CN103617975A - Wire forging-facilitating lead frame - Google Patents
Wire forging-facilitating lead frame Download PDFInfo
- Publication number
- CN103617975A CN103617975A CN201310548433.6A CN201310548433A CN103617975A CN 103617975 A CN103617975 A CN 103617975A CN 201310548433 A CN201310548433 A CN 201310548433A CN 103617975 A CN103617975 A CN 103617975A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- terminal pin
- pin
- lead
- slide glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a wire forging-facilitating lead frame. 48 lead frame units (1) are in single-row connection with one another through connecting ribs (2) so as to form the wire forging-facilitating lead frame; each lead frame unit (1) comprises a chip loading area (3) and lead pins; the lead pins comprise a middle lead pin (4), a left lead pin (5) and a right lead pin (6); the chip loading area (3) is fixedly connected with the right lead pin (6); the upper parts of middle lead pin (4) and the left lead pin (5) are provided with bonding portions (7); and one side of the chip loading area (3) is provided with heat dissipation fins. The wire forging-facilitating lead frame of the invention has the advantages of simple structure, little possibility of connection in wire forging as well as welding wire-saving and cost-saving properties.
Description
Technical field
The present invention is specifically related to lead frame, particularly a kind of lead frame of being convenient to beat silk.
Background technology
Development along with electron trade, semiconductor device adopts the more and more many of Plastic Package form, this just need to adapt to the lead frame of various different model plastic devices, and lead frame must adapt to the requirement of heat radiation, conduction and the carrying high-power chip of epoxy seal semiconductor device.
Lead frame is in beating silk process, and traditional slide glass district and the position relationship of bonding region can cause while breaking silk and easily cause and be connected, and have wasted welding wire, have increased cost.
Summary of the invention
The problem to be solved in the present invention be to provide a kind of simple in structure, to break silk be the lead frame that be difficult for to be connected and to have saved welding wire, to have reduced cost.
For addressing the above problem, technical scheme provided by the invention is: a kind of lead frame of being convenient to beat silk, by 48 lead frame unit, by dowel is single, connected to form, lead frame unit comprises slide glass district and terminal pin, described terminal pin comprises middle leads pin, left side terminal pin and right side terminal pin, described slide glass district is fixedly connected with right side terminal pin, and described middle leads pin and terminal pin top, left side are provided with bonding part, and described slide glass district one side is provided with heat radiating fin.
As a further improvement on the present invention, described bonding part is provided with electrodeposited coating, and the thickness of described electrodeposited coating is at least 3 μ m.The length in described slide glass district is 2.14-2.18mm, and width is 2.02-2.06mm.
The present invention compared with prior art has the following advantages.
(1), a kind of lead frame of being convenient to beat silk, by 48 lead frame unit, by dowel is single, connected to form, lead frame unit comprises slide glass district and terminal pin, described terminal pin comprises middle leads pin, left side terminal pin and right side terminal pin, described slide glass district is fixedly connected with right side terminal pin, described middle leads pin and terminal pin top, left side are provided with bonding part, the present invention has changed the position of bonding part and slide glass district in traditional handicraft, semi-surrounding slide glass district, bonding region, lead frame of the present invention should not be connected when breaking silk, the length of having saved welding wire is cost, improved industrial efficiency, the present invention is generally applied in miniwatt energy-saving lamp.Described slide glass district one side is provided with heat radiating fin, has guaranteed use safety and the life-span of lead frame.
(2), described bonding part is provided with electrodeposited coating, the thickness of described electrodeposited coating is at least 3 μ m.The length in described slide glass district is 2.14-2.18mm, and width is 2.02-2.06mm.Electrodeposited coating has guaranteed conductivity of the present invention, can select silver-plated or copper facing.
Accompanying drawing explanation
Fig. 1 is that dozen structural representation of the lead frame of silk is convenient in the present invention.
In figure: 1-lead frame unit, 2-dowel ，3-slide glass district, 4-middle leads pin, 5-left side terminal pin, 6-right side terminal pin, 7-bonding part.
Embodiment
Below in conjunction with drawings and Examples, the present invention is improved further to explanation.
As shown in Figure 1, a kind of lead frame of being convenient to beat silk, by 48 lead frame unit 1, by dowel 2 is single, connected to form, lead frame unit 1 comprises slide glass district 3 and terminal pin, terminal pin comprises middle leads pin 4, left side terminal pin 5 and right side terminal pin 6, slide glass district 3 is fixedly connected with right side terminal pin 6, and middle leads pin 4 and left side terminal pin 5 tops are provided with bonding part 7, and slide glass district 3 one sides are provided with heat radiating fin.Bonding part 7 is provided with electrodeposited coating, and the thickness of electrodeposited coating is 3 μ m.The length in slide glass district 3 is 2.16mm, and width is 2.04mm.
Teachings herein is example of the present invention and explanation; but do not mean that the obtainable advantage of the present invention is so limited, may be to wherein one or more of the advantage realizing in the simple transformation of structure and/or some execution modes all in the application's protection range in every practice process of the present invention.
Claims (3)
1. be convenient to dozen lead frame of silk for one kind, it is characterized in that: by 48 lead frame unit (1) by single the connecting to form of dowel (2), lead frame unit (1) comprises slide glass district (3) and terminal pin, described terminal pin comprises middle leads pin (4), left side terminal pin (5) and right side terminal pin (6), described slide glass district (3) is fixedly connected with right side terminal pin (6), described middle leads pin (4) and left side terminal pin (5) top are provided with bonding part (7), and described slide glass district (3) one sides are provided with heat radiating fin.
2. the lead frame of being convenient to beat silk according to claim 1, is characterized in that: described bonding part (7) is provided with electrodeposited coating, and the thickness of described electrodeposited coating is at least 3 μ m.
3. the lead frame of being convenient to beat silk according to claim 1, is characterized in that: the length in described slide glass district (3) is 2.14-2.18mm, and width is 2.02-2.06mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310548433.6A CN103617975A (en) | 2013-11-08 | 2013-11-08 | Wire forging-facilitating lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310548433.6A CN103617975A (en) | 2013-11-08 | 2013-11-08 | Wire forging-facilitating lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103617975A true CN103617975A (en) | 2014-03-05 |
Family
ID=50168678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310548433.6A Pending CN103617975A (en) | 2013-11-08 | 2013-11-08 | Wire forging-facilitating lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103617975A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5083193A (en) * | 1988-02-20 | 1992-01-21 | Deutsche Itt Industries Gmbh | Semiconductor package, method of manufacturing the same, apparatus for carrying out the method, and assembly facility |
| CN202084532U (en) * | 2011-02-22 | 2011-12-21 | 吴江市松陵镇明博精密机械厂 | TO92 model encapsulation box and supporting moulds |
| CN202616226U (en) * | 2012-05-29 | 2012-12-19 | 四川立泰电子有限公司 | TO serial power diode lead wire framework structure |
| CN203617280U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame convenient for bonding wires |
-
2013
- 2013-11-08 CN CN201310548433.6A patent/CN103617975A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5083193A (en) * | 1988-02-20 | 1992-01-21 | Deutsche Itt Industries Gmbh | Semiconductor package, method of manufacturing the same, apparatus for carrying out the method, and assembly facility |
| CN202084532U (en) * | 2011-02-22 | 2011-12-21 | 吴江市松陵镇明博精密机械厂 | TO92 model encapsulation box and supporting moulds |
| CN202616226U (en) * | 2012-05-29 | 2012-12-19 | 四川立泰电子有限公司 | TO serial power diode lead wire framework structure |
| CN203617280U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame convenient for bonding wires |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140305 |