CN202084533U

CN202084533U - T0126 packaging box and matched mould

Info

Publication number: CN202084533U
Application number: CN 201120043751
Authority: CN
Inventors: 周志刚
Original assignee: WUJIANG SONGLING MINGBO PRECISION MACHINERY FACTORY
Current assignee: WUJIANG SONGLING MINGBO PRECISION MACHINERY FACTORY
Priority date: 2011-02-22
Filing date: 2011-02-22
Publication date: 2011-12-21
Anticipated expiration: 2021-02-22

Abstract

The utility model relates to a model T0126 packaging box and a matched mould. The model T0126 packaging box comprises a lead wire frame, pins, gaskets, location holes, metal lead wires and seal casings, wherein the gaskets are arranged in hollow rings arranged on islets at the head parts of the lead wire frame, the lower parts of the gaskets are connected with the pins via the metal lead wires, the external parts of the islets are enclosed via the seal casings, the location holes and gaskets on the lead wire frame are single-row 60 and 35 respectively, the lead wire frame has a thickness of 0.38mm and a width of 23mm, and the seal casings has steering wheel shapes. The matched mould corresponding to T0126 packaging has 1440 per mould, and mould colloid channel employs a narrow type. The model T0126 packaging box and the matched mould make an improvement to a packaging frame and a corresponding mould, improve the usage of equipment and raw materials in production, make the equipment better, faster and more accurate in operation, and produce more products under the same quantity condition.

Description

T0126 model enclosure and matching die

Technical field

The utility model relates to a kind of semiconductor packages of TO126 model, especially relates to the improvement of TO126 model enclosure and the improvement of matching die.

Background technology

Semiconductor packages is meant and will obtains the process of individual chips according to the processing of product type functional requirement by the wafer of test; the encapsulation of semiconductor chip is with diced wafer; fasten with glue on the island of lead frame; with the superfine metal lead wiring pad of wafer is connected to the respective pins of substrate again; then; independently wafer is with can close and protect in addition; what model was that the enclosure of the semiconductor packages of TO126 adopts is single 50; 25 is main; thickness is 0.4mm; width is the structure of 27.5mm; and what corresponding supporting mould adopted is that a mould is 1200 a version; like this, on raw-material employing and production efficiency, all be subjected to restriction to a certain degree.

Summary of the invention

Technical problem to be solved in the utility model provides a kind of improvement of the TO126 model enclosure that can reduce raw material and boost productivity and the improvement of matching die.

The technical scheme in the invention for solving the technical problem is: a kind of model is TO126 model enclosure and matching die, comprise lead frame, pin, pad, location hole, metal lead wire and can, in the sky circle of on the island of lead frame head, offering pad is housed, the pad below is connecting pin with metal lead wire, outside at whole island is sealed with a can, on lead frame, location hole and pad are respectively single 60 and 35, and the thickness of lead frame is that 0.38mm, width are 23mm.

In order to save raw material, the thickness of described lead frame is that 0.38mm, width are 23mm.

For saving under the raw-material situation, can reach the effect of boosting productivity, described lead frame adopts the version of single 60 location holes and 35 pads.

, differentiation model fastening in order to seal, the shape of described can is the presenting direction plate-like.

For in conjunction with the production that improves back model TO126, corresponding matching die adopts the version of 1440 of moulds, and mould colloid runner is narrow shape.

After adopting the version of above-mentioned model, each equipment on producing and raw material use have obtained perfect, reduced the wasting of resources, be in a ratio of under the state before improving raw material and can under situation, produce more products in the use with quantity, the production time also corresponding the shortening.

Description of drawings:

Below in conjunction with accompanying drawing the utility model is further specified.

Fig. 1 is the improvement figure of the utility model structural framing;

Fig. 2 is the left view of the utility model structural framing;

Fig. 3 is the front view behind the utility model plastic packaging;

Fig. 4 is originally to be left view with behind the novel plastic packaging;

Fig. 5 is the front view of can;

Fig. 6 is the vertical view of can;

1, lead frame 2, pin 3, wafer 31, location hole 32, pad 4, metal lead wire 5, can

Embodiment:

The enclosure of Fig. 1, TO126 model shown in Figure 2, comprise lead frame 1, pin 2, pad 32, location hole 31, metal lead wire 4, in the sky circle of on the island of lead frame 1 head, offering pad 32 is housed, pad 32 belows are connecting pin 2 with metal lead wire 4, on lead frame 1, described location hole 31 and pad 32 are respectively single 60 and 35, the thickness of described lead frame 1 is that 0.38mm, width are 23mm, adopting increases location hole count and pad number, and the effect of boosting productivity is arranged on prouctiveness.

After Fig. 3, TO126 model shown in Figure 4 add wafer 3 plastic packagings, can 5 on the enclosure, outside at the whole island of lead frame 1 head is sealed with a can 5, corresponding matching die adopts 1440 of moulds, mould colloid runner adopts narrow shape, its effect is, at the same time between in produce more products, saved more materials.

The can 5 of Fig. 5, employing direction plate-like shown in Figure 6, its effect are in order to strengthen the sealing of wafer on island, and distinguish the encapsulation model.

The encapsulation of semiconductor chip is the wafer 3 with well cutting; fasten with glue on the island of lead frame 1; be connected to the respective pins 2 of substrate again with superfine metal lead-in wire 4 wiring pads with wafer 3; then; independently wafer is with can 5 close and protect in addition; what model was that the enclosure of the semiconductor packages of TO126 adopts is single 60; 35 is main; thickness is 0.38mm; width is the structure of 23mm; and what corresponding supporting mould adopted is that a mould is 1440 a version; mould colloid runner also adopts narrow shape, like this, has obtained perfect on each equipment on producing and raw material use; make the equipment can be better faster more accurate aspect operation, be in a ratio of that raw material in the use can be in production more products under the square one under the state before improving.

All equivalences of being done according to the utility model content change or modify, and all should be encompassed within the protection range of the present utility model.

Claims

1. TO126 model enclosure, comprise lead frame (1), pin (2), pad (32), location hole (31), metal lead wire (4) and can (5), pad (32) is housed in the sky circle of offering on the island of lead frame (1) head, pad (32) below is connecting pin (2) with metal lead wire (4), outside at whole island is sealed with a can (5), it is characterized in that: on lead frame (1), location hole (31) and pad (32) are respectively single 60 and 35, and the thickness of lead frame (1) is 0.38mm, width is 23mm.

2. TO126 model enclosure according to claim 1 is characterized in that: the shape of described can (5) is 2 of a presenting direction plate-like.

3. a kind of matching die of TO126 model enclosure is characterized in that: the mould of corresponding supporting TO126 encapsulation, a mould is 1440.

4. the matching die of TO126 model enclosure according to claim 3 is characterized in that: mould colloid runner is narrow shape.