transversely cutting the prepared hole; 4. a base island; 41. embossing the frame; 42. embossing grooves; 43. a through groove; 5. a collector pin; 6. a base pin; 61. a frame portion; 7. an emitter pin; 71. a wire splashing part; 8. a middle rib; 81. a second pin; 82. a first pin; 83. a third pin.
Detailed Description
The invention will be further elucidated below by means of non-limiting examples, with the understanding that the invention is not limited thereto.
As in fig. 1-5, the utility model relates to a lead frame, including four the same basic unit 2 through last, the horizontal repeated extension in the side band 1 of lower both sides forms after connecting, be connected through connecting portion 24 between the adjacent basic unit 2, be equipped with left lead frame group 21 and right lead frame group 22 in the basic unit 2, be connected through muscle piece 23 between left lead frame group 21 and the right lead frame group 22, left lead frame group 21 and right lead frame group 22 vertically all are equipped with two head and the tail inverted arrangement's frame element, frame element includes base island 4, base island 4's top is equipped with fin 3, be equipped with louvre 31 on the fin 3, the shape of mounting hole 31 is the omega type. The middle position of the lower part of the base island 4 is connected with a collector pin 5, the left side and the right side of the collector pin 5 are respectively provided with a base pin 6 and an emitter pin 7, the collector pin 5, the base pin 6 and the emitter pin 7 are connected through a middle rib 8, the lower parts of the collector pin 5, the base pin 6 and the emitter pin 7 are respectively connected with a first pin 82, a second pin 81 and a third pin 83, the upper part of the base pin 6 is connected with a frame part 61, the upper part of the emitter pin 7 is connected with a wire splashing part 71, and the radiating fins 3 of the upper frame unit in the left lead frame group 21 and the right lead frame group 22 are respectively connected with the radiating fins 3 of the lower.
A transverse cutting reserved hole 32 is formed at the joint of the radiating fin 3 of the upper frame unit and the radiating fin 3 of the lower frame unit, a positioning hole 241 is formed in the connecting part 24, longitudinal cutting reserved openings 11 are formed in the side bands 1 on the upper side and the lower side, and the positioning hole 241 and the rib piece 23 are located on the same axis; the rib 23 is also provided with a coaxial fabrication hole 231. Because vertical reservation cutting opening has been seted up in the 1 outside of lower sideband, be provided with horizontal reservation cutting individual mouth between adjacent frame element, make things convenient for the later stage to cut and take apart the frame element who links together.
The periphery of the base island 4 is provided with an imprinting frame 41, an imprinting groove 42 which is concave inwards is arranged on the imprinting frame 41 close to one side of the radiating fin 3, the imprinting groove 42 is in a sawtooth shape, and a through groove 43 is arranged in the imprinting frame 41.
The sawtooth-shaped imprinting groove 42 can effectively prevent electroplating liquid from entering during electroplating, and the through groove 43 is further arranged in the imprinting frame 41 to increase the resin joint surface of the slide loading area, so that the resin combination property of the slide loading area is better, and the plastic package is firmer.
To sum up, the utility model relates to a rationally, compact structure.

Claims (3)

1. A lead frame is composed of multiple identical basic units, which are formed by connecting upper and lower side bands and then extending transversely and repeatedly, and adjacent basic units are connected via connecting part and have left and right lead frame groups connected via ribs The upper part of the base pin is connected with a frame part, the upper part of the emitter pin is connected with a wire splashing part, and the radiating fins of the upper frame unit in the left frame group and the right frame group are respectively connected with the radiating fins of the lower frame unit; the periphery of the base island is provided with an embossing frame, an inwardly concave embossing groove is formed in the embossing frame close to one side of the radiating fin, the embossing groove is in a sawtooth shape, and a through groove is formed in the embossing frame.
2. The lead frame according to claim 1, wherein a transverse cutting prepared hole is provided at a connection part of the heat sink of the upper frame unit and the heat sink of the lower frame unit, a positioning hole is provided on the connection part, longitudinal cutting prepared holes are provided on the side bands of the upper and lower sides, and the positioning hole and the rib are located on the same axis; the rib is also provided with coaxial fabrication holes.
3. Lead frame according to claim 1, characterised in that the mounting holes are omega-shaped.
CN201920918333.0U 2019-06-19 2019-06-19 Lead frame Active CN209880602U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920918333.0U CN209880602U (en) 2019-06-19 2019-06-19 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920918333.0U CN209880602U (en) 2019-06-19 2019-06-19 Lead frame

Publications (1)

Publication Number Publication Date
CN209880602U true CN209880602U (en) 2019-12-31

Family

ID=68947541

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920918333.0U Active CN209880602U (en) 2019-06-19 2019-06-19 Lead frame

Country Status (1)

Country Link
CN (1) CN209880602U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111916421A (en) * 2020-08-05 2020-11-10 南通皋鑫科技开发有限公司 T0263 double-row frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111916421A (en) * 2020-08-05 2020-11-10 南通皋鑫科技开发有限公司 T0263 double-row frame

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