CN204375731U - A kind of COB substrate and COB light source - Google Patents
A kind of COB substrate and COB light source Download PDFInfo
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- CN204375731U CN204375731U CN201420851873.9U CN201420851873U CN204375731U CN 204375731 U CN204375731 U CN 204375731U CN 201420851873 U CN201420851873 U CN 201420851873U CN 204375731 U CN204375731 U CN 204375731U
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- pad
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- crystal bonding
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Abstract
The utility model discloses a kind of COB substrate and COB light source.COB substrate comprises substrate body, substrate body is provided with crystal bonding area, substrate body is provided with external pad, in crystal bonding area is provided with, connects pad, external pad and the interior pad that connects are crisscross arranged, and are provided with conducting wire at the external pad of homopolarity and interior connecing between pad.The chip that COB light source comprises above-mentioned COB substrate and is located on substrate.Utilize structure of the present utility model, on external pad during welding lead, the touching to gold thread can be reduced, reduce loss and the fracture probability of gold thread.
Description
Technical field
The utility model relates to COB substrate and COB light source.
Background technology
Pad locations is connect in same direction and distance very near in the inner gold thread of the position of the external pad of the connection wire of current compound substrate and COB, and be connected with gold thread at chip and interior connecing between pad, this kind of layout can cause product to touch the colloid of contiguous gold thread because of carelessness when external pad solder wire, when welding lead, if to gold thread create extruding or temperature higher time, can cause colloid elastic deformation, this deformation can cause gold thread to damage or fracture.
Summary of the invention
The purpose of this utility model is to provide a kind of COB substrate and COB light source, utilizes structure of the present utility model, on external pad during welding lead, can reduce the touching to gold thread, reduces loss and the fracture probability of gold thread.
For achieving the above object, a kind of COB substrate, comprise substrate body, substrate body is provided with crystal bonding area, substrate body is provided with external pad, in crystal bonding area is provided with, connect pad, external pad and the interior pad that connects are crisscross arranged, and are provided with conducting wire at the external pad of homopolarity and interior connecing between pad.
A kind of COB light source, the chip comprising COB substrate and be located on COB substrate; Described COB substrate, comprises substrate body, substrate body is provided with crystal bonding area, and substrate body is provided with external pad, connects pad in being provided with in crystal bonding area, and chip and interior connecing between pad are provided with gold thread; External pad and the interior pad that connects are crisscross arranged, and are provided with conducting wire at the external pad of homopolarity and interior connecing between pad.
Said structure, external pad and interiorly connect pad interlaced arrangement, can increase external pad and the interior distance connect between pad in limited space, on external pad during welding lead, the touching to gold thread can be reduced, reduce loss and the fracture probability of gold thread, improve the reliability of COB light source.
Further, crystal bonding area is square, and external pad is positioned at the outside of crystal bonding area to relative edge, inside connects the outside that pad is positioned at other two relative edges in crystal bonding area; Described conducting wire is L-shaped along crystal bonding area edge distribution.Above-mentioned arrangement, can make external pad and interior to connect pad distance in limited space maximum, thus reduces the touching probability to gold thread further, protects gold thread further.
Further, the conducting wire be connected with external pad has protuberance, can increase the electrical connection area of conducting wire and external weldering like this, improves the reliability of conduction.
Further, wherein an external pad is square, and another external pad is oval.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of COB substrate.
Fig. 2 is the schematic diagram of COB light source.
Fig. 3 is the cutaway view of COB light source.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is further elaborated.
Embodiment 1.
As shown in Figure 1, COB substrate comprises substrate body 1, and substrate body 1 is provided with crystal bonding area 2, and in the present embodiment, crystal bonding area 2 is square; Substrate body 1 is provided with external pad 3, and external pad 3 is positioned at the outside of crystal bonding area to relative edge, and external pad is made up of positive pole and two, negative pole, and wherein an external pad is square, and another external pad is oval; In crystal bonding area is provided with, connect pad 4, inside connect the outside that pad 4 is positioned at other two relative edges in crystal bonding area, the line between two external pads is vertical with the line connect in two between pad; Conducting wire 5 is provided with at the external pad of homopolarity and interior connecing between pad, described conducting wire is L-shaped along crystal bonding area edge distribution, the conducting wire be connected with external pad has protuberance 51, increases the electrical connection area of conducting wire and external weldering, improves the reliability of conduction.
The COB board structure of present embodiment, external pad 3 connects pad 4 interlaced arrangement with interior, external pad and the interior distance connect between pad can be increased in limited space, on external pad during welding lead, the touching to gold thread can be reduced, reduce loss and the fracture probability of gold thread, improve the reliability of COB light source.
Embodiment 2.
As shown in Figures 2 and 3, COB light source comprises COB substrate, chip 6 and fluorescent material glue mixture 7.
As shown in Figure 1, COB substrate comprises substrate body 1, and substrate body 1 is provided with crystal bonding area 2, and in the present embodiment, crystal bonding area 2 is square; Substrate body 1 is provided with external pad 3, and external pad 3 is positioned at the outside of crystal bonding area to relative edge, and external pad is made up of positive pole and two, negative pole, and wherein an external pad is square, and another external pad is oval; In crystal bonding area is provided with, connect pad 4, inside connect the outside that pad 4 is positioned at other two relative edges in crystal bonding area, the line between two external pads is vertical with the line connect in two between pad; Conducting wire 5 is provided with at the external pad of homopolarity and interior connecing between pad, described conducting wire is L-shaped along crystal bonding area edge distribution, the conducting wire be connected with external pad has protuberance 51, increases the electrical connection area of conducting wire and external weldering, improves the reliability of conduction.
Chip 6 is located in crystal bonding area 2, has gold thread at chip and interior connecing between pad.Fluorescent powder colloid mixture 7 is encapsulated on chip 6.
The COB light source structure of present embodiment, external pad 3 connects pad 4 interlaced arrangement with interior, external pad and the interior distance connect between pad can be increased in limited space, on external pad during welding lead, the touching to gold thread can be reduced, reduce loss and the fracture probability of gold thread, improve the reliability of COB light source.
Claims (8)
1. a COB substrate, comprises substrate body, and substrate body is provided with crystal bonding area, substrate body is provided with external pad, in crystal bonding area is provided with, connects pad, it is characterized in that: external pad and the interior pad that connects are crisscross arranged, be provided with conducting wire at the external pad of homopolarity and interior connecing between pad.
2. COB substrate according to claim 1, is characterized in that: crystal bonding area is square, and external pad is positioned at the outside of crystal bonding area to relative edge, inside connects the outside that pad is positioned at other two relative edges in crystal bonding area; Described conducting wire is L-shaped along crystal bonding area edge distribution.
3. COB substrate according to claim 2, is characterized in that: the conducting wire be connected with external pad has protuberance.
4. COB substrate according to claim 2, is characterized in that: wherein an external pad is square, and another external pad is oval.
5. a COB light source, the chip comprising COB substrate and be located on COB substrate; Described COB substrate, comprises substrate body, substrate body is provided with crystal bonding area, and substrate body is provided with external pad, connects pad in being provided with in crystal bonding area, and chip and interior connecing between pad are provided with gold thread; It is characterized in that: external pad and the interior pad that connects are crisscross arranged, be provided with conducting wire at the external pad of homopolarity and interior connecing between pad.
6. COB substrate according to claim 5, is characterized in that: crystal bonding area is square, and external pad is positioned at the outside of crystal bonding area to relative edge, inside connects the inner side that pad is positioned at other two relative edges in crystal bonding area; Described conducting wire is L-shaped along crystal bonding area edge distribution.
7. COB substrate according to claim 6, is characterized in that: the conducting wire be connected with external pad has protuberance.
8. COB substrate according to claim 6, is characterized in that: wherein an external pad is direction, and another external pad is oval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420851873.9U CN204375731U (en) | 2014-12-30 | 2014-12-30 | A kind of COB substrate and COB light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420851873.9U CN204375731U (en) | 2014-12-30 | 2014-12-30 | A kind of COB substrate and COB light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204375731U true CN204375731U (en) | 2015-06-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420851873.9U Active CN204375731U (en) | 2014-12-30 | 2014-12-30 | A kind of COB substrate and COB light source |
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| Country | Link |
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| CN (1) | CN204375731U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021114714A1 (en) * | 2019-12-13 | 2021-06-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2014
- 2014-12-30 CN CN201420851873.9U patent/CN204375731U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021114714A1 (en) * | 2019-12-13 | 2021-06-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| C14 | Grant of patent or utility model | ||
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Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: Huadu District, Guangdong city of Guangzhou Province, 510890 East Town Airport high-tech industrial base and SAST Jingu South Road intersection Patentee before: Guangzhou Hongli Tronic Co., Ltd. |