CN201853695U - Power diode lead frame - Google Patents
Power diode lead frame Download PDFInfo
- Publication number
- CN201853695U CN201853695U CN2010205859184U CN201020585918U CN201853695U CN 201853695 U CN201853695 U CN 201853695U CN 2010205859184 U CN2010205859184 U CN 2010205859184U CN 201020585918 U CN201020585918 U CN 201020585918U CN 201853695 U CN201853695 U CN 201853695U
- Authority
- CN
- China
- Prior art keywords
- pair
- lead frame
- connecting hole
- chip area
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a power diode lead frame, which comprises a paster area for loading a chip, a radiating fin, a guide pin I and a guide pin II, the upper ends and the lower ends of the guide pin I and the guide pin II are respectively connected with a connecting piece and are fixed with an edge belt, the two side walls of the paster area are provided with a pair of protruded edges, the surface of the connection of the paster area and the radiating fin is provided with a horizontal baffle slot, the middle of the radiating fin is provided with a connecting hole, the axial middle part of the inner wall of the connecting hole is provided with a pair of fan-shaped snap rings along the periphery of the inner wall, a sinking cavity is formed between the fan-shaped snap rings and the inner wall of the connecting hole, a sinking table is formed between the protruded edges and the surface of the paster area, the back of the paster area is provided with a plurality of pits, and the two corners of the radiating fin are provided with a pair of bosses along the edge of the radiating fin. In the utility model, since a multiple anti-cracking anti-seepage structure with a plurality of concave-convex irregular and non symmetrical combination surfaces is added, the plastic package material can be prevented from cracking with a lead frame base body, the service life can be prolonged, and the work stability can be improved.
Description
Technical field
The utility model relates to the manufacturing technology field of semiconductor electronic components and parts, especially refers to the anti-crack and anti-seepage technology between power diode lead frame and the plastic packaging material.
Background technology
Power diode can be divided into different sizes such as Schottky diode, fast recovery diode, power frequency diode, its main application comprises rectification, afterflow, amplitude limit, clamper and voltage stabilizing etc., be a kind of range of application electronic devices and components extremely widely, be widely used in fields such as electricity-saving lamp, charger, power transmission and transformation, Switching Power Supply and automotive electronics; It wherein is the power diode lead frame product of representative with TO-247 series, because its performance requirement aspect the heat radiation temperature rise, and be applied to such as factors such as the contour vibration of automotive electronics, high temperature difference and wet environment places, cause the bond strength of its lead frame matrix and plastic packaging material and heat radiation to require higher.This early stage series products generally adopts the direct packaged type of planar substrates, so use after a period of time often because adverse circumstances such as height vibration, high temperature difference cause the delamination splitting between plastic packaging material and the lead frame, the antiseepage humidity resistance reduces greatly; The people was arranged afterwards by at the lead frame matrix surface cutting being set, setting up mode such as breach to increase firmness, but still fail effectively to solve the delamination splitting problem of plastic packaging material, power diode product quality and class are difficult to promote, and seriously hinder the development of industry technology.For this reason, people's expectation with anti-mechanical shock of effective enhancing and heat-resistant anti-fatigue intensity, prevents the delamination splitting of plastic packaging material and lead frame by further improving the lead frame contour structures, improves the useful life and the job stability of power diode product.
The utility model content
The technical problems to be solved in the utility model is to overcome defective and the deficiency that existing like product can not effectively solve plastic packaging material and layered lead frame cracking problem, provide a kind of power diode lead frame product to society with multiple anti-crack and anti-seepage structure, to strengthen anti-mechanical shock and heat-resistant anti-fatigue intensity, effectively prolong power diode useful life, improve job stability.
The technical scheme that its technical problem that solves the utility model adopts is: the power diode lead frame comprises Chip Area, fin, lead foot one and the lead foot two of carries chips; The two ends up and down of described lead foot one and lead foot two are respectively equipped with brace and sideband fixes; Described lead foot one is equipped with leg with the root of lead foot two; Two side, described Chip Area is provided with a pair of bead, and the surface that described Chip Area is connected with described fin is provided with horizontal retaining groove; Described fin middle part is provided with connecting hole, the axial middle part of described connecting hole inwall, is provided with a pair of fan-shaped snap ring along its circumference, a pair of fan-shaped heavy chamber of formation between described fan-shaped snap ring and the described connecting hole inwall.
Form heavy stand between described bead and the surface, described Chip Area; Back, described Chip Area is provided with a plurality of pits; Two bights of described fin are provided with a pair of projection along its edge.
Described leg is provided with the through hole that donating bond plying line passes through; Surface between described leg and the described brace is provided with groove.
The utility model power diode lead frame product, plastic packaging material after the encapsulation is coated on fin, Chip Area, lead foot one and lead foot two leg zones, and be filled in concavo-convex irregular positions such as groove, horizontal retaining groove, fan-shaped heavy chamber, heavy stand, and the projection in the bead of both sides, Chip Area, fin two bights still is exposed to the external world, the heat that the Chip Area chip is produced is distributed fast, and has increased the mutually junction area of matrix with plastic packaging material greatly; After adopting above-mentioned multiple anti-crack and anti-seepage structure, help to prevent the delamination splitting of plastic packaging material and lead frame matrix, thereby the antiseepage of this product, antidetonation and heat-resistant anti-fatigue intensity are promoted greatly, finally help prolonging useful life, the raising job stability of power diode product.
Description of drawings
Fig. 1 is the utility model structural representation.
Fig. 2 is the left view of Fig. 1.
Fig. 3 is that the A-A of Fig. 1 is to cutaway view.
Fig. 4 is the power diode lead frame version part structural representation that adopts the utility model technology.
Embodiment
As shown in Figure 1 to Figure 3, the utility model power diode lead frame comprises Chip Area 6, fin 16, lead foot 1 and the lead foot 27 of carries chips; The two ends up and down of described lead foot 1 and lead foot 27 are respectively equipped with brace 3 and sideband 15 fixes, and between the adjacent lead foot dislocation distortion can not take place to guarantee this product when the continuous rolling.Described lead foot 1 is equipped with the leg 10 that welds with the bonding silk thread with the root of lead foot 27, and the surface between described leg 10 and the described brace 3 is provided with groove 14; Described leg 10 also can be provided with the through hole 8 that donating bond plying line passes through, with further enhancing firm welding degree; 6 two sides, described Chip Area are provided with a pair of bead 9, and as shown in Figure 2, the surface of described bead 9 is lower than 6 surfaces, described Chip Area, make and form heavy stand 17 between itself and 6 surfaces, described Chip Area; The surface that described Chip Area 6 is connected with described fin 16 is provided with horizontal retaining groove 13; 6 backs 11, described Chip Area are provided with a plurality of pits.
As shown in Figure 3, described fin 16 middle parts are provided with connecting hole 1; The axial middle part of described connecting hole 1 inwall, be provided with a pair of fan-shaped snap ring 2 along its circumference, the external diameter on described snap ring 2 surfaces is greater than described connecting hole 1, thereby forms a pair of fan-shaped heavy chamber 12 between described fan-shaped snap ring 2 and described connecting hole 1 inwall; Two bights of described fin 16 are provided with a pair of protruding 4 along its edge.
Continue in conjunction with the accompanying drawings the operation principle of summary the utility model product below.As shown in Figure 4, after using the encapsulation of this product, fin 16, Chip Area 6, lead foot 1 and lead foot 27 leg zones are filled and be coated on to plastic packaging material, and the projection 4 in the bead 9 of 6 both sides, Chip Area, 16 liang of bights of fin still is exposed to the external world, the heat that Chip Area 6 chips are produced is distributed fast, and has increased the mutually junction area of matrix with plastic packaging material greatly; In view of same reason, the plastic packaging material after the encapsulation is filled in concavo-convex irregular positions such as groove 14, horizontal retaining groove 13, fan-shaped heavy chamber 12, heavy stand 17, has increased irregular, asymmetrical faying face; After the utility model product adopts above-mentioned multiple anti-crack and anti-seepage structure, help to prevent the delamination splitting of plastic packaging material and lead frame matrix, thereby the antiseepage of this product, antidetonation and heat-resistant anti-fatigue intensity are promoted greatly, finally help prolonging the useful life of power diode product and improve job stability.
Claims (3)
1. power diode lead frame comprises Chip Area (6), fin (16), lead foot one (5) and the lead foot two (7) of carries chips; The two ends up and down of described lead foot one (5) and lead foot two (7) are respectively equipped with brace (3) and sideband (15) fixes; Described lead foot one (5) is equipped with leg (10) with the root of lead foot two (7); It is characterized in that: two side, described Chip Area (6) is provided with a pair of bead (9), and the surface that described Chip Area (6) are connected with described fin (16) is provided with horizontal retaining groove (13); Described fin (16) middle part is provided with connecting hole (1), the axial middle part of described connecting hole (1) inwall, is provided with a pair of fan-shaped snap ring (2) along its circumference, formation a pair of fan-shaped heavy chamber (12) between described fan-shaped snap ring (2) and described connecting hole (1) inwall.
2. power diode lead frame according to claim 1 is characterized in that: form heavy stand (17) between described bead (9) and the surface, described Chip Area (6); Back, described Chip Area (6) (11) is provided with a plurality of pits; Two bights of described fin (16) are provided with a pair of projection (4) along its edge.
3. power diode lead frame as claimed in claim 1 or 2, it is characterized in that: described leg (10) is provided with the through hole (8) that donating bond plying line passes through; Surface between described leg (10) and the described brace (3) is provided with groove (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205859184U CN201853695U (en) | 2010-10-28 | 2010-10-28 | Power diode lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205859184U CN201853695U (en) | 2010-10-28 | 2010-10-28 | Power diode lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201853695U true CN201853695U (en) | 2011-06-01 |
Family
ID=44096079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205859184U Expired - Lifetime CN201853695U (en) | 2010-10-28 | 2010-10-28 | Power diode lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201853695U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368490A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Improved transistor lead frame |
| CN103617977A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | High-power molding-encapsulated lead frame |
| CN103943587A (en) * | 2014-03-20 | 2014-07-23 | 张轩 | Lead frame for high-power electrical appliance |
| CN105590907A (en) * | 2016-03-01 | 2016-05-18 | 江苏捷捷微电子股份有限公司 | Automobile diode device and manufacturing method thereof |
| CN108807329A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of overloading type lead frame convenient for encapsulation process |
-
2010
- 2010-10-28 CN CN2010205859184U patent/CN201853695U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368490A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Improved transistor lead frame |
| CN103617977A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | High-power molding-encapsulated lead frame |
| CN103943587A (en) * | 2014-03-20 | 2014-07-23 | 张轩 | Lead frame for high-power electrical appliance |
| CN105590907A (en) * | 2016-03-01 | 2016-05-18 | 江苏捷捷微电子股份有限公司 | Automobile diode device and manufacturing method thereof |
| CN108807329A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of overloading type lead frame convenient for encapsulation process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110601 |
|
| CX01 | Expiry of patent term |