JPH11135527A - Sealing resin formation of electronic parts and its mold - Google Patents

Abstract

PROBLEM TO BE SOLVED: To raise effective availability of a resin material by reducing the hardening resin unnecessary for the product, on sealing resin forming of electronic parts on a lead frame. SOLUTION: When two lead frames 31 are arranged in parallel close to each other on the set part 24 provided with P.L side of the mold for sealing resin formation composed of a fixed mold and a movable mold 21, the melting resin material is injected and filled into both cavities 26 through a short resin passage 28, by making the needed plural number position of pot 25 correspond to the paired parts of two lead frames 31 of the set part 24 respectively, and also by making a notch 32 of a lead frame 31 correspond to each pot 25 respectively, and by blocking the melting resin material from the pot 25 at a bank 29.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin encapsulation method for encapsulating and molding electronic components such as ICs, LSIs, diodes and capacitors mounted on a lead frame with a resin material (resin tablet). Regarding mold improvement.

[0002]

2. Description of the Related Art Conventionally, as a resin molding die for sealing and molding an electronic component with a resin tablet,
For example, as shown in FIG.
One that employs a plunger structure is known.

[0003] That is, the mold shown in FIG.
A movable lower mold 1 opposed to the fixed mold, a plurality of required resin material supply pots 2 provided on the movable mold 1, a resin pressurizing plunger fitted in each of the pots 2, A fixed-type cull portion 3 for distributing the molten resin material, which is disposed opposite to each pot 2, and a fixed-type cavity and a movable-type cavity 4 opposed to the parting line surface (PL surface) of both dies (1). And a movable mold 1 for supplying and setting a lead frame 9 on which an electronic component 10 is mounted.
A set section 11 (set recess) provided on the PL surface is provided. Accordingly, the lead frame 9 on which the electronic component 10 is mounted is supplied and set to the set portion 11 and the molds (1) are clamped, so that the electronic component 10 is placed in the cavities (4). By fitting and setting, and supplying the resin tablet 7 into the pot 2 and pressing the resin material heated and melted in the pot 2 with the plunger, the molten resin material is removed from the pot 2. The two cavities (4) are injected and filled into the two cavities (4) through the resin passage 8 including the cull part 3, the runner 5 and the gate 6, and the electronic component 10 on the lead frame 9 is shaped into the two cavities (4). Resin molded body corresponding to
It is configured so as to be able to be molded into the inside of the device. Note that a resin sealing area 14 is set on the surface of the lead frame 9 corresponding to the opening of the fixed mold cavity.

[0005]

However, in recent years,
For example, since the electronic component 10 such as an IC chip mounted on the lead frame 9 tends to be reduced in size, the resin-sealed molded body 12 molded in the two cavities (4) of the mold is used.
The size of (product) tends to be smaller. That is, in the miniaturized resin-sealed molded body 12 molded in both the mold cavities (4), the amount of the resin tends to be light and the thickness tends to be thin. For example,
In the mold shown in FIG. 8, when the small electronic component 10 on the lead frame 9 is molded with resin, the transfer distance of the molten resin material from the pot 2 to both cavities (4) becomes relatively long. As a product that hardens in the resin passage 8 composed of the cull portion 3, the runner 5, and the gate 6, the amount of unnecessary resin 13 tends to relatively increase, and the mold cavities (4) The amount of the resin in the small-sized resin-sealed molded body 12 molded in) tends to relatively decrease. Therefore, the ratio of the amount of the resin 13 unnecessary as a product cured in the resin passage 8 to the total resin amount of the resin tablet 7 before molding increases, and the product (resin-sealed molded body) There is a problem that the ratio of the amount of the resin (12) (effective utilization rate of the resin material) decreases. The resin material used for resin-sealing the electronic component 10 mounted on the lead frame 9 is thermosetting and cannot be recycled.

According to the present invention, the amount of cured resin unnecessary as a product (resin-sealed molded body) obtained by resin-sealing an electronic component mounted on a lead frame can be reduced, thereby improving the effective utilization rate of the resin material. It is an object of the present invention to provide a resin sealing molding method for an electronic component and a mold therefor.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned technical problems, a resin sealing molding method for an electronic component according to the present invention is directed to a resin sealing molding method in which a fixed mold and a movable mold are arranged to face each other. Using a mold, supply and set the lead frame with the electronic component mounted on the set portion of the lead frame provided on the PL surface of both molds, and clamp the two molds to remove the electronic component on the lead frame. Fit and set in the resin molding cavity opposite to the PL surface of both molds, and in this state,
The resin material heated and melted in a plurality of required resin material supply pots provided on the PL surfaces of the two molds is injected and filled into the two cavities through a resin passage for transferring the molten resin material, thereby forming the lead. What is claimed is: 1. A resin sealing molding method for an electronic component, comprising: resin-molding an electronic component on a frame, wherein the two lead frames are connected and supplied in parallel to the set portion, and the two The position of each of the above-mentioned pots is made to correspond to the joint portion of the lead frame, and a molten resin material is injected and filled into both of the cavities through a short resin passage connecting and connecting the above-mentioned pots and the cavities.

[0008] In addition, the resin sealing molding method for an electronic component according to the present invention for solving the above technical problem uses a resin sealing molding die in which a fixed mold and a movable mold are arranged to face each other. A lead frame having electronic components mounted thereon is supplied and set to a set portion of the lead frame provided on the PL surface of the both molds, and the molds of the two molds are clamped so that the electronic components on the lead frames are PL surfaces of the both molds. Is set in the resin molding cavity opposite to
By injecting and filling the resin material heated and melted in a plurality of required resin material supply pots provided on the surface into the two cavities through a resin passage for transferring the molten resin material, the electronic component on the lead frame is filled. A resin sealing molding method for an electronic component, wherein the two lead frames are supplied and set close to and parallel to the set portion, and the opposing portions of the two lead frames are set. A short resin for communicating and connecting the pot and the cavity in a state where the molten resin material permeating from the pot to the opposing portions of the two lead frames is blocked while the positions of the pots correspond to each other. A molten resin material is injected and filled into the two cavities through a passage.

[0009] Further, in a resin sealing molding method for an electronic component according to the present invention for solving the above-mentioned technical problem, a notch provided in a lead frame corresponding to the above-mentioned pot opening is formed by inserting the notch into the pot opening. The lead frame is supplied and set to a setting section in a state corresponding to the above.

Further, the resin sealing molding method for an electronic component according to the present invention for solving the above-mentioned technical problem is characterized in that the resin is formed by setting the height in the pot to at least twice the diameter. It is characterized by supplying a tablet.

According to another aspect of the present invention, there is provided a resin-molding mold for an electronic component, which includes a fixed mold, a movable mold opposed to the fixed mold, and a movable mold.
A set section for supplying and setting a lead frame provided with electronic components provided on the PL surface, a resin molding cavity opposed to the PL surface of both molds, and a required part provided in at least one of the molds. Resin encapsulation of an electronic component having a plurality of resin material supply pots and a resin passage for transferring a molten resin material for injecting and filling the resin material heated and melted in the pot into the two cavities. A pot for arranging each of the pots at a joint portion of the two lead frames in a set portion supplied and set in a state in which the two lead frames are joined and arranged in parallel, and the pots described above. And the cavity are connected to each other by a short resin passage.

According to another aspect of the present invention, there is provided a mold for resin-sealing an electronic component according to the present invention, comprising: a fixed mold; a movable mold opposed to the fixed mold;
A set section for supplying and setting a lead frame provided with electronic components provided on the PL surface, a resin molding cavity opposed to the PL surface of both molds, and a required part provided in at least one of the molds. Resin encapsulation of an electronic component having a plurality of resin material supply pots and a resin passage for transferring a molten resin material for injecting and filling the resin material heated and melted in the pot into the two cavities. A mold, wherein the pots are respectively arranged at opposing portions of the two lead frames in a set portion supplied and set in a state where the two lead frames are arranged in close proximity to each other, and the setting portion is provided. Provide at least a required dam portion for damping the molten resin material that infiltrates the opposing portions of the two lead frames in the set portion from at least the pot, the pot and the cavity Characterized by being configured to be communicatively connected with a short resin passage.

[0013]

According to the present invention, in a resin sealing molding die in which a fixed die and a movable die are arranged to face each other, the two lead frames described above are joined in parallel to the set part of the movable die. Alternatively, by supplying and setting in close proximity to each other, and by configuring the positions of the required plurality of pots to correspond to the joint portion of the two lead frames or the opposing portion, respectively, Since both cavities can be arranged in a close position and the transfer distance of the molten resin material can be shortened, the above-mentioned pot and the cavities can be connected and connected by a short resin passage. Therefore,
At the time of resin molding by both molds, unnecessary resin can be reduced as a product cured in at least the resin passage including the cull portion and the runner, and the effective utilization rate of the resin material can be improved.

The lead frame is provided with notches corresponding to the openings of the required plurality of pots. When the lead frame is supplied and set to the set portion, the opening of each pot is set. Since the notch portion is configured to correspond to the portion, the molten resin material hardens in the vicinity of the opening of the pot including the notch portion during the resin sealing molding by the two dies. Therefore, since the area of the cured resin adhered to the lead frame can be reduced, the cured resin unnecessary for the product adhered to the lead frame can be easily removed.

Since the height of a resin tablet used for resin encapsulation of an electronic component can be set to twice or more its diameter by an extrusion molding method, the opening of a pot for supplying the resin tablet has a small diameter. It can be made into a small pot. That is, since the pot opening can be configured to have a small diameter, when the two lead frames are set and connected in parallel or close to and parallel to the set portion, the small pot and the two cavities are set. Can be arranged at close positions to reduce the transfer distance of the molten resin material from the pot to the two cavities, and to allow the pot and the two cavities to communicate with each other via a short resin passage. Therefore, at the time of the resin sealing molding by the two molds, unnecessary resin can be reduced as a product cured in the resin passage including at least the cull portion and the runner, and the effective utilization rate of the resin material can be improved. .

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. 1 and 2 show a mold for resin sealing molding according to the present invention.

That is, the mold for resin encapsulation shown in FIGS. 1 and 2 includes a fixed upper die 40 and a movable lower die 41 arranged opposite to the fixed upper die 40. On the parting line surface (PL surface) of the movable die 41, a set portion 44 (set recess) for supplying and setting a lead frame 43 on which required electronic components 42 are mounted is provided. The two lead frames 43 are joined and arranged in parallel in the unit 44 so that they can be supplied and set. Also, a plurality of required resin material supply pots 45 are provided on the bottom surface of the set portion 44, and a plunger 57 for pressing the resin is fitted into each of the pots 45, respectively. The resin material that has been heated and melted can be pressed (moved upward) by the plunger 57 in the direction of the PL surface of the two molds (40, 41). Further, in the setting portion 44, the pots 45 are arranged so as to correspond to the joining portions of the two lead frames 43 supplied and set to the setting portion 44, respectively. A required number of movable mold cavities 46 for resin molding are provided on the PL surface of the movable mold 41 (that is, the bottom surface of the set portion 44), and the fixed mold 40
On the PL surface, fixed mold cavities 47 for resin molding are provided opposite to the movable mold cavities 46, respectively, and on the upper surface of the lead frame 43 corresponding to the opening (peripheral edge) of the fixed mold cavities 47. Is configured such that a resin sealing range 54 is set. Therefore, when clamping the molds (40, 41),
The electronic component 42 mounted on the lead frame 43 can be fitted and set in the two cavities (46, 47). The lead frame described above
At the time of supply setting to the set portion 43, the openings of the pots 45 are respectively covered with the two lead frames 43, and when the molds (40 and 41) are closed, the pots 45 are closed. And both cavities (46, 47) can be arranged in close proximity.

In addition, a short resin passage 48 (gate) is provided on the bottom surface of the set portion 44 for communicating and connecting the pot 45 and the movable mold cavity 46 disposed in the above-described proximity position. The short resin passage 48 is configured to be covered with the lead frame 43 at the time of supply setting to the setting section 44. Therefore, the resin material heated and melted in the pot 45 is pressed by the plunger 57 in the direction of the PL surface of the two dies (40 and 41), so that the two cavities (46 47) can be filled with a molten resin material, and the electronic component 42 on the lead frame 43 can be molded into a resin-sealed body corresponding to the shape of the two cavities (46, 47).
53 can be molded in the seal. At this time, since the molten resin material is injected and filled into the fixed mold cavity 47, the resin sealing area 54 on the surface of the lead frame 43 is covered with the resin. In the example shown, one pot is provided for four cavities (46 and 47).
45 are provided, and each cavity (4
6, 47), a short resin passage 48 is separately provided.

That is, in the mold shown in FIGS. 1 and 2,
First, the resin tablets 50 are respectively supplied into a plurality of required pots 45 of the movable mold 41, and
The two lead frames 43 described above are joined and arranged in parallel in the set section 44 of 41, and are supplied and set. The movable mold 41 is moved upward to clamp the two molds (40, 41). At this time, the setting section 44
In this case, the positions of the pots 45 correspond to the joint portions of the two lead frames 43, respectively. Next, the resin material heated and melted in the pot 45 is pressurized by the plunger 57, and the molten resin material is passed through the short resin passage 48 to the two cavities (46 and 46).
47). Therefore, the two cavities (46
47) Inside the electronic component 42 mounted on the lead frame 43, a resin molded article corresponding to the shape of the two cavities (46, 47)
53 (product) can be sealed and molded. After a lapse of time required for curing, the molds (40 and 41) are opened, and the resin-encapsulated molded body 53 cured in the cavities (46 and 47) and the short resin passages described above. Unnecessary resin 55 can be released as a product cured in the interior 48 and in the vicinity of the opening of the pot 45 described above.

That is, by supplying and setting the two lead frames 43 in the set portion 44 in a state where the two lead frames 43 are joined and arranged in parallel, the pot 45 and the two cavities (46, 47) are set.
Can be disposed in close proximity to each other, so that the transfer distance of the molten resin material transferred from the pot 45 to the two cavities (46, 47) can be shortened, and the pot described in the short resin passage 48 can be shortened. 45 and both cavities (46, 47) can be connected and connected. Therefore, at the time of the resin sealing molding by the two molds (40, 41), at least the unnecessary resin can be reduced as a product cured in the resin passage including the cull portion and the runner, and the effective utilization rate of the resin material can be reduced. Can be improved.

Next, another embodiment shown in FIG. 3 will be described. The basic components of the mold shown in FIG. 3 are the same as the basic components of the mold shown in the above embodiment.

In the embodiment shown in FIG. 3, the two lead frames 51 are provided with cutouts 52 corresponding to the openings of the pots 45. When the two lead frames 51 are supplied and set in a state of being joined and arranged in parallel, the notch 52 can correspond to the opening of the pot 45. For example, as shown in FIG. 3, a portion corresponding to the opening of the pot 45, that is, the lead frame along the periphery of the opening of the pot 45 in the lead frame 51 joined and arranged in the set portion 44, By cutting out 51,
The notch 52 described above is formed in the lead frame 51. Therefore, when the two lead frames 51 are supplied and set in the setting portion 44 in a state where the two lead frames 51 are joined and arranged in parallel, the position of the cutout portion 52 can correspond (match) to the opening position of the pot 45. Is configured. That is,
Similarly to the above-described embodiment, the lead frame 51 having the cutout portion 52 is set and supplied in a state where the lead frame 51 is joined to the set portion 44 in a parallel state, and the resin tablet 50 is supplied into the pot 45. (41) is clamped, and the resin material heated and melted in the pot 45 is injected and filled into the two cavities (46) through the short resin passage 48 by pressing with the plunger. The electronic components 42 on the frame 51 can be molded in the resin molded body 44. After the lapse of the time required for curing, the resin-sealed molded body 44 and the short resin
Unnecessary resin 56 is released from the cured product in the interior of the pot 45 and the vicinity of the opening of the pot 45 including the interior of the cutout 52 described above.

That is, in the same manner as in the above-described embodiment, the two lead frames 51 are supplied and set in the setting portion 44 in a state where the two lead frames 51 are joined and juxtaposed, so that the above-described pot is formed.
45 and both cavities (46, 47) can be arranged close to each other.
The transfer distance of the molten resin material transferred to (46, 47) can be shortened, and the pot 45 and both cavities (46, 47) can be connected and connected by the short resin passage 48. Therefore,
At the time of resin encapsulation molding by both molds (40, 41), unnecessary resin can be reduced as a product that is hardened in the resin passage composed of at least the cull part and runner, and the effective utilization rate of resin material is improved. Can be done. In addition, the notch
Since the lead frame 51 is provided with the resin 52, the resin 56 unnecessary as a product cured at least in the vicinity of the opening of the pot including the inside of the short resin passage 48 and the inside of the notch 52 described above contains the lead frame. The area attached to the 51 surface can be reduced. Therefore, both types (40.4
1) After the release from the lead frame 51, when removing the unnecessary cured resin 56 from the lead frame 51, for example, by projecting the resin cured in the cutout 52, the cured resin 56 is removed from the lead frame. The cured resin 56 can be efficiently removed from the surface 51, and the cured resin 56 can be efficiently removed.

Next, the embodiment shown in FIG. 4 will be described. The basic components of the mold shown in FIG. 4 are the same as the basic components of the mold shown in each of the above embodiments.

That is, the resin sealing mold shown in FIG. 4 is composed of a fixed upper die and a movable lower die 21 opposed to the fixed upper die as in the above-described embodiments. I have. In addition, the parting line surface (PL
Side) is a lead frame with the required electronic components 22
A set portion 24 (setting recess) for supplying and setting 23 is provided, and the two lead frames 23 described above are arranged in the set portion 24 so that they can be supplied and set in close proximity to each other. . In addition, a plurality of required resin material supply pots 25 are provided on the bottom surface of the set portion 24, and a plunger for pressing the resin is fitted into each of the pots 25, and the pot 25 is heated in the pot 25. The molten resin material is configured to be pressurized (moved upward) in the direction of the PL surfaces of the two molds by the plunger. In the setting section 24, each of the pots 25
Are arranged so as to correspond to the opposing portions of the two lead frames 23 supplied and set in the setting section 24, respectively. A required number of movable mold cavities 26 for resin molding are provided on the PL surface of the movable mold 21 (that is, the bottom surface of the set portion 24), and the movable mold cavity 26 is provided on the fixed mold PL surface. Fixed mold cavities for resin molding are respectively provided opposite to 26, and a resin sealing range 34 is set on the upper surface of the lead frame 23 corresponding to the opening (peripheral edge) of the fixed mold cavity. It is configured. Therefore, the electronic component 22 mounted on the lead frame 23 can be fitted and set in the cavities 26 when the dies 21 are clamped. In addition, each pot 25 is set in the
24, the pot 25 and the cavities (26) are arranged in close proximity to each other when the molds (21) are clamped. can do. In addition, the two lead frames 23 are supplied and set in a state in which the two lead frames 23 are arranged in close proximity to the setting section 24, and for example, as shown in FIG. A configuration in which a part of each part is covered, or a configuration in which the opening of each pot 25 is not covered can be adopted.

In the same manner as in each of the above embodiments, a short resin passage 28 for communicating the pot 25 and the movable mold cavity 26 located at the above-described close positions is provided on the bottom surface of the set portion 24 of the movable mold 21. For example, as shown in FIG. 4, when the lead frame 23 is supplied and set to the setting portion 24, the short resin passage is provided.
28 can be covered with the lead frame 23. As shown in FIG. 4, in the above-described set portion 24, at least a portion from the inside of the pot 25 is provided at a portion opposed to the two lead frames 23 supplied and set in a state of being close to and parallel to the set portion 24. A required dam portion 29 for damping the molten resin material is provided, and at the time of resin sealing molding by the two molds (21), for example, the two lead frames 23 in the set portion 24 from the pot 25 are formed. It is configured such that the molten resin material that enters the opposing portion can be blocked. Therefore, the resin material heated and melted in the pot 25 is pressed by the plunger in the direction of the PL surface of the two molds, and the molten resin material from inside the pot 25 is blocked by the weir portion 29. The short resin passage described above
The molten resin material is injected and filled into the two cavities (26) through 28 and the electronic components on the lead frame 23 are filled.
22 can be molded in a resin molded body 33 corresponding to the shape of the two cavities (26). At this time, since the molten resin material is injected and filled in the fixed mold cavity, the resin sealing area of the lead frame 23 surface is reduced.
34 will be covered with resin. In the above-described embodiment, the configuration in which the weir portion 29 is provided in the set portion 24 of the movable die 21 is exemplified.
A configuration provided on the PL surface can be adopted.

Accordingly, in the embodiment shown in FIG. 4, the required plurality of pots
In addition to supplying the resin tablets 30 respectively, the two lead frames 23 described above are supplied and set in close proximity to the set section 24, and the movable mold 21 is moved upward to form the two molds.
Clamp (21). At this time, in the setting section 24, the positions of the pots 25 correspond to the opposing portions of the two lead frames 23, respectively. Next, the resin material heated and melted in the pot 25 is pressurized by the plunger, and the molten resin material that penetrates into the opposing portions of the two lead frames 23 from inside the pot 25 (the pot 25). Then, the molten resin material is injected and filled into the two cavities (26) through the short resin passage (28). Therefore, the electronic component 22 mounted on the lead frame 23 in the two cavities (26) can be molded into the resin molded body 33 corresponding to the shapes of the two cavities (26). After the required time for curing elapses, both molds (21)
And the resin-encapsulated molded body 33 (product) cured in both the cavities (26), and the product cured in the short resin passage 28 and in the vicinity of the opening of the pot 25 include The unnecessary resin 35 can be released from the mold.

That is, the above-mentioned pot 25 and both cavities (26) are arranged in a position close to each other by supplying and setting the two lead frames 23 in the setting section 24 in a state of being arranged in close proximity to each other. Therefore, the transfer distance of the molten resin material transferred from the pot 25 to the two cavities (26) can be reduced, and the pot 25 and the two cavities (26) are connected and connected by the short resin passage 28. can do. Therefore, at the time of resin sealing molding by the two molds (21), at least the unnecessary resin can be reduced as a product which is cured in the resin passage including the cull portion and the runner, and the effective utilization rate of the resin material is improved. Can be done.

Next, the embodiment shown in FIGS. 5 and 6 will be described. The basic components of the mold shown in FIGS. 5 and 6 are the same as the basic components of the mold shown in each of the above-described embodiments.

The dies shown in FIGS. 5 and 6 are provided with a fixed upper die 20, a movable lower die 21 and
A set part 24 for supplying and setting two lead frames 31 on which the electronic components 22 are mounted in a state of being closely arranged in a side-by-side manner;
0.21), the movable cavity 26 and the fixed cavity 27 (resin sealing area 34) opposed to the PL surface;
A plurality of required resin material supply pots 25 arranged at opposing portions of the two lead frames 31 set and supplied to the short resin passage 28 for communicating and connecting the pot 25 and the movable mold cavity 26; A resin pressurizing plunger 37 for pressing the resin material heated and melted in the pot 25,
Weir section 29 for blocking the molten resin material from inside the pot 25
Are provided.

In the embodiment shown in FIGS. 5 and 6, the two lead frames 31 are attached to the pot 25.
In addition to adopting a configuration in which the notch portion 32 corresponding to the opening portion is provided, the two lead frames
It is possible to adopt a configuration in which the notch 32 is made to correspond to the opening of the pot 25 when the supply is set in a state in which the 31s are arranged in close proximity. For example, as shown in FIGS. 5 and 6, the lead frames 31 arranged close to and parallel to each other in the set portion 24 correspond to the openings of the pot 25, that is,
The notch 32 is provided in the lead frame 31 by notching a portion corresponding to the opening of the pot 25 and a small portion corresponding to the outer periphery thereof.
Therefore, the two lead frames 31 are attached to the setting section 24.
Can be made to correspond to the position of the opening of the pot 25 when they are supplied and set in a state of close proximity. That is, similarly to the above-described embodiment, first, the lead frame 31 having the cutout portion 32 is supplied and set in a state in which the lead frame 31 is arranged in close proximity to the setting portion 24, and the resin tablet 30 is supplied into the pot 25. And both types
(20 ・ 21) is clamped. Next, the resin material heated and melted in the pot 25 is injected and filled into the two cavities (26, 27) through the short resin passage 28 by pressing with the plunger 37, and the lead frame 31 is filled. The upper electronic component 22 can be molded in the resin molded body 33. At this time, the molten resin material penetrating from the pot 25 into the opposing portions of the two lead frames 31 in the set portion 24 is removed (except for the vicinity of the opening of the pot 25 including the cutout portion 32) by the weir portion. You can stop at 29.
After the elapse of the time required for curing, as the product cured in the vicinity of the opening of the pot 25 including the resin sealing molded body 33 and the short resin passage 48 and the notch 32 described above, The unnecessary resin 36 is released from the mold.

That is, in the same manner as in the above-described embodiment, the above-described pot is set by supplying and setting the two lead frames 31 in the set portion 24 in a state of being closely adjacent to each other.
25 and both cavities (26, 27) can be arranged in close proximity to each other.
The transfer distance of the molten resin material transferred to (26, 27) can be shortened, and the pot 25 and both cavities (26, 27) can be connected and connected by the short resin passage 28. Therefore,
At the time of resin encapsulation molding by the two molds (20 and 21), at least the unnecessary resin can be reduced as a product that is cured in the resin passage including the cull portion and the runner, thereby improving the effective utilization rate of the resin material. Can be done. In addition, the notch
Since the lead frame 31 is provided with the lead 32, the resin 36 unnecessary as a product cured at least in the vicinity of the opening of the pot 25 including the inside of the short resin passage 28 and the inside of the notch 32 described above is converted into the lead. The area adhered to the frame 31 can be reduced. Therefore, both types (20
21) After the release from the mold, when the unnecessary cured resin is removed from the lead frame 31,
By projecting the cured resin in the inside 32, the cured resin 36 can be easily separated from the lead frame 31 surface, and the cured resin 36 can be efficiently removed.

Further, in each of the above-described embodiments, the configuration in which the set portion for supplying and setting the lead frame described above is provided in the movable type is illustrated. However, the configuration in which the set portion is provided in the fixed type may be adopted. No problem. Also,
In each of the embodiments described above, the configuration in which the pot and the short resin passage are provided in the movable mold is illustrated. However, a configuration in which the pot and the short resin passage are provided in the fixed mold may be adopted. Further, in each of the above-described embodiments, it is possible to adopt a configuration in which the set portion, the pot, and the short resin passage are provided in the fixed mold.

The above-mentioned resin tablet is usually
By compressing a predetermined amount of a powdered resin material (powder) by a tableting method, for example, the resinous resin material is formed into a cylindrical shape, and the height of the cylindrical resin tablet formed by the above-described tableting method is changed to the height of the circle. It is customary that tableting cannot exceed twice the diameter of the tablet. Therefore, in order to form the resin tablet at a height twice or more the diameter of the circle, it has been studied to form the resin tablet by a so-called extrusion molding method. That is, the extrusion port of the extrusion die used in the extrusion molding method is formed in, for example, a circular shape, and the powder resin material is extruded from the circular extrusion port while being appropriately heated and is extruded to a required length (height).
By cutting into pieces, a resin tablet can be formed. Therefore, it is possible to form a resin tablet of an appropriate height by the extrusion molding method, and, in the resin tablet by the extrusion molding method, the height can be set to an appropriate multiple of the diameter of a circle, for example, Thus, a resin tablet having a height set to twice the diameter of the circle can be formed. As shown in FIG. 5, the resin tablet 60 can be formed with the height H set to four times the diameter D of the circle.

When a resin tablet having the same resin amount as that of the above-described tableting method is formed by the extrusion molding method, the diameter of the resin tablet can be reduced, and the height of the resin tablet can be reduced. Those obtained by the extrusion molding method, which can be higher than the resin tablets obtained by the extrusion method, are usually elongated resin tablets. That is, by adopting the elongated resin tablet by the extrusion molding method, the diameter of the opening of the pot for supplying the resin tablet can be reduced, and the elongated resin tablet corresponds to the resin tablet. The electronic component on the lead frame described above can be supplied into the small-diameter pot (small-sized pot) to be resin-molded. For example, in each of the above-described embodiments, the configuration in which the above-described small pot is provided can be adopted, so that the small pot and the two cavities can be arranged in close proximity to each other, and the small pot and both cavities can be arranged. Can be connected by a short resin passage. Therefore, as in the above-described embodiments, the cured resin unnecessary as a product can be reduced, and the effective utilization rate of the resin material can be improved.

As an elongated resin tablet obtained by the extrusion molding method described above, for example, the diameter is 5 mm and the length is 5 mm.
What is 0 mm can be adopted.

The present invention is not limited to the above-described embodiment, but can be arbitrarily and appropriately changed and selected as necessary without departing from the spirit of the present invention. It is.

In each of the above embodiments, a thermosetting resin material has been described as an example. However, for example, a thermoplastic resin material and an electronic component on a lead frame are formed by resin sealing. It can be carried out by employing a resin material to be used.

[0040]

According to the present invention, the resin encapsulation of an electronic component which can reduce the amount of a cured resin unnecessary as a product (resin encapsulant) and improve the effective utilization rate of the resin material. An excellent effect of being able to provide a molding method and a mold therefor is exerted.

[Brief description of the drawings]

FIG. 1 is a partially cutaway schematic plan view showing a mold for resin sealing molding of an electronic component according to the present invention, showing a lower mold surface thereof.

FIG. 2 is a schematic vertical sectional view of a part of the mold shown in FIG. 1, showing a closed state of both molds.

FIG. 3 is a partially cutaway schematic plan view showing a resin sealing mold for an electronic component according to another embodiment of the present invention, showing a lower mold surface thereof.

FIG. 4 is a partially cutaway schematic plan view showing a resin-sealing molding die of an electronic component according to another embodiment of the present invention, showing a lower die surface thereof.

FIG. 5 is a partially cutaway schematic plan view showing a resin sealing molding die of an electronic component according to another embodiment of the present invention, showing a lower die surface thereof.

FIG. 6 is a schematic vertical sectional view of a part of the mold shown in FIG. 5, showing a mold clamping state of both molds.

FIG. 7 is a perspective view showing the appearance of a resin tablet used in the resin sealing molding method according to the present invention.

FIG. 8 is a partially cutaway schematic plan view showing a conventional resin molding die.

[Explanation of symbols]

 20 Fixed upper mold 21 Movable lower mold 22 Electronic components 23 Lead frame 24 Set part (recess for set) 25 Pot 26 Movable mold cavity 27 Fixed mold cavity 28 Short resin passage (gate) 29 Weir 30 Resin tablet 31 Lead frame 32 Notch 33 Resin molding 34 Resin sealing area 35 Cured resin 36 Cured resin 37 Plunger 40 Fixed upper die 41 Movable lower die 42 Electronic component 43 Lead frame 44 Set part (recess for setting) 45 Pot 46 Movable cavity 47 Fixed cavity 48 Short resin passage (gate) 50 Resin tablet 51 Lead frame 52 Notch 53 Resin molding 54 Plastic sealing area 55 Cured resin 56 Cured resin 57 Plunger 60 Resin tablet

Claims (6)

[Claims] 1. A lead frame in which electronic components are mounted on a set portion of a lead frame provided on a PL surface of both molds using a mold for resin sealing molding in which a fixed mold and a movable mold are arranged to face each other. At the same time, the two dies are clamped and the electronic components on the lead frame are fitted and set in the resin molding cavities facing the PL surfaces of the two dies. The resin material heated and melted in the required plurality of resin material supply pots provided on the PL surface is injected and filled into the two cavities through a resin passage for transferring the molten resin material, so that the lead frame has What is claimed is: 1. A resin sealing molding method for an electronic component, wherein an electronic component is resin-encapsulated and molded, wherein said two lead frames are connected and supplied in parallel to said set portion, and said two lead frames are Joining Wherein the pots correspond to the positions of the pots, and a molten resin material is injected and filled into the two cavities through a short resin passage connecting and connecting the pots and the cavities. Stop molding method. 2. A lead frame in which electronic components are mounted on a set portion of a lead frame provided on a PL surface of both molds by using a resin molding mold in which a fixed mold and a movable mold are arranged to face each other. At the same time, the two dies are clamped and the electronic components on the lead frame are fitted and set in the resin molding cavities facing the PL surfaces of the two dies. The resin material heated and melted in the required plurality of resin material supply pots provided on the PL surface is injected and filled into the two cavities through a resin passage for transferring the molten resin material, so that the lead frame has A resin sealing molding method for an electronic component, wherein an electronic component is resin-encapsulated and molded, wherein the two lead frames are supplied and set in parallel in the set portion, and the two lead frames are Opposite The position of each of the pots corresponds to the position of each of the pots, and while the molten resin material entering the opposing portions of the two lead frames is blocked from the pots, the pot and the cavity are connected in a short-circuited manner. A resin sealing molding method for an electronic component, wherein a molten resin material is injected and filled into the two cavities through a resin passage. 3. The lead frame is supplied and set to a setting portion with a cutout provided in the lead frame corresponding to the pot opening corresponding to the pot opening. A resin molding method for an electronic component according to claim 2. 4. The resin tablet according to claim 1, wherein the height of the resin tablet is set to be at least twice the diameter in the pot. Resin molding method for electronic parts. 5. A fixed type, a movable type opposed to the fixed type, a setting unit for supplying and setting a lead frame provided with an electronic component provided on a PL surface of both types, and a PL of both types. A resin molding cavity opposed to the surface, a plurality of resin material supply pots provided in at least one of the molds, and a resin material heated and melted in the pot. A resin sealing molding die for an electronic component having a resin passage for transferring a molten resin material to be injected and filled into a cavity, wherein the set part is supplied and set in a state where the two lead frames are joined and arranged in parallel. The electronic component according to claim 1, wherein the pots are respectively disposed at a joint portion between the two lead frames, and the pot and the cavity are connected to each other through a short resin passage. Mold for resin sealing molding. 6. A fixed type, a movable type opposed to the fixed type, a set unit for supplying and setting a lead frame provided with electronic components provided on a PL surface of both types, and a PL of both types. A resin molding cavity opposed to the surface, a plurality of resin material supply pots provided in at least one of the molds, and a resin material heated and melted in the pot. A mold for resin-sealing molding of an electronic component having a resin passage for transferring a molten resin material to be injected and filled into a cavity, wherein the set part is supplied and set in a state where the two lead frames are closely arranged in parallel. The above-mentioned pots are respectively disposed at the opposing portions of the two lead frames in the above, and at least the molten metal which penetrates into the setting portion from at least the pots to the opposing portions of the two lead frames in the setting portion. A mold for resin-sealing molding of electronic components, wherein a required dam portion for damping the molten resin material is provided, and the pot and the cavity are connected and connected by a short resin passage.