CN104051404A - Partially silvered lead frame - Google Patents
Partially silvered lead frame Download PDFInfo
- Publication number
- CN104051404A CN104051404A CN201410322011.1A CN201410322011A CN104051404A CN 104051404 A CN104051404 A CN 104051404A CN 201410322011 A CN201410322011 A CN 201410322011A CN 104051404 A CN104051404 A CN 104051404A
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- CN
- China
- Prior art keywords
- lead frame
- terminal pin
- lead
- frame unit
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a partially silvered lead frame. The partially silvered lead frame is formed by arranging a plurality of lead frame units into a single row, and the lead frame units are connected through connecting ribs. Each lead frame unit comprises a base body and three lead pins, wherein the lead pins of each lead frame unit are the left lead pin, the middle lead pin and the right lead pin, the end of each left lead pin is provided with a bonding area, a silvered layer covers the surface of each bonding area, each middle lead pin is fixedly connected with the corresponding base body, each lead frame unit is provided with a positioning hole, and the bonding area of the left lead pin of each lead frame unit is silvered. The heat conduction and electricity conduction performance of each left lead pin are improved, welding is easy, and the anti-corrosion performance is achieved.
Description
Technical field
The present invention relates to a kind of lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use lead frame, is basic material important in electronics and information industry.At present, more enterprise requires lead frame local silver-plating, because silver coating has good heat conduction, conduction and welding performance, also possesses the effect of anticorrosion simultaneously.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of lead frame of local silver-plating.
In order to solve the problems of the technologies described above, the invention provides a kind of lead frame of local silver-plating, by a plurality of lead frames unit single composition, described lead frame connects by dowel between unit, described lead frame unit comprises matrix and terminal pin, and described terminal pin is provided with three, is respectively left terminal pin, middle terminal pin and right terminal pin, described left terminal pin end is provided with bonding region, and surface, described bonding region is covered with silver coating.
As a further improvement on the present invention, described middle terminal pin is fixedly connected with matrix.
As a further improvement on the present invention, described lead frame cell width is 11.405 ± 0.03mm, and matrix thickness is 1.3 ± 0.02mm, and terminal pin thickness is 0.5 ± 0.0,1mm.
As a further improvement on the present invention, described lead frame unit is provided with location hole, and location hole diameter is 2 ± 0.05mm.
Adopt said structure, its beneficial effect is: this lead frame is silver-plated in the bonding region of left terminal pin, has improved left terminal pin heat conduction, electric conductivity, is easy to welding, has possessed the function of anti-corruption simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation of the lead frame of local silver-plating of the present invention.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, the left terminal pin of 3-1-, terminal pin in 3-2-, the right terminal pin of 3-3-, 4-bonding region, 5-silver coating, 6-location hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Figure 1, a kind of lead frame of local silver-plating, by 1 single composition of a plurality of lead frames unit, between described lead frame unit 1, by dowel, connect, described lead frame unit 1 comprises matrix 2 and terminal pin 3, described terminal pin 3 is provided with three, be respectively left terminal pin 3-1, middle terminal pin 3-2 and right terminal pin 3-3, described left terminal pin 3-1 end is provided with bonding region 4, 4 surfaces, described bonding region are covered with silver coating 5, described middle terminal pin 3-2 is fixedly connected with matrix 2, described lead frame unit 1 width is 11.405 ± 0.03mm, matrix 2 thickness are 1.3 ± 0.02mm, terminal pin 3 thickness are 0.5 ± 0.0, 1mm, described lead frame unit 1 is provided with location hole 6, location hole 6 diameters are 2 ± 0.05mm.
The bonding region of the left terminal pin of this lead frame is silver-plated, has improved left terminal pin heat conduction, electric conductivity, is easy to welding, has possessed the function of anti-corruption simultaneously.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.
Claims (4)
1. the lead frame of a local silver-plating, by a plurality of lead frames unit (1) single composition, between described lead frame unit (1), by dowel, connect, described lead frame unit (1) comprises matrix (2) and terminal pin (3), it is characterized in that: described terminal pin (3) is provided with three, be respectively left terminal pin (3-1), middle terminal pin (3-2) and right terminal pin (3-3), described left terminal pin (3-1) end is provided with bonding region (4), and surface, described bonding region (4) is covered with silver coating (5).
2. the lead frame of a kind of local silver-plating according to claim 1, is characterized in that: described middle terminal pin (3-2) is fixedly connected with matrix (2).
3. the lead frame of a kind of local silver-plating according to claim 1, is characterized in that: described lead frame unit (1) width is 11.405 ± 0.03mm, and matrix (2) thickness is 1.3 ± 0.02mm, and terminal pin (3) thickness is 0.5 ± 0.0,1mm.
4. the lead frame of a kind of local silver-plating according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (6), and location hole (6) diameter is 2 ± 0.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410322011.1A CN104051404A (en) | 2014-07-08 | 2014-07-08 | Partially silvered lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410322011.1A CN104051404A (en) | 2014-07-08 | 2014-07-08 | Partially silvered lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104051404A true CN104051404A (en) | 2014-09-17 |
Family
ID=51504058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410322011.1A Pending CN104051404A (en) | 2014-07-08 | 2014-07-08 | Partially silvered lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104051404A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116698878A (en) * | 2023-05-26 | 2023-09-05 | 广州丰江微电子有限公司 | Lead frame plating layer detection equipment and detection method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040262720A1 (en) * | 2003-06-30 | 2004-12-30 | Renesas Technology Corp. | Semiconductor device |
| CN103617977A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | High-power molding-encapsulated lead frame |
| CN104051403A (en) * | 2014-07-02 | 2014-09-17 | 沈健 | Partially silvered lead frame |
-
2014
- 2014-07-08 CN CN201410322011.1A patent/CN104051404A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040262720A1 (en) * | 2003-06-30 | 2004-12-30 | Renesas Technology Corp. | Semiconductor device |
| CN103617977A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | High-power molding-encapsulated lead frame |
| CN104051403A (en) * | 2014-07-02 | 2014-09-17 | 沈健 | Partially silvered lead frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116698878A (en) * | 2023-05-26 | 2023-09-05 | 广州丰江微电子有限公司 | Lead frame plating layer detection equipment and detection method thereof |
| CN116698878B (en) * | 2023-05-26 | 2024-02-13 | 广州丰江微电子有限公司 | Lead frame plating layer detection equipment and detection method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140917 |
|
| WD01 | Invention patent application deemed withdrawn after publication |