CN102646661A

CN102646661A - TO92S packaging box and matched die

Info

Publication number: CN102646661A
Application number: CN2011100421859A
Authority: CN
Inventors: 周志刚
Original assignee: WUJIANG SONGLING MINGBO PRECISION MACHINERY FACTORY
Current assignee: WUJIANG SONGLING MINGBO PRECISION MACHINERY FACTORY
Priority date: 2011-02-22
Filing date: 2011-02-22
Publication date: 2012-08-22

Abstract

The invention relates to a TO92S packaging box and a matched die. The TO92S packaging box comprises a lead frame, pins, connecting pads, locating holes and a seal shell, wherein the connecting pads are arranged in an empty loop arranged on an islet on the head of the lead frame; the lower parts of the connecting pads are connected with the pins through metal leads; the outside of the whole islet is sealed by the seal shell; on the lead frame, the quantities of the locating holes and the connecting pads are respectively 60 and 35 in a single row; the lead frame is 0.34mm thick and 17.3mm wide; the seal shell is a trapezoid of which the middle is provided with a concave circle; and the correspondingly matched TO92S packaging die has 1480 molds, and the die colloid flow passage adopts a narrow type. The invention improves the packaging frame and the corresponding die, and perfects the use of equipment and raw materials in production, so that the equipment can operate better, faster and more precisely, and produce more products under the condition of the same quantity.

Description

A kind of TO92S model enclosure and matching die

Technical field

The present invention relates to a kind of semiconductor packages of TO92S model, especially relate to TO92S model enclosure and matching die after the improvement.

Background technology

Semiconductor packages is meant processes the process that obtains individual chips with the wafer through test according to the product type functional requirement, and the encapsulation of semiconductor chip is with diced wafer, on the island of the lead frame that fastens with glue; With the superfine metal lead wiring pad of wafer is connected to the respective pins of substrate again; Then, independently wafer is with can close and protect in addition, and what model was that the enclosure of the semiconductor packages of TO92S adopts is single 50; 25 is main; Thickness is 0.38mm, and width is the structure of 23.8mm, and the employing of corresponding supporting mould is that a mould is 1200 a version; Like this, on raw-material employing and production efficiency, all received restriction to a certain degree.

Summary of the invention

Technical problem to be solved by this invention provides a kind of TO92S model enclosure and matching die that can reduce raw material and boost productivity.

The present invention solves the technical scheme that its technical problem takes: a kind of model is TO92S model enclosure and matching die; Comprise lead frame, pin, connection pad, location hole, metal lead wire and can; In the sky circle of on the island of lead frame head, offering connection pad is housed; The connection pad below is connecting pin with metal lead wire, seals with a can in the outside of whole island, on lead frame; Location hole and connection pad are respectively single 60 and 35, and the thickness of lead frame is that 0.34mm, width are 17.3mm.

In order to save raw material, the thickness of said lead frame is that 0.34mm, width are 17.3mm.

For saving under the raw-material situation, can reach the effect of boosting productivity, said lead frame adopts the version of single 60 location holes and 35 connection pads.

, differentiation model fastening in order to seal, the shape of said can are that the round trapezoidal shape of an indent is arranged in the middle of appearing.

In order to combine to improve the production of back model TO92S, corresponding matching die adopts the version of 1480 of moulds, and mould colloid runner is narrow shape.

After adopting the version of above-mentioned model; Each equipment on producing and raw material use have obtained perfect; Reduced the wasting of resources, be in a ratio of under the state before improving raw material and can under situation, produce more products in the use with quantity, the production time also corresponding the shortening.

Description of drawings:

Below in conjunction with accompanying drawing and embodiment the present invention is further specified.

Fig. 1 is the improvement figure of structural framing of the present invention;

Fig. 2 is the left view of structural framing of the present invention;

Fig. 3 is the front view behind the plastic packaging of the present invention;

Fig. 4 is the left view behind the plastic packaging of the present invention;

Fig. 5 is the front view of can;

Fig. 6 is the vertical view of can;

1, lead frame 2, pin 3, wafer 31, location hole 32, connection pad 4, can.

Embodiment

The enclosure of Fig. 1, TO92S model shown in Figure 2; Comprise lead frame 1, pin 2, connection pad 32, location hole 31; In the sky circle of on the island of lead frame 1 head, offering connection pad 32 is housed, connection pad 32 belows are connecting pin 2 with metal lead wire, on lead frame 1; Said location hole 31 is respectively single 60 and 35 with connection pad 32; The thickness of said lead frame 1 is that 0.34mm, width are 17.3mm, and adopting increases location hole count and connection pad number, and the effect of boosting productivity is arranged on prouctiveness.

After Fig. 3, TO92S model shown in Figure 4 add wafer 3 plastic packagings; Can 4 on the enclosure seals with a can 4 in the outside of the whole island of lead frame 1 head, and corresponding matching die adopts 1480 of moulds; Mould colloid runner adopts narrow shape; Its effect is, at the same time between in produce more products, saved more materials.

The can 4 that the trapezoidal shape of one indent circle is arranged in the middle of Fig. 5, employing shown in Figure 6, its effect are in order to strengthen the sealing of wafer on island, and distinguish the encapsulation model.

The encapsulation of semiconductor chip is the wafer 3 with well cutting, on the island of the lead frame 1 that fastens with glue, with the superfine metal lead-in wire wiring pad of wafer 3 is connected to the respective pins 2 of substrate again; Then, independently wafer is with can 4 close and protect in addition, and what model was that the enclosure of the semiconductor packages of TO92S adopts is single 60; 35 is main, and thickness is 0.34mm, and width is the structure of 17.3mm; And what corresponding supporting mould adopted is that a mould is 1480 a version; Mould colloid runner also adopts narrow shape, like this, has obtained perfect on each equipment on producing and raw material use; Make the equipment can be more accurate better sooner aspect operation, be in a ratio of that raw material in the use can be in production more products under the square one under the state before improving.

Claims

1. TO92S model enclosure; Comprise lead frame (1), pin (2), connection pad (32), location hole (31) and can (4); Connection pad (32) is housed in the sky circle of on the island of lead frame (1) head, offering; Connection pad (32) below is connecting pin (2) with metal lead wire, seals with a can (4) in the outside of whole island, it is characterized in that: on lead frame (1); Location hole (31) and connection pad (32) are respectively single 60 and 35, and the thickness of lead frame (1) is that 0.34mm, width are 17.3mm.

2. TO92S model enclosure according to claim 1 is characterized in that: the shape of said can (4) is that the round trapezoidal shape of an indent is arranged in the middle of appearing.

3. the matching die of a corresponding TO 92S model enclosure is characterized in that: the mould of corresponding supporting TO92S encapsulation, a mould is 1480.

4. the matching die of TO92S model enclosure according to claim 3 in order to realize the increase of a mould semiconductor number, is characterized in that: mould colloid runner is narrow shape.