CN108807329A - A kind of overloading type lead frame convenient for encapsulation process - Google Patents
A kind of overloading type lead frame convenient for encapsulation process Download PDFInfo
- Publication number
- CN108807329A CN108807329A CN201810409487.7A CN201810409487A CN108807329A CN 108807329 A CN108807329 A CN 108807329A CN 201810409487 A CN201810409487 A CN 201810409487A CN 108807329 A CN108807329 A CN 108807329A
- Authority
- CN
- China
- Prior art keywords
- pin
- slide glass
- area
- glass area
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention discloses a kind of overloading type lead frame convenient for encapsulation process, including matrix and pin area, matrix includes heat sink area and slide glass area, the slide glass area is equipped with multizone slide glass submodule, the multizone slide glass submodule includes center diamond shape slide glass area and four trapezoidal slide glass areas of surrounding, it is equipped with chip mounting groove in each slide glass area, chip is installed in the chip mounting groove；The pin area is equipped with several pins, include the first pin, second pin and third pin successively from left to right, it is respectively equipped with pin slide glass area at the top of first pin and second pin, pin slide glass area is surrounded by welding section, it is equipped with connection sheet at the top of the third pin, is connected matrix with pin area by the connection sheet.Multiple submodule slide glass area is arranged in slide glass area in initiative of the invention, considerably increases slide counts, overcomes the single problem of existing product structure, improve chip charging ratio, improve packaging efficiency.
Description
Technical field
The invention belongs to technical field of semiconductor encapsulation, and in particular to a kind of overloading type lead frame convenient for encapsulation process
Frame.
Background technology
Chip carrier of the lead frame as integrated circuit is that one kind realizing that chip internal circuits draw by means of bonding material
The electrical connection of outlet and outer lead, forms the key structure part of electric loop, it plays the bridge connected with outer lead
Effect is required in most semiconductor integrated blocks using lead frame, is basic material important in electronics and information industry
Material.Existing lead frame is mostly single base island lead frame frame in the market, can only install 1 ~ 2 chip, structure is single, cannot meet
The demand in market；In addition, the structure of existing lead frame can usually exist, plastic packaging effect is bad, insulation effect is poor and waterproof
The problems such as effect is poor, and the more difficult demoulding in processing, cause product quality bad.
Invention content
Goal of the invention：Present invention aims in view of the deficiencies of the prior art, provide a kind of overloading convenient for encapsulation process
Type lead frame.
Technical solution：A kind of overloading type lead frame convenient for encapsulation process of the present invention, including matrix and pin
Area, matrix include heat sink area and slide glass area, and the slide glass area is equipped with multizone slide glass submodule, the multizone slide glass submodule
Block includes center diamond shape slide glass area and four trapezoidal slide glass areas of surrounding, and chip mounting groove, chip are equipped in each slide glass area
It is installed in the chip mounting groove；The pin area is equipped with several pins, draws successively including the first pin, second from left to right
It is respectively equipped with pin slide glass area, pin slide glass area surrounding at the top of foot and third pin, first pin and second pin
Equipped with welding section, it is equipped with connection sheet at the top of the third pin, is connected matrix with pin area by the connection sheet.
Further, the both sides in the slide glass area are equipped with waterproof construction；The waterproof construction is to be arranged in slide glass area both sides
Curved surface ramp, the curved surface ramp be equipped with one group of conduit pipe.
Further, the both sides of the chip mounting groove are equipped with chip fixing structure；The chip fixing structure includes setting
Set the baffle of the movable plant in the bar groove and bar groove of the lateral opening of chip mounting groove both sides.
Further, the conduit pipe is open horn-like structure.
Further, the connection sheet is trapezium structure, and connection sheet center has rectangular through-hole.
Further, it is equipped with pin slide glass area and the junction of connection sheet on pin and helps envelope guide groove, it is described to help envelope
Guide groove includes the circular through hole in the middle part of the parallel bar groove and bar groove being arranged at the top of pin.
Further, the junction in the heat sink area and slide glass area is equipped with waist hole, and the lower section of the waist hole is equipped with buffering
Slot.
Advantageous effect：What 1, the present invention was initiative is arranged multiple submodule slide glass area in slide glass area, considerably increases slide glass
Quantity overcomes the single problem of existing product structure, improves chip charging ratio, and pin is additionally arranged at the top of pin carries
Section further increases chip charging ratio, meets market and is loaded into demand to lead frame multi-chip；2, by slide glass area
The water resistance that waterproof construction improves lead frame is set；The shape for changing location hole by design, improves frame and is moulding
Locating effect in the process such as envelope, avoids the problem that occurring torticollis in process, leads to bad part；Pass through connection sheet
The rectangular through-hole at center and the design for helping envelope guide groove on pin, substantially increase packaging effect, and be convenient for encapsulation process,
Improve processing efficiency.
Description of the drawings
Fig. 1 is the structural diagram of the present invention；
Wherein：1, heat sink area, 2, slide glass area, 21, center diamond shape slide glass area, 22, trapezoidal slide glass area, the 3, first pin, 4,
Two pins, 5, third pin, 6, pin slide glass area, 7, welding section, 8, connection sheet, 81, rectangular through-hole, 82, help envelope guide groove, 9, waist
Hole, 10, dashpot.
Specific implementation mode
Technical solution of the present invention is described in detail below by attached drawing, but protection scope of the present invention is not limited to
The embodiment.
Embodiment 1：A kind of overloading type lead frame convenient for encapsulation process, including matrix and pin area, matrix include dissipating
Backing area 1 and slide glass area 2, the slide glass area 2 are equipped with multizone slide glass submodule, and the multizone slide glass submodule includes center
Four trapezoidal slide glass areas 22 in diamond shape slide glass area 21 and surrounding are equipped with chip mounting groove in each slide glass area, and chip is installed on
In the chip mounting groove；The pin area is equipped with several pins, includes the first pin 3,4 and of second pin successively from left to right
Third pin 5, first pin 3 and 4 top of second pin are respectively equipped with pin slide glass area 6,6 surrounding of pin slide glass area
Equipped with welding section 7,5 top of the third pin is equipped with connection sheet 8, is connected matrix with pin area by the connection sheet 8；Institute
The junction for stating heat sink area 1 and slide glass area 2 is equipped with waist hole 9, and the lower section of the waist hole 9 is equipped with dashpot 10.
The both sides in slide glass area are equipped with waterproof construction；The waterproof construction is the curved surface ramp being arranged in slide glass area both sides, institute
It states curved surface ramp and is equipped with one group of conduit pipe.The both sides of chip mounting groove are equipped with chip fixing structure；The chip fixed knot
Structure includes the baffle that the movable plant in the bar groove and bar groove of the lateral opening of chip mounting groove both sides is arranged.Water guide is logical
Road is open horn-like structure.
The connection sheet 8 is trapezium structure, and connection sheet center has rectangular through-hole 81.On pin with the pin slide glass
Area and the junction of connection sheet, which are equipped with, helps envelope guide groove 82, and described to help envelope guide groove include the parallel bar groove being arranged at the top of pin and item
Circular through hole in the middle part of slot.
As described above, although the present invention has been indicated and described with reference to specific preferred embodiment, must not explain
For the limitation to invention itself.It without prejudice to the spirit and scope of the invention as defined in the appended claims, can be right
Various changes can be made in the form and details for it.
Claims (7)
1. a kind of overloading type lead frame convenient for encapsulation process, including matrix and pin area, matrix include heat sink area and load
Section, it is characterised in that：The slide glass area is equipped with multizone slide glass submodule, and the multizone slide glass submodule includes center water chestnut
Four trapezoidal slide glass areas in shape slide glass area and surrounding are equipped with chip mounting groove in each slide glass area, and chip is installed on the core
In piece mounting groove；The pin area is equipped with several pins, draws successively including the first pin, second pin and third from left to right
It is respectively equipped with pin slide glass area at the top of foot, first pin and second pin, pin slide glass area is surrounded by welding section,
It is equipped with connection sheet at the top of the third pin, is connected matrix with pin area by the connection sheet.
2. the overloading type lead frame according to claim 1 convenient for encapsulation process, it is characterised in that：The slide glass area
Both sides are equipped with waterproof construction；The waterproof construction is the curved surface ramp being arranged in slide glass area both sides, and the curved surface ramp is equipped with
One group of conduit pipe.
3. the overloading type lead frame according to claim 1 convenient for encapsulation process, it is characterised in that：The chip installation
The both sides of slot are equipped with chip fixing structure；The chip fixing structure includes the lateral opening being arranged in chip mounting groove both sides
The baffle of movable plant in bar groove and bar groove.
4. improved TO-220EW lead frames according to claim 3, it is characterised in that：The conduit pipe is to open
The horn-like structure of formula.
5. the overloading type lead frame according to claim 1 convenient for encapsulation process, it is characterised in that：The connection sheet is
Trapezium structure, and connection sheet center has rectangular through-hole.
6. the overloading type lead frame according to claim 5 convenient for encapsulation process, it is characterised in that：On pin with it is described
Pin slide glass area and the junction of connection sheet, which are equipped with, helps envelope guide groove, and described to help envelope guide groove include the parallel strip being arranged at the top of pin
Circular through hole in the middle part of slot and bar groove.
7. the overloading type lead frame according to claim 5 convenient for encapsulation process, it is characterised in that：The heat sink area
It is equipped with waist hole with the junction in slide glass area, the lower section of the waist hole is equipped with dashpot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810409487.7A CN108807329A (en) | 2018-05-02 | 2018-05-02 | A kind of overloading type lead frame convenient for encapsulation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810409487.7A CN108807329A (en) | 2018-05-02 | 2018-05-02 | A kind of overloading type lead frame convenient for encapsulation process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108807329A true CN108807329A (en) | 2018-11-13 |
Family
ID=64093617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810409487.7A Pending CN108807329A (en) | 2018-05-02 | 2018-05-02 | A kind of overloading type lead frame convenient for encapsulation process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108807329A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201853695U (en) * | 2010-10-28 | 2011-06-01 | 宁波华龙电子股份有限公司 | Power diode lead frame |
| CN102637664A (en) * | 2012-04-12 | 2012-08-15 | 张轩 | Novel lead frame |
| CN203085520U (en) * | 2013-01-14 | 2013-07-24 | 无锡市玉祁红光电子有限公司 | A leading wire framework equipped with an isolating groove |
| CN204857714U (en) * | 2015-08-24 | 2015-12-09 | 四川金湾电子有限责任公司 | Novel lead frame |
| CN205177821U (en) * | 2015-11-17 | 2016-04-20 | 四川金湾电子有限责任公司 | Prevent water tank structure lead frame more |
| CN205920964U (en) * | 2016-06-28 | 2017-02-01 | 无锡市玉祁红光电子有限公司 | Lead frame with two kinds of chips |
| US20180122726A1 (en) * | 2008-12-22 | 2018-05-03 | Rohm Co., Ltd. | Semiconductor device |
-
2018
- 2018-05-02 CN CN201810409487.7A patent/CN108807329A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180122726A1 (en) * | 2008-12-22 | 2018-05-03 | Rohm Co., Ltd. | Semiconductor device |
| CN201853695U (en) * | 2010-10-28 | 2011-06-01 | 宁波华龙电子股份有限公司 | Power diode lead frame |
| CN102637664A (en) * | 2012-04-12 | 2012-08-15 | 张轩 | Novel lead frame |
| CN203085520U (en) * | 2013-01-14 | 2013-07-24 | 无锡市玉祁红光电子有限公司 | A leading wire framework equipped with an isolating groove |
| CN204857714U (en) * | 2015-08-24 | 2015-12-09 | 四川金湾电子有限责任公司 | Novel lead frame |
| CN205177821U (en) * | 2015-11-17 | 2016-04-20 | 四川金湾电子有限责任公司 | Prevent water tank structure lead frame more |
| CN205920964U (en) * | 2016-06-28 | 2017-02-01 | 无锡市玉祁红光电子有限公司 | Lead frame with two kinds of chips |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181113 |