CN202259224U - Feeding device of lead frame - Google Patents
Feeding device of lead frame Download PDFInfo
- Publication number
- CN202259224U CN202259224U CN2011203175048U CN201120317504U CN202259224U CN 202259224 U CN202259224 U CN 202259224U CN 2011203175048 U CN2011203175048 U CN 2011203175048U CN 201120317504 U CN201120317504 U CN 201120317504U CN 202259224 U CN202259224 U CN 202259224U
- Authority
- CN
- China
- Prior art keywords
- frame
- feeding device
- framework
- lead frame
- recessed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a feeding device of a lead frame. The feeding device of the lead frame comprises a frame body, wherein the frame body consists of an upper transverse frame, a lower transverse frame, a left vertical frame and a right vertical frame; the middle part of the frame body is of a hollow structure; two longitudinal connecting lines are arranged between the upper frame and the lower frame of the frame body; the left vertical frame and the right vertical frame of the frame body are provided with a plurality of recessed grooves; each recessed groove with four corners of right-angle shape is recessed into the frame; and the bottom surface of the recessed groove is provided with a lug boss. By adopting the feeding device of the lead frame, the feeding efficiency is high, the placing precision of a mould is high and the utilization rate of a mould surface is high.
Description
Technical field
The utility model relates to a kind of lead frame feeding device.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; Form the key structure spare of electric loop, it has played the function served as bridge that is connected with outer lead, all need use lead frame in the semiconductor integrated package of the overwhelming majority; Thereby lead frame is a basic material important in the electronics and information industry.
The lead frame product type has TO, DIP, ZIP, SIP, SOP, SSOP, QFP (QFJ), SOD, SOT etc.Mainly produce with die stamping method and chemical etching method.
Existing lead frame feeding device structure is single, and efficient is low.
The utility model content
The utility model technical issues that need to address just are to overcome the defective of prior art, and a kind of lead frame feeding device is provided, and its loading efficiency is high, and mould is gone into a precision height, the die face utilance is high.
For addressing the above problem, the utility model adopts following technical scheme:
The utility model provides a kind of lead frame feeding device; Comprise framework, said framework is made up of upper and lower two horizontal frames and left and right two vertical frames, is hollow-core construction in the middle of the framework; Be provided with two vertical connecting lines between upper and lower two frames of framework; Left and right two the vertical frames of framework are provided with a plurality of recessed channels, and four jiaos of rectangular types of the female groove are recessed into framework, and the recessed channel bottom surface is provided with convexity.
The utility model loading efficiency is high, and mould is gone into a precision height, the die face utilance is high.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
As shown in Figure 1, the utility model provides a kind of lead frame feeding device, comprises framework 1; Said framework is made up of upper and lower two horizontal frames and left and right two vertical frames; In the middle of the framework is hollow-core construction 2, is provided with two vertical connecting lines 3 between upper and lower two frames of framework, and left and right two the vertical frames of framework are provided with a plurality of recessed channels 4; Four jiaos of rectangular types of the female groove are recessed into framework, and the recessed channel bottom surface is provided with protruding 5.
The utility model loading efficiency is high, and mould is gone into a precision height, the die face utilance is high.
What should explain at last is: obviously, the foregoing description only be for explain clearly that the utility model does for example, and be not qualification to execution mode.For the those of ordinary skill in affiliated field, on the basis of above-mentioned explanation, can also make other multi-form variation or change.Here need not also can't give exhaustive to all execution modes.And conspicuous variation of being amplified out thus or change still are among the protection range of the utility model.
Claims (1)
1. lead frame feeding device; It is characterized in that: comprise framework, said framework is made up of upper and lower two horizontal frames and left and right two vertical frames, is hollow-core construction in the middle of the framework; Be provided with two vertical connecting lines between upper and lower two frames of framework; Left and right two the vertical frames of framework are provided with a plurality of recessed channels, and four jiaos of rectangular types of the female groove are recessed into framework, and the recessed channel bottom surface is provided with convexity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203175048U CN202259224U (en) | 2011-08-29 | 2011-08-29 | Feeding device of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203175048U CN202259224U (en) | 2011-08-29 | 2011-08-29 | Feeding device of lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202259224U true CN202259224U (en) | 2012-05-30 |
Family
ID=46120423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203175048U Expired - Fee Related CN202259224U (en) | 2011-08-29 | 2011-08-29 | Feeding device of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202259224U (en) |
-
2011
- 2011-08-29 CN CN2011203175048U patent/CN202259224U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202259224U (en) | Feeding device of lead frame | |
| CN205303458U (en) | To inserting type TO220F encapsulation lead frame | |
| CN202238734U (en) | Lead frame rinsing tank | |
| CN202239174U (en) | Device for cutting off connection rib between outer pins of lead frame | |
| CN201523005U (en) | Double-row pin quad flat non-pin package piece | |
| CN203617344U (en) | Surface mount type LED lead frame | |
| CN203553212U (en) | Composable wafer direct packaging COB support | |
| CN202905705U (en) | High-density-arrangement low-power integrated circuit lead frame member | |
| CN202239431U (en) | Forging and pressing forming mold for copper strips | |
| CN202239159U (en) | Height limiting device for lead frame punch forming equipment | |
| CN207250503U (en) | A kind of lead frame that can improve stock utilization | |
| CN202231006U (en) | SMA integrated circuit punching moulded product and SMA multi-row lead frame | |
| CN206789536U (en) | High-power ultra-thin rectification chip | |
| CN202259227U (en) | Arranging device for lead frames | |
| CN204451058U (en) | A kind of paster rectifier bridge injection mold | |
| CN220856568U (en) | Lead frame and glue filling die | |
| CN203218252U (en) | EMSOP8 integrated circuit packaging lead frame structure | |
| CN202255448U (en) | Lead wire framework detection tool | |
| CN202384327U (en) | Small-size chip package structure | |
| CN205355048U (en) | Novel SOT223 packaging lead frame | |
| CN209880599U (en) | Lead frame | |
| CN203774303U (en) | Array type lead wire framework plate member | |
| CN202259229U (en) | Lead wire framework transmission clamp | |
| CN201490167U (en) | Supporting frame used for material loading of lead frame | |
| CN204167288U (en) | Flat no-lead packages body |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20120829 |