CN101944499A - Support frame for material loading of lead frame - Google Patents
Support frame for material loading of lead frame Download PDFInfo
- Publication number
- CN101944499A CN101944499A CN2009101441053A CN200910144105A CN101944499A CN 101944499 A CN101944499 A CN 101944499A CN 2009101441053 A CN2009101441053 A CN 2009101441053A CN 200910144105 A CN200910144105 A CN 200910144105A CN 101944499 A CN101944499 A CN 101944499A
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- China
- Prior art keywords
- frame
- framework
- lead frame
- material loading
- holder
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a support frame for material loading of a lead frame. The support frame comprises a frame body [1] and a plurality of support wires [2], wherein the support wires [2] are vertically connected with upper and lower frames of the frame body [1]; a plurality of concave grooves [4] which are parallel to each other and are used for supporting four angles of the lead frame are arranged on two transverse sides of the frame body [1]; four angles of the concave groove [4] are recessed into the frame body [1] in a right angle shape so as to horizontally position the lead frame; bumps [3] for supporting the lead frame are arranged on the bottoms of the concave grooves [4]; and a gap [5] for injecting is reserved in the middle of the frame body [1]. The support frame has the advantages of multiple tomes of single material loading, high efficiency, high accuracy of mould positioning and high utilization of modular surface.
Description
Technical field
The present invention relates to be used in a kind of semiconductor packages operation the holder frame of lead frame material loading.
Background technology
At present, behind semiconductor in the road packaging process, the bottleneck because the design of the structural design of lead frame and lead frame feeding device has come out gradually, the more and more high speed development of industry such as incompatibility semiconductor chip design.Existing lead frame stock shelf structure is single, refer to limit position, material loading screening by simple little holder with pilot pin, and each loading efficiency is very low, each material loading lead frame quantity is few, it is low to go into a precision on the mould, the die face utilance is low, traditional small lot material loading, encapsulation can not have been satisfied client's production, skill upgrading, development, and the client presses for the problem of the new long-term puzzlement of lead frame feeding device appearance solution and improves its productivity effect like this.
Summary of the invention
The purpose of this usefulness invention be exactly solve that existing lead frame stock shelf loading efficiency is very low, single material loading lead frame quantity is few, go into that a precision is low, the die face utilance is low on the mould, encapsulation is with moulding the low problem of fat material utilance, provide that a kind of feed material list sub-quantity is many, efficient is high, go into a precision height, die face utilance height on the mould, greatly reduce encapsulation with the material loading holder frame of moulding packaging cost such as fat material.
The technical solution used in the present invention is: the holder frame that is used for the lead frame material loading, it is characterized in that it comprises framework and some holder lines, described holder line vertically is connected on the upper and lower side frame of framework, described framework both lateral sides is provided with several parallel recessed channels that is used for four jiaos of supporting wire frameworks, four jiaos of rectangular types of the female groove are recessed into framework, to the lead frame horizontal location, the recessed channel bottom surface is provided with and is used for the projection of supporting wire framework; The centre of framework is provided with the space that is used for making things convenient for injection moulding.
Adopt technique scheme, because both lateral sides is provided with several parallel recessed channels that is used for four jiaos of supporting wire frameworks on the framework, therefore every side can be used for several lead frames, because the recessed frame of four jiaos of rectangular types of recessed channel, can be to the lead frame horizontal location, the projection of bottom surface supports four jiaos of lead frame, and the holder line on the framework can be confronted soft lead frame middle part and further be supported, can be from the gap simultaneously to the both sides injection moulding during injection moulding.
In sum, beneficial effect of the present invention is: because single of the present invention can go up four above lead frames, so efficient improves (and old structure can only be carried out the encapsulation arrangement form of the lead frame of 2 or following quantity) greatly; Because lead frame is positioned at the framework upper horizontal plane, therefore go into a precision height; The gap of an injection moulding of framework can be to a plurality of lead frame injection mouldings, therefore improved the die face utilance greatly, saved encapsulation with moulding packaging cost such as fat material greatly.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Among the figure, 1, framework, 2, the holder line, 3, projection, 4, recessed channel, 5, the space.
Embodiment
The present invention is used for the holder frame of lead frame material loading, and as shown in Figure 1, it comprises framework 1 and two holder lines 2, and the holder line adopts steel wire to make, and two holder line 2 parallel longitudinals are connected on the upper and lower side frame of framework 1.Framework 1 both lateral sides is respectively equipped with two parallel recessed channels 4 that are used for four jiaos of supporting wire frameworks, and 4 four jiaos of rectangular types of recessed channel are recessed into framework 1, and to the horizontal fine positioning of lead frame, recessed channel 4 bottom surfaces are provided with and are used for the projection 3 of supporting wire framework; The centre of framework 1 is provided with the space 5 that is used for making things convenient for injection moulding.
Claims (1)
1. the holder frame that is used for the lead frame material loading, it is characterized in that it comprises framework [1] and some holder lines [2], described holder line [2] vertically is connected on the upper and lower side frame of framework [1], described framework [1] both lateral sides is provided with several parallel recessed channels [4] that is used for four jiaos of supporting wire frameworks, [4] four jiaos of rectangular types of the female groove are recessed into framework [1], to the lead frame horizontal location, recessed channel [4] bottom surface is provided with and is used for the projection [3] of supporting wire framework; The centre of framework [1] is provided with the space [5] that is used for making things convenient for injection moulding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910144105 CN101944499B (en) | 2009-07-09 | 2009-07-09 | Support frame for material loading of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910144105 CN101944499B (en) | 2009-07-09 | 2009-07-09 | Support frame for material loading of lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101944499A true CN101944499A (en) | 2011-01-12 |
| CN101944499B CN101944499B (en) | 2013-02-27 |
Family
ID=43436419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910144105 Active CN101944499B (en) | 2009-07-09 | 2009-07-09 | Support frame for material loading of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101944499B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709218A (en) * | 2012-06-20 | 2012-10-03 | 铜陵三佳山田科技有限公司 | Loading frame for lead frame with staggered pins |
| CN111128825A (en) * | 2020-01-08 | 2020-05-08 | 佛山市蓝箭电子股份有限公司 | Lead frame material loading frame with automatic fixing function |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0163856A1 (en) * | 1984-05-02 | 1985-12-11 | GTE Products Corporation | Method of making lead frame support for ic chip |
| CN101241875A (en) * | 2007-08-14 | 2008-08-13 | 三星电子株式会社 | A mobile carrier for lead frame and method for using this mobile carrier |
| CN201490167U (en) * | 2009-07-09 | 2010-05-26 | 铜陵三佳科技股份有限公司 | Supporting frame used for material loading of lead frame |
-
2009
- 2009-07-09 CN CN 200910144105 patent/CN101944499B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0163856A1 (en) * | 1984-05-02 | 1985-12-11 | GTE Products Corporation | Method of making lead frame support for ic chip |
| CN101241875A (en) * | 2007-08-14 | 2008-08-13 | 三星电子株式会社 | A mobile carrier for lead frame and method for using this mobile carrier |
| CN201490167U (en) * | 2009-07-09 | 2010-05-26 | 铜陵三佳科技股份有限公司 | Supporting frame used for material loading of lead frame |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709218A (en) * | 2012-06-20 | 2012-10-03 | 铜陵三佳山田科技有限公司 | Loading frame for lead frame with staggered pins |
| CN102709218B (en) * | 2012-06-20 | 2015-11-18 | 铜陵三佳山田科技有限公司 | A kind of material loading framework for the lead frame with staggered pin |
| CN111128825A (en) * | 2020-01-08 | 2020-05-08 | 佛山市蓝箭电子股份有限公司 | Lead frame material loading frame with automatic fixing function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101944499B (en) | 2013-02-27 |
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