CN202084534U

CN202084534U - TO92S type packaging box and assorted mould

Info

Publication number: CN202084534U
Application number: CN 201120043752
Authority: CN
Inventors: 周志刚
Original assignee: WUJIANG SONGLING MINGBO PRECISION MACHINERY FACTORY
Current assignee: WUJIANG SONGLING MINGBO PRECISION MACHINERY FACTORY
Priority date: 2011-02-22
Filing date: 2011-02-22
Publication date: 2011-12-21
Anticipated expiration: 2021-02-22

Abstract

The utility model relates to a TO92S type packaging box and an assorted mould. The TO92S type packaging box comprises a lead frame, pins, connecting pads, positioning holes and sealing casings. Each islet of the head of the lead frame is provided with a cavity containing one connecting pad, the connecting pads are connected with the pins through metal leads and the integral islet is sealed by the sealing casing, 60 positioning holes and 35 connecting pads in a single row are arranged on the lead frame, the lead frame is 0.34mm thick and 17.3mm wide and each sealing casing is in the shape of trapezoid with an inward recessed circle in the middle. The mould assorted with the TO92S packaging box is provided with 1480 positioning holes, and mould rubber runners are narrow. The packaging frame and the corresponding mould are modified, so that utilization of different devices and raw materials during production is perfected, the devices can run better, faster and more accurately, and more products can be produced by the devices in the same quantity.

Description

TO92S model enclosure and matching die

Technical field

The utility model relates to a kind of semiconductor packages of TO92S model, especially relates to TO92S model enclosure and matching die after the improvement.

Background technology

Semiconductor packages is meant and will obtains the process of individual chips according to the processing of product type functional requirement by the wafer of test; the encapsulation of semiconductor chip is with diced wafer; fasten with glue on the island of lead frame; with the superfine metal lead wiring pad of wafer is connected to the respective pins of substrate again; then; independently wafer is with can close and protect in addition; what model was that the enclosure of the semiconductor packages of TO92S adopts is single 50; 25 is main; thickness is 0.38mm; width is the structure of 23.8mm; and what corresponding supporting mould adopted is that a mould is 1200 a version; like this, on raw-material employing and production efficiency, all be subjected to restriction to a certain degree.

Summary of the invention

Technical problem to be solved in the utility model provides a kind of TO92S model enclosure and matching die that can reduce raw material and boost productivity.

The technical scheme in the invention for solving the technical problem is: a kind of model is TO92S model enclosure and matching die, comprise lead frame, pin, connection pad, location hole, metal lead wire and can, in the sky circle of on the island of lead frame head, offering connection pad is housed, the connection pad below is connecting pin with metal lead wire, outside at whole island is sealed with a can, on lead frame, location hole and connection pad are respectively single 60 and 35, and the thickness of lead frame is that 0.34mm, width are 17.3mm.

In order to save raw material, the thickness of described lead frame is that 0.34mm, width are 17.3mm.

For saving under the raw-material situation, can reach the effect of boosting productivity, described lead frame adopts the version of single 60 location holes and 35 connection pads.

, differentiation model fastening in order to seal, the shape of described can are that the round trapezoidal shape of an indent is arranged in the middle of presenting.

For in conjunction with the production that improves back model TO92S, corresponding matching die adopts the version of 1480 of moulds, and mould colloid runner is narrow shape.

After adopting the version of above-mentioned model, each equipment on producing and raw material use have obtained perfect, reduced the wasting of resources, be in a ratio of under the state before improving raw material and can under situation, produce more products in the use with quantity, the production time also corresponding the shortening.

Description of drawings:

Below in conjunction with accompanying drawing the utility model is further specified.

Fig. 1 is the improvement figure of the utility model structural framing;

Fig. 2 is the left view of the utility model structural framing;

Fig. 3 is the front view behind the utility model plastic packaging;

Fig. 4 is originally to be left view with behind the novel plastic packaging;

Fig. 5 is the front view of can;

Fig. 6 is the vertical view of can;

1, lead frame 2, pin 3, wafer 31, location hole 32, connection pad 4, can

Embodiment:

The enclosure of Fig. 1, TO92S model shown in Figure 2, comprise lead frame 1, pin 2, connection pad 32, location hole 31, in the sky circle of on the island of lead frame 1 head, offering connection pad 32 is housed, connection pad 32 belows are connecting pin 2 with metal lead wire, on lead frame 1, described location hole 31 and connection pad 32 are respectively single 60 and 35, the thickness of described lead frame 1 is that 0.34mm, width are 17.3mm, adopting increases location hole count and connection pad number, and the effect of boosting productivity is arranged on prouctiveness.

After Fig. 3, TO92S model shown in Figure 4 add wafer 3 plastic packagings, can 4 on the enclosure, outside at the whole island of lead frame 1 head is sealed with a can 4, corresponding matching die adopts 1480 of moulds, mould colloid runner adopts narrow shape, its effect is, at the same time between in produce more products, saved more materials.

The can 4 that the trapezoidal shape of one indent circle is arranged in the middle of Fig. 5, employing shown in Figure 6, its effect are in order to strengthen the sealing of wafer on island, and distinguish the encapsulation model.

The encapsulation of semiconductor chip is the wafer 3 with well cutting; fasten with glue on the island of lead frame 1; with the superfine metal lead-in wire wiring pad of wafer 3 is connected to the respective pins 2 of substrate again; then; independently wafer is with can 4 close and protect in addition; what model was that the enclosure of the semiconductor packages of TO92S adopts is single 60; 35 is main; thickness is 0.34mm; width is the structure of 17.3mm; and what corresponding supporting mould adopted is that a mould is 1480 a version; mould colloid runner also adopts narrow shape, like this, has obtained perfect on each equipment on producing and raw material use; make the equipment can be better faster more accurate aspect operation, be in a ratio of that raw material in the use can be in production more products under the square one under the state before improving.

All equivalences of being done according to the utility model content change or modify, and all should be encompassed within the protection range of the present utility model.

Claims

1. TO92S model enclosure, comprise lead frame (1), pin (2), connection pad (32), location hole (31) and can (4), connection pad (32) is housed in the sky circle of offering on the island of lead frame (1) head, connection pad (32) below is connecting pin (2) with metal lead wire, outside at whole island is sealed with a can (4), it is characterized in that: on lead frame (1), location hole (31) and connection pad (32) are respectively single 60 and 35, and the thickness of lead frame (1) is that 0.34mm, width are 17.3mm.

2. TO92S model enclosure according to claim 1 is characterized in that: the shape of described can (4) is that the round trapezoidal shape of an indent is arranged in the middle of presenting.

3. the matching die of a corresponding TO 92S model enclosure is characterized in that: the mould of corresponding supporting TO92S encapsulation, a mould is 1480.

4. the matching die of TO92S model enclosure according to claim 3 is characterized in that: mould colloid runner is narrow shape.