CN206748935U - For manufacturing the mould of semiconductor sealing material curing molding mold fouling thing test piece - Google Patents
For manufacturing the mould of semiconductor sealing material curing molding mold fouling thing test piece Download PDFInfo
- Publication number
- CN206748935U CN206748935U CN201720483612.XU CN201720483612U CN206748935U CN 206748935 U CN206748935 U CN 206748935U CN 201720483612 U CN201720483612 U CN 201720483612U CN 206748935 U CN206748935 U CN 206748935U
- Authority
- CN
- China
- Prior art keywords
- mould
- test piece
- injection
- template
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of mould for being used to manufacture semiconductor sealing material curing molding mold fouling thing test piece, structure is divided into 3 layers, it is made up of upper mould runner template, middle injection block template, lower mould test test piece fixed form, wherein upper mould runner template carries sprue and runner, encapsulating material injection injection block can be ensured, centre injection block template includes 6 injection cavitys, lower mould test test piece fixed form can fix bed die of the mould steel test test piece of 6 optional surface roughnesses and coating as injection block, and test piece can be replaced conveniently in dismounting.The utility model is simple in construction, can save semiconductor packages support, simplifies injection operation, quickly obtains the test piece with semiconductor sealing material mold fouling thing.
Description
Technical field
A kind of injection mold is the utility model is related to, it is especially a kind of to be solidified into pattern for manufacturing semiconductor sealing material
Has the mould of Contaminant measurement piece.
Background technology
Mould structure used in existing semiconductor packaging is complicated, is mainly used in semiconductor devices production, it is necessary to pacify
Supported the use on the special encapsulation injection-moulding device of semiconductor, in the materials'use effect of research cleaning semiconductor packaging mold
When, checking evaluation can only be carried out in production equipment, delays production and efficiency is very low.Semiconductor packages forming process will make
Ensure that encapsulating material can be easily removed from the molds with Metal Packaging support, if being intended merely to obtain encapsulating material solidification
The mold fouling thing of shaping is, it is necessary to waste substantial amounts of material and support.For analog semiconductor encapsulation process, manufacture encapsulating material is consolidated
Left mold fouling thing is, it is necessary to manufacture the mould of semiconductor sealing material curing molding mold fouling thing during chemical conversion type
Tool.
Utility model content
Technical problem to be solved in the utility model is to provide one kind and saves semiconductor packages support, simplifies injection behaviour
Make, quickly obtain the mould for manufacturing semiconductor sealing material curing molding mold fouling thing test piece.
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is：One kind is used to manufacture semiconductor package
Package material curing molding mold fouling thing tests the mould of piece, including upper mould stream that is dismountable and being fixed successively by alignment pin
Road template, middle injection block template, lower mould test piece fixed form, the bottom surface of upper mould runner template is carved with certain depth
Runner with multiple branches, top surface are provided with a sprue communicated with bottom surface runner, and centre injection block template, which carries, passes through
Multiple independent injection cavitys of injection block template among logical, each injection molding cavity body is positioned at the lower section of a runner branches, lower mould
Test on piece fixed form, the groove of installation mold test piece is provided with below each injection cavity.
Mould test piece as the bed die of injection is that the mould steel of surface roughness and coating can be selected to test piece.
The one side of the groove is communicated with the side of lower mould test piece fixed form, and mould test is replaced in convenient dismounting
Piece.
The beneficial effects of the utility model are：Mould has simple in construction, can save semiconductor packages support, simplify injection
Operation, quickly obtain the test piece with semiconductor sealing material mold fouling thing.
Brief description of the drawings
Fig. 1 is the mould of the present utility model for being used to manufacture semiconductor sealing material curing molding mold fouling thing test piece
Overall structure side top view.
Fig. 2 is the mould of the present utility model for being used to manufacture semiconductor sealing material curing molding mold fouling thing test piece
Overall structure side upward view.
Embodiment
The utility model is described in further detail with reference to the accompanying drawings and detailed description：
As shown in Figure 1, 2, it is of the present utility model to be used to manufacture the test of semiconductor sealing material curing molding mold fouling thing
The mould of piece, including it is dismountable and by alignment pin 6 successively fixed upper mould runner template 2, middle injection block template 3, under
Mould test piece fixed form 4, the runner 8 with multiple branches with certain depth is carved with the bottom surface of upper mould runner template 2, top
Face is provided with a sprue 7 communicated with bottom surface runner 8, and centre injection block template 3 is with injection block template 3 among insertion
Multiple independent injection cavitys 9, each cavity 9 that is molded is positioned at the lower section of a branch of runner 8, lower mould test piece fixed form 4
On, positioned at it is each injection cavity 9 lower section be provided with installation mold test piece 5 groove 10.
Mould test piece 5 as the bed die of injection is that the mould steel of surface roughness and coating can be selected to test piece.
The one side of the groove 10 communicates with the side of lower mould test piece fixed form 4, and convenient dismounting is replaced mould and surveyed
Test piece 5.
In the present embodiment, mould is made up of 3 layers of template, wherein upper mould runner template 2 carries sprue and runner, Ke Yibao
Encapsulating material injection injection block is demonstrate,proved, centre injection block template 3 includes 6 injection cavitys 9, and lower mould test piece fixed form 4 can be consolidated
Bed die of the mould steel test piece 5 of fixed 6 optional surface roughnesses and coating as injection block, test piece can facilitate dismounting to replace
Change.Three pieces of templates of upper, middle and lower are fixed together by dismountable alignment pin 6.
Because upper, middle and lower template size is consistent, cooperate, reuse the accurate positioning between alignment pin guarantee template, can
The injection block for ensureing to be molded every time is all on same position, after corresponding survey strip will leave encapsulating material curing molding
Mold fouling thing be available for studying and test.The mould structure is simple, can save semiconductor packages support, simplifies injection behaviour
Make, quickly obtain the test piece with semiconductor sealing material mold fouling thing.
In summary, content of the present utility model is not limited in the above embodiments, in same area it is insighted it
Scholar can easily propose other embodiments within technological guidance's thought of the present utility model, but this embodiment is all wrapped
Include within the scope of the utility model.
Claims (3)
- A kind of 1. mould for being used to manufacture semiconductor sealing material curing molding mold fouling thing test piece, it is characterised in that bag Include upper mould runner template (2) that is dismountable and being fixed successively by alignment pin (6), middle injection block template (3), the test of lower mould The runner (8) with multiple branches with certain depth is carved with piece fixed form (4), the bottom surface of upper mould runner template (2), top Face is provided with a sprue (7) communicated with bottom surface runner (8), and centre injection block template (3) is with injection block among insertion Multiple independent injection cavitys (9) of template (3), cavity (9) is each molded positioned at the lower section of runner (8) branch, lower mould Test on piece fixed form (4), the groove of installation mold test piece (5) is provided with below each injection cavity (9) (10)。
- 2. the mould according to claim 1 for being used to manufacture semiconductor sealing material curing molding mold fouling thing test piece Tool, it is characterised in that the mould test piece (5) as the bed die of injection is the mould steel that can select surface roughness and coating Test piece.
- 3. the mould according to claim 1 for being used to manufacture semiconductor sealing material curing molding mold fouling thing test piece Tool, it is characterised in that the one side of the groove (10) communicates with the side of lower mould test piece fixed form (4), convenient dismounting Replace mould test piece (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720483612.XU CN206748935U (en) | 2017-05-04 | 2017-05-04 | For manufacturing the mould of semiconductor sealing material curing molding mold fouling thing test piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720483612.XU CN206748935U (en) | 2017-05-04 | 2017-05-04 | For manufacturing the mould of semiconductor sealing material curing molding mold fouling thing test piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206748935U true CN206748935U (en) | 2017-12-15 |
Family
ID=60616107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720483612.XU Active CN206748935U (en) | 2017-05-04 | 2017-05-04 | For manufacturing the mould of semiconductor sealing material curing molding mold fouling thing test piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206748935U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102126897B1 (en) * | 2019-09-20 | 2020-06-25 | 유만근 | Apparatus for forming the guide roller |
| CN117484745A (en) * | 2023-11-27 | 2024-02-02 | 中国船舶集团有限公司第七一五研究所 | Piezoelectric copolymer thick film forming die and processing mode |
-
2017
- 2017-05-04 CN CN201720483612.XU patent/CN206748935U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102126897B1 (en) * | 2019-09-20 | 2020-06-25 | 유만근 | Apparatus for forming the guide roller |
| CN117484745A (en) * | 2023-11-27 | 2024-02-02 | 中国船舶集团有限公司第七一五研究所 | Piezoelectric copolymer thick film forming die and processing mode |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206748935U (en) | For manufacturing the mould of semiconductor sealing material curing molding mold fouling thing test piece | |
| CN207448956U (en) | A kind of infrared camera shell moulding injection mold | |
| CN102069564B (en) | Rotary multi-station injection molding mould for manufacturing microfluidic chip | |
| KR200468472Y1 (en) | A gate runner with a cross-section of which flow diameter varies from a start point to an end point | |
| CN204340093U (en) | A kind of chip tantalum capacitor encapsulating mould | |
| CN210940272U (en) | Novel plastic mould of full plastic-coated aluminum alloy die casting | |
| CN104599982A (en) | Whole-sealing semiconductor wafer packaging mold | |
| CN204209090U (en) | Novel metal die casting | |
| CN206536776U (en) | A kind of plastic tape pitches the injecting molding die of pole | |
| CN204354397U (en) | A kind of mould with movable inserts carrier | |
| CN203737951U (en) | Die for manufacturing automobile engine support body | |
| CN206840591U (en) | Maintenance door switch molding mould on a kind of car duct plate | |
| CN202555765U (en) | Pouring mold for bases of lathe beds | |
| CN206326815U (en) | A kind of dual channel mould structure | |
| CN206230007U (en) | A kind of die casting for elevator motor end cap | |
| CN208232253U (en) | A kind of high-precision injection molding mold | |
| CN205522279U (en) | Nail oil bottle perspective window template of moulding plastics | |
| CN204109262U (en) | PP thin-walled welding bell tool | |
| CN103736935A (en) | Mold for manufacturing automobile engine support body | |
| CN203343367U (en) | Cast hole device avoiding parting surface | |
| CN211683161U (en) | Realize metalwork and spring and bury and penetrate quick forming die simultaneously | |
| CN206335786U (en) | A kind of penholder injection mold | |
| CN208359308U (en) | A kind of integral and intelligent vacuum circuit breaker mold | |
| CN206085524U (en) | Thermometer injection mold | |
| CN208730107U (en) | A kind of bracket of perfusion production silicon rubber mould |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |