JPH11195659A - Resin sealing method of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively prevent resin burrs from being formed on the surface of a multilayer sheet member mounted with an electronic component or on the P.L(parting line) surface of a molding die and to effectively restrain the surface of the multilayer sheet member from being ground down with molten resin material which is pressure-transferred. SOLUTION: A resin sealing molding die is of three-piece structure composed of a stationary die 40, a movable die 41, and an intermediate die 42, wherein depth B of a set part 48 of the intermediate die 42 is set smaller than the minimum thickness of a multilayer sheet member 43. The dies 40, 41, and 42 are clamped to form a gap 50 between the stationary die 40 and the P.L surface of the intermediate die 42, and molten resin material is injected from the pot 45 of the movable die 41 and filled into a cavity 49 where an electronic part 44 is arranged through the resin path 52 (large communicating path) and small reservoir 55 (small communicating path) of the intermediate die 42 coming into slight contact with the surface of multilayer sheet member 43 while it passes through the small reservoir 55.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin encapsulation method for an electronic component in which an electronic component such as an IC mounted on a flexible sheet member made of plastic or the like is molded with a resin material. Regarding improvement.

[0002]

2. Description of the Related Art Conventionally, it has been known that an electronic component mounted on a metal lead frame is molded with a resin using a so-called transfer molding method.

Further, as a plastic sheet member used in the same manner as the above-mentioned lead frame,
A so-called printed circuit board or PC board (Printed Cir
cuitBoard) is known. The P
The sheet member such as the C board has a required flexibility because it is molded from plastic or the like, and has an electronic component such as an electronic circuit or an IC mounted on a surface portion thereof. It is configured such that the electronic component can be resin-encapsulated using In addition, the above-mentioned sheet member is a single layer, and the thickness of the single-layer sheet member generally has a variation as compared with the above-mentioned metal lead frame.

In recent years, instead of the above-described single-layer sheet member, a multilayer sheet member obtained by laminating the single-layer sheet members has been used. This multi-layer sheet member has the required flexibility (soft) similarly to the single-layer sheet member, and its thickness is considerably large (for example, 4 mm) due to being laminated.
It is customary that the thickness varies considerably.

[0005] Further, the electronic component mounted on the above-mentioned multilayer sheet member is configured so as to be resin-molded by the above-mentioned transfer molding method, similarly to the above-mentioned single-layer sheet member. For example, as shown in FIG.
First, a parting line surface of the lower mold 3 (using a mold for resin sealing molding comprising a fixed upper mold and a movable lower mold 3)
The multi-layer sheet member 1 made of plastic or the like is supplied and set into a set portion 4 (set recess) provided on the PL surface), and the two dies (3) are clamped so that the electronic component 2 is placed in the upper die. Into the cavity 6 for resin molding provided on the PL surface, and then inject and fill the molten resin material into the upper mold cavity 6 through the resin passage 5 for transferring the molten resin material including a runner and a gate. By doing so, the electronic component 2 on the multilayer sheet member 1 can be sealed and molded in a resin molding 7 (mold package) molded in accordance with the shape of the cavity 6. At this time, the multilayer sheet member 1 corresponds to the opening of the cavity 6.
Will be covered with resin. Further, a chamfered surface 9 is formed by chamfering (cutting out) a corner portion of the resin sealing molded body 7, and the resin passage 5 corresponds to the chamfered surface 9. It is connected to a chamfer 10 formed in the mold cavity 6. Therefore, the chamfered portion of the cavity 6
The molten resin material can be injected and filled from 10 through the resin passage 5. An external electronic circuit portion 11 in which electronic circuits are wired is provided around the outer surface of the resin sealing area 8 on the surface of the multilayer sheet member 1, and the molten resin material passing through the resin passage 5 is It comes into contact with the surface of the multilayer sheet member 1, that is, the external electronic circuit section 11.

[0006]

However, since the depth of the set portion 4 is set to the average value of the thickness of the multilayer sheet member 1, the thickness of the multilayer sheet member 1 having the minimum value can be reduced. Supply and set to the setting part 4 and both types (3)
When the mold is clamped, a gap is generated between the PL surface of both molds (3) and the upper surface of the multilayer sheet member 1. When the molten resin material enters and cures, there is a problem that resin burrs are easily formed on the surface of the multilayer sheet member 1. Also,
The depth of the set portion 4 is set to an average value of the thickness of the multilayer sheet member 1, and the multilayer sheet member 1 having the maximum thickness is supplied to the set portion 4 and set. When mold (3) is clamped with normal clamping pressure,
(3) cannot be completely clamped, and both molds (3)
A gap will be generated between the PL surfaces. Therefore, there is a problem that resin burrs are easily formed on the PL surfaces of both molds (3) due to the molten resin material entering the gap and hardening. When the multilayer sheet member 1 having the maximum thickness described above is supplied to the set section 4 and the molds (3) are clamped with excessive clamping pressure, the soft multilayer sheet member is crushed. As a result, a required electronic circuit formed in the external electronic circuit portion 11 on the surface of the multilayer sheet member 1 is easily broken.

In addition, since the above resin material contains a large amount of fine powder silica having high hardness, for example,
When the resin material is heated and melted and transferred under pressure, the surface of the soft multi-layer sheet member 1 which comes into contact with the molten resin material is caused by the grinding action of the molten resin material transferred under pressure and is ground (cut). )easy. Further, the cavity inlet of the resin passage 5 in the chamfered portion 10 of the cavity 6 (that is, the cavity inlet)
Since the gate) is formed to be very narrow, when the molten resin material is transferred under pressure from the inside of the resin passage 5 into the cavity 6, the resin pressure (resin pressing force) at the cavity injection port becomes extremely high. become. Accordingly, the surface of the multilayer sheet member 1 near the cavity injection port is easily ground by the molten resin material passing through the cavity injection port (the resin passage 5), and the external electronic circuit portion 11 on the surface of the multilayer sheet member 1 is easily ground. A serious adverse effect occurs in that the required electronic circuit formed in the circuit is disconnected.

The present invention relates to a resin sealing molding method for an electronic component in which an electronic component mounted on a multilayer sheet member is molded with a resin.
An object of the present invention is to efficiently prevent resin burrs from being formed on a surface. Further, the present invention provides a resin sealing molding method for an electronic component in which an electronic component mounted on a multilayer sheet member is resin-encapsulated and molded, wherein the surface of the multilayer sheet member is efficiently ground by a molten resin material. It is an object of the present invention to efficiently prevent a required electronic circuit formed on the surface of the above-mentioned multilayer sheet member from being disconnected.

[0009]

According to the present invention, there is provided a resin sealing molding method for an electronic component, which comprises a fixed mold, a movable mold, and an intermediate mold provided between the molds. A multi-layer sheet member on which an electronic component is mounted is supplied and set to a mold set portion by using a resin molding mold, and a molten resin material is injected into a mold cavity to form the electronic component in the cavity. A resin sealing molding method for an electronic component to be resin molded, wherein a molten resin material passing through a small reservoir for resin injection connected to a chamfered portion of the cavity is slightly applied to the surface of the multilayer sheet member. In contact with
A step of injecting a molten resin material into the cavity.

[0010] Further, a method for resin sealing and molding of an electronic component according to the present invention for solving the above-mentioned technical problem, comprises a resin sealing molding metal comprising a fixed die and a movable die opposed to the fixed die. An electronic component which supplies and sets a multilayer sheet member on which an electronic component is mounted using a mold to a mold set portion, and injects a molten resin material into a mold cavity to resin-mold the electronic component in the cavity. In the resin sealing molding method of, the molten resin material passing through the small reservoir for resin injection connected to the chamfer of the cavity, in a state of slightly contacting the multilayer sheet member surface, A step of injecting a molten resin material into the cavity.

Further, in the resin sealing molding method for an electronic component according to the present invention for solving the above technical problem, the small reservoir is provided in the external electronic circuit portion on the surface of the multilayer sheet member. It is characterized by having a process.

Further, the resin sealing molding method for an electronic component according to the present invention for solving the above-mentioned technical problem includes a step of providing the small reservoir corresponding to the chamfered portion of the cavity. It is characterized by having.

According to another aspect of the present invention, there is provided a resin sealing molding method for an electronic component, comprising: a multi-layer sheet member having a through-hole for transferring a molten resin material to a small reservoir; The method further comprises a step of supplying and setting to the setting section.

[0014] In addition, a method for resin-molding an electronic component according to the present invention for solving the above-mentioned technical problem is a resin-molding method comprising a fixed die, a movable die, and an intermediate die provided between the two dies. A multi-layer sheet member on which electronic components are mounted is supplied and set to a mold set portion using a mold, and a molten resin material is injected into a mold cavity to resin-mold the electronic component in the cavity. A resin sealing molding method for an electronic component, wherein a molten resin material passing through a resin passage for transferring a molten resin material connected to the cavity is not brought into contact with the surface of the multilayer sheet member. A step of injecting a molten resin material is provided.

[0015] Further, a method for resin sealing and molding of an electronic component according to the present invention for solving the above-mentioned technical problem, comprises a metal mold for resin sealing comprising a fixed die and a movable die opposed to the fixed die. An electronic component which supplies and sets a multilayer sheet member on which an electronic component is mounted using a mold to a mold set portion, and injects a molten resin material into a mold cavity to resin-mold the electronic component in the cavity. Wherein the molten resin material passing through a resin passage for transferring a molten resin material connected to the cavity is not brought into contact with the surface of the multilayer sheet member. A step of injecting a material is provided.

Further, a method of resin sealing and molding an electronic component according to the present invention for solving the above-mentioned technical problem includes a step of providing the above-mentioned resin passage in a step formed in a cavity. And

Further, the resin sealing molding method for an electronic component according to the present invention for solving the above-mentioned technical problem includes a step of providing the resin passage in the vicinity of a chamfered portion on the bottom surface of the cavity. It is characterized by.

Further, the resin sealing molding method for an electronic component according to the present invention for solving the above-mentioned technical problem includes a step of providing the above-described resin passage at a portion corresponding to a chamfer on the bottom surface of the cavity. Features.

Further, in the resin sealing molding method for an electronic component according to the present invention for solving the above technical problem, the depth of the set portion is set to be equal to or less than the minimum value of the thickness of the multilayer sheet member. It is characterized by having a process.

[0020]

According to the present invention, there is provided a three-piece resin-sealing mold comprising a fixed mold, a movable mold and an intermediate mold provided between the two molds, or a resin mold opposed to the fixed mold and the fixed mold. In a two-piece resin molding mold having a movable mold disposed therein, a small reservoir (cavity injection port) for resin injection for injecting a molten resin material into a resin molding cavity of the mold is provided.
Since the configuration is provided with a slight opening on the PL surface, when the molten resin material is injected into the cavity through the small reservoir, the molten resin material passing through the small reservoir is applied to the surface of the multilayer sheet member. The molten resin material can be injected into the cavity with a slight contact. Therefore, since the molten resin material is only slightly brought into contact with the multilayer sheet member surface, it is possible to efficiently prevent the multilayer sheet member surface from being shaved by the grinding action of the molten resin material transferred under pressure. it can.

According to the present invention, in the three-piece or two-piece mold, the resin is supplied and set to the resin passage (cavity inlet) on the bottom surface of the cavity of the mold and the set portion of the mold. Since the configuration is such that the multilayer sheet member and the multi-layer sheet member are spaced apart from each other, when the molten resin material is injected into the cavity through the resin passage, the surface of the multilayer sheet member is ground by the molten resin material passing through the resin passage. The molten resin material can be injected into the cavity without the need.

According to the present invention, in the three-piece or two-piece mold, the depth of the set portion of the multilayer sheet member of the mold is set to be equal to or less than the minimum value of the thickness of the multilayer sheet member. The gap is formed between the PL surfaces of the mold by setting and supplying and setting the multilayer sheet member to the set portion and clamping the mold with a normal mold clamping pressure. The gap can eliminate the influence of the excess portion of the thickness of the multilayer sheet member in the set portion (portion protruding outside the set portion), and can be adjusted. Therefore, the surface of the multilayer sheet member of the set portion is
Since a state is brought into close contact with the peripheral edge of the opening of the cavity, it is possible to efficiently prevent the formation of a gap between the surface of the multilayer sheet member and the peripheral edge of the cavity opening.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. 1 and 2 show a mold for resin sealing molding according to the present invention.

That is, the mold shown in FIGS. 1 and 2 is a three-piece mold, and includes a fixed upper mold 20 (fixed mold) and a movable lower mold provided below the fixed mold 20. Mold 21 (movable type)
And an intermediate mold 22 (intermediate mold) provided between the fixed mold 20 and the movable mold 21 described above.
Electronic component 24 mounted on multilayer sheet member 23 using 2)
Is configured to be able to be molded with a resin. Further, the intermediate mold 22 and the movable mold 21 are respectively moved upward to combine the fixed mold 20, the intermediate mold 22, and the movable mold 21 with each other, thereby making the mold (20 ・ 21 ・ 22) a normal mold. Along with being configured so that the mold can be clamped by the mold clamping pressure, by moving the intermediate mold 22 and the movable mold 21 downward respectively, the fixed mold 20, the intermediate mold 22, and the movable mold 21 are moved together. It is configured so that the mold can be opened separately from each other. The intermediate mold 22 is configured to be able to freely move up and down between the fixed mold 20 and the movable mold 21.

As shown in FIGS. 1 and 2, the movable mold 21 is provided with a pot 25 for supplying a resin material, and the pot 25 is fitted with a plunger 26 for pressing the resin. . Accordingly, the resin material 27 is supplied into the pot 25, and the resin material heated and melted in the pot 25 can be pressurized by the plunger 26.

As shown in FIGS. 1 and 2, the PL (parting line) surface of the intermediate mold 22 on the fixed mold 20 side is provided with the multilayer sheet member 23 (in the illustrated example, a two-layer sheet member). Is provided, and the depth A of the set portion 28 is set to be equal to or less than the minimum value of the thickness of the multilayer sheet member 23. A resin molding cavity 29 communicating with the set portion 28 is provided at the bottom. Therefore, when the multilayer sheet member 23 is supplied and set to the setting section 28, the upper surface of the multilayer sheet member 23 is located above the PL surface of the intermediate mold 22 on the fixed mold 20 side or in the same plane as the PL surface. That is, for example, as shown in the example of the drawing, a part of the multilayer sheet member 23 protrudes from the inside of the set portion 28 to the upper side. At this time, the electronic component 24 mounted on the multilayer sheet member 23 is fitted in the cavity 29. Accordingly, the intermediate mold 22 is moved upward to move the upper surface of the multilayer sheet member 23 and the PL on the fixed mold 20 side.
The molds (20, 21 and 22) may be clamped with a normal clamping pressure in this state. At this time, since the multilayer sheet member 23 only receives a normal mold clamping pressure, a required electronic circuit formed on the surface of the multilayer sheet member 23 is not broken. At this time, a gap 30 is formed between the PL surfaces of the fixed mold 20 and the intermediate mold 22 in accordance with the thickness of the multilayer sheet member 23. That is, the gap 30 can be appropriately formed corresponding to an excessive portion of the thickness of the multilayer sheet member 23 obtained by subtracting the depth A of the set portion 28 from the thickness of the multilayer sheet member 23. With the configuration, the variation in the thickness of the multilayer sheet member 23 can be adjusted by the gap 30. At this time, the lower surface of the multilayer sheet member 23 is provided with the cavity 29 on the bottom surface of the set portion 28.
Is in close contact with the peripheral edge of the opening.

The intermediate mold 22 is provided with a resin passage 32 (sprue) for transferring the molten resin material. One end of the resin passage 32 communicates with the pot 25 on the movable mold 21 side. The other end of the resin passage 32 is a cavity of the intermediate mold 22.
It is provided so as to communicate with an appropriate position on the bottom surface of 29. Further, an injection port (cavity injection port) into the cavity 29 of the resin passage 32 is provided separately from the multilayer sheet member 23 supplied and set to the setting section 28, so that the cavity injection port (the The molten resin material passing through the resin passage 32) does not contact the surface of the multilayer sheet member 23.

First, as shown in FIG.
The multi-layer sheet member 23 is supplied and set, and the resin material 27 is supplied into the pot 25.
And the intermediate mold 22 are moved upward to clamp the molds (20, 21 and 22) with a normal mold clamping pressure. At this time, the multilayer sheet member 23
The electronic component 24 mounted on the pot 25 is fitted and set in the cavity 29, and the resin material 27 in the pot 25 is subjected to a mold heating action. Further, at this time, the gap 30 corresponds to the variation in the thickness of the multilayer sheet member 23.
Therefore, no gap is formed between the surface of the multilayer sheet member 23 and the peripheral edge of the cavity opening on the bottom surface of the set portion 28. Further, since the mold (20 ・ 21 ・ 22) is configured to clamp the mold with a normal clamping pressure instead of an excessive clamping pressure, the multilayer sheet member 23 is not crushed, and accordingly, the multilayer The required electronic circuit on the surface of the sheet member 23 is not disconnected.

Next, the resin material heated and melted in the pot 25 is injected and filled into the cavity 29 through the resin passage 32 by pressurizing the resin material with the plunger 26. After the required time for curing has elapsed, the movable mold
By lowering the mold 21 and the intermediate mold 22 to open the molds (20, 21 and 22), the resin sealing molded body 33 molded in the cavity 29 is cured in the resin passage 32. In the finished product, unnecessary resin 34 is cut and separated, and the resin-sealed molded body 33 is released from the cavity 29 (see FIG. 2). That is, since no gap is formed between the surface of the multilayer sheet member 23 and the peripheral edge portion of the cavity opening, it is possible to efficiently prevent the molten resin material from entering the gap, and the surface of the multilayer sheet member 23 or The intermediate mold 22 and the fixed mold 20
It is possible to efficiently prevent resin burrs from being formed on the PL surface. Further, since the surface of the multilayer sheet member and the cavity injection port are configured to be separated from each other, the resin pressure of the molten resin material injected into the cavity is extremely increased at the cavity injection port (the resin passage 32). Even if the height is increased, the surface of the multilayer sheet member is not ground with the resin passing through the cavity injection port. Accordingly, it is possible to efficiently prevent the surface of the multilayer sheet member 23 from being ground by the molten resin material, and it can be efficiently determined that the required electronic circuit formed on the surface of the multilayer sheet member is disconnected. It can be prevented well.

Next, the embodiment shown in FIGS. 3A and 3B will be described. That is, the example shown in FIG. 3A has a configuration in which a chamfered surface is provided at a corner portion of the resin-sealed molded body. Set section 12 for feeding and setting sheet member 23
1 into the cavity 122 communicating with the bottom surface.
A chamfered portion 123 is formed corresponding to a chamfered surface formed by chamfering a corner portion of the resin-sealed molded body molded in 2. A cavity chamfering corresponding portion 124 is formed corresponding to the chamfered portion (notched portion) of the stop formed body. Therefore, in the embodiment shown in FIG. 1 and FIG.
As shown in (1), a configuration in which the resin passage 32 (cavity inlet) is provided near the chamfered portion 123 on the bottom surface of the cavity 122 can be adopted. The example shown in FIG. 3 (2) has a configuration in which the corners of the resin-encapsulated body are not chamfered. In the resin-encapsulation mold (intermediate mold 130), the multi-layer sheet member 23 Cavity 132 communicating with the bottom of setting section 131 for supply setting
The corners of the cavity shown in FIG.
A chamfer equivalent part 133 corresponding to 4 exists. Therefore, in the embodiment shown in FIGS. 1 and 2, when the corners of the resin-sealed molded body are not chamfered, FIG.
As shown in (2), a configuration in which the resin passage 32 (cavity inlet) is provided in the chamfered portion 133 on the bottom surface of the cavity 132 can be adopted. In the embodiment shown in FIGS. 3 (1) and 3 (2), the same operation and effect as those of the embodiment shown in FIGS. 1 and 2 can be obtained.

Next, FIG. 4A and FIG. 4B will be described. That is, since the basic configuration of the mold shown in FIGS. 4A and 4B is basically the same as the basic configuration of the mold shown in FIGS. Attach.

The mold shown in FIGS. 4 (1) and 4 (2) has a fixed upper mold 20 (fixed mold) and a movable lower mold 21 (movable mold) similarly to the molds shown in FIGS. 1 and 2. And a middle mold 35 (middle mold). The middle mold 35 has a multilayer sheet member on which the electronic component 24 provided on the PL surface of the fixed mold 20 is mounted. A set section 28 for supplying and setting 23 and a resin molding cavity 36 communicating with the bottom of the set section 38 are provided. Also, a step 37 is provided at an appropriate position in the cavity 36, and a concave portion is formed in the resin sealing molded body formed in the cavity 36 corresponding to the step 37. It is configured. In addition, the step
A resin passage 38 (sprue) is provided between the movable mold 21 and the pot 25.
And the injection port (the resin passage 38) of the cavity provided in the step portion 37 and the surface of the multilayer sheet member 23 supplied and set in the setting portion 28 are separated from each other. ing. As in the embodiment shown in FIGS. 1 and 2, the depth A of the set portion is set to be equal to or less than the minimum value of the thickness of the multilayer sheet member. In addition,
In the embodiment shown in FIGS. 4 (1) and 4 (2), for example, it is possible to adopt a configuration in which the stepped portion 37 is provided in the cavity 36 at a position corresponding to a corner of the resin molded article. it can.

That is, first, as shown in FIG. 4A, the multilayer sheet member 23 is supplied and set in the setting section 28, and the molds (20, 21 and 35) are clamped. Fitting and setting the electronic component 24 in the cavity 36,
A gap 30 is formed between the fixed mold 20 and the intermediate mold 35, and then the resin material heated and melted in the pot 25 is pressed by the plunger 26, so that the step is passed through the resin passage 38. The cavity 36 can be injected and filled into the cavity 36 from the inlet of the cavity of the part 37. Therefore, similarly to the embodiment shown in FIGS. 1 and 2, the surface of the multilayer sheet member 23 and the injection port of the cavity are separated from each other, so that the molten resin passing through the injection port of the cavity is formed. It is possible to efficiently prevent the surface of the multilayer sheet member from being ground with a material, and to efficiently prevent the electronic circuit on the multilayer sheet member from being disconnected. FIG.
With the configuration shown in (1) and FIG. 4 (2), the same functions and effects as those shown in FIGS. 1 and 2 can be obtained.

The embodiment shown in FIGS. 1 and 2 and FIG.
(1) In the embodiment shown in FIG. 4 (2), the configuration of the movable lower die (21) is provided on the fixed upper die, and the configuration of the fixed upper die (20) is provided on the movable lower die. A configuration can be employed. For example, a set portion (28) is provided on the movable lower mold (21), and a pot (25) is provided on the fixed upper mold (20).
And the cavity (29/36) may be provided on the PL surface of the intermediate mold (22/35) on the movable mold side. That is, the resin passages (32 and 38) are provided with the (injection port of the cavity) on the bottom surface of the cavity (29) or on the step (37) of the cavity (36), and the setting portion (28) Is set to be equal to or less than the minimum value of the multilayer sheet member (23), so that the same operation and effect as in the above-described embodiment can be obtained.

Next, the embodiment shown in FIGS. 5 and 6 will be described. The basic configuration of the resin molding die shown in FIGS. 5 and 6 is the same as the basic configuration of the die shown in FIGS.

That is, the mold shown in FIGS. 5 and 6 is a three-piece mold as in the above-described embodiment, and is a fixed upper mold 40.
(Fixed mold), movable lower mold 41 (movable mold), and both molds (40
41) An intermediate mold 42 (intermediate mold) provided therebetween. Further, similarly to the above-described embodiment, a set for supplying and setting a multilayer sheet member 43 (two-layer sheet member in the illustrated example) on which the electronic component 44 is mounted is provided on the PL surface of the intermediate mold 42 on the fixed mold 40 side. A portion 48 is provided, and a cavity 49 for resin molding is provided in communication with a bottom portion of the set portion 48. The depth B of the set portion 48 is set to be equal to or less than the minimum value of the thickness of the multilayer sheet member 43. Is set. Further, similarly to the above-described embodiment, the fixed mold 40 is provided with a pot 45 for supplying a resin material 47 for supplying a resin material 47 and a plunger 46 fitted in the pot 45. Also, FIG.
As shown in FIG. 6, a small reservoir 55 (cavity injection port) for injecting a molten resin material into the cavity 49 is provided at an appropriate position of the cavity 49 at the bottom of the set portion 48. The multi-layer sheet member 43 is provided to be connected to the bottom of the set portion 48 in a slightly opened state and is connected to the small reservoir portion 55 when the multi-layer sheet member 43 is set in the set portion 48.
A resin contact range with a small area is set on the surface of the multilayer sheet member 43 in correspondence with the opening of (a). Similarly to the above-described embodiment, one end of the resin passage 52 (sprue) for transferring the molten resin material communicates with the small reservoir 55, and the other end communicates with the pot 45 on the movable mold 41 side. It is configured. That is, when the molds (40, 41, 42) are clamped, the cavity 49 and the pot 47 are connected to the resin passage 52 (Dalian communication section).
And the small reservoir 55 (small communication portion). The small reservoir 55 serves as a gate port for injecting the molten resin material into the cavity 49. In the embodiment shown in FIGS. 5 and 6, for example,
It is possible to adopt a configuration in which the small reservoir 55 is connected to the chamfered portion of the cavity 49.

That is, in the embodiment shown in FIGS. 5 and 6,
Similarly to the above-described embodiment, first, the multi-layer sheet member 43 is supplied and set to the set section 48, and the fixed mold 40 and the intermediate mold 42 are supplied.
And the movable mold 41 with normal mold clamping pressure.
The electronic component 44 is fitted and set in the cavity 49, and the resin material heated and melted in the pot 45 is injected and filled into the cavity 49 through the resin passage 52 and the small reservoir 55. At this time, similarly to the above-described embodiment, by forming the gap 50 corresponding to the thickness variation of the multilayer sheet member 43, the opening peripheral portion of the cavity 49 and the small reservoir are formed on the surface of the multilayer sheet member 43. Since the peripheral edge of the opening of the portion 55 can be pressed tightly, no gap is formed between the surface of the multilayer sheet member 43 and the bottom surface of the set portion 48. It is possible to efficiently prevent resin burrs from being formed on the surface or the PL surface of the intermediate mold 42 on the fixed mold 40 side. Further, since the multilayer sheet member 43 only receives a normal mold clamping pressure, it is not said that the electronic circuit on the surface of the multilayer sheet member 43 is disconnected. After the time required for curing has passed, the movable mold
By lowering the intermediate mold 41 and the intermediate mold 42, the mold (40
(42) is opened to cut and separate the cured resin 54 in the resin passage 52 and the cured resin 56 in the small reservoir 55, and adhere the cured resin 56 in the small reservoir 55 to the multilayer sheet member 43. In this state, the mold is integrally released from the cavity 49 with the resin molding 53. Therefore, even if the resin pressure at the cavity injection port for injecting the molten resin material from the small reservoir 55 into the cavity 49 becomes extremely high, the surface of the multilayer sheet member 43 and the molten resin material come into contact with the resin. Since the contact is made only with a small area of the portion, the fact that the surface of the multilayer sheet member 43 is ground with a molten resin material can be greatly reduced as compared with the conventional example, and the surface of the multilayer sheet member 43 can be greatly reduced. Can be efficiently prevented from being ground with a molten resin material, and the required electronic circuit formed on the surface of the multilayer sheet member can be efficiently prevented from being disconnected.

Next, the embodiment shown in FIGS. 7A and 7B will be described. That is, the resin molded article 53 shown in FIG. 7 (2) is formed by sealing and molding the electronic component mounted on the multilayer sheet member 43 in the cavity 49 of the mold (intermediate mold 60) shown in FIG. 7 (1). The resin molded article 53
Is provided with a chamfered surface 61 by chamfering a corner thereof.
The cavity 49 shown in FIG.
A chamfered portion 62 of the cavity corresponding to is formed,
The set portion 48 is formed with a chamfer corresponding portion 63 of the cavity corresponding to the formation of the chamfer portion 62. FIG.
As shown in (1) and FIG. 7 (2), in the multilayer sheet member 43, the resin sealing molded body 53 (the cavity
An external electronic circuit section 64 provided with a required electronic circuit is provided around the outer periphery of the resin sealing area corresponding to the opening of 49). That is, in the embodiment shown in FIGS. 5 and 6, the small reservoir 65 (the cavity inlet) connected to and connected to the resin passage 52 corresponds to the inside of the external electronic circuit portion 64 at the bottom of the set portion 48. A configuration provided at an appropriate position can be adopted. For example, as shown in FIG. 7A, the small reservoir 65 is connected to an external electronic circuit unit 64 including the chamfering corresponding unit 63.
And a configuration in which a molten resin material is injected from the chamfered portion 62 into the cavity 49 can be adopted. Therefore, in the embodiment shown in FIGS. 7 (1) and 7 (2), the same operation and effect as those in the embodiment shown in FIGS. 5 and 6 can be obtained. In this case, FIG.
Unnecessary resin 66 as a product cured in the small reservoir 65 shown in
Can be cut and separated from the chamfered surface 61 of the resin-sealed molded body 53 and removed from the surface of the multilayer sheet member 43.

Next, the embodiment shown in FIG. 7C will be described. That is, in the embodiment shown in FIGS. 5 and 6, for example, as shown in a mold (intermediate mold 70) shown in FIG. The entrance) is a chamfered portion 72 at the bottom of the set portion 48.
And a configuration in which a molten resin material is injected into the cavity 49 from the chamfered portion 73 of the cavity 49. Therefore, in the embodiment shown in FIG. 7C, the same operation and effect as those in the embodiment shown in FIGS. 5 and 6 can be obtained. Further, in this case, the resin cured in the small reservoir 71 can be used as a product in a state of being attached to the surface of the multilayer sheet member 43.

In the embodiment shown in FIG.
A configuration in which an electronic circuit is not provided on the surface of the multilayer sheet member 43 corresponding to the chamfering corresponding portion 72 can be adopted. In this case, when the multilayer sheet member 43 is supplied and set to the setting section 48, since the electronic circuit is not arranged within the resin contact area corresponding to the opening of the small reservoir 55, the small reservoir The electronic circuit has never been cut by the molten resin material passing through 55.

The embodiment shown in FIGS. 5 and 6 (or
7 (1) and 7 (3)), the configuration of the movable lower die (41) is provided in the fixed upper die, and the configuration of the fixed upper die (40) is replaced by the movable lower die (40). A configuration provided in the mold can be adopted. For example, the movable lower mold (41) is provided with the set portion (48), and the depth (B) of the set portion (48) is set to be equal to or less than the minimum value of the multilayer sheet member (43), and A pot (45) is provided on the fixed mold (40), and the cavity (49) and the small reservoir (55) are provided on the PL surface of the intermediate mold (42, 60, 70) on the movable mold (41) side. 65, 71) can be adopted, and the same operation and effect as the embodiment shown in FIGS. 5 and 6 can be obtained.

Next, the embodiment shown in FIG. 8 will be described. The mold for resin encapsulation shown in FIG. 8 is a three-piece mold and has a fixed upper mold 80 as in the above embodiment.
(Fixed mold), movable lower mold 81 (movable mold), and both molds (80
81) a pot 85 for supplying a resin material 87 to the movable mold 81, and a resin pressurizing fitting set in the pot 85, which comprises an intermediate mold 82 (intermediate mold) provided therebetween. Plunger 86 is provided. Further, on the PL surface of the intermediate mold 82 on the fixed mold 82 side, a multilayer sheet member 83 (four-layer sheet member in the illustrated example) on which electronic components 84 are mounted is provided.
And a resin passage 92 (a sprue) for transferring a molten resin material opened at the bottom surface of the set portion 88, and the depth C of the set portion 88 is set to the depth of the multilayer sheet member. 83 is set to be equal to or less than the minimum value of the thickness, and a resin molding cavity 89 is provided on the PL surface of the fixed die 80, and a small reservoir for injecting a molten resin material into the cavity 89. A part 95 (cavity inlet) is provided. Further, the multilayer sheet member 83 used in the embodiment shown in FIG. 8 is provided with a through hole 97 penetrating through both surfaces of the multilayer sheet member 83, so that the molten resin material can be transferred. That is, the mold (8
At the time of mold clamping of (81), (82) and (82), the small reservoir portion 95 of the fixed die 80 and the resin passage 92 on the bottom surface of the set portion 88 communicate with each other through the through hole 97 of the multilayer sheet member 83 in the set portion 88. In addition, a resin contact area having a small area corresponding to the opening of the small reservoir 95 is set on the upper surface of the multilayer sheet member 83 (in the vicinity of the opening of the through hole 97). .

Therefore, first, the multi-layer sheet member 83 is supplied and set to the setting section 88, and the molds (80, 81, 82) are clamped at a normal clamping pressure. The heat-melted resin material is passed through the resin passage 92 and the through hole 97.
And filling into the cavity 89 through the small reservoir 95,
Further, by opening the molds (80, 81, 82), the cured resin in the resin passage 92 and the cured resin in the through hole 97 can be cut and separated. That is, similarly to the above-described embodiments, the thickness variation of the multilayer sheet member 83 can be adjusted by the gap 90 formed between the PL surfaces of the fixed mold 80 and the intermediate mold 82, and the multilayer sheet member 83 can be adjusted. It is possible to efficiently prevent a gap from being formed between the upper surface and the peripheral edge of the opening of the cavity 89, and to form a resin flash on the surface of the multilayer sheet member 83 or the PL surface of the fixed die 80. Can be efficiently prevented. Further, similarly to the above-described embodiments, the surface of the multilayer sheet member 83 and the small reservoir portion are formed.
Since the molten resin material passing through 95 comes into contact with the resin contact area having a small area, the surface of the multilayer sheet member 83 can be efficiently ground with the molten resin material as compared with the conventional example. It is possible to efficiently prevent the required electronic circuit formed on the surface of the multilayer sheet member 83 from being disconnected.

Further, in the embodiment shown in FIG. 8, it is possible to adopt a configuration in which the position of the small reservoir 95 is provided at the position shown in FIGS. 7 (1) and 7 (3).

In the embodiment shown in FIG. 8, the structure provided on the movable lower die (81) is provided on the fixed upper die, and the structure provided on the fixed upper die (80) is replaced with the movable lower die (80). A configuration provided in the mold can be adopted. For example, the movable lower mold (81) is provided with the set portion (88) and the cavity (89), and the fixed upper mold (80) is provided with a pot (88),
In addition, since a configuration in which the intermediate mold (82) is provided so as to penetrate the resin passage (92) can be adopted, the same operation and effect as the embodiment shown in FIG. 8 can be obtained.

Next, the embodiment shown in FIG. 9 will be described. That is, the resin sealing mold shown in FIG.
100, and a movable lower mold 101 opposed to the fixed mold 100, wherein the movable mold 101 has a PL.
A set portion 104 for supplying and setting a multilayer sheet member 103 (three layers in the illustrated example) on which an electronic component 102 is mounted is provided on the surface, and the depth D of the set portion 104 is equal to the thickness of the multilayer sheet member 103. It is set below the minimum value. Also,
On the PL surface of the fixed mold 100, a resin molding cavity 10 is provided.
5, a small reservoir 106 for resin injection, a pot 108 for supplying a resin material 107, a plunger 109 for pressurizing resin fitted in the pot 108, and a resin passage communicating the pot 108 with the small reservoir 106. 110 are provided. That is, first,
By supplying and setting the multilayer sheet member 103 in the setting portion 104 and clamping the dies (100 and 101), the electronic component 102 is fitted and set in the cavity 105 and the dies (100 and 101) are set. A gap 112 is formed between the PL surfaces 100 and 101), and the resin material heated and melted in the pot 108 is pressurized by the plunger 109 to pass through the resin passage 110 and the small reservoir 106. By injecting the mold into the cavity 105 and then opening the two molds (100 and 101), the resin sealing molded body molded in the cavity 105 is ejected with an ejector pin to release the mold. The cured resin in the resin passage 110 and the small reservoir
The cured resin in 106 can be cut and separated. Therefore, in the embodiment shown in FIG. 9, the same operation and effect as those of the above-described embodiment can be obtained.

Further, in the embodiment shown in FIG. 9, it is possible to adopt a configuration in which the pot 108 and the bottom surface of the cavity 105 are connected to each other through a resin passage 111 (in the example shown in FIG. Illustrated). In the embodiment shown in FIG. 9, the position of the small reservoir 106 is
A configuration provided at the position shown in (1) and FIG. 7 (3) can be adopted. Further, in the embodiment shown in FIG. 9, the configuration in which the position of the resin passage 111 is provided at the position shown in FIGS. 3A and 3B can be adopted.
A configuration in which the steps shown in FIGS. 4A and 4B are provided in the cavity 105 can be adopted.

The present invention is not limited to the above-described embodiment, but can be arbitrarily and appropriately changed and selected as needed without departing from the spirit of the present invention. It is.

[0049]

According to the present invention, there is provided a resin sealing molding method for an electronic component, wherein the electronic component mounted on the multilayer sheet member is molded with a resin. This has an excellent effect that the formation of resin burrs can be efficiently prevented.

Further, according to the present invention, in a resin sealing molding method for an electronic component in which an electronic component mounted on a multilayer sheet member is molded with a resin, the surface of the multilayer sheet member is ground with a molten resin material. This can effectively prevent the required electronic circuit formed on the surface of the multilayer sheet member from being disconnected.

[Brief description of the drawings]

FIG. 1 is a partially cut-away schematic longitudinal sectional view schematically showing a mold for resin sealing molding according to the present invention, showing a mold-clamped state of the mold.

FIG. 2 is a partially cut-away schematic longitudinal sectional view schematically showing a mold corresponding to FIG. 1, showing a mold open state of the mold.

FIGS. 3 (1) and 3 (2) are partially cut-out enlarged schematic plan views schematically showing enlarged main portions of a mold according to another embodiment of the present invention. (1) and FIG. 3 (2) each show an intermediate mold surface.

FIG. 4 (1) is a partially cut-away schematic longitudinal sectional view schematically showing a resin-sealing molding die according to another embodiment of the present invention, showing a mold-clamped state of the die. FIG. 4 (2) shows FIG. 4 (1).
2 is a schematic plan view schematically showing an intermediate mold of the mold shown in FIG.

FIG. 5 is a partially cut-away schematic longitudinal sectional view schematically showing a resin molding die according to another embodiment of the present invention;
3 shows a mold clamping state of the mold.

FIG. 6 is a partially cut-away schematic longitudinal sectional view schematically showing a mold corresponding to FIG. 5, showing a mold opened state.

FIG. 7 (1) is a partially cut-out enlarged schematic plan view schematically showing a main part of a mold according to another embodiment of the present invention in an enlarged manner, showing a mold surface of an intermediate mold. 7 (2) is a partially cutaway schematic plan view schematically showing the multilayer sheet member formed by the mold shown in FIG. 7 (1), and shows the position of the cured resin in the small reservoir. FIG. 7 (3) is a partially cut-out enlarged schematic plan view schematically showing an enlarged main part of a mold according to another embodiment of the present invention, showing a mold surface of the intermediate mold. .

FIG. 8 is a partially cut-away schematic longitudinal sectional view schematically showing a resin molding die according to another embodiment of the present invention;
3 shows a mold clamping state of the mold.

FIG. 9 is a partially cut-away schematic longitudinal sectional view schematically showing a resin molding mold according to another embodiment of the present invention;
3 shows a mold clamping state of the mold.

FIG. 10 is a partially cutaway schematic plan view schematically showing a conventional mold for resin sealing molding, showing a mold surface of a lower mold.

[Explanation of symbols]

 20 Fixed upper mold 21 Movable lower mold 22 Intermediate mold 23 Multilayer sheet member 24 Electronic component 25 Pot 26 Plunger 27 Resin material 28 Set part 29 Cavity 30 Void 32 Resin passage 33 Resin-sealed molded body 34 Cured resin 35 Middle metal Mold 36 Cavity 37 Step 38 Resin passage 40 Fixed upper mold 41 Movable lower mold 42 Intermediate mold 43 Multilayer sheet member 44 Electronic component 45 Pot 46 Plunger 47 Resin material 48 Set part 49 Cavity 50 Void 52 Resin passage 53 Resin seal Stopping molded body 54 Hardened resin 55 Small reservoir (small communication part) 56 Cured resin 60 Intermediate mold 61 Chamfered surface 62 Chamfered part 63 Chamferable part 64 External circuit part 65 Small reservoir (small communication part) 66 Hardened Resin 70 Intermediate mold 71 Small reservoir 72 Chamfer compatible part 73 Chamfer part 80 Fixed upper mold 81 Movable lower mold 82 Intermediate mold 83 Multilayer sheet member 84 Electronic component 85 Pot 86 Plunger 87 Resin material 88 Set part 89 Cavity 90 Void 92 Resin passage 95 Small reservoir (Small communication part) 97 Through hole 100 Fixed upper die 101 Movable lower die 102 Electronic component 103 Multilayer sheet member 104 Set part 105 Cavity 106 Small reservoir (Small communication part) 107 Resin material 108 Pot 109 Plunger 110 Resin passage 111 Resin passage 112 Void 120 Intermediate mold 121 Set part 122 Cavity 123 Chamfer part 124 Chamfer corresponding part 130 Intermediate mold 131 Set part 132 Cavity 133 Chamfer equivalent part A Set part depth B Set part depth C Set part Depth D Depth of set part

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI H01L 21/60 311 H01L 21/60 311R // B29L 31:34

Claims (11)

[Claims] 1. A multi-layer sheet member on which an electronic component is mounted is supplied and set to a mold set portion by using a resin sealing molding mold including a fixed mold, a movable mold, and an intermediate mold provided between the fixed mold and the movable mold. A resin sealing molding method for an electronic component in which a molten resin material is injected into a mold cavity and the electronic component is resin molded in the cavity, wherein the resin is connected to a chamfered portion of the cavity. An electronic component comprising a step of injecting the molten resin material into the cavity while the molten resin material passing through the small reservoir for injection is slightly in contact with the surface of the multilayer sheet member. Resin molding method. 2. A multi-layer sheet member on which an electronic component is mounted is supplied and set to a mold set portion by using a resin molding mold including a fixed mold and a movable mold opposed to the fixed mold. A resin encapsulation method for an electronic component, comprising injecting a resin material into a mold cavity and encapsulating and molding the electronic component within the cavity. A step of injecting the molten resin material into the cavity while the molten resin material passing through the small reservoir portion is slightly in contact with the surface of the multilayer sheet member. Stop molding method. 3. The resin sealing of an electronic component according to claim 1, further comprising a step of providing a small reservoir portion corresponding to the inside of the external electronic circuit portion on the surface of the multilayer sheet member. Stop molding method. 4. The method according to claim 1, further comprising the step of providing a small reservoir portion corresponding to the chamfered portion of the cavity. . 5. The resin sealing of an electronic component according to claim 1, further comprising a step of supplying and setting a multilayer sheet member having a through-hole for transferring the molten resin material to the small reservoir to the set section. Stop molding method. 6. A multi-layer sheet member on which electronic components are mounted is supplied and set to a mold set portion by using a resin-sealing molding mold including a fixed mold, a movable mold, and an intermediate mold provided between the both molds. A resin sealing molding method for an electronic component, wherein a molten resin material is injected into a mold cavity and the electronic component is resin molded in the cavity. A step of injecting the molten resin material into the cavity in a state where the molten resin material passing through the resin passage is not in contact with the surface of the multilayer sheet member. . 7. A multi-layer sheet member on which electronic components are mounted is supplied and set to a mold set portion by using a resin-sealing mold composed of a fixed mold and a movable mold opposed to the fixed mold. A resin sealing molding method for an electronic component, wherein a resin material is injected into a mold cavity and the electronic component is resin molded within the cavity, wherein a resin passage for transferring a molten resin material is connected to the cavity. A step of injecting the molten resin material into the cavity without contacting the molten resin material passing through the cavity with the surface of the multilayer sheet member. 8. The method according to claim 6, further comprising the step of providing a resin passage in a step formed in the cavity. 9. The method according to claim 6, further comprising the step of providing a resin passage near the chamfered portion on the bottom surface of the cavity. 10. The method according to claim 6, further comprising the step of providing a resin passage at a portion corresponding to a chamfer on the bottom surface of the cavity. 11. The method according to claim 1, further comprising the step of setting the depth of the set portion to be equal to or less than the minimum value of the thickness of the multilayer sheet member. A resin sealing molding method for an electronic component according to claim 7.