CN101944499B - Support frame for material loading of lead frame - Google Patents
Support frame for material loading of lead frame Download PDFInfo
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- CN101944499B CN101944499B CN 200910144105 CN200910144105A CN101944499B CN 101944499 B CN101944499 B CN 101944499B CN 200910144105 CN200910144105 CN 200910144105 CN 200910144105 A CN200910144105 A CN 200910144105A CN 101944499 B CN101944499 B CN 101944499B
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- frame
- lead frame
- framework
- material loading
- holder
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Abstract
The invention discloses a support frame for material loading of a lead frame. The support frame comprises a frame body [1] and a plurality of support wires [2], wherein the support wires [2] are vertically connected with upper and lower frames of the frame body [1]; a plurality of concave grooves [4] which are parallel to each other and are used for supporting four angles of the lead frame are arranged on two transverse sides of the frame body [1]; four angles of the concave groove [4] are recessed into the frame body [1] in a right angle shape so as to horizontally position the lead frame; bumps [3] for supporting the lead frame are arranged on the bottoms of the concave grooves [4]; and a gap [5] for injecting is reserved in the middle of the frame body [1]. The support frame has the advantages of multiple tomes of single material loading, high efficiency, high accuracy of mould positioning and high utilization of modular surface.
Description
Technical field
The present invention relates to be used in a kind of semiconductor packages operation the holder frame of material loading of lead frame.
Background technology
At present, behind semiconductor in the road packaging process, the bottleneck because the design of the structural design of lead frame and feeding device of lead frame has come out gradually more and more is not suitable with the high speed development of the industries such as semiconductor chip design.Existing material loading of lead frame shelf structure is single, refer to limit position, material loading screening with pilot pin by simple little holder, and each loading efficiency is very low, each material loading lead frame quantity is few, it is low to enter a precision on the mould, the die face utilance is low, traditional small lot material loading, encapsulation can not have been satisfied client's production, skill upgrading, development, and the client occurs solving the problem of long-term puzzlement and improving its productivity effect in the urgent need to new feeding device of lead frame like this.
Summary of the invention
The purpose of this usefulness invention be exactly solve that existing material loading of lead frame frame loading efficiency is very low, single material loading lead frame quantity is few, enter that a precision is low, the die face utilance is low on the mould, encapsulation is with moulding the low problem of fat material utilance, provide that a kind of feed material list sub-quantity is many, efficient is high, enter on the mould that a precision is high, the die face utilance is high, greatly reduce encapsulation with the material loading holder frame of moulding the packaging cost such as fat material.
The technical solution used in the present invention is: the holder frame that is used for material loading of lead frame, it is characterized in that it comprises framework and some holder lines, described holder line vertically is connected on the upper and lower side frame of framework, described framework both lateral sides is provided with several parallel recessed channels that is used for four jiaos of supporting wire frameworks, four jiaos of rectangular types of the female groove are recessed into framework, to the lead frame horizontal location, the recessed channel bottom surface is provided with the projection of supporting wire framework; The centre of framework is provided with to make things convenient for the space of injection moulding.
Adopt technique scheme, since on the framework laterally both sides be provided with several parallel recessed channels that is used for four jiaos of supporting wire frameworks, therefore every side can be used for several lead frames, because the recessed frame of four jiaos of rectangular types of recessed channel, can be to the lead frame horizontal location, the projection of bottom surface supports four jiaos of lead frame, and the holder line on the framework can be confronted soft lead frame middle part and further be supported, can be from the gap simultaneously to the both sides injection moulding during injection moulding.
In sum, beneficial effect of the present invention is: because single of the present invention can go up four above lead frames, so efficient improves (and old structure can only be carried out the encapsulation arrangement form of the lead frame of 2 or following quantity) greatly; Because lead frame is positioned at the framework upper horizontal plane, therefore enter a precision high; The gap of an injection moulding of framework can be to a plurality of lead frame injection mouldings, therefore greatly improved the die face utilance, greatly saved encapsulation with moulding the packaging cost such as fat material.
Description of drawings
Fig. 1 is structural representation of the present invention.
Among the figure, 1, framework, 2, the holder line, 3, projection, 4, recessed channel, 5, the space.
Embodiment
The present invention is used for the holder frame of material loading of lead frame, and as shown in Figure 1, it comprises framework 1 and two holder lines 2, and the holder line adopts steel wire to make, and two holder line 2 parallel longitudinals are connected on the upper and lower side frame of framework 1.Framework 1 both lateral sides is respectively equipped with two parallel recessed channels 4 that are used for four jiaos of supporting wire frameworks, and 4 four jiaos of rectangular types of recessed channel are recessed into framework 1, and to the horizontal fine positioning of lead frame, recessed channel 4 bottom surfaces are provided with the projection 3 of supporting wire framework; The centre of framework 1 is provided with to make things convenient for the space 5 of injection moulding.
Claims (1)
1. the holder frame that is used for material loading of lead frame, it is characterized in that it comprises framework [1] and some holder lines [2], described holder line [2] vertically is connected on the upper and lower side frame of framework [1], described framework [1] both lateral sides is provided with several parallel recessed channels [4] that is used for four jiaos of supporting wire frameworks, [4] four jiaos of rectangular types of the female groove are recessed into framework [1], to the lead frame horizontal location, recessed channel [4] bottom surface is provided with the projection [3] of supporting wire framework; The centre of framework [1] is provided with to make things convenient for the space [5] of injection moulding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200910144105 CN101944499B (en) | 2009-07-09 | 2009-07-09 | Support frame for material loading of lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200910144105 CN101944499B (en) | 2009-07-09 | 2009-07-09 | Support frame for material loading of lead frame |
Publications (2)
Publication Number | Publication Date |
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CN101944499A CN101944499A (en) | 2011-01-12 |
CN101944499B true CN101944499B (en) | 2013-02-27 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200910144105 Active CN101944499B (en) | 2009-07-09 | 2009-07-09 | Support frame for material loading of lead frame |
Country Status (1)
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CN (1) | CN101944499B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102709218B (en) * | 2012-06-20 | 2015-11-18 | 铜陵三佳山田科技有限公司 | A kind of material loading framework for the lead frame with staggered pin |
CN111128825B (en) * | 2020-01-08 | 2023-05-02 | 佛山市蓝箭电子股份有限公司 | Lead frame feeding frame with automatic fixing function |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0163856A1 (en) * | 1984-05-02 | 1985-12-11 | GTE Products Corporation | Method of making lead frame support for ic chip |
CN101241875A (en) * | 2007-08-14 | 2008-08-13 | 三星电子株式会社 | A mobile carrier for lead frame and method for using this mobile carrier |
CN201490167U (en) * | 2009-07-09 | 2010-05-26 | 铜陵三佳科技股份有限公司 | Supporting frame used for material loading of lead frame |
-
2009
- 2009-07-09 CN CN 200910144105 patent/CN101944499B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0163856A1 (en) * | 1984-05-02 | 1985-12-11 | GTE Products Corporation | Method of making lead frame support for ic chip |
CN101241875A (en) * | 2007-08-14 | 2008-08-13 | 三星电子株式会社 | A mobile carrier for lead frame and method for using this mobile carrier |
CN201490167U (en) * | 2009-07-09 | 2010-05-26 | 铜陵三佳科技股份有限公司 | Supporting frame used for material loading of lead frame |
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CN101944499A (en) | 2011-01-12 |
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