KR102067654B1 - Molding apparatus for semiconductor package - Google Patents

Abstract

The present invention relates to a molding device for producing a semiconductor package and, more specifically, to a molding device for forming a semiconductor package to protect a semiconductor chip on a substrate having a plurality of semiconductor chips, which comprises: a port into which a resin for molding the semiconductor chip is introduced; a chamfer unit having the inner diameter wider than the outer diameter of a plunger toward an end portion on an inner circumferential surface of the port to secure driving stability due to the initial insertion and repeated injection of the plunger in a coupling structure of the plunger for resin injection; and a tapered unit having the outer diameter smaller than the inner diameter of a barrel portion toward a tip portion of the plunger.

Description

Molding apparatus for semiconductor package manufacturing {MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE}

The present invention relates to a molding apparatus for manufacturing a semiconductor package, and more particularly, in a molding apparatus for molding a semiconductor package to protect the semiconductor chip in a substrate having a plurality of semiconductor chips, a port into which a resin for molding the semiconductor chip is introduced. And, in the coupling structure of the plunger for the resin injection, the chamfer having an inner diameter that is wider than the outer diameter of the plunger toward the end portion in the inner peripheral surface of the port to ensure the driving stability according to the initial insertion and repeated injection of the plunger, and correspondingly The present invention relates to a molding apparatus for manufacturing a semiconductor package having a tapered portion having an outer diameter which becomes smaller than the inner diameter of the barrel portion toward the tip portion of the plunger.

In general, in a molding apparatus for molding a semiconductor chip provided on a printed circuit board with a thermosetting resin, the semiconductor chip is bonded to a lead frame or a printed circuit board of the semiconductor chip, and the semiconductor chip is wire bonded, and then the semiconductor chip and It refers to a device for manufacturing a semiconductor package surrounding the printed circuit board with a thermosetting resin so that wires and the like can be protected from the external environment.

Conventional semiconductor package manufacturing technology, Korean Patent No. 10-0716054 (2007.05.02.) "Semiconductor manufacturing mold apparatus" (hereinafter referred to as the prior art 1),

The prior art 1 relates to a mold manufacturing apparatus for semiconductor manufacturing comprising upper and lower molds for molding a printed circuit board. The lower mold includes a moving block, a lower block installed at the center of the moving block, and having a plurality of holes. And a plunger positioned below the lower block and supplying a resin rod to the hole, a pair of cavity blocks installed above the lower block and on which the printed circuit board is placed, and molding of the printed circuit board. A lifting device for adjusting the height of the cavity block during operation, and a plurality of lifting and lowering guides provided on an outer circumferential surface of the cavity block, wherein the cavity block is moved up and down in contact with the lifting and lowering guide. It relates to a die manufacturing apparatus for semiconductor manufacturing.

In the prior art 1 is installed in the mold for injection of the resin rod of the plunger is called a port.

The pot is preheated in a state in which a thermosetting resin called a resin rod (hereinafter referred to as a molding compound) is melted, and the resin rod is melted in a liquefied state, and then a plunger inserted therein presses the thermosetting resin into the mold and fills it. A semiconductor package is manufactured by wrapping semiconductor chips of a printed circuit board with a thermosetting resin and then curing them.

In addition, as the prior art of the plunger, Republic of Korea Utility Model No. 2 0-0150082 (1999.04.02.) "Plunger of the semiconductor mold" (hereinafter referred to as the prior art 2),

The prior art 2 is formed with a plurality of guide grooves on the upper outer peripheral surface of the plunger tip portion detachably installed on the body of the plunger inserted into the port formed between the port block of the mold and the holder base, the plunger tip portion through the guide groove The present invention relates to a plunger of a semiconductor mold in which a resin is injected into a central ring groove and cured so that air penetration from the bottom surface can be blocked so that the thermosetting resin can be efficiently injected.

Since the plungers of the prior arts 1 and 2 have to be injected and filled by pressurizing the thermosetting resin in a molten state, the plunger is manufactured with a tolerance to allow the plunger to reciprocate in close contact with the inner wall of the port and the outer wall of the plunger, and the contact portion It is manufactured to eliminate friction by polishing.

In this case, the tolerance between the port and the plunger is manufactured to a very small value (for example, 3 mm / 1000mm) to prevent external leakage of the thermosetting resin. In this case, the insertion work of the plunger is not easy due to the almost same processing error, so that the high skill Has a problem that requires

In particular, even when the insertion direction is slightly misaligned during the initial insertion of the plunger, assembly takes a long time due to the difference in diameter (circumference) due to the machining error, and there is a problem that replacement work is delayed when internal parts such as the plunger are needed. .

Furthermore, when the plunger is replaced, the remaining amount of the thermosetting resin melted at a high temperature remains inside the port, which makes it difficult to separate and reinsert the plunger.

Accordingly, the present invention has been made to solve the above problems,

When manufacturing a molding device for manufacturing a semiconductor package, it is possible to accurately and quickly insert the plunger into the barrel of the port and to prevent scratches on the surface of the port and the plunger due to friction and staggering of the port and the plunger. And a chamfer having an inner diameter that is wider than the outer diameter of the plunger on the inner circumferential surface of the port toward the end so as to secure the operational stability of the plunger, and correspondingly to the outer circumferential surface of the tip of the plunger than the inner diameter of the barrel. An object of the present invention is to provide a molding apparatus for manufacturing a semiconductor package having a tapered portion having a smaller outer diameter.

In addition, the present invention can prevent the port and plunger from surface corrosion by cobalt used as a material of the pot and plunger when the rubber sheet is seated in the mold for the cleaning of the cavity and injected into the cobalt used by the rubber sheet. For example, the pot and plunger may be made of a cemented carbide material containing sintered mixture of nickel and cobalt, mainly tungsten carbide, or nitriding on the surface of powder high speed steel (P / M high speed steel). An object of the present invention is to provide a molding apparatus for manufacturing a semiconductor package.

Then, an object of the present invention is to provide a molding apparatus for manufacturing which is provided with at least one slit groove formed concave on the outer peripheral surface of the tip portion of the plunger to prevent malfunction or damage due to gas pressure imbalance during the forward and backward operation of the plunger. .

In order to achieve the above object, the molding device for manufacturing a semiconductor package according to the present invention,

In the molding apparatus for manufacturing a semiconductor package including a resin injection means which is provided in any one of the molds each having a cavity in which both sides of the semiconductor chip is molded,

The resin injecting means,

A port into which the thermosetting resin is introduced,

A plunger inserted into the port to pressurize and inject a thermosetting resin into the cavity;

A rod for forward and backward operation of the plunger,

The port has a chamfered portion whose inner diameter is wider than the outer diameter of the tip portion of the plunger toward the end on the inner circumferential surface of the inlet side of the barrel portion,

The plunger is characterized in that it has a tapered portion whose outer diameter is smaller than the inner diameter of the barrel portion toward the end portion on the outer peripheral surface of the tip portion.

And in the molding apparatus for manufacturing a semiconductor package according to the present invention,

The port and the plunger may be nitrided on a surface of a powder high speed tool steel material to prevent corrosion due to chemical modification on the surface of the port and the plunger during mold cleaning using a rubber sheet.

Or in the molding apparatus for manufacturing a semiconductor package according to the present invention,

The port and the plunger are made of a cemented carbide material obtained by sintering a mixture of nickel and cobalt mainly based on tungsten carbide, and can prevent corrosion due to chemical modification on the surface of the pot and plunger during mold cleaning using a rubber sheet. do.

In addition, in the molding device for manufacturing a semiconductor package according to the present invention,

The plunger is characterized in that it comprises one or more slit grooves formed concave on the outer peripheral surface of the tip portion.

Molding apparatus for manufacturing a semiconductor package according to the present invention,

The inner circumferential surface of the port portion and the outer circumferential surface of the tip portion of the plunger are provided with chamfering portions and tapered portions having different diameters, respectively, so that the plunger can be easily and precisely inserted and manufactured during the production and assembly of the resin injection means. When the plunger reciprocates the port in the state, the contact surface is peeled off to prevent damage such as scratches. Furthermore, even when the plunger is replaced or reassembled after replacing the mold, or when the plunger is replaced, Regardless of how easy it is to insert the plunger,

Nitriding ports and plungers are applied to the surface of cemented carbide or powdered high speed tool steels sintered from a mixture of nickel and cobalt, rather than ordinary cobalt cemented carbide, to maintain durability against high compressive strength at high temperatures to increase durability. It can increase the service life of ports and plungers, increase productivity while reducing the manufacturing cost of these durable ports and plungers,

In addition, the plunger prevents malfunction or damage due to gas pressure imbalance during forward and backward operation.

Reduces friction that may occur between the port and the plunger to ensure operational stability and durability of the plunger, while preventing high pressure compressed air from entering the mold through the barrel while making it easier to remove resin residues remaining in the barrel. There is an effect that can be done.

1 is a perspective view schematically showing a lower plate of a molding apparatus for manufacturing a semiconductor package according to the present invention.
2 is a cross-sectional view schematically showing a molding apparatus for manufacturing a semiconductor package according to the present invention.
Figure 3 is a photograph for explaining the cleaning operation of the molding device for manufacturing a semiconductor package using a rubber sheet.
4 is a plan view schematically showing an example of mounting a rubber sheet;
5 is a comparison table of the conventional material (KF12) and the ASP + nitrided material of the present invention.
6 is a comparison table of the conventional cemented carbide (WC + Cobalt) and the cemented carbide (WC + Ni-Co) of the present invention.
7 is an enlarged cross-sectional view of main parts for explaining a friction reducing means according to the present invention;

Since the present invention may be modified in various ways and have various forms, embodiments (or embodiments) will be described in detail in the text. However, this is not intended to limit the present invention to the specific form disclosed, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

In each of the drawings, the same reference numerals, in particular, the tens and ones digits, or the same digits, tens, ones, and alphabets refer to members having the same or similar functions, and unless otherwise specified, each member in the figures The member referred to by the reference numeral may be regarded as a member conforming to these criteria.

In addition, in the drawings, the components are exaggerated in size (or thick) in size (or thick) in size (or thin) or simplified in consideration of the convenience of understanding, but the protection scope of the present invention is limited in this way. It should not be.

The terminology used herein is for the purpose of describing particular embodiments (suns, aspects, and embodiments) (or embodiments) only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

 In this application, the terms “comprises” or “consists” are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

In the present specification, the first to the second and the like will only refer to different elements and are not limited to the order of manufacture, and their names are used in the description and the claims. It may not match.

In describing the molding apparatus for manufacturing a semiconductor package according to the present invention, for the sake of convenience, a non-strict approximate direction reference is specified with reference to FIG. 2, and the top, bottom, left and right sides are determined as shown in the direction in which gravity acts downward.

Hereinafter, a molding apparatus for manufacturing a semiconductor package according to the present invention will be described with reference to the accompanying drawings.

First, as shown in FIGS. 1 to 4, the present invention is installed in any one of the molds 10 and 20 having the cavities 13 and 23 on which both sides of the semiconductor chip C are molded. The present invention relates to a molding apparatus for manufacturing a semiconductor package including a resin injecting means (30).

The first mold 10 (the lower mold in the drawing) and the second mold 20 (the upper mold in the drawing) are installed to be opened and closed with each other, and resin injection means for injecting and filling a thermosetting resin into one of these molds ( 30) is mounted.

The substrate B seated between the molds 10 and 20 has a plurality of semiconductor chips C connected to each other through a lead frame, and each of the semiconductor chips C is molded into a semiconductor package. Each is separated and finally shipped through the cutting process.

The first mold 10 is configured by coupling the core block 12 to the base block 11. The core block 12 has a size corresponding to a substrate B composed of a plurality of semiconductor chips C, and allows one surface of each of the semiconductor chips C to be wrapped and then cured. A plurality of first cavities 13 are installed.

In FIG. 1, it can be seen that a plurality of first cavities 13 are formed at both sides of the runner part 14 where the thermosetting resin flows and is cured. In FIGS. 2 to 4, one runner part is provided for convenience of description. Only one first cavity is shown as provided.

As shown in FIG. 2, the core block 22 is coupled to the base block 21 and manufactured to correspond to the first mold 10 so that each of the semiconductor chips C may be formed. A plurality of second cavities 23 are provided to allow the thermosetting resin injected on the other side to be wrapped and then cured.

The first mold 10 and the second mold 20 are manufactured in a vertical type or a horizontal type according to the installation form, which will be described with reference to a vertical molding apparatus.

The first mold 10 and the second mold 20 are moved in close contact with each other through separate lifting means (not shown) so that resin is filled in the first cavity 13 and the second cavity 23 at the same position. When the resin is leaking to the outside to prevent burrs (burr) and the like.

Although not shown in the drawing, a separate guide rod and guide holes may be further provided for the first mold 10 and the second mold 20 to be matched with each other.

In addition, the mold of any one of the first mold 10 or the second mold 20 is further provided with a mil pin (not shown) to take out the substrate B from the mold after the resin filled for each cavity is cured. Can be.

In addition, the core block 12 may further include a gas vent or an etched corrosion surface for discharging gas during resin injection.

The resin injecting means 30 may be installed in any one of the first and second molds 10 and 20, but the resin injecting means 30 is inserted into the first mold 10 which is a lower mold in the drawings of the present specification. Exemplary embodiments in which are installed) are representatively shown.

1 and 2, specifically, the resin injection means 30 is inserted into the port 31 and the port 31 coupled to the center of the core block 12 of the first mold 10. It consists of a plunger 32 which presses and injects a thermosetting resin into a cavity, and the rod 33 which operates the said plunger 32 back and forth.

As shown in FIG. 2, the pot 31 is filled with a thermosetting resin rod R before melting, and the pot 31 is connected to a separate heating means (not shown), so that the thermosetting resin inside during the molding operation. The rod R is heated and melted to allow injection molding through the plunger 32.

The port 31 has a coupling protrusion 31a formed on the outer circumferential surface thereof to protrude from the core block 12.

The rod 33 is then operated in a separate hydraulic or pneumatic manner, more preferably hydraulically driven to ensure proper injection pressure.

The port 31 and the plunger 32 are installed in the core block 12 of the first mold 10, and the port 31 into which the plunger 32 is inserted is coupled to the lower base block 11. With the auxiliary port 35 communicated with each other, the rod 33 is installed in the base (not shown) of the molding apparatus is inserted through the auxiliary port to press the plunger 32 to operate.

The hydraulic lifting means including the rod 33 is installed in the base of the mold apparatus without being installed in the mold, and the first and second molds 10 and 20 are formed of the semiconductor chip C or the substrate B. Depending on the type, it is installed to replace the base of the molding device.

At this time, the plunger 32 and the port 31 must be manufactured to have a numerical value (for example, 3/1000 mm) having a very small processing error, and the molten resin flows back into the gap between the plunger 32 and the port 31. Leakage can be prevented.

To this end, the inner circumferential surface of the barrel portion 31H of the port 31 and the outer circumferential surface of the plunger 32 are polished to maintain the straightness according to the same diameter, respectively.

Therefore, when the plunger 32 is inserted into and coupled to the port 31, the plunger 32 moves in the port 31 as the rod 33 moves up and down, and presses the molten thermosetting resin to inject. As a result, the filling is completed while the molten resin is injected into the cavities of the mold, and after the filling is completed, the resin is cured through a predetermined cooling time, the mold is opened, and the product is taken out through the mill pin.

In this case, the plunger 32 and the port 31 are formed to have substantially the same diameter, and the tip portion 32H of the plunger 32 is made flat in the horizontal direction so as to transmit the same pressure according to the pressure of the resin molding device In the process of inserting the plunger 32 into the port 31 at the time of manufacture, the plunger 32 can be inserted in the form of fine shift | offset | difference, and high skill is required for assembly work.

In addition, when the plunger 32 is forcedly inserted and assembled in a displaced state, the contact portion of the plunger 32 and the port 31 is rubbed due to the reciprocating movement of the plunger 32, and the surface is peeled off. If such damage occurs, the plunger 32 may become inoperable due to the plunger 32 being stuck in the port 31 during long-term use, which may cause a problem that both the port 31 and the plunger 32 need to be replaced. The correct assembly of the and ports 31 is important.

Furthermore, since the plunger 32 is pulled in and out of the port 31 through the rod 33, ascending and descending is performed, the normal molding apparatus can be operated only when the plunger 32 is correctly inserted when entering the port 31 at the maximum. Become.

Therefore, as shown in the lower enlarged cross-sectional view of FIG. 2 to solve the above problems,

The port 31 has a chamfer portion 31A whose inner diameter is wider than the outer diameter of the tip portion 32H of the plunger 32 toward the end portion on the inlet side inner peripheral surface of the barrel portion 31H,

The plunger 32 is characterized in that it has a taper portion 32A whose outer diameter is smaller than the inner diameter of the barrel portion 31H toward the end portion on the outer circumferential surface of the tip portion 32H.

The inner peripheral surface of the barrel portion 31H of the port 31 corresponds to the outer diameter of the plunger 32, wherein the chamfered portion 31A has a rear end portion of the inlet side inner circumferential surface of the barrel portion 31H. It is formed by increasing the inner diameter toward the side.

Corresponding to this chamfered portion 31A, the tapered portion 32A is formed with the outer diameter of the tip side 32H of the tip portion 32H (the edge portion) decreasing toward the front end side of the plunger 32.

Specifically, the chamfer 31A is formed to be inclined from the inner side to the outer side from the upper side to the lower side at a predetermined inclination with respect to the straightness of the inner peripheral surface of the barrel portion 31H.

In addition, the tapered portion 32A is formed to be inclined from the outer side to the inner side toward the upper side at a predetermined inclination with respect to the straightness of the outer circumferential surface of the plunger 32.

Accordingly, the chamfer 31A forms the inlet of the barrel portion 31H wider than the outer diameter of the tip portion 32H, and at the same time the taper portion 32A sets the initial entry outer diameter of the tip portion 32H to the barrel portion 31H. Smaller than the inner diameter of

It facilitates the initial insertion of the plunger 32 into the port 31 and is guided while the taper portion 32A is brought into contact with the chamfer 31A, so that the plunger 32 is inserted into the port 31 and coupled, so as to ensure accurate assembly. It can be done quickly and easily, and can prevent scratches and the like caused by forced fit.

The plunger 32 is further provided with slit grooves 32a and 32b which are recessed on the outer circumferential surface of the plunger 32 to prevent the operation and the damage caused by the gas pressure imbalance while raising and lowering (forward and backward) in the port 31. .

Subsequently, fixing pins (not shown) for fixing the substrate B are protruded to the core blocks 12 and 22 of the first mold 10, the second mold 20, or both. And the substrate (B) is provided with an insertion hole corresponding to the fixing pin.

The fixing pins are installed in a sliding manner with respect to each core block 12 so that the molds 10 and 20 protrude outwardly in the open state to insert the insertion holes of the substrate B into the fixing pins. The substrate (B) is seated and fixed to the

When the molds 10 and 20 are closed, the fixing pins may slide into each of the core blocks according to the contact so that the molds may be in close contact with each other.

Alternatively, any one of the molds 10 and 20 is introduced into a fixing pin which is fixed and protruded, and a coupling hole corresponding to the fixing pin is installed in the other mold so that the fixing pin is inserted into the coupling hole during mold closing. While the core block 12 is in close contact with each other may be considered.

Meanwhile, as described above, the substrate B is manufactured to have a plurality of semiconductor chips C in order to secure manufacturing convenience and improve productivity of the semiconductor package. Therefore, the cavities of the molds 10 and 20 are also manufactured to correspond to the number thereof. As the number of cavities increases, the plurality of cavities can be manufactured by molding a plurality of semiconductor chips C at the same time. Increasing is very important in terms of productivity.

However, when the thermosetting resin is melted, a high pressure is required in order to pressurize the resin in a semi-liquid state so that the resin is filled in a plurality of cavities. To this end, when the pressing force of the plunger 32 is increased, the resin is injected and Since the molds 10 and 20 are opened to each other by the repulsive force, high clamping force is required to prevent this.

Therefore, the increase in the clamping force and the injection pressure of the plunger 32 is accompanied by an increase in the manufacturing cost due to the enlargement of the molding apparatus, so that a technique for filling the resin into a plurality of cavities with only a minimum injection pressure is important.

Thus, as shown in FIG. 2, the present invention has a retention part 24 to allow the resin injected from the port 31 to firstly stay in the second mold 20, and the first mold 10. And a runner portion 14 to fill the resin of the retention portion 24 with the cavities 13 and 23.

The retention portion 24 and the runner portion 14 are formed to have a diameter larger than a passage through which resin is injected into each cavity.

In particular, the retention part 24 is installed in the center of the core block 12 of the mold, so that the resin is injected and filled into the cavities on both sides so as to have a larger space than the cavity so as to minimize the stress caused by the initial injection and flow of the resin. do.

Therefore, in the present invention, the injection pressure of the plunger 32 is increased when resin is injected into the cavities through the runner part 14 after a certain amount of resin is injected into the retention part 24 before the resin is filled in the cavity. As the filling proceeds through the resin pre-injected into the retention part 24 and the runner part 14, the semiconductor package may be manufactured by filling the plurality of cavities with minimal pressure.

Subsequently, if the semiconductor package molding operation is repeated for a long time, the residue (dust) of the thermosetting resin remains in the cavities 13 and 23.

This resin residue not only impairs the flowability of the resin but can also be a major cause of poor molding.

3 and 4, injection molding is performed in a state where the rubber sheet RB is seated in the port 31 and the cavity 13 and 23, and thus the port 31 and the cavity 13 are shown in FIG. (23) was periodically performed with a molten rubber to remove the residue of the thermosetting resin.

On the other hand, unlike the core blocks 12 and 22, the conventional pot 31 and the plunger 32 pressurize directly after melting the thermosetting resin, so that the super-hardness of the pot 31 and the plunger 32 is ensured. In order to produce tungsten carbide as the main component, cobalt is mixed and sintered cemented carbide.

The port 31 and the plunger 32 are chemically modified while cobalt contained in the inner diameter of the port 31 and the outer diameter of the plunger 32 is in contact with the rubber material during the residue removal operation using the rubber sheet RB. As the rapid corrosion progresses on the surfaces of the pot 31 and the plunger 32, the service life of the resin injection means is shortened.

Thus, the present invention can prevent the corrosion of the port 31 and the plunger 32 due to the residual work using the rubber sheet (RB).

First, as a first embodiment, the port 31 and the plunger 32 are nitrided on the surface of P / M high speed steel (Ph. When cleaning the mold to prevent corrosion due to chemical modification on the surface of the port 31 and the plunger 32.

Powder high speed tool steel is manufactured by powder metallurgy and has very good machinability, and is representative of ASP-60 product.

Since the port 31 and the plunger 32, which are nitrided in the powder high speed tool steel thus manufactured, have a cobalt content of 0, they have superior corrosion resistance than conventional tungsten-cobalt cemented carbide, and guarantee cemented carbide materials such as cemented carbide. can do.

5 is a test table comparing the conventional material (KF12) and the ASP + nitrided material of the present invention in the port 31 and the plunger 32, the ASP + nitrided product has a hardness compared to the existing product Although there is no significant difference, it does not contain any cobalt and thus prevents the occurrence of corrosion, which can be seen that the service life is improved by about three times compared to the existing products.

In addition, as a second embodiment, the port 31 and the plunger 32 are made of a cemented carbide material obtained by sintering a mixture of nickel and cobalt mainly composed of tungsten carbide, and the pot 31 when cleaning a mold using a rubber sheet RB. And chemical corrosion on the surface of the plunger 32.

This second embodiment is similar to the conventional tungsten + cobalt cemented carbide, but reduces the cobalt content of the existing 6% weight ratio and replaces it with nickel to prevent corrosion by chemical modification of cobalt and rubber materials.

At this time, it may be possible to use a cemented carbide containing only nickel, but nickel has a weaker adhesion force due to the binder during sintering than cobalt, so that chipping defects may occur, which may cause debris, and thus a small amount of cobalt may be included to produce a cemented carbide.

This second embodiment is made by mixing 88 to 90% by weight of tungsten carbide (WC), 5 to 6% by weight of nickel (Ni), and 5 to 6% by weight of cobalt (Co).

6 is a comparison table of the conventional cemented carbide (WC + Cobalt) and the cemented carbide (WC + Ni-Co) of the present invention in the port 31 and the plunger 32, and has high corrosion resistance compared to conventional products according to the use of nickel. The lifespan can be extended by approximately 30% or more compared to existing products.

In the present invention, the outer surface of the port 31 and the plunger 32 are polished while maintaining the airtightness while removing the friction, so that the plunger 32 can operate back and forth without resistance, but it is used for a long time due to problems such as machining errors. The straightness of the medium may be lowered so that normal operation of the plunger 32 may not be possible.

Accordingly, the present invention further includes friction reducing means 40 for reducing friction between the inner circumferential surface of the barrel portion 31H and the outer circumferential surface of the tip portion 32H, further improving the operational stability of the plunger 32.

Specifically, as shown in FIG. 7 (for the sake of understanding, the fine gap between the port 31 and the tip portion 32H is exaggerated in FIG. 7).

The friction reducing means 40,

A plurality of injection holes 41 perforated on the outer circumferential surface of the tip portion 32H to inject compressed air when the plunger 32 is moved back and forth to form a fine air layer between the tip portion 32H and the barrel portion 31H,

The tip portion 32H is fitted into the uppermost slit groove 32b, the outer end portion is in close contact with the inner circumferential surface of the barrel portion 31H, and the stop portion is formed as a pleated portion overlapped one or more times in the injection hole 41 Hermetic ring 42 for preventing a part of the compressed air injected to leak outside the front end of the tip portion (32H),

One end is hinged to the slit groove 32b on which the hermetic ring 42 is mounted, and the roller part 43 provided at the other end and the wing part 45 protruding to both sides of the roller part 43 are provided. In addition, the wing portion 45 is pushed toward the front end of the tip portion (32H) by the compressed air injected from the injection hole 41 to rotate the roller portion 43 by pressing the wrinkle portion to the outside to the The hermetic ring 42 includes a pressing member 44 forcing the barrel portion 31H to come into close contact with the barrel portion 31H.

The injection hole 41 is connected toward the outer circumferential surface of the tip portion 32H at the inner end portion of the flow passage penetrating the plunger 32 in the longitudinal direction, and has a plurality of injection holes 41 provided in the circumferential direction of the tip portion 32H. ) May be arranged in a row in the longitudinal direction of the plunger 32.

The injection hole 41 is connected to a pneumatic supply means such as a compressor to inject high-pressure compressed air into the injection hole 41, and the injected compressed air hits the inner circumferential surface of the barrel portion 31H while being connected to the port 31. A micro air layer is formed between the plungers 32 to reduce the frictional force in the forward and backward movements.

In addition, the hermetic ring 42 is provided on the outer circumferential surface of the mounting ring 44A fitted in the uppermost slit groove 32b to close the fine gap between the tip portion 32H and the barrel portion 31H, wherein the hermetic ring 42 ) Has a fold where the middle portion is folded.

The hermetic ring 42 is made of a flexible material having an elastic force so as to open from the pleated portion, and maintains hermeticity while the inner and outer widths are variable in length depending on the frictional resistance with the barrel portion 31H when the plunger 32 moves forward and backward. do.

One end of the pressing member 44 is hinged to the mounting ring 44A and coupled to the hinge shaft 44c so as to be rotatable up and down, and the other end is provided with a roller portion 43 arranged on the rotating shaft 43a. do.

The roller portion 43 is free to rotate around the axis of rotation (43a), both wings 45 are formed in an arc shape convex upwards.

The pressing member 44 is rotated downward by the load of the roller portion 43 when the compressed air is not injected, that is, the plunger 32 is stopped, so that the roller portion 43 of the airtight ring 42 Do not press wrinkles.

In the forward and backward operation of the plunger 32, the compressed air injected through the injection hole 41 forms a fine air layer to reduce friction between the port 31 and the plunger 32, and at this time, A part rotates upwardly the pressing member 44 while being sprayed toward the wing part 45.

When the pressing member 44 rotates upward during the operation of the plunger 32 in this way, the roller portion 43 pushes the corrugated portion outward so that the end of the hermetic ring 42 is pressed against the inner circumferential surface of the barrel portion 31H. By preventing the compressed air injected during operation of the plunger 32 from leaking into the upper opening of the barrel portion 31H, it prevents a poor molding operation and the plunger 32 due to the flexible material of the air layer and the airtight ring 42. Since the friction force does not occur when the forward and backward of the plunger 32 can ensure the operating stability.

In the above description of the present invention, a molding apparatus for manufacturing a semiconductor package having a specific shape and structure has been described with reference to the accompanying drawings. However, the present invention may be modified, changed, and replaced by those skilled in the art. Substitutions should be construed as falling within the protection scope of the present invention.

10: first mold 20: second mold
11, 12: core block 13, 23: cavity
30: resin injection means 31: port
31H: Barrel part 31A: Chamfer part
32: Plunger 32H: Tip part
32A: Taper 33: Rod
40: friction reducing means 41: injection hole
42: hermetic ring 43: roller
44 pressure member 45 wings

Claims (4)

In the molding apparatus for manufacturing a semiconductor package comprising a resin injection means 30 which is provided in any one of the molds each having a cavity (13, 23) on which both sides of the semiconductor chip (C) is molded,
The resin injection means 30,
A port 31 into which the thermosetting resin is introduced,
A plunger 32 inserted into the port 31 to pressurize and inject thermosetting resin into the cavity 13 and 23;
A rod 33 for forward and backward operation of the plunger 32,
The port 31 has a chamfer portion 31A whose inner diameter is wider than the outer diameter of the tip portion 32H of the plunger 32 toward the end on the inlet side inner peripheral surface of the barrel portion 31H,
The plunger 32 has a tapered portion 32A whose outer diameter becomes smaller than the inner diameter of the barrel portion 31H toward the end portion on the outer circumferential surface of the tip portion 32H,

The plunger 32 includes one or more slit grooves 32b formed concave in the outer peripheral surface of the tip portion 32H,
Further comprising a friction reducing means 40 for reducing the friction between the inner peripheral surface of the barrel portion 31H and the outer peripheral surface of the tip portion 32H,
The friction reducing means 40,
A plurality of injection holes 41 perforated on the outer circumferential surface of the tip portion 32H to inject compressed air when the plunger 32 is moved back and forth to form a fine air layer between the tip portion 32H and the barrel portion 31H,
The tip portion 32H is fitted into the uppermost slit groove 32b, the outer end portion is in close contact with the inner circumferential surface of the barrel portion 31H, and the stop portion is formed as a wrinkle portion overlapping at least one time in the injection hole 41 Hermetic ring 42 for preventing a part of the compressed air injected to leak out of the front end of the tip portion 32H,
One end is hinged to the slit groove 32b on which the hermetic ring 42 is mounted, and the roller part 43 provided at the other end and the wing part 45 protruding to both sides of the roller part 43 are provided. In addition, the wing portion 45 is pushed to the front end side of the tip portion (32H) by the compressed air injected from the injection hole 41 to rotate the roller portion 43 by pressing the wrinkle portion to the outside to the Molding device for producing a semiconductor package, characterized in that the airtight ring (42) comprises a pressing member (44) forcing the barrel portion (31H) to be in close contact.
The method of claim 1,
The port 31 and the plunger 32 are nitrided on a surface of powder high speed tool steel material, and are chemically modified on the surfaces of the port 31 and the plunger 32 during the mold cleaning using the rubber sheet RB. Molding apparatus for manufacturing a semiconductor package, which can prevent corrosion.
The method of claim 1,
The port 31 and the plunger 32 may be made of a cemented carbide material obtained by sintering a mixture of nickel and cobalt mainly composed of tungsten carbide, and thus, the pot 31 and the plunger 32 may be cleaned when the mold is cleaned using a rubber sheet (RB). Molding apparatus for manufacturing a semiconductor package, characterized in that it can prevent corrosion due to chemical modification on the surface. delete

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